JP2607191B2 - Method for measuring deep impurity levels in semiconductors - Google Patents
Method for measuring deep impurity levels in semiconductorsInfo
- Publication number
- JP2607191B2 JP2607191B2 JP30697791A JP30697791A JP2607191B2 JP 2607191 B2 JP2607191 B2 JP 2607191B2 JP 30697791 A JP30697791 A JP 30697791A JP 30697791 A JP30697791 A JP 30697791A JP 2607191 B2 JP2607191 B2 JP 2607191B2
- Authority
- JP
- Japan
- Prior art keywords
- transient
- semiconductor
- signal
- deep impurity
- weighting function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 25
- 239000012535 impurity Substances 0.000 title claims description 15
- 230000001052 transient effect Effects 0.000 claims description 33
- 230000008859 change Effects 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 7
- 230000006870 function Effects 0.000 description 21
- 102100031920 Dihydrolipoyllysine-residue succinyltransferase component of 2-oxoglutarate dehydrogenase complex, mitochondrial Human genes 0.000 description 16
- 101000992065 Homo sapiens Dihydrolipoyllysine-residue succinyltransferase component of 2-oxoglutarate dehydrogenase complex, mitochondrial Proteins 0.000 description 16
- 238000001773 deep-level transient spectroscopy Methods 0.000 description 16
- 230000010354 integration Effects 0.000 description 11
- 238000005259 measurement Methods 0.000 description 9
- 238000000691 measurement method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002368 isothermal capactiance transient spectroscopy Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、半導体の深い不純物準
位測定方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring a deep impurity level in a semiconductor.
【0002】[0002]
【従来の技術】半導体の深い不純物準位は、半導体の特
性、信頼性、劣化などに大きな影響を与える。近年、半
導体集積回路の高密度化に伴い、イオン注入、熱中性子
によるドーピングなどにより半導体を製造する工程中に
発生する各種の欠陥あるいは結晶その物に存在する欠陥
の電気特性に関して、非常に高感度で、かつ、簡便に動
的性質まで精度よく測定する必要が生じてきている。2. Description of the Related Art Deep impurity levels in a semiconductor greatly affect the characteristics, reliability and deterioration of the semiconductor. In recent years, with the increase in the density of semiconductor integrated circuits, very high sensitivity has been achieved regarding the electrical characteristics of various defects generated during the semiconductor manufacturing process due to ion implantation, thermal neutron doping, etc. or defects present in crystals themselves. In addition, there is a need to easily and accurately measure dynamic properties.
【0003】これらの要求に沿うものの一つとして、ラ
ング(Lang)が提案した半導体の深い不純物準位測定方
法(以下、DLTS測定方法と云う)がある。図2は、
DLTS測定方法を実施するための装置を示し、この図
において、1はクライオスタットで、その内部には試料
としての半導体2が設けられている。3はクライオスタ
ット1内の半導体2近傍の温度を検出する温度センサ
で、このセンサ3の出力は温度コントローラ4に入力さ
れ、これに基づいてクライオスタット1内の温度は所望
の温度に設定される。5は半導体2の容量変化を測定す
る過渡容量計で、トランジェントコンバータを内蔵して
いる。6は信号処理装置としてのコンピュータ、7は出
力装置である。As one of those requirements, there is a method for measuring a deep impurity level of a semiconductor (hereinafter, referred to as a DLTS measurement method) proposed by Lang. FIG.
1 shows an apparatus for performing a DLTS measurement method. In this figure, reference numeral 1 denotes a cryostat, in which a semiconductor 2 as a sample is provided. Reference numeral 3 denotes a temperature sensor for detecting the temperature near the semiconductor 2 in the cryostat 1. The output of the sensor 3 is input to a temperature controller 4, and the temperature in the cryostat 1 is set to a desired temperature based on the output. Reference numeral 5 denotes a transient capacitance meter for measuring a change in the capacitance of the semiconductor 2, and has a built-in transient converter. 6 is a computer as a signal processing device, and 7 is an output device.
【0004】前記ラングのDLTS測定方法は、上記装
置を用いて、図3(A)に示すようなバイアスパルスを
半導体2に印加して半導体2を多数のキャリアで埋め、
バイアスパルスの立ち下がりに伴って同図(B)に示す
ような半導体接合容量の過渡変化出力を過渡容量計5に
よって得る。そして、コンピュータ6内において、前記
過渡変化出力に、同図(C)に示すようなダブルボック
スカー型と呼ばれるパルス幅t1 ,t2 が狭く、パルス
間隔の離れた重みづけ関数信号を乗じて、その積により
深い不純物準位信号(以下、DLTS信号と云う)を得
る方法である。According to the Lang's method for measuring DLTS, a bias pulse as shown in FIG. 3A is applied to the semiconductor 2 using the above-described apparatus, and the semiconductor 2 is filled with a large number of carriers.
