JPH0813530B2 - Chlorine-containing resin molded product - Google Patents
Chlorine-containing resin molded productInfo
- Publication number
- JPH0813530B2 JPH0813530B2 JP62180574A JP18057487A JPH0813530B2 JP H0813530 B2 JPH0813530 B2 JP H0813530B2 JP 62180574 A JP62180574 A JP 62180574A JP 18057487 A JP18057487 A JP 18057487A JP H0813530 B2 JPH0813530 B2 JP H0813530B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chlorine
- acid
- metal
- containing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims description 86
- 239000011347 resin Substances 0.000 title claims description 86
- 239000000460 chlorine Substances 0.000 title claims description 47
- 229910052801 chlorine Inorganic materials 0.000 title claims description 46
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 title claims description 43
- 239000011247 coating layer Substances 0.000 claims description 41
- 239000003381 stabilizer Substances 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 32
- 229910052755 nonmetal Inorganic materials 0.000 claims description 30
- -1 hydrazide Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 10
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 9
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 8
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 description 11
- 229920000578 graft copolymer Polymers 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000000057 synthetic resin Substances 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000003086 colorant Substances 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 235000013305 food Nutrition 0.000 description 6
- 229910052745 lead Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000003814 drug Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 239000011593 sulfur Substances 0.000 description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- UKVYVZLTGQVOPX-IHWYPQMZSA-N (z)-3-aminobut-2-enoic acid Chemical compound C\C(N)=C\C(O)=O UKVYVZLTGQVOPX-IHWYPQMZSA-N 0.000 description 2
- OYIFNHCXNCRBQI-UHFFFAOYSA-N 2-aminoadipic acid Chemical compound OC(=O)C(N)CCCC(O)=O OYIFNHCXNCRBQI-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229930194542 Keto Natural products 0.000 description 2
- 229930195725 Mannitol Natural products 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001334 alicyclic compounds Chemical class 0.000 description 2
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 2
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000010775 animal oil Substances 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- LUZSPGQEISANPO-UHFFFAOYSA-N butyltin Chemical compound CCCC[Sn] LUZSPGQEISANPO-UHFFFAOYSA-N 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- PGRHXDWITVMQBC-UHFFFAOYSA-N dehydroacetic acid Chemical compound CC(=O)C1C(=O)OC(C)=CC1=O PGRHXDWITVMQBC-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 2
- 229960004488 linolenic acid Drugs 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- 229940049920 malate Drugs 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- 239000000594 mannitol Substances 0.000 description 2
- 235000010355 mannitol Nutrition 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 150000002843 nonmetals Chemical class 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 235000010356 sorbitol Nutrition 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000811 xylitol Substances 0.000 description 2
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 description 2
- 235000010447 xylitol Nutrition 0.000 description 2
- 229960002675 xylitol Drugs 0.000 description 2
- KFSWZAIFJAKGSH-UHFFFAOYSA-N (4-nonyl-2-phenylphenyl) dihydrogen phosphite Chemical compound CCCCCCCCCC1=CC=C(OP(O)O)C(C=2C=CC=CC=2)=C1 KFSWZAIFJAKGSH-UHFFFAOYSA-N 0.000 description 1
- HACMXPVQBHWNHX-VKHMYHEASA-N (4s)-4-amino-5-hydrazinyl-5-oxopentanoic acid Chemical compound NNC(=O)[C@@H](N)CCC(O)=O HACMXPVQBHWNHX-VKHMYHEASA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- ABZHGLSYGDUSDL-OWOJBTEDSA-N (e)-2-aminobut-2-enedioic acid Chemical compound OC(=O)C(/N)=C\C(O)=O ABZHGLSYGDUSDL-OWOJBTEDSA-N 0.000 description 1
- MTANTOSWGQDIGK-NSCUHMNNSA-N (e)-but-2-enehydrazide Chemical compound C\C=C\C(=O)NN MTANTOSWGQDIGK-NSCUHMNNSA-N 0.000 description 1
- GEYKZYNEWQWLTF-KTKRTIGZSA-N (z)-octadec-9-enehydrazide Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)NN GEYKZYNEWQWLTF-KTKRTIGZSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- KHUFHLFHOQVFGB-UHFFFAOYSA-N 1-aminoanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2N KHUFHLFHOQVFGB-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- LNETULKMXZVUST-UHFFFAOYSA-N 1-naphthoic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1 LNETULKMXZVUST-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- VJEZYZLITKUTFH-UHFFFAOYSA-N 2-(hydrazinecarbonyl)benzoic acid Chemical compound NNC(=O)C1=CC=CC=C1C(O)=O VJEZYZLITKUTFH-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- QRKJNCRCYBKANP-UHFFFAOYSA-N 2-amino-n-phenylacetamide Chemical compound NCC(=O)NC1=CC=CC=C1 QRKJNCRCYBKANP-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- KLLLJCACIRKBDT-UHFFFAOYSA-N 2-phenyl-1H-indole Chemical compound N1C2=CC=CC=C2C=C1C1=CC=CC=C1 KLLLJCACIRKBDT-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-L 3-(2-carboxylatoethylsulfanyl)propanoate Chemical compound [O-]C(=O)CCSCCC([O-])=O ODJQKYXPKWQWNK-UHFFFAOYSA-L 0.000 description 1
- FLROJJGKUKLCAE-UHFFFAOYSA-N 3-amino-2-methylphenol Chemical compound CC1=C(N)C=CC=C1O FLROJJGKUKLCAE-UHFFFAOYSA-N 0.000 description 1
- ODHCTXKNWHHXJC-VKHMYHEASA-N 5-oxo-L-proline Chemical compound OC(=O)[C@@H]1CCC(=O)N1 ODHCTXKNWHHXJC-VKHMYHEASA-N 0.000 description 1
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 1
- ALEBYBVYXQTORU-UHFFFAOYSA-N 6-hydrazinyl-6-oxohexanoic acid Chemical compound NNC(=O)CCCCC(O)=O ALEBYBVYXQTORU-UHFFFAOYSA-N 0.000 description 1
- BWDBEAQIHAEVLV-UHFFFAOYSA-N 6-methylheptan-1-ol Chemical compound CC(C)CCCCCO BWDBEAQIHAEVLV-UHFFFAOYSA-N 0.000 description 1
- QDTDKYHPHANITQ-UHFFFAOYSA-N 7-methyloctan-1-ol Chemical compound CC(C)CCCCCCO QDTDKYHPHANITQ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N Acetoacetic acid Natural products CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical group C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- XOLZCQFKOHAXTK-UHFFFAOYSA-H C(CCCCCCCCCCC)(=O)[O-].S[Sn+2]CCCCCCCC.C(CCC)[Sn+3].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-] Chemical compound C(CCCCCCCCCCC)(=O)[O-].S[Sn+2]CCCCCCCC.C(CCC)[Sn+3].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-].C(CCCCCCCCCCC)(=O)[O-] XOLZCQFKOHAXTK-UHFFFAOYSA-H 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004287 Dehydroacetic acid Substances 0.000 description 1
- 206010016275 Fear Diseases 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- BGRDGMRNKXEXQD-UHFFFAOYSA-N Maleic hydrazide Chemical compound OC1=CC=C(O)N=N1 BGRDGMRNKXEXQD-UHFFFAOYSA-N 0.000 description 1
- FCSHMCFRCYZTRQ-UHFFFAOYSA-N N,N'-diphenylthiourea Chemical compound C=1C=CC=CC=1NC(=S)NC1=CC=CC=C1 FCSHMCFRCYZTRQ-UHFFFAOYSA-N 0.000 description 1
- RFMMMVDNIPUKGG-YFKPBYRVSA-N N-acetyl-L-glutamic acid Chemical compound CC(=O)N[C@H](C(O)=O)CCC(O)=O RFMMMVDNIPUKGG-YFKPBYRVSA-N 0.000 description 1
- XUYPXLNMDZIRQH-LURJTMIESA-N N-acetyl-L-methionine Chemical compound CSCC[C@@H](C(O)=O)NC(C)=O XUYPXLNMDZIRQH-LURJTMIESA-N 0.000 description 1
- CBQJSKKFNMDLON-JTQLQIEISA-N N-acetyl-L-phenylalanine Chemical compound CC(=O)N[C@H](C(O)=O)CC1=CC=CC=C1 CBQJSKKFNMDLON-JTQLQIEISA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 235000019485 Safflower oil Nutrition 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 235000019486 Sunflower oil Nutrition 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 125000000738 acetamido group Chemical group [H]C([H])([H])C(=O)N([H])[*] 0.000 description 1
- OFLXLNCGODUUOT-UHFFFAOYSA-N acetohydrazide Chemical compound C\C(O)=N\N OFLXLNCGODUUOT-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001370 alpha-amino acid derivatives Chemical class 0.000 description 1
- 235000008206 alpha-amino acids Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WARCRYXKINZHGQ-UHFFFAOYSA-N benzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1 WARCRYXKINZHGQ-UHFFFAOYSA-N 0.000 description 1
