JP3837455B2 - Epoxy resin coating flooring - Google Patents
Epoxy resin coating flooring Download PDFInfo
- Publication number
- JP3837455B2 JP3837455B2 JP32945399A JP32945399A JP3837455B2 JP 3837455 B2 JP3837455 B2 JP 3837455B2 JP 32945399 A JP32945399 A JP 32945399A JP 32945399 A JP32945399 A JP 32945399A JP 3837455 B2 JP3837455 B2 JP 3837455B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- compound
- ether
- group
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000576 coating method Methods 0.000 title claims description 43
- 239000011248 coating agent Substances 0.000 title claims description 38
- 229920000647 polyepoxide Polymers 0.000 title claims description 35
- 239000003822 epoxy resin Substances 0.000 title claims description 28
- 238000009408 flooring Methods 0.000 title claims description 25
- -1 amino compound Chemical class 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 39
- 125000004432 carbon atom Chemical group C* 0.000 claims description 33
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 26
- 125000003700 epoxy group Chemical group 0.000 claims description 17
- 125000000623 heterocyclic group Chemical group 0.000 claims description 17
- 150000004292 cyclic ethers Chemical group 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 7
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- 125000004434 sulfur atom Chemical group 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 239000003085 diluting agent Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 239000012024 dehydrating agents Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims 2
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 229920000768 polyamine Polymers 0.000 description 25
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 24
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 18
- 239000000126 substance Substances 0.000 description 15
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical group S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 10
- 101150065749 Churc1 gene Proteins 0.000 description 10
- 102100038239 Protein Churchill Human genes 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 150000002391 heterocyclic compounds Chemical class 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 8
- 150000002989 phenols Chemical class 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 150000007514 bases Chemical class 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 150000002170 ethers Chemical class 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- 125000005263 alkylenediamine group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 2
- XVBLEUZLLURXTF-UHFFFAOYSA-N 2,4-dimethylbenzene-1,3-diamine Chemical compound CC1=CC=C(N)C(C)=C1N XVBLEUZLLURXTF-UHFFFAOYSA-N 0.000 description 2
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 2
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 2
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 2
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000003915 air pollution Methods 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000004816 latex Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- MERIEQHLDYSVSR-UHFFFAOYSA-N n-[[2-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C(=CC=CC=1)CN(CC1OC1)CC1OC1)CC1CO1 MERIEQHLDYSVSR-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 150000002921 oxetanes Chemical class 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 150000008442 polyphenolic compounds Chemical class 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000002987 primer (paints) Substances 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000001302 tertiary amino group Chemical group 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- PFTAWBLQPZVEMU-DZGCQCFKSA-N (+)-catechin Chemical compound C1([C@H]2OC3=CC(O)=CC(O)=C3C[C@@H]2O)=CC=C(O)C(O)=C1 PFTAWBLQPZVEMU-DZGCQCFKSA-N 0.000 description 1