With the falling of the bias pulse, a transient change output of the semiconductor junction capacitance as shown in FIG. Then, in the computer 6, the transient change output is multiplied by a weighting function signal having a narrow pulse width t 1 , t 2 called a double boxcar type as shown in FIG. , And a product thereof to obtain a deep impurity level signal (hereinafter, referred to as a DLTS signal).
【0005】なお、前記図3において、V0 はバイアス
パルスの電圧、VR は逆バイアス電圧、T1 はバイアス
パルス印加時間(パルス幅)、C1 はバイアスパルスの
印加時における接合容量、C∞は逆バイアス電圧印加後
に達成された定常状態での接合容量、C0 はV0 からV
R への逆バイアス電圧印加直後の接合容量、C0 ´は容
量計リレーの応答特性により得られる最低の接合容量で
ある。In FIG. 3, V 0 is the bias pulse voltage, V R is the reverse bias voltage, T 1 is the bias pulse application time (pulse width), C 1 is the junction capacitance when the bias pulse is applied, ∞ is the junction capacitance in the steady state achieved after application of the reverse bias voltage, and C 0 is from V 0 to V
The junction capacitance immediately after the application of the reverse bias voltage to R , C 0 ′, is the minimum junction capacitance obtained from the response characteristics of the capacitance meter relay.
【0006】このようなラングのDLTS測定方法に
は、従来の他の方法に比較して、検出感度、測定の早
さ、解析の容易さ、2つ以上の深い不純物準位を分離し
て測定できるなどといった優れた利点がある。しかしな
がら、この測定方法においては、アナログのみで装置を
構成すると、ダブルボックスカーを用いるので、装置が
著しく高温になる。また、DLTS信号のS/Nが十分
とはいえない欠点があった。[0006] Such a Lang's DLTS measurement method is different from other conventional methods in that detection sensitivity, measurement speed, ease of analysis, and measurement by separating two or more deep impurity levels. There are excellent advantages such as being able to. However, in this measurement method, if the device is constituted only by analog, the temperature of the device becomes extremely high because a double box car is used. Further, there is a disadvantage that the S / N of the DLTS signal is not sufficient.
【0007】これに対して、キメリング(Kimerling )
により、ロックインアンプを用いるDLTS測定方法が
提案されている。この方法は、図3(D)に示すような
バイアスパルスの1周期を1周期T´として、バイアス
パルスの立ち上がり時に立ち上がる矩形波状の重みづけ
関数信号を用いて、過渡容量計5から得られる同図
(B)に示すような半導体接合容量の過渡変化出力に重
みづけ関数を乗じて、その積によりDLTS信号出力を
得る方法である。On the other hand, Kimerling
Has proposed a DLTS measurement method using a lock-in amplifier. In this method, one cycle of the bias pulse as shown in FIG. 3 (D) is defined as one cycle T ′, and a rectangular wave weighting function signal which rises when the bias pulse rises is used and obtained from the transient capacitance meter 5. This is a method of obtaining a DLTS signal output by multiplying a transient change output of the semiconductor junction capacitance by a weighting function as shown in FIG.
【0008】このようなキメリングの測定方法は、装置
が比較的安価であり、DLTS信号出力のS/Nも改善
されている。しかしながら、この測定方法では、得られ
たDLTS信号から求められるトラップ準位などのデー
タを得るために、ある定数の決定などの手続きを必要と
し、データ解析が複雑になると共に、過渡容量計5の応
答性による誤差が混入し、この誤差の分離が容易でない
などの欠点がある。In such a method for measuring chimering, the equipment is relatively inexpensive and the S / N of the DLTS signal output is improved. However, in this measurement method, a procedure such as determination of a certain constant is required in order to obtain data such as a trap level obtained from the obtained DLTS signal, which complicates data analysis and makes the transient capacitance meter 5 There is a drawback that an error due to responsiveness is mixed in and the error is not easily separated.