- VMHLCAPNSPEJGO-UHFFFAOYSA-N buta-1,3-diene 1-phenylpenta-1,4-dien-3-one Chemical compound C=CC=C.C(=O)(C=C)C=CC1=CC=CC=C1 VMHLCAPNSPEJGO-UHFFFAOYSA-N 0.000 description 1
- HCOMFAYPHBFMKU-UHFFFAOYSA-N butanedihydrazide Chemical compound NNC(=O)CCC(=O)NN HCOMFAYPHBFMKU-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- FCCCRBDJBTVFSJ-UHFFFAOYSA-N butanehydrazide Chemical compound CCCC(=O)NN FCCCRBDJBTVFSJ-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001804 chlorine Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 229940061632 dehydroacetic acid Drugs 0.000 description 1
- 235000019258 dehydroacetic acid Nutrition 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007922 dissolution test Methods 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- YTQHSQQSLTYMSL-UHFFFAOYSA-N dodecanohydrazide Chemical compound CCCCCCCCCCCC(=O)NN YTQHSQQSLTYMSL-UHFFFAOYSA-N 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 229940093476 ethylene glycol Drugs 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- SSVSELJXJJCANX-UHFFFAOYSA-N hexadecanehydrazide Chemical compound CCCCCCCCCCCCCCCC(=O)NN SSVSELJXJJCANX-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- QKWRNBNHSRYCOE-UHFFFAOYSA-N hexanehydrazide Chemical compound CCCCCC(=O)NN QKWRNBNHSRYCOE-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229960004717 insulin aspart Drugs 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- OCWMFVJKFWXKNZ-UHFFFAOYSA-L lead(2+);oxygen(2-);sulfate Chemical compound [O-2].[O-2].[O-2].[Pb+2].[Pb+2].[Pb+2].[Pb+2].[O-]S([O-])(=O)=O OCWMFVJKFWXKNZ-UHFFFAOYSA-L 0.000 description 1
- ONUFRYFLRFLSOM-UHFFFAOYSA-N lead;octadecanoic acid Chemical compound [Pb].CCCCCCCCCCCCCCCCCC(O)=O ONUFRYFLRFLSOM-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229960001855 mannitol Drugs 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- SJOCPYUKFOTDAN-ZSOIEALJSA-N methyl (4z)-4-hydroxyimino-6,6-dimethyl-3-methylsulfanyl-5,7-dihydro-2-benzothiophene-1-carboxylate Chemical compound C1C(C)(C)C\C(=N\O)C=2C1=C(C(=O)OC)SC=2SC SJOCPYUKFOTDAN-ZSOIEALJSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229940043348 myristyl alcohol Drugs 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- VMFUMDXVTKTZQY-UHFFFAOYSA-N naphthalene-1-carbohydrazide Chemical compound C1=CC=C2C(C(=O)NN)=CC=CC2=C1 VMFUMDXVTKTZQY-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- VOMXSOIBEJBQNF-UTTRGDHVSA-N novorapid Chemical compound C([C@H](NC(=O)[C@H](CC(C)C)NC(=O)[C@H](CO)NC(=O)[C@H](CS)NC(=O)[C@H]([C@@H](C)CC)NC(=O)[C@H](CO)NC(=O)[C@H]([C@@H](C)O)NC(=O)[C@H](CS)NC(=O)[C@H](CS)NC(=O)[C@H](CCC(N)=O)NC(=O)[C@H](CCC(O)=O)NC(=O)[C@H](C(C)C)NC(=O)[C@@H](NC(=O)CN)[C@@H](C)CC)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC=1C=CC(O)=CC=1)C(=O)N[C@@H](CS)C(=O)N[C@@H](CC(N)=O)C(O)=O)C1=CC=C(O)C=C1.C([C@@H](C(=O)N[C@@H](CC(C)C)C(=O)N[C@H](C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CC=1C=CC(O)=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CS)C(=O)NCC(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)NCC(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC=1C=CC(O)=CC=1)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)O)C(O)=O)C(C)C)NC(=O)[C@H](CO)NC(=O)CNC(=O)[C@H](CS)NC(=O)[C@H](CC(C)C)NC(=O)[C@H](CC=1NC=NC=1)NC(=O)[C@H](CCC(N)=O)NC(=O)[C@H](CC(N)=O)NC(=O)[C@@H](NC(=O)[C@@H](N)CC=1C=CC=CC=1)C(C)C)C1=CN=CN1 VOMXSOIBEJBQNF-UTTRGDHVSA-N 0.000 description 1
- BYTFESSQUGDMQQ-UHFFFAOYSA-N octadecanehydrazide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NN BYTFESSQUGDMQQ-UHFFFAOYSA-N 0.000 description 1
- IIGMITQLXAGZTL-UHFFFAOYSA-N octyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCC IIGMITQLXAGZTL-UHFFFAOYSA-N 0.000 description 1
- ZMHZSHHZIKJFIR-UHFFFAOYSA-N octyltin Chemical compound CCCCCCCC[Sn] ZMHZSHHZIKJFIR-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 125000005461 organic phosphorous group Chemical group 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- PSIKPHJLTVSQFO-UHFFFAOYSA-N propanedihydrazide Chemical compound NNC(=O)CC(=O)NN PSIKPHJLTVSQFO-UHFFFAOYSA-N 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 229940079889 pyrrolidonecarboxylic acid Drugs 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000003813 safflower oil Substances 0.000 description 1
- 235000005713 safflower oil Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 229960002920 sorbitol Drugs 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229940012831 stearyl alcohol Drugs 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000002600 sunflower oil Substances 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- QERYCTSHXKAMIS-UHFFFAOYSA-N thiophene-2-carboxylic acid Chemical compound OC(=O)C1=CC=CS1 QERYCTSHXKAMIS-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- XUHUMYVYHLHMCD-UHFFFAOYSA-N tris(2-cyclohexylphenyl) phosphite Chemical compound C1CCCCC1C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C1CCCCC1)OC1=CC=CC=C1C1CCCCC1 XUHUMYVYHLHMCD-UHFFFAOYSA-N 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
- RISNZTASXOONEL-UHFFFAOYSA-N tris(4-phenylphenyl) phosphite Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1OP(OC=1C=CC(=CC=1)C=1C=CC=CC=1)OC(C=C1)=CC=C1C1=CC=CC=C1 RISNZTASXOONEL-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は塩素含有樹脂の成型品に関し、特に半導体等
の電子部品の製造設備、梱包容器、その機器ケース、更
には生化学、医療、医薬、食品関連の用途等に好適に用
いられる新規な塩素含有樹脂成型品に関する。TECHNICAL FIELD The present invention relates to a molded product of a chlorine-containing resin, and in particular, a manufacturing facility for electronic parts such as semiconductors, a packaging container, a device case thereof, and further biochemistry, medical treatment, and pharmaceuticals. , A novel chlorine-containing resin molded product that is preferably used for food-related applications.
(従来の技術) 塩素含有樹脂の代表例である塩化ビニル(以下、PVC
と略称する)樹脂は安価・強靭且つ耐薬品性、二次加工
性に優れていることから合成樹脂成型品として広く用い
られている。該PVC樹脂は樹脂構造の特性から、成型時
の温度によりHおよびCl元素が遊離して脱塩酸し、成型
品が黄変乃至黒変する為、樹脂原料中に事前にPVC樹脂
用安定剤を添加させておくのが一般的である。斯かる安
定剤としてはPb或はSn系金属化合物の安定剤が主に用い
られており、PVC以外の他の塩素含有樹脂においても同
様の金属系安定剤が用いられていた。(Prior art) A typical example of chlorine-containing resin is vinyl chloride (hereinafter referred to as PVC).
Resin is widely used as a synthetic resin molded product because it is inexpensive, tough, and has excellent chemical resistance and secondary workability. Due to the characteristics of the resin structure of the PVC resin, H and Cl elements are liberated and dehydrochlorinated depending on the temperature during molding, and the molded product turns yellow or black, so a stabilizer for PVC resin should be added in advance in the resin raw material. Generally, it is added. As such a stabilizer, a stabilizer of Pb or Sn-based metal compound is mainly used, and the same metal-based stabilizer is also used in chlorine-containing resins other than PVC.
(発明が解決しようとする問題点) ところで、近時半導体を主体とした電子部品の発展は
目覚ましいものがあるが、斯かる半導体の製造設備や半
導体部品の梱包容器、該半導体を用いた機器のケースな
どの関連機器にも合成樹脂成型品が用いられるようにな
ったことは周知の通りである。このような製造設備を用
いた電子部品の製造工程においては、水洗・酸洗等の種
々の処理をしなければならず、また梱包容器、機器ケー
ス等においても然りであり、上記のごとくPb或はSnなど
の金属化合物を安定剤として含む塩素含有樹脂は、上記
処理の際にこれらの金属元素が溶出し、電子部品等に悪
影響を及ぼすことになる為、高品質の半導体、例えば1
メガビットの半導体用の部材としては使用出来なかっ
た。さらに、上記の製造設備の外装材も金属元素を含む
塩素含有樹脂を用いると、該外装材が摩耗等によりはが
れたり、金属元素が折出したりし、これが雰囲気中に発
散して電子部品等に悪影響を与えるという問題もあっ
た。この他、生化学、医療、医薬、食品関連の用途にお
いても金属の溶出や発散が種々のトラブルの原因となっ
ていた。このような実情から上記のごとき用途に適用さ
せる合成樹脂としては熱安定性に極めて優れたフッ素樹
脂が用いられる場合もあるが、該フッ素樹脂は高価でり
且つ溶接などの二次加工がしにくいと云う欠点を有して
いるため汎用性に乏しかった。従ってこのような欠点を
有さずしかも安価・強靭且つ耐薬品性に優れた塩素含有
樹脂での上記用途への適正化が強く望まれるところであ
った。(Problems to be Solved by the Invention) By the way, recently, there has been remarkable development of electronic components mainly composed of semiconductors. However, such semiconductor manufacturing facilities, packaging containers for semiconductor components, and devices using the semiconductors have been developed. It is well known that synthetic resin molded products have come to be used for related devices such as cases. In the manufacturing process of electronic parts using such manufacturing equipment, various treatments such as water washing and pickling must be performed, and this is also true of packaging containers, equipment cases, etc. Alternatively, in a chlorine-containing resin containing a metal compound such as Sn as a stabilizer, these metal elements are eluted during the above treatment, which adversely affects electronic parts and the like.