- LJCJRRKKAKAKRV-UHFFFAOYSA-N (2-amino-2-methylpropyl) 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(N)COC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 LJCJRRKKAKAKRV-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- PDZGUDFYWJIFLV-PPHPATTJSA-N (4r)-1-methyl-4-prop-1-en-2-ylcyclohexene;phenol Chemical compound OC1=CC=CC=C1.CC(=C)[C@@H]1CCC(C)=CC1 PDZGUDFYWJIFLV-PPHPATTJSA-N 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
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Description
【0001】
【発明が属する技術分野】
本発明は塗り床材に関する。さらに詳しくは新規なエポキシ系樹脂からなる塗り床材に関する。
【0002】
【従来の技術】
従来、塗り床材としては使用方法および施工方法の簡便性を考慮して、アクリル樹脂系塗り床材を代表とする一液型の塗り床材が汎用されている。
【発明が解決しようとする課題】
【0003】
ところが、従来の塗り床材は揮発性有機溶剤を使用する場合が多く、この種の一液型塗り床材で補修を繰り返すと、塗膜が厚くなり塗り重ねる塗り床材に含有されている溶剤が蓄積した塗膜を軟化膨潤させ、このため乾燥が極めて遅くなって使用に耐えられないという事態が発生する。
また、前記の一液型塗り床材を塗布した後に、耐久性や仕上がり性の高度化を求めるために反応型塗材、例えばエポキシ樹脂系塗材やウレタン樹脂系塗材を塗り重ねようとする場合にも、同様に反応型塗材に含まれる溶剤が積層塗膜を溶解、膨潤軟化させ、いつまでも塗膜硬度が発現されなかったり、リフティング等の不都合な事態が生じる。
また、大気汚染問題が取り上げられる今日、このような溶剤を使用しない塗り床材が望まれている。
【0004】
本発明は、これらの問題を解決するものであり、さらに5℃のような低温でも塗布及び硬化が可能であり、適度な可使時間を有し、かつ低粘度で作業性が良好であり、接着性に優れたエポキシ樹脂系塗り床材を提供するものである。
【0005】
【課題を解決するための手段】
本発明者らは、上記目的を達成すべく鋭意検討を重ねた結果、本発明に到達した。
すなわち、本発明は、下記一般式(1)で表されるヘテロ環含有化合物(A)、分子中に2個以上のエポキシ基を有するポリエポキシ化合物(B)、並びに分子中にアミノ基に由来する活性水素を2個以上有するアミノ化合物(C)からなることを特徴とするエポキシ樹脂系塗り床材である。
【0006】
【化5】
【0007】
[式(1)中、nは1〜10の整数、X1、Y1及びZ1は、それぞれ独立に酸素又は硫黄原子;R1は環状エーテル基含有化合物(D)の残基又は水素原子;R2は炭素数2〜10の炭化水素基である。]
【0008】
【発明の実施の形態】
本発明においてヘテロ環含有化合物(A)は、前記一般式(1)で示される。式中、nは1〜10の整数、好ましくは2〜8の整数である。X1、Y1及びZ1は、それぞれ酸素又は硫黄原子である。好ましくはX1が硫黄原子(S)で、Y1、Z1の一方が硫黄原子(S)で他方が酸素原子(O)である。
R2 は、環状エーテル基中の酸素原子以外の環を構成する残基である。これは炭素数2〜10の炭化水素基であり、3価の炭化水素基>CH(CH2)m−(mは1〜9の整数)で示される基であり、例えば>CHCH2−、>CHCH2CH2−、>CHCH2CH2CH2−、>CHCH2CH2CH2CH2CH2−等;4価の炭化水素基>CH(CH2)mCH<(mは0〜8の整数)で示される基であり、例えば>CHCH<、>CHCH2CH<、>CHCH2CH2CH<、>CHCH2CH2CH2CH2CH<等が挙げられ、好ましくは3価の炭化水素基であり、特に好ましくは>CHCH2−、>CHCH2CH2−である。
R1 は水素原子又は環状エーテル基含有化合物(D)の残基であり、一般式(5)で示される。
一般式
【0009】
【化6】
【00010】
環状エーテル基としては、環内に酸素原子を1個以上有するものならば特に限定されず、例えば分子内に環状エーテル基を1〜10個有する化合物があげられる。
環状エーテル基含有化合物(D)の例としては、後述するエポキシ基含有化合物(D1)、及びオキセタン化合物(D2)等が挙げられ、好ましくは、エポキシ基含有化合物(D1)である。
エポキシ基含有化合物(D1)としては、モノエポキサイド(d11)と分子中にエポキシ基を2個以上有するポリエポキサイド(D11)とがある。
モノエポキサイド(d11)としては、分子中に1個のエポキシ基を有していれば特に限定されず、用途、目的に応じて適宜選択することができる。その例としては以下のものが挙げられる。例えば、
(d11−1)炭素数2〜24の炭化水素系オキシド(エチレンオキシド、プロピレンオキシド、1−ブテンオキシド、2−ブテンオキシド、炭素数5〜24のα−オレフィンオキシド、スチレンオキシド等)、
(d11−2)炭素数3〜19の炭化水素のグリシジルエーテル(n−ブチルグリシジルエーテル、アリルグリシジルエーテル、2−エチル−ヘキシルグリシジルエーテル、2−メチルオクチルグリシジルエーテル、フェニルグリシジルエーテル、クレジルグリシジルエーテル、p−sec−ブチルフェニルグリシジルエーテル、p−tert−ブチルフェニルグリシジルエーテル等)、
(d11−3)炭素数3〜30のモノカルボン酸のグリシジルエステル(グリシジルアクリレート、グリシジルメタクリレート等)、エピクロルヒドリン、エピブロモヒドリン等のエピハロヒドリン及びグリシドール等の水酸基含有オキシド等が挙げられる。好ましいのは炭素数2〜24の炭化水素系オキシド、炭素数3〜19の炭化水素のグリシジルエーテルである。
【0011】
ポリエポキサイド(D11)は、分子中に2個以上のエポキシ基を有していれば特に限定されず、用途、目的に応じて適宜選択することができる。好ましくは分子中にエポキシ基を2〜6個有するものである。ポリエポキサイドのエポキシ当量(エポキシ基1個当たりの分子量)は、通常65〜1000であり、好ましくは90〜500である。エポキシ当量が1000以下であると、架橋構造がルーズにならず硬化物の耐水性、耐薬品性、機械的強度等の物性が良好であり、一方、エポキシ当量が65以上であると硬化物の耐水性、耐薬品性、機械的強度等が良好な架橋構造となる。
ポリエポキサイド(D11)の例としては、下記(D11−1)から(D11−5)が挙げられる。
【0012】
(D11−1)グリシジルエーテル型
(i)2価フェノール類のジグリシジルエーテル 炭素数6〜30の2価フェノール類のジグリシジルエーテル例えば、ビスフェノールFジグリシジルエーテル、ビスフェノールAジグリシジルエーテル、ビスフェノールBジグリシジルエーテル、ビスフェノールADジグリシジルエーテル、ビスフェノールSジグリシジルエーテル、ハロゲン化ビスフェノールAジグリシジルエーテル、テトラクロロビスフェノールAジグリシジルエーテル、カテキンジグリシジルエーテル、レゾルシノールジグリシジルエーテル、ハイドロキノンジグリシジルエーテル、1,5−ジヒドロキシナフタレンジグリシジルエーテル、ジヒドロキシビフェニルジグリシジルエーテル、オクタクロロ−4,4’−ジヒドロキシビフェニルジグリシジルエーテル、テトラメチルビフェニルジグリシジルエーテル、9,9’−ビス(4−ヒドロキシフェニル)フロオレンジグリシジルエーテル、ビスフェノールA2モルとエピクロロヒドリン3モルの反応から得られるジグリシジルエーテル等が挙げられる。
【0013】
(ii)3価〜6価又はそれ以上の、多価フェノール類のポリグリシジルエーテル
炭素数6〜50又はそれ以上で、分子量250〜5000の3価〜6価又はそれ以上の多価フェノール類のポリグリシジルエーテル例えば、ピロガロールトリグリシジルエーテル