【0009】上記従来の測定方法の欠点を解消するもの
として、特公昭58− 10853号公報に開示されたDLTS
測定方法がある。この方法は、重みづけ関数信号とし
て、図3(E)に示すようなバイアスパルスの印加時間
T1 と過渡容量計5の応答予定時間Td との和の時間
(T1 +Td )だけ連続的にゼロにして前記応答予定時
間Td 後に立ち上がって矩形波状に変化し、応答予定時
間Td 後から次のバイアスパルスの立ち上がり時までを
1サイクルとして変化する信号を用いている。[0009] To solve the above-mentioned drawbacks of the conventional measuring method, a DLTS disclosed in Japanese Patent Publication No. 58-10853 is disclosed.
There is a measurement method. According to this method, as a weighting function signal, a continuous time (T 1 + T d ) of the sum of the application time T 1 of the bias pulse and the expected response time T d of the transient capacitance meter 5 as shown in FIG. A signal that rises to zero and rises after the expected response time Td and changes in a rectangular waveform, and changes from the expected response time Td to the rising of the next bias pulse in one cycle is used.
【0010】しかしながら、この公報に記載の方法にお
いては、前記重みづけ関数は、定積分がゼロになるよう
に定める必要があるが、積分区間を分割して行う積分す
る必要があると共に、この重みづけ関数を、離散的なデ
ータに対して適用した場合、定積分がゼロになるように
するのに、極めて複雑な操作が必要となるなど、測定手
順が煩雑である他、測定精度がよくないといった不都合
がある。However, in the method described in this publication, the weighting function needs to be determined so that the definite integration becomes zero. When applying the weighting function to discrete data, the measurement procedure is complicated and the measurement accuracy is not good, for example, extremely complicated operation is required to make the definite integral zero. There is such a disadvantage.
【0011】本発明は、上述の事柄に留意してなされた
もので、その目的とするところは、数値積分の精度が優
れ、しかも、測定手順が簡易な半導体の深い不純物準位
測定方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned matters, and an object of the present invention is to provide a method for measuring a deep impurity level of a semiconductor which has an excellent numerical integration accuracy and a simple measurement procedure. Is to do.
【0012】[0012]
【課題を解決するための手段】上記目的を達成するた
め、本発明においては、半導体にバイアスパルスを印加
し、このバイアスパルスの立ち下がりに伴って発生する
半導体接合容量の過渡変化を過渡容量計で測定し、この
過渡容量計から得られる過渡変化出力に重みづけ関数信
号を乗じて深い不純物準位信号を得て半導体の深い不純
物準位を測定する方法において、前記重みづけ関数信号
として、前記過渡容量計の応答時間後、任意の異なる2
点を定めることで定義できる三角波状に変化する信号を
用いるようにしている。In order to achieve the above object, in the present invention, a bias pulse is applied to a semiconductor, and a transient capacitance meter measures a transient change in a semiconductor junction capacitance caused by a fall of the bias pulse. In a method of measuring a deep impurity level of a semiconductor by obtaining a deep impurity level signal by multiplying the transient change output obtained from this transient capacitance meter by a weighting function signal, the weighting function signal, After the transient capacitance meter response time,
A signal that changes in a triangular wave shape that can be defined by defining a point is used.
【0013】[0013]
【作用】本発明に係る半導体の深い不純物準位測定方法
においては、過渡容量計から得られる過渡変化出力に乗
ぜられる重みづけ関数信号として、図1(B)に示すよ
うに変化する三角波信号を用いている。従って、重みが
かかる所が重みづけ関数の領域の両端で絶対値的に最も
大きくなるため、波形分離が良好に行われる。また、波
形処理のときの定積分の領域が重みづけ関数の両端のポ
イントのみで決まるため、前記公報に記載された方法の
ように、積分区間を分割して積分を行う必要がないの
で、手順が簡単である。そして、数値積分の精度がよ
く、重みづけ関数の二乗の定積分の面積が大きいことと
あいまって、S/Nが大幅に向上する。In the semiconductor deep impurity level measuring method according to the present invention, a triangular wave signal changing as shown in FIG. 1B is used as a weighting function signal to be multiplied by a transient change output obtained from a transient capacitance meter. Used. Therefore, the place where the weight is applied becomes the largest in absolute value at both ends of the area of the weighting function, so that the waveform separation is performed well. Also, since the area of definite integration at the time of waveform processing is determined only by the points at both ends of the weighting function, it is not necessary to perform integration by dividing the integration interval as in the method described in the above-mentioned publication. Is easy. The accuracy of numerical integration is good, and the area of definite integration of the square of the weighting function is large, so that the S / N is greatly improved.
【0014】[0014]
【実施例】以下、本発明の実施例を、図面を参照しなが
ら説明する。Embodiments of the present invention will be described below with reference to the drawings.