It could not be used as a member for megabit semiconductors. Furthermore, when the chlorine-containing resin containing a metal element is also used as the exterior material of the above-mentioned manufacturing facility, the exterior material is peeled off due to abrasion or the like, or the metal element is broken out, and this is dispersed in the atmosphere to electronic parts or the like. There was also the problem of having an adverse effect. In addition, elution and diffusion of metals have caused various troubles in biochemical, medical, pharmaceutical, and food-related applications. From such circumstances, there is a case where a fluororesin having extremely excellent thermal stability is used as the synthetic resin applied to the above-mentioned applications, but the fluororesin is expensive and difficult to be secondary processed such as welding. However, it lacks versatility because it has the drawback. Therefore, it has been strongly desired that the chlorine-containing resin, which does not have such drawbacks and is inexpensive, tough, and excellent in chemical resistance, is suitable for the above-mentioned applications.
亦、一般に合成樹脂成型品は電気抵抗率が大きく(上
記塩素含有樹脂も例外ではなく1015Ωcm程度である)、
摩擦やマスキングフィルムの剥離によって容易に帯電
し、雰囲気中のゴミや埃りを吸着するため、上記用途に
供した場合電子部品等の性能に悪影響を及ぼすこととな
る。Generally, synthetic resin molded products have a large electrical resistivity (the chlorine-containing resins mentioned above are not exceptions and are about 10 15 Ωcm).
It is easily charged by rubbing or peeling of the masking film and adsorbs dust and dirt in the atmosphere, so that when it is used for the above-mentioned purpose, it adversely affects the performance of electronic parts and the like.
本発明は叙上に鑑みなされたもので、従来の金属系安
定剤により安定化された塩素含有樹脂の表面を、PbやSn
などの金属元素を含まない安定剤にて安定化された塩素
含有樹脂と、制電性若しくは導電性材料とにより覆うこ
とにより、金属元素が溶出したり発散せずしかもゴミや
埃り等の付着がなく、上記半導体関連等の用途に極めて
有効且つ安価で新規な塩素含有樹脂成型品を提供せんと
するものである。The present invention has been made in view of the above, the surface of the chlorine-containing resin stabilized by a conventional metal-based stabilizer, Pb and Sn
By covering with chlorine-containing resin stabilized by a stabilizer that does not contain metal elements, and antistatic or conductive materials, metal elements do not elute or diffuse and dust and dirt adhere Therefore, it is an object of the present invention to provide a novel chlorine-containing resin molded product which is extremely effective and inexpensive for the above semiconductor-related applications.
(問題点を解決する為の手段) 上記目的を達成するための本発明塩素含有樹脂成型品
の構成を添付の実施例図に基づき説明すると、第1図は
本発明成型品の一実施例を示す部分切欠縦断面図、第2
図はその適用例を示す部分拡大斜視図である。即ち、本
発明の塩素含有樹脂成型品は、金属系安定剤により安定
化された塩素含有樹脂の基層部1と、アミノカルボン
酸、ヒドラジド、エポキシ化合物及び有機亜燐酸エステ
ル等の非金属系安定剤より選ばれたいずれか一種若しく
は数種により安定化された塩素含有樹脂より成り且つ上
記基層部の片面に積層された非金属被覆層2と、上記基
層部の他面に直接若しくは樹脂フィルムを介して積層さ
れた制電性若しくは導電性被覆層3とより成ることを要
旨とするものである。(Means for Solving the Problems) The structure of the chlorine-containing resin molded product of the present invention for achieving the above object will be described with reference to the accompanying example drawings. FIG. 1 shows an example of the molded product of the present invention. Second partial cutaway vertical section shown
The figure is a partially enlarged perspective view showing an application example thereof. That is, the chlorine-containing resin molded article of the present invention comprises a base layer portion 1 of a chlorine-containing resin stabilized by a metal-based stabilizer and a non-metal-based stabilizer such as aminocarboxylic acid, hydrazide, epoxy compound and organic phosphite ester. A non-metal coating layer 2 composed of a chlorine-containing resin stabilized by any one or several selected from the above and laminated on one surface of the base layer portion, and directly on the other surface of the base layer portion or via a resin film. The gist of the present invention is that it is composed of the antistatic or conductive coating layer 3 laminated as a layer.
(i)基層部1について; 基層部1を構成する塩素含有樹脂は、従来の三塩基性
硫酸鉛、二塩基性ステアリン酸鉛、ステアリン酸鉛等の
鉛系、ステアリン酸亜鉛等の亜鉛系、ステアリン酸バリ
ウム、ステアリン酸カルシウム等のアルカリ土類金属
系、ブチル錫ウラレート、ブチル錫マレート、ブチル錫
メルカプト、オクチル錫ラウレート、オクチル錫マレー
ト、オクチル錫メルカプト等の錫系等の金属系安定剤に
より主に安定化された塩素含有樹脂であり、この塩素含
有樹脂とは、前記のPVC樹脂の他に塩素化塩化ビニル樹
脂、エチレン化塩化ビニル樹脂、他の樹脂とのアロイな
ど、塩化ビニルを主体とする樹脂を云う。斯かる塩素含
有樹脂の重合度は600〜1500の種々のものが採用される
が、物性、加工性等から1000〜1200のものが好ましく採
用される。なお、上記金属系安定剤の他に、エポキシ等
の安定化助剤、滑剤、紫外線吸収剤、可塑剤、顔料等が
従来と同様に適宜添加される。(I) Regarding Base Layer Part 1; The chlorine-containing resin constituting the base layer part 1 is a lead-based material such as conventional tribasic lead sulfate, dibasic lead stearate, lead stearate, or a zinc-based material such as zinc stearate. Alkaline earth metal stabilizers such as barium stearate, calcium stearate, and tin-based metal stabilizers such as butyltin urealate, butyltin malate, butyltin mercapto, octyltin laurate, octyltin malate, and octyltin mercapto. Stabilized chlorine-containing resin, and this chlorine-containing resin is mainly composed of vinyl chloride, such as PVC resin, chlorinated vinyl chloride resin, ethylenized vinyl chloride resin, alloys with other resins, etc. Refers to resin. Various chlorine-containing resins having a degree of polymerization of 600 to 1500 are adopted, but those having a polymerization degree of 1000 to 1200 are preferably used in view of physical properties and processability. In addition to the above metal-based stabilizers, stabilizing aids such as epoxy, lubricants, ultraviolet absorbers, plasticizers, pigments and the like are appropriately added as in the conventional case.
(ii)非金属被覆層2について; 亦、非金属被覆層2を構成する塩素含有樹脂は、上記
の如き非金属系の安定剤にて安定化されるが、この非金
属系安定剤のうち、アミノカルボン酸は、アミノ基とカ
ルボン酸基とを有する化合物の総称であり、このアミノ
基を有する化合物としては、アンモニア、尿素、アクリ
ロニトリル、アミノアセトアニリド、アミノアントラキ
ノン、アミノエタノール、アミノエチレン、アミノエチ
ルベンゼン、アミノクレゾール、アミノフェノール、カ
プロラクタム、等が挙げられ、一方カルボン酸基を有す
る化合物としては、酪酸、カプロン酸、ラウリン酸、パ
ルミチン酸、ステアリン酸、クロトン酸、オレイン酸、
リノレン酸、安息香酸、ナフトル酸、マロン酸、コハク
酸、アジピン酸、マレイン酸、フタル酸等を挙げること
が出来る。また、これらの化合物であるアミノカルボン
酸の代表的なものとしては、アセチルグルタミン酸、グ
リシン、アラニン、ピロリドンカルボン酸、リジン、ア
ルキニン、トリプトファン、アントラニル酸、安息香
酸、β−アミノクロトン酸、α−アミノアクリル酸、α
−アミノアジピン酸、アミノマロイン酸、アセチルフェ
ニルアラニン、アセチルメチオニン及びこれらのエステ
ル化合物、更にアセチルアミノ酸とペンタエリスリトー
ル又はジペンタエリスリトールとのエステル化合物、2
−ピロリドン−5−カルボン酸とペンタエリスリトール
とのエステル化合物等が挙げられる。これらのアミノカ
ルボン酸のうち、β−アミノクロトン酸エステルは、一
般式 但し、n;1〜6 R;1〜6価のアルコールの残基 で示されるものである。また、このエステルを構成する
ROH)nの具体例としては、メタノール、エタノー
ル、プロパノール、イソプロパノール、ブタノール、2
−エチルヘキサノール、イソオクタノール、オクタノー
ル、イソノナノール、デカノール、ラウリルアルコー
ル、ミリスチルアルコール、パルミチルアルコール、ス
テアリルアルコール、エチレングリコール、プロピレン
グリコール、1,3−ブタンジオール、1,4−ブタンジオー
ル、1,6−ヘキサンジオール、1,10−デカンジオール、
ジエチレングリコール、チオジエタノール、トリメチロ
ールプロパン、グリセリン、トリス(2−ヒドロキシエ
チル)イソシアヌレート、トリエタノールアミン、ペン
タエリスリトール、ジトリメタノールプロパン、ジグリ
セリン、ソルビトール、マンニトール、キシリトール、
ジペンタエリスリトールなどが挙げられる。そしてこれ
らのアルコールとβ−アミノクロトン酸とが縮重合して
上記エステルが得られるが、該エステルの望ましい具体
例として、ステアリルアルコールβ−アミノクロトン酸
エステル、1,4ブタンジオールジβ−アミノクロトン酸
エステル、チオジエタノールジβ−アミノクロトン酸エ
ステル、トリメチロールプロパントリβ−アミノクロト
ン酸エステル、ペンタエリスリトールテトラβ−アミノ
クロトン酸エステル、ジペンタエリスリトールヘキサβ
−アミノクロトン酸エステルなどが挙げられる。(Ii) Regarding the non-metal coating layer 2; The chlorine-containing resin constituting the non-metal coating layer 2 is stabilized by the non-metal stabilizer as described above. Aminocarboxylic acid is a general term for compounds having an amino group and a carboxylic acid group, and examples of the compound having this amino group include ammonia, urea, acrylonitrile, aminoacetanilide, aminoanthraquinone, aminoethanol, aminoethylene, aminoethylbenzene. , Aminocresol, aminophenol, caprolactam, and the like, while compounds having a carboxylic acid group include butyric acid, caproic acid, lauric acid, palmitic acid, stearic acid, crotonic acid, oleic acid,
Examples thereof include linolenic acid, benzoic acid, naphthoic acid, malonic acid, succinic acid, adipic acid, maleic acid and phthalic acid. Further, as typical examples of aminocarboxylic acids which are these compounds, acetylglutamic acid, glycine, alanine, pyrrolidonecarboxylic acid, lysine, alkynine, tryptophan, anthranilic acid, benzoic acid, β-aminocrotonic acid, α-amino acid. Acrylic acid, α
-Aminoadipic acid, aminomaleic acid, acetylphenylalanine, acetylmethionine and their ester compounds, and further ester compounds of acetylamino acid and pentaerythritol or dipentaerythritol, 2
Examples include ester compounds of -pyrrolidone-5-carboxylic acid and pentaerythritol. Among these aminocarboxylic acids, β-aminocrotonic acid ester has the general formula However, it is represented by n; 1 to 6 R; a residue of a mono- to hexa-valent alcohol. Specific examples of ROH) n constituting this ester include methanol, ethanol, propanol, isopropanol, butanol,
-Ethylhexanol, isooctanol, octanol, isononanol, decanol, lauryl alcohol, myristyl alcohol, palmityl alcohol, stearyl alcohol, ethylene glycol, propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6- Hexanediol, 1,10-decanediol,
Diethylene glycol, thiodiethanol, trimethylolpropane, glycerin, tris (2-hydroxyethyl) isocyanurate, triethanolamine, pentaerythritol, ditrimethanolpropane, diglycerin, sorbitol, mannitol, xylitol,
Examples include dipentaerythritol. Then, these alcohols and β-aminocrotonic acid are polycondensed to obtain the above-mentioned ester, and preferred specific examples of the ester include stearyl alcohol β-aminocrotonic acid ester and 1,4 butanediol diβ-aminocrotonone. Acid ester, thiodiethanol diβ-aminocrotonic acid ester, trimethylolpropane triβ-aminocrotonic acid ester, pentaerythritol tetra β-aminocrotonic acid ester, dipentaerythritol hexaβ
-Aminocrotonic acid esters and the like.
亦、ヒドラジドは、一般式、 RCONHNH2(Rはアルキル基又はアリール基) で示され、その具体例としては、アセトヒドラジド、酪
酸ヒドラジド、カプロン酸ヒドラジド、ラウリン酸ヒド
ラジド、パルミチン酸ヒドラジド、ステアリン酸ヒドラ
ジド、クロトン酸ヒドラジド、オレイン酸ヒドラジド、
リノレン酸ヒドラジド、安息香酸ヒドラジド、ナフトル
酸ヒドラジド、マロン酸ヒドラジド、コハク酸ヒドラジ
ド、グルタミン酸ヒドラジド、アジピン酸ヒドラジド、
マレイン酸ヒドラジド、フタル酸ヒドラジド等が用いら
れる。Hydrazide is represented by the general formula RCONHNH 2 (R is an alkyl group or an aryl group), and specific examples thereof include acetohydrazide, butyric acid hydrazide, caproic acid hydrazide, lauric acid hydrazide, palmitic acid hydrazide, and stearic acid hydrazide. , Crotonic acid hydrazide, oleic acid hydrazide,
Linolenic acid hydrazide, benzoic acid hydrazide, naphthoic acid hydrazide, malonic acid hydrazide, succinic acid hydrazide, glutamic acid hydrazide, adipic acid hydrazide,
Maleic acid hydrazide, phthalic acid hydrazide, etc. are used.
更にエポキシ化合物としては、エポキシ化動植物油、
エポキシ化脂肪酸エステル、エポキシ化脂環化合物、グ
リシジルエーテル又はグリシジルエステル化合物、エポ
キシ化高分子化合物等のエポキシ化合物等が挙げられ
る。具体的には、エポキシ化動植物油として、エポキシ
化大豆油、エポキシ化アマニ油、エポキシ化サフラワー
油、エポキシ化ひまわり油、エポキシ化綿実油等が、エ
ポキシ化脂肪酸エステルとして、エポキシ化ステアリン
酸ブチル、エポキシ化ステアリン酸オクチル、エポキシ
化アマニ油脂肪酸ブチル等が、エポキシ化脂環化合物と
して、エポキシ化テトラヒドロフタル酸エステル(アル
コールとしてはブタノール、オクタノール、デカノール
等)が、グリシジルエーテル又はグリシジルエステル化
合物としてビスフェノールAグリシジルエーテル、グリ
シジルメタクリレート及びその重合体が、エポキシ化高
分子化合物として、エポキシ化ポリブタジエン、エポキ
シ化アクリロニトリル・ブタジエンゴム等が夫々挙げら
れる。Further, as the epoxy compound, epoxidized animal and vegetable oil,
Examples thereof include epoxidized fatty acid esters, epoxidized alicyclic compounds, glycidyl ether or glycidyl ester compounds, and epoxy compounds such as epoxidized polymer compounds. Specifically, as the epoxidized animal and vegetable oil, epoxidized soybean oil, epoxidized linseed oil, epoxidized safflower oil, epoxidized sunflower oil, epoxidized cottonseed oil and the like, as the epoxidized fatty acid ester, epoxidized butyl stearate, Epoxidized octyl stearate, epoxidized linseed oil fatty acid butyl, etc., epoxidized alicyclic compound, epoxidized tetrahydrophthalic acid ester (butanol, octanol, decanol etc. as alcohol), bisphenol A as glycidyl ether or glycidyl ester compound Examples of glycidyl ether, glycidyl methacrylate and polymers thereof include epoxidized polymer compounds such as epoxidized polybutadiene and epoxidized acrylonitrile-butadiene rubber.
有機亜燐酸エステルとしては、トリフェニルフォスフ
ァイト、トリス(p−フェニルフェニル)フォスファイ
ト、トリス(o−シクロヘキシルフェニル)フォスファ
イト、トリス(p−ノニルフェニル)フォスファイト、
フェニル−p−ノニルフェニルフォスファイト、トリス
(2,4ジtブチルフェニル)フォスファイト等のトリア
リールフォスファイト、モノアルキルジフェニルフォス
ファイトやジアルキルモノフェニルフォスファイト等の
アルキル・アリールフォスファイト、グリコールやポリ
オールやビスフェニールやトリスフェノール等でオリゴ
化されたオリゴフォスファイトやジフェル・アミド・フ
ォスファイトやジラウリル・アミド・フォスファイト等
のアシドフォスファイト等が用いられる。Examples of the organic phosphite include triphenyl phosphite, tris (p-phenylphenyl) phosphite, tris (o-cyclohexylphenyl) phosphite, tris (p-nonylphenyl) phosphite,
Triaryl phosphites such as phenyl-p-nonylphenyl phosphite and tris (2,4 ditbutylphenyl) phosphite, alkyl aryl phosphites such as monoalkyldiphenyl phosphite and dialkylmonophenyl phosphite, glycols and polyols Or oligophosphite oligodated with bisphenyl, trisphenol or the like, and acid phosphite such as difer amide phosphite or dilauryl amide phosphite are used.