【0015】本発明に係る半導体の深い不純物準位測定
方法は、図2に示したものと同様の装置を用いるが、過
渡容量計5から得られる過渡変化出力に乗ぜられる重み
づけ関数として、過渡容量計5の応答時間後、任意の異
なる2点を定めることで定義できる三角波状に変化する
信号を用いた点が従来の方法と大きく異なる。The method for measuring the deep impurity level of a semiconductor according to the present invention uses the same apparatus as that shown in FIG. 2, but uses a transient function as a weighting function to be multiplied by the transient output obtained from the transient capacitance meter 5. The difference from the conventional method is that a signal that changes in a triangular waveform, which can be defined by defining any two different points after the response time of the capacitance meter 5, is used.
【0016】測定は、半導体2の温度を一定のレートで
変化させながら、半導体2の過渡容量波形を採取する。
図1(A)は、このとき得られる過渡容量の波形の一例
を示す図である。この図において、横軸は時間t、縦軸
は過渡容量C(t)をそれぞれ示す。過渡容量計5には
トランジェントコンバータが内蔵されているので、ディ
ジタル化された過渡波形がコンピュータ6に送られ、メ
モリに記憶される。そして、コンピュータ6において
は、前記ディジタル化された過渡波形に対して、同図
(B)に示すように、三角波状に変化する重みづけ関数
w(t)が乗ぜられる。In the measurement, a transient capacitance waveform of the semiconductor 2 is collected while changing the temperature of the semiconductor 2 at a constant rate.
FIG. 1A is a diagram showing an example of a waveform of the transient capacitance obtained at this time. In this figure, the horizontal axis represents time t, and the vertical axis represents transient capacitance C (t). Since the transient capacity meter 5 has a built-in transient converter, a digitized transient waveform is sent to the computer 6 and stored in the memory. Then, the computer 6 multiplies the digitized transient waveform by a weighting function w (t) that changes like a triangular wave, as shown in FIG.
【0017】すなわち、コンピュータ6内部に記憶され
た複数の過渡波形データC1 ,C2 ,…Cn に対して、
それぞれ次の計算が行われる。[0017] That is, a plurality of transient waveforms stored inside the computer 6 data C 1, C 2, with respect ... C n,
The following calculations are performed respectively.
【0018】[0018]
【数1】 (Equation 1)
【0019】これによって、ある温度Tでのレートウイ
ンドtr ,tj におけるDLTS信号(以下、DLTS
(T)と云う)が算出される。これを複数のレートウイ
ンドーに対して行うことにより、複数のDLTS(T)
が得られる。このデータを掃引される温度Tに対してプ
ロットすることにより、DLTS波形を得ることができ
る。[0019] Thus, rate window t r at a certain temperature T, DLTS signal at t j (hereinafter, DLTS
(Referred to as (T)) is calculated. By performing this for a plurality of rate windows, a plurality of DLTS (T)
Is obtained. By plotting this data against the temperature T to be swept, a DLTS waveform can be obtained.
【0020】[0020]
【発明の効果】以上説明したように、本発明方法におい
ては、重みづけ関数として三角波状に変化する信号を用
いているから、重みがかかる所が重みづけ関数の領域の
両端で絶対値的に最も大きくなるため、波形分離が良好
に行われる。また、波形処理のときの定積分の領域が重
みづけ関数の両端のポイントのみで決まるため、積分区
間を分割して積分を行う必要がないので、手順が簡単で
ある。そして、数値積分の精度がよく、重みづけ関数の
二乗の定積分の面積が大きいこととあいまって、S/N
が大幅に向上する。その結果、精度の高い測定を簡便に
行うことができる。As described above, in the method of the present invention, since a signal that changes in a triangular wave shape is used as the weighting function, the place where the weight is applied is the absolute value at both ends of the area of the weighting function. Since it is the largest, waveform separation is performed well. In addition, since the area of definite integration at the time of waveform processing is determined only by the points at both ends of the weighting function, it is not necessary to divide the integration section and perform integration, thereby simplifying the procedure. The accuracy of the numerical integration is good, and the area of the definite integral of the square of the weighting function is large.
Is greatly improved. As a result, highly accurate measurement can be easily performed.
【0021】なお、本発明方法は、DLTS測定のみな
らず、ICTS(等温過渡容量測定)法にも適用するこ
とができる。The method of the present invention can be applied not only to DLTS measurement but also to ICTS (isothermal transient capacitance measurement) method.