他の非金属安定剤としては、フェノール誘導体、多価
アルコール、含窒素化合物、含イオウ化合物、ケト化合
物が用いられる。フェノール誘導体としては、ヒンダー
ドフェノール、ヒンダードビスフェノール等が用いら
れ、多価アルコールとしてはグリセリン、マンニトー
ル、キシリトール、トリメチロールプロパン、ペンタエ
リスリトール、ソルビトール、ポリエチレングリコー
ル、ソルビタンモノラウリレート、グリセリンモノステ
アレート及びカルボン酸との部分エステル化合物、含窒
素多価アルコール、含イオウ多価アルコール等が用いら
れ、含窒素化合物としては、2−フェニールインドー
ル、ジフェニルチオ尿素、トリアジン等が用いられ、含
イオウ化合物としては、チオジプロピオン酸エステル、
トリアジンチオール、チオールカルボン酸無水物等が、
ケト化合物としては、アセト醋酸エステル、デヒドロ醋
酸、β−ジケトン等が採用される。As other non-metal stabilizers, phenol derivatives, polyhydric alcohols, nitrogen-containing compounds, sulfur-containing compounds and keto compounds are used. As the phenol derivative, hindered phenol, hindered bisphenol, etc. are used, and as the polyhydric alcohol, glycerin, mannitol, xylitol, trimethylolpropane, pentaerythritol, sorbitol, polyethylene glycol, sorbitan monolaurate, glycerin monostearate and Partial ester compounds with carboxylic acids, nitrogen-containing polyhydric alcohols, sulfur-containing polyhydric alcohols and the like are used, and as the nitrogen-containing compound, 2-phenylindole, diphenylthiourea, triazine and the like are used, and as the sulfur-containing compound, , Thiodipropionate,
Triazine thiol, thiol carboxylic acid anhydride, etc.
As the keto compound, acetoacetic acid ester, dehydroacetic acid, β-diketone and the like are adopted.
これらの安定剤は、塩素含有樹脂100重量部に対し合
計で0.5乃至7.0重量部添加され塩素含有樹脂を主に安定
化するが、これらの安定剤にはPbやSnなどの金属元素が
何等含まれないことで特徴づけられる。該安定剤の塩素
含有樹脂に対する適正な添加量は上記の通りであるが、
0.5重量部未満の場合熱安定性が充分に得られず、一
方、7.0重量部を超えると熱安定性はそれだけ向上する
が経済的に不利となる。尚、これらの安定剤のうち、ア
ミノカルボン酸、ヒドラジド、エポキシ化合物、有機亜
燐酸アステルを単独又は組合せて用いる場合には0.5乃
至5重量部、望ましくは1.0乃至3.0重量部の範囲で、ま
たフェノール誘導体、多価アルコール、含窒素化合物、
含イオウ化合物、ケト化合物を単独又は上記安定剤と組
み合わせて用いる場合には2乃至7重量部、望ましくは
3乃至5重量部の範囲で用いられる。これらの安定剤
は、夫々単独若しくは組み合わせて用いられるが、組み
合わせる場合には、アミノカルボン酸及びエポキシ化合
物の組合せ、アミノカルボン酸、エポキシ化合物及び有
機亜燐酸エステルの組合せ、ヒドラジド、エポキシ化合
物及び有機亜燐酸エステルの組合せ、そしてエポキシ化
合物及び有機亜燐酸エステルの組合せ等が望ましく採用
される。These stabilizers add 0.5 to 7.0 parts by weight in total to 100 parts by weight of the chlorine-containing resin to mainly stabilize the chlorine-containing resin, but these stabilizers do not contain metal elements such as Pb and Sn. It is characterized by not being able to. The proper amount of the stabilizer added to the chlorine-containing resin is as described above,
If it is less than 0.5 parts by weight, sufficient thermal stability cannot be obtained. On the other hand, if it exceeds 7.0 parts by weight, the thermal stability is improved, but it is economically disadvantageous. Among these stabilizers, in the case of using aminocarboxylic acid, hydrazide, epoxy compound, and organic aspart phosphite alone or in combination, 0.5 to 5 parts by weight, preferably 1.0 to 3.0 parts by weight, and phenol Derivative, polyhydric alcohol, nitrogen-containing compound,
When the sulfur-containing compound or keto compound is used alone or in combination with the above stabilizer, it is used in an amount of 2 to 7 parts by weight, preferably 3 to 5 parts by weight. These stabilizers may be used alone or in combination, and when they are combined, a combination of aminocarboxylic acid and epoxy compound, a combination of aminocarboxylic acid, epoxy compound and organic phosphite, hydrazide, epoxy compound and organic sulfite are used. A combination of a phosphoric acid ester, a combination of an epoxy compound and an organic phosphorous acid ester, and the like are desirably adopted.
亦、上記塩素含有樹脂には、成型時の金型からの離型
を良くする為及び成型品の仕上り外観(特に、艶、光沢
等)を良くする為、ステアリン酸で代表される高級脂肪
酸や、軟化温度を低下させないアクリル系滑剤が用いら
れる。Moreover, in order to improve the release from the mold at the time of molding and to improve the finished appearance (especially luster, gloss, etc.) of the molded product, the chlorine-containing resin described above contains higher fatty acids such as stearic acid. An acrylic lubricant that does not lower the softening temperature is used.
前記のような安定剤は主安定剤として塩素含有樹脂の
熱安定性に寄与し、また滑剤は樹脂に滑性を付与する
が、その他の金属を含まない添加剤、例えば、アミン
系、フェノール系、イオウ系、燐系等の抗酸化剤、紫外
線吸収剤等の光安定剤、フタル酸エステル、芳香族カル
ボン酸エステル、脂肪族二塩基エステル等の可塑剤、透
明用のABS・MBS等の補強剤、顔料、助剤、防黴剤、発泡
剤等の添加剤を添加して、塩素含有樹脂の安定化を助長
し、加工性を良くし、耐候性を向上させ、機械的特性を
向上させたり或は軟質化し、発泡させたりすることがで
きる。The above-mentioned stabilizers contribute to the thermal stability of the chlorine-containing resin as a main stabilizer, and the lubricant imparts lubricity to the resin, but other metal-free additives, for example, amine-based and phenol-based additives. , Sulfur-based, phosphorus-based antioxidants, light stabilizers such as UV absorbers, phthalates, aromatic carboxylic esters, plasticizers such as aliphatic dibasic esters, reinforcement of ABS / MBS for transparency, etc. Add additives such as agents, pigments, auxiliaries, antifungal agents, and foaming agents to help stabilize the chlorine-containing resin, improve processability, improve weather resistance, and improve mechanical properties. Or it can be softened and foamed.
(iii)制電性又は導電性被覆層3について; (iii−1)制電性又は導電性被覆層3は、本出願人に
係る特願昭58−91182号で提案した制電性合成樹脂シー
トの製法による技術を応用して基層部1上に形成させた
ものが望ましく採用される。即ち、SnO2、TiO2、In2O3
及びZnO等の導電性酸化物若しくはAu、Pt、Cu、Pd及びN
i等の金属微粉を分散させた導電性塗料を基層部1上に
塗布・乾燥させ、上記の微粉を塗膜の表面部位に存置さ
せ、続いて厚み方向にホットプレスして上記表面部位の
微粉を塗膜内側に圧入させると共に表面部位の塗膜を軟
化圧延させることにより形成するか、或いは別の合成樹
脂フィルムに上記導電性塗料を塗布・乾燥させ基層部1
と積層一体化させる時に上記同様にホットプレスし微粉
を内側に圧入させるようにして形成したものが採用され
る。この場合被覆層3の電気低効率は104〜105Ωcmとな
る。(Iii) Regarding antistatic or conductive coating layer 3; (iii-1) The antistatic or conductive coating layer 3 is an antistatic synthetic resin proposed in Japanese Patent Application No. 58-91182 filed by the present applicant. What was formed on the base layer part 1 by applying the technique according to the manufacturing method of the sheet is preferably adopted. That is, SnO 2 , TiO 2 , In 2 O 3
And conductive oxides such as ZnO or Au, Pt, Cu, Pd and N
A conductive coating material in which fine metal powder such as i is dispersed is applied on the base layer portion 1 and dried, and the fine powder is left on the surface portion of the coating film, and subsequently hot pressed in the thickness direction to fine powder on the surface portion. Is formed by press-fitting the inside of the coating film and softening and rolling the coating film on the surface portion, or by coating and drying the above-mentioned conductive coating on another synthetic resin film to form the base layer portion 1
In the same manner as described above, when it is laminated and integrated, the one formed by hot pressing to press fine powder into the inside is adopted. In this case, the electrical low efficiency of the coating layer 3 is 10 4 to 10 5 Ωcm.
(iii−2)また、体積固有抵抗率の小なるゴム幹重合
体にビニル単量体又はビニリデン単量体をグラフト重合
することによって得られたクラフト共重合体又はこのグ
ラフト共重合体にこれと相溶性のある熱可塑性樹脂を相
溶させて得た制電性樹脂を基層部1にラミネートして形
成させることも可能である。この場合被覆層3の電気抵
抗率は、1011〜1013Ωcmとなる。上記ゴム幹重合体は、
4〜500個のアレキレンオキサイド基を有する単量体10
〜50重量%と共役ジエン及びアクリル酸エステルから選
ばれた1種以上の単量体50〜90重量%から成る共重合体
である。このゴム幹重合体の相が加工時に枝重合体相中
に互いにブリッジ状態をなして分散しており、電荷が主
としてこのゴム幹重合体相中を通って拡散、減衰するこ
とにより制電効果を発揮する。しかもポリアルキレンオ
キサイド基はゴム幹重合体に化学的に結合しているので
過酷な水洗等によっても制電性が低下することがなくこ
れにより永久的な帯電防止効果をも保有するものであ
る。上記グラフト共重合体は単独でも使用可能である
が、基層部1との積層性或は表面硬度を勘案してこれに
熱可塑性樹脂を相溶させて用いることが望ましい。この
熱可塑性樹脂は、グラフト共重合体と相溶性のある樹脂
であれば特に限定されないが、基層部1の塩素含有樹脂
に対し積層性の良いPVC樹脂、ポリ塩化ビニリデン樹
脂、ニトリル樹脂、表面硬度に優れるポリメチルメタク
リレート樹脂及びその共重合体、アクリル−スチレン−
ブタジエン樹脂等が好ましく、とりわけ上記非金属被覆
層2で採用された非金属系安定剤で安定化された塩素含
有樹脂は、金属が含有していないこと、積層性が良好な
こと、耐薬品性に優れていることなどにより最も好まし
く採用される。この熱可塑性樹脂とグラフト共重合体と
の配合割合は、グラフト共重合体10〜99重量部に対し、
熱可塑性樹脂は90〜1重量部が適当であるが、グラフト
共重合体と熱可塑性樹脂との合計量に対して上記ゴム幹
重合体が5〜80重量%、好ましくは8〜60重量%含まれ
るように配合することが肝要である。(Iii-2) Further, a kraft copolymer obtained by graft-polymerizing a vinyl monomer or a vinylidene monomer onto a rubber trunk polymer having a small volume resistivity or a graft copolymer thereof, It is also possible to laminate the base layer 1 with an antistatic resin obtained by making compatible thermoplastic resins compatible with each other. In this case, the electric resistivity of the coating layer 3 is 10 11 to 10 13 Ωcm. The rubber trunk polymer is
Monomer having 4 to 500 alkylene oxide groups 10
It is a copolymer composed of 50 to 90% by weight and 50 to 90% by weight of one or more monomers selected from conjugated dienes and acrylates. The phase of this rubber trunk polymer is dispersed in the branched polymer phase in a bridge state during processing, and the charge is diffused and attenuated mainly through this rubber trunk polymer phase, thereby providing an antistatic effect. Demonstrate. Moreover, since the polyalkylene oxide group is chemically bonded to the rubber trunk polymer, the antistatic property is not deteriorated even by rigorous washing with water, so that it also has a permanent antistatic effect. Although the above graft copolymer can be used alone, it is preferable to use a thermoplastic resin compatible with it in consideration of the layerability with the base layer portion 1 or the surface hardness. The thermoplastic resin is not particularly limited as long as it is a resin compatible with the graft copolymer, but PVC resin, polyvinylidene chloride resin, nitrile resin, surface hardness having good lamination properties with respect to the chlorine-containing resin of the base layer part 1. Excellent polymethylmethacrylate resin and its copolymer, acrylic-styrene-
Butadiene resin and the like are preferable, and in particular, the chlorine-containing resin stabilized by the non-metal-based stabilizer used in the non-metal coating layer 2 contains no metal, has good lamination properties, and has chemical resistance. It is most preferably adopted because it is excellent. The blending ratio of the thermoplastic resin and the graft copolymer is 10 to 99 parts by weight of the graft copolymer,
90 to 1 parts by weight of the thermoplastic resin is suitable, but 5 to 80% by weight, preferably 8 to 60% by weight of the rubber trunk polymer is contained in the total amount of the graft copolymer and the thermoplastic resin. It is essential to mix them as described above.
(iii−3)その他、PVC樹脂、ポリ塩化ビニリデン樹
脂、ニトリル樹脂、ポリメチルメタクリレート樹脂及び
その共重合体、アクリル−スチレン−ブタジエン樹脂等
の合成樹脂に、導電性カーボン、グラファイト、カーボ
ン繊維及び金属繊維等の導電性フィラーを単独若しくは
適宜組み合わせてブレンドし、基層部1にラミネートす
ることによっても形成される。この場合の被覆層3の電
気抵抗率は、102Ωcm以下とすることができる。(Iii-3) In addition, PVC resin, polyvinylidene chloride resin, nitrile resin, polymethylmethacrylate resin and its copolymer, synthetic resin such as acryl-styrene-butadiene resin, conductive carbon, graphite, carbon fiber and metal It is also formed by blending conductive fillers such as fibers alone or in an appropriate combination and laminating the blended on the base layer portion 1. In this case, the electric resistivity of the coating layer 3 can be 10 2 Ωcm or less.
上述の如く基層部1及び被覆層2、3用に調製された
材料は、成型時に積層一体化され所望の形状に成型され
る。ここで所望形状とは、第1図に示す如き板状体、或
は第2図に示す如き箱型ケース、その他パイプやアング
ルやブロック状のものなど上記用途に供される全ての部
材の形状を含むものである。The materials prepared for the base layer portion 1 and the coating layers 2 and 3 as described above are laminated and integrated at the time of molding and molded into a desired shape. Here, the desired shape means the shape of a plate-like body as shown in FIG. 1 or a box-shaped case as shown in FIG. Is included.
ここで板状体での成型方法の例を示せば、上記(iii
−1)で示した導電性塗料をPVCフィルム若しくはアク
リル樹脂フィルムに塗布・乾燥し、これと(i)による
複数のPVCカレンダーシート及び(ii)によるカレンダ
ーシートを積層し、ホットプレスにて積層一体とする方
法、或は(ii)によるカレンダーシートと(i)による
複数のPVCカレンダーシートとをプレス成型にて積層一
体とした後、その片面に(iii−1)による導電性塗料
を塗布・乾燥する方法などが挙げられる。Here, if an example of the molding method with a plate-like body is shown, the above (iii
The conductive paint shown in -1) is applied to a PVC film or an acrylic resin film and dried, and a plurality of PVC calender sheets according to (i) and a calender sheet according to (ii) are laminated and laminated by hot pressing. Or a plurality of calender sheets according to (ii) and a plurality of PVC calender sheets according to (i) are laminated by press molding, and the conductive paint according to (iii-1) is applied and dried on one side. The method of doing is mentioned.
この場合、その用途にもよるが、少なくとも前記薬液
或は食品等に接触する側には、非金属被覆層2が向くよ
う配置させることが必要であり、特に箱型ケースやパイ
プ等では内側に非金属被覆層2がくるように成型する必
要がある。In this case, it is necessary to arrange the non-metal coating layer 2 so as to face at least the side in contact with the drug solution or food, depending on its use. It is necessary to mold so that the non-metal coating layer 2 comes.
その他、本発明の成型品は、その用途に応じて透明、
不透明乃至不透明の成型品として供給されるが、その為
には基層部1或いは/及び非金属被覆層2に適宜着色剤
を添加する必要がある。非金属被覆層2は、それ自体透
明であるが、これを着色したい場合は、非金属系の各種
着色剤、例えば、有機顔料、アクリル変性改質剤、ABS
樹脂、MBS樹脂、AAS樹脂、AES樹脂、ACS樹脂、AS樹脂、
EVA樹脂、カーボンブラック等が適宜添加される。亦、
基層部1には上記着色剤の他に酸化チタン等の金属を含
んだ通常の顔料等が適宜添加される。なお、基層部1は
非金属被覆層2と同色となるように調色することが好ま
しい。In addition, the molded article of the present invention is transparent depending on its use,
It is supplied as an opaque or opaque molded product, but for that purpose, it is necessary to appropriately add a colorant to the base layer portion 1 and / or the non-metal coating layer 2. The non-metal coating layer 2 is transparent by itself, but if it is desired to color the non-metal coating layer 2, various non-metal colorants such as organic pigments, acrylic modified modifiers, and ABS are used.
Resin, MBS resin, AAS resin, AES resin, ACS resin, AS resin,
EVA resin, carbon black, etc. are appropriately added. also,
In addition to the above colorants, ordinary pigments containing a metal such as titanium oxide are appropriately added to the base layer portion 1. In addition, it is preferable that the base layer portion 1 is toned to have the same color as the non-metal coating layer 2.
(作用) 上記の如く得られた本発明成型品は、その成型時に塩
素含有樹脂の温度が150−200℃になる為、樹脂中に安定
剤が含まれていないと樹脂構造のHとClとが遊離して脱
塩酸し、樹脂が黄変乃至黒変する。しかし本発明成型品
の基層部1及び非金属被覆層2を構成する塩素含有樹脂
は、上記夫々の安定剤により熱安定性が付与されている
から、成型時の温度上昇によっても変色することがな
い。(Function) In the molded product of the present invention obtained as described above, the temperature of the chlorine-containing resin becomes 150 to 200 ° C. at the time of molding, so that H and Cl of the resin structure are formed unless the stabilizer is contained in the resin. Are released and dehydrochlorinated, and the resin turns yellow or black. However, since the chlorine-containing resin constituting the base layer portion 1 and the non-metal coating layer 2 of the molded product of the present invention is provided with thermal stability by the above-mentioned respective stabilizers, it may be discolored even when the temperature rises during molding. Absent.
そして非金属被覆層2を構成する塩素含有樹脂には、
実質的に金属元素が含まれないから、前記用途に用いる
場合、薬液や食品等に対し該被覆層2が接触するように
これを用いれば、これら薬液若しくは食品等にPbやSnな
どの有害な金属元素が溶出することがなく、これによる
種々の悪影響も懸念されることがないのである。The chlorine-containing resin that constitutes the non-metal coating layer 2 includes
Since it does not substantially contain a metal element, when it is used for the above-mentioned applications, if it is used so that the coating layer 2 comes into contact with a liquid medicine or food, harmful liquid such as Pb or Sn may be added to the liquid medicine or food. The metal element does not elute, and there are no fears of various adverse effects.