【図1】(A)は過渡容量の波形の一例を示す図であ
り、(B)は本発明で用いる重みづけ関数を示す図であ
る。FIG. 1A is a diagram showing an example of a waveform of a transient capacitance, and FIG. 1B is a diagram showing a weighting function used in the present invention.
【図2】半導体の深い不純物準位測定方法を実施する装
置の構成を示す図である。FIG. 2 is a diagram showing a configuration of an apparatus for implementing a method for measuring a deep impurity level of a semiconductor.
【図3】(A)〜(E)は、従来技術を説明するための
図である。FIGS. 3A to 3E are diagrams for explaining a conventional technique.
w(t)…重みづけ関数。 w (t): weighting function.
Claims (1)
バイアスパルスの立ち下がりに伴って発生する半導体接
合容量の過渡変化を過渡容量計で測定し、この過渡容量
計から得られる過渡変化出力に重みづけ関数信号を乗じ
て深い不純物準位信号を得て半導体の深い不純物準位を
測定する方法において、前記重みづけ関数信号として、
前記過渡容量計の応答時間後、任意の異なる2点を定め
ることで定義できる三角波状に変化する信号を用いるこ
とを特徴とする半導体の深い不純物準位測定方法。1. A bias pulse is applied to a semiconductor, and a transient change in a semiconductor junction capacitance caused by a fall of the bias pulse is measured by a transient capacitance meter, and a weight is assigned to a transient change output obtained from the transient capacitance meter. In a method of measuring a deep impurity level of a semiconductor by obtaining a deep impurity level signal by multiplying a weighting function signal, as the weighting function signal,
A method for measuring a deep impurity level in a semiconductor, comprising using a signal that changes in a triangular wave shape that can be defined by defining any two different points after the response time of the transient capacitance meter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30697791A JP2607191B2 (en) | 1991-10-25 | 1991-10-25 | Method for measuring deep impurity levels in semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30697791A JP2607191B2 (en) | 1991-10-25 | 1991-10-25 | Method for measuring deep impurity levels in semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05121507A JPH05121507A (en) | 1993-05-18 |
| JP2607191B2 true JP2607191B2 (en) | 1997-05-07 |
Family
ID=17963543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30697791A Expired - Lifetime JP2607191B2 (en) | 1991-10-25 | 1991-10-25 | Method for measuring deep impurity levels in semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2607191B2 (en) |
-
1991
- 1991-10-25 JP JP30697791A patent/JP2607191B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05121507A (en) | 1993-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0656643B1 (en) | Method for determining the minority carrier surface recombination lifetime constant(ts) of a specimen of semiconductor material | |
| Wagner et al. | Fast digital apparatus for capacitance transient analysis | |
| US3620069A (en) | Method and apparatus for measuring the damping characteristics of a structure | |
| JP2607191B2 (en) | Method for measuring deep impurity levels in semiconductors | |
| Hakkinen et al. | Theoretical and experimental investigation of random gust loads part I: aerodynamic transfer function of a simple wing configuration in incompressible flow | |
| JP2943474B2 (en) | Waveform analysis method | |
| JP2579280B2 (en) | Calibration method for SQUID magnetometer | |
| US6469492B1 (en) | Precision RMS measurement | |
| Afanasenko et al. | Online Degradation Detection and Estimation of SiC Power MOSFET based on TSEP | |
| CN111856237B (en) | A deep-level transient spectrum testing method, device and storage medium | |
| JPS5948542B2 (en) | Method for measuring deep impurity levels in semiconductors | |
| CN104766809A (en) | PN node transient capacitance energy spectrum measuring method and system | |
| EP0517023B1 (en) | Isothermal capacitance transient spectroscopy | |
| SU1765788A1 (en) | Method for measuring contact potential difference | |
| JPS6134101B2 (en) | ||
| JP3071875B2 (en) | IC test equipment | |
| SU974296A1 (en) | Device for measuring ac voltage curve shape coefficient | |
| JPS5810853B2 (en) | Method for measuring deep impurity levels in semiconductors | |
| JPH0475467B2 (en) | ||
| Fogle et al. | Development of a temperature scale below 0.5 K | |
| Ritchie et al. | Instrumentation and techniques for the measurement of low frequency internal friction | |
| Fothergill et al. | A simple method for correcting time constant errors incurred in step scan systems | |
| CN115420769A (en) | Seebeck coefficient testing method of infrared thermopile sensor | |
| JPS61149869A (en) | Waveform analysis system | |
| JPH03290944A (en) | Apparatus for measurement of deep level in semiconductor |