尚、ここで実質的に金属を含まないと云う表現を用い
たのは、塩素含有樹脂、安定剤、滑剤或は着色剤等を製
造する際、及び上記成型の際に意図的ではなく不可避的
な範囲で微量の金属が混入することがあり、最終成型品
中に金属が皆無とは言えないからである。In addition, the expression that it is substantially free of metal is used here when the chlorine-containing resin, the stabilizer, the lubricant, the colorant or the like is produced, and when the molding is performed, it is not intentional but unavoidable. This is because a trace amount of metal may be mixed in such a range that the metal cannot be said to be completely absent in the final molded product.
亦、制電性若しくは導電性被覆層3は、帯電防止機能
を有し、雰囲気中のゴミや埃り等を吸着する懸念がな
く、上記被覆層2の非金属である特性と相俟って前記半
導体関連等の用途に極めて好適である。特に該被覆層3
を上記(iii−1)により形成した場合、その電気抵抗
率が低く良好な帯電防止効果が得られる。また(iii−
2)によるグラフト共重合体を用いた場合、水洗等の過
酷な条件で用いても永久的に帯電防止機能が損われるこ
とがなく、更に該グラフト共重合体に熱可塑性樹脂を併
用すれば、ゴム幹重合体が熱可塑性樹脂に埋め込まれる
ようになり、帯電防止機能の永久的な持続性が確実なも
のとなる。Further, the antistatic or conductive coating layer 3 has an antistatic function, has no fear of adsorbing dust and dirt in the atmosphere, and is coupled with the non-metal characteristic of the coating layer 2. It is extremely suitable for the above-mentioned semiconductor-related applications. Especially the coating layer 3
Is formed by the above (iii-1), its electric resistivity is low and a good antistatic effect is obtained. Also (iii−
When the graft copolymer according to 2) is used, even if it is used under severe conditions such as washing with water, the antistatic function is not permanently impaired, and if a thermoplastic resin is used in combination with the graft copolymer, The rubber trunk polymer comes to be embedded in the thermoplastic resin, ensuring the permanent durability of the antistatic function.
亦、基層部1は従来の金属系安定剤により安定化され
た塩素含有樹脂により構成されるから、その本来の優れ
た剛性が成型品に発現され、また該樹脂の熱柔軟(熱変
形)温度が高いことから使用温度を高くしても成型品が
変形することがなく、更にコストダウンにも寄与する。Moreover, since the base layer part 1 is composed of a chlorine-containing resin stabilized by a conventional metal-based stabilizer, its original excellent rigidity is exhibited in a molded product, and the temperature of the resin is heat-flexible (heat-deformation) temperature. Since the temperature is high, the molded product does not deform even if the operating temperature is raised, which further contributes to cost reduction.
亦、基層部1には着色剤(顔料)を自由に添加して、
透明、不透明、さらには着色できるので、成型品もそれ
に応じた形態にすることが可能である。非金属被覆層2
は非金属系の着色剤を添加しなければならないので不透
明にする為には前記樹脂を多量に添加しなければならな
いし、また色相も自由に選択することはできず、更に制
電性若しくは導電性被覆層3はその性能を出す材料に限
定される為に色相が自由にならず、また厚みもコスト的
な面から薄くしなければならず、これらのみでは不透明
性、着色性に問題があるが基層部1を中間層とすること
で上記のように解決される。加えて基層部1は金属系安
定剤を使用するので耐熱性が良くて厚みを厚くすること
ができ、成型品の厚みも厚くできる。なお、基層部1に
用いる塩素含有樹脂はSn系の安定剤を用いて安定化させ
ることが、非金属被覆層2との積層性、加工性、ソリ、
二次加工性(曲げ、溶接)にすぐれて好ましい。Also, a colorant (pigment) can be freely added to the base layer part 1,
Since it can be transparent, opaque, and even colored, the molded product can be shaped accordingly. Non-metal coating layer 2
Since a non-metallic colorant must be added, a large amount of the above resin must be added to make it opaque, and the hue cannot be freely selected. Since the functional coating layer 3 is limited to the material that exerts its performance, the hue cannot be freely set, and the thickness must be thin from the viewpoint of cost, and there is a problem in opacity and colorability only with these. Is solved as described above by using the base layer portion 1 as the intermediate layer. In addition, since the base layer portion 1 uses a metal-based stabilizer, it has good heat resistance and can be thickened, and the molded product can be thickened. The chlorine-containing resin used for the base layer portion 1 should be stabilized by using a Sn-based stabilizer to improve the stackability with the non-metal coating layer 2, workability, warpage,
Excellent in secondary workability (bending, welding) and preferable.
(実施例) 次に実施例について述べる。(Example) Next, an example will be described.
(I)テストピースの調製 (i)基層部1用の塩素含有樹脂を第1表の配合で調製
した。(I) Preparation of test piece (i) A chlorine-containing resin for the base layer portion 1 was prepared according to the formulation shown in Table 1.
(ii)非金属被覆層2用の塩素含有樹脂を第2表の配合
で調製した。 (Ii) A chlorine-containing resin for the non-metal coating layer 2 was prepared according to the formulation shown in Table 2.
(iii)制電性若しくは導電性被覆層3用の材料を次の
如く調製した。 (Iii) A material for the antistatic or conductive coating layer 3 was prepared as follows.
(iii−1)粒径0.1μm以下の導電性SnO2の微粉15%
(重量…以下同じ)、ポリエステル樹脂8%、分散剤0.
6%、溶剤76.4%より成る導電性塗料を調製し、これを
厚み0.3mmのPVCフィルムの片面にロールコータ法により
塗装し、約60℃で数分間乾燥した(イ)。(Iii-1) 15% fine particles of conductive SnO 2 with a particle size of 0.1 μm or less
(Weight ... same below), polyester resin 8%, dispersant 0.
A conductive paint consisting of 6% of solvent and 76.4% of solvent was prepared, and this was coated on one side of a PVC film having a thickness of 0.3 mm by a roll coater method and dried at about 60 ° C for several minutes (a).
(iii−2)グラフト共重合体〔呉羽化学工業(株)
製、商品名;RRY−009〕100%のもの(ロ)、及び該共重
合体50重量部と上記第2表中のと同等の樹脂50重量部
とをブレンドしたもの(ハ)を厚さ0.25mmシートとし
た。(Iii-2) Graft copolymer [Kureha Chemical Industry Co., Ltd.
Manufactured by RRY-009] 100% (B), and a blend of 50 parts by weight of the copolymer and 50 parts by weight of a resin equivalent to those in Table 2 above (C). It was a 0.25 mm sheet.
(iii−3)上記第2表中のと同等の樹脂100重量部に
大日本インキ化学工業(株)製、ケッチェンブラック10
重量部をブレンドしたもの(ニ)を厚さ0.5mmのシート
とした。(Iii-3) Ketjen Black 10 manufactured by Dainippon Ink and Chemicals, Inc. in 100 parts by weight of the resin as shown in Table 2 above.
A sheet having a thickness of 0.5 mm was prepared by blending parts by weight (d).
(iv)(i)及び(ii)の配合樹脂を夫々カレンダーロ
ール(160℃×5分)で0.5mmのシート状となし、(i)
のシートを16枚重ね、その片面に(ii)のシートを4枚
積層し、更に他面に(iii)のフィルムを積層しプレス
(160℃×5分)にて加熱・加圧成型して厚さ約10mmの
テストピースとし、これらを組み合わせて成るテストピ
ースを実施例1乃至21とした。但しその組み合わせ態様
は後記する。(Iv) Forming the blended resin of (i) and (ii) into a 0.5 mm sheet by calender rolls (160 ° C x 5 minutes), respectively (i)
16 sheets are laminated, 4 sheets of (ii) are laminated on one side, and a film of (iii) is laminated on the other side and heated and pressed by a press (160 ° C x 5 minutes). A test piece having a thickness of about 10 mm was prepared, and the test pieces formed by combining these were taken as Examples 1 to 21. However, the combination mode will be described later.
(v)第1表aの配合樹脂による厚さ0.5mmのシートの
みを20枚重ね合わせ、これを(iv)と同様に加熱・加圧
成型して厚さ10mmのテストピースとし、これを比較例
(1)とした。(V) Only 20 sheets with a thickness of 0.5 mm made of the compounded resin of Table 1 a are stacked, and this is heated and pressed to form a test piece with a thickness of 10 mm in the same manner as (iv), and this is compared. The example (1) was adopted.
(II)熱安定性の測定 上記(iv)及び(v)の加熱成型によって得たテスト
ピースについてその外表面の色相変化を観察した。結果
を第4表に示す。(II) Measurement of thermal stability The hue change of the outer surface of the test pieces obtained by the heat molding of (iv) and (v) above was observed. The results are shown in Table 4.
但し、実施例の後の括弧書き内におけるa、bは第1
表における基層部1の種類を、乃至は第2表におけ
る非金属被覆層2の種類を、イ乃至ニは上記(I)−
(iii)で示した制電性若しくは導電性被覆層3の種類
を夫々表す。尚、色相変化の判定は非金属被覆層2の表
面で行なった。 However, a and b in parentheses after the embodiment are the first
The type of the base layer portion 1 in the table, or the type of the non-metal coating layer 2 in Table 2, and a to d are the above (I)-
Each of the types of the antistatic or conductive coating layer 3 shown in (iii) is shown. The change in hue was determined on the surface of the non-metal coating layer 2.
この第4表で理解される通り、実施例13乃至16及び2
1、22においては色相変化は見られず、比較例1と同様
の熱安定性を示した。また17乃至20は極くわずかに黄味
を帯び、実施例1乃至8及び9乃至12はわずかに黄味を
帯び、実施例5乃至8は黄味を帯びて比較例1より若干
熱安定性に劣っているが、熱圧成型性には何等問題がな
かった。また何れのテストピースも積層性に優れてい
た。As can be seen in this Table 4, Examples 13 to 16 and 2
In Nos. 1 and 22, no hue change was observed, and the same thermal stability as in Comparative Example 1 was exhibited. In addition, 17 to 20 are very slightly yellowish, Examples 1 to 8 and 9 to 12 are slightly yellowish, and Examples 5 to 8 are yellowish and are slightly more heat stable than Comparative Example 1. Although it was inferior to the above, there was no problem in thermocompression moldability. In addition, all the test pieces were excellent in stackability.
(III)一般物性の測定 上記実施例13、14、15、16、21、22及び比較例1のテ
ストピースについて一般物性を測定した。その結果を第
5表に示す。但し、実施例16、22については表面抵抗率
と全光線透過率のみを測定した。(III) Measurement of General Physical Properties General physical properties of the test pieces of Examples 13, 14, 15, 16, 21, 22 and Comparative Example 1 were measured. Table 5 shows the results. However, in Examples 16 and 22, only the surface resistivity and the total light transmittance were measured.
上記第5表で理解される通り、13、14、15は比較例1
と比べてほぼ同等の物性値を示し、従来のPVC板と同じ
ように使用出来ることがわかる。実施例21はシャルピー
値が約2倍となり耐衝撃板として使用できることがわか
る。 As can be seen in Table 5 above, 13, 14, and 15 are comparative examples 1
Compared with, it shows almost the same physical property values, and it can be seen that it can be used in the same way as conventional PVC plates. It can be seen that Example 21 has a Charpy value about twice and can be used as an impact resistant plate.
亦、実施例13、21は表面抵抗率が107Ω−cmであり良
好な制電性を示す。一方実施例14、15の表面抵抗率はい
ずれも1011Ω−cmであり、ゴミや埃りを吸着しない程度
の制電機能を有している。更に、実施例16の表面抵抗率
は102Ω−cmであり、導電機能を有していることがわか
る。また、実施例21は全光線透過率が低く非透光性であ
ることがわかる。さらに実施例22は全く光線を通さず不
透明であることがわかる。In addition, Examples 13 and 21 have a surface resistivity of 10 7 Ω-cm and exhibit good antistatic property. On the other hand, the surface resistivities of Examples 14 and 15 are both 10 11 Ω-cm, and have an antistatic function to the extent that dust and dirt are not adsorbed. Further, the surface resistivity of Example 16 is 10 2 Ω-cm, which shows that it has a conductive function. Further, it can be seen that Example 21 has a low total light transmittance and is non-translucent. Further, it can be seen that Example 22 is opaque because it does not transmit any light rays.
(V)溶出テスト 上記実施例13、14、15、比較例1及びPbを主安定剤と
するPVC樹脂にて比較例1と同様に別途調製したサンプ
ル(比較例2とする)を純水中に浸し、溶出した微量金
属を原子吸光法及びICP発光分析法にて分析した。但
し、第2図に示す如く非金属被覆層を内側にして容器状
に成型しその中に純水を充たして行なった。その結果を
第6表に示す。(V) Elution test Samples prepared separately in the same manner as in Comparative Example 1 (referred to as Comparative Example 2) using the above-mentioned Examples 13, 14, 15 and Comparative Examples 1 and PVC resin containing Pb as the main stabilizer in pure water. A trace amount of the metal thus eluted was analyzed by atomic absorption spectrometry and ICP emission spectrometry. However, as shown in FIG. 2, the non-metal coating layer was placed inside and molded into a container, and pure water was filled therein. The results are shown in Table 6.
この第6表から理解される通り、実施例13、14、15か
らは金属が溶出されなかった。また、比較例1、2から
はその安定剤に含まれるSn或はPbが溶出した。更にこの
溶出テスト済の実施例13、14、15のサンプルについて再
度上記表面抵抗率を測定したが変化はなかった。 As can be seen from Table 6, no metal was eluted from Examples 13, 14, and 15. Further, from Comparative Examples 1 and 2, Sn or Pb contained in the stabilizer was eluted. Further, the surface resistivity of the samples of Examples 13, 14 and 15 which had been subjected to the dissolution test was measured again, but there was no change.
尚、上記実施例以外の安定剤を用いたPVC樹脂につい
ても上記と同様の試験をしたところ略同様の結果を得
た。In addition, the same test was performed on the PVC resin using the stabilizer other than the above examples, and substantially the same result was obtained.
(発明の効果) 叙上のごとく、本発明の塩素含有樹脂成型品はPbやSn
などの金属化合物を安定剤として含む塩素含有樹脂の基
層部と、その片面に積層一体とされた非金属被覆層と、
他面に積層一体とされた制電性若しくは導電性被覆層と
より成るから、これを半導体、生化学、医療、医薬、食
品等の関連機器等の用途に用いる場合に、上記非金属被
覆層を酸や純水と接する側に、即ち酸や純水による処理
面になるように、或いは外装材として用いる場合は上記
機器が設置された側に非金属被覆層がなるように用いれ
ば、これら処理液等に金属元素が溶出したり、溶解した
りする懸念がなく、また他面の制電性若しくは導電性被
覆層によって帯電防止効果が付与されるから雰囲気中の
ゴミや埃り等が吸着されず、更に基層部によって塩素含
有樹脂が本来有する安価で強靭な特性及び耐薬品性・二
次加工性に優れた特性が維持され、これらの特性が総和
されて上記用途関連の機器等に対する適正が飛躍的に増
大する。斯かる優れた性能を有する本発明塩素含有樹脂
成型品は有用性極めて大である。(Effects of the Invention) As described above, the chlorine-containing resin molded product of the present invention contains Pb and Sn.
A base layer portion of a chlorine-containing resin containing a metal compound such as a stabilizer, and a non-metal coating layer integrally laminated on one surface thereof,
Since it is composed of an antistatic or conductive coating layer integrally laminated on the other surface, the nonmetal coating layer is used when it is used for related devices such as semiconductors, biochemistry, medical care, pharmaceuticals, foods, etc. If the non-metal coating layer is used on the side in contact with acid or pure water, that is, on the surface treated with acid or pure water, or on the side where the above equipment is installed when used as an exterior material, There is no concern that metal elements will elute or dissolve in the treatment liquid, etc., and the antistatic or conductive coating layer on the other surface will give an antistatic effect, so dust and dirt in the atmosphere will be adsorbed. In addition, the base layer maintains the inexpensive and tough properties inherent in chlorine-containing resins and the excellent chemical resistance and secondary processability, and these properties are summed up to be suitable for equipment related to the above applications. Will increase dramatically. The chlorine-containing resin molded product of the present invention having such excellent performance is extremely useful.
第1図は本発明成型品の一実施例を示す部分切欠縦断面
図、第2図はその適用例を示す部分拡大斜視図である。 (符号の説明) 1……基層部、2……非金属被覆層、3……制電性若し
くは導電性被覆層。FIG. 1 is a partially cutaway vertical sectional view showing an embodiment of the molded product of the present invention, and FIG. 2 is a partially enlarged perspective view showing an application example thereof. (Description of symbols) 1 ... Base layer, 2 ... Non-metal coating layer, 3 ... Antistatic or conductive coating layer.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08L 27/06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display area C08L 27/06
Claims (1)
樹脂の基層部と、アミノカルボン酸、ヒドラジド、エポ
キシ化合物及び有機亜燐酸エステル等の非金属系安定剤
より選ばれたいずれか一種若しくは数種により安定化さ
れた塩素含有樹脂より成り且つ上記基層部の片面に積層
された非金属被覆層と、上記基層部の他面に直接若しく
は樹脂フィルムを介して積層された制電性若しくは導電
性被覆層とより成る塩素含有樹脂成型品。1. A base layer portion of a chlorine-containing resin stabilized by a metal stabilizer and any one selected from non-metal stabilizers such as aminocarboxylic acid, hydrazide, epoxy compound and organic phosphite, or A non-metal coating layer made of a chlorine-containing resin stabilized by several kinds and laminated on one surface of the base layer portion, and an antistatic or conductive material laminated directly on the other surface of the base layer portion or through a resin film. Molded chlorine-containing resin product with a hydrophilic coating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62180574A JPH0813530B2 (en) | 1987-07-20 | 1987-07-20 | Chlorine-containing resin molded product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62180574A JPH0813530B2 (en) | 1987-07-20 | 1987-07-20 | Chlorine-containing resin molded product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6424745A JPS6424745A (en) | 1989-01-26 |
| JPH0813530B2 true JPH0813530B2 (en) | 1996-02-14 |
Family
ID=16085656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62180574A Expired - Lifetime JPH0813530B2 (en) | 1987-07-20 | 1987-07-20 | Chlorine-containing resin molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0813530B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3579155B2 (en) * | 1995-01-18 | 2004-10-20 | 東芝セラミックス株式会社 | Tools for firing |
-
1987
- 1987-07-20 JP JP62180574A patent/JPH0813530B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6424745A (en) | 1989-01-26 |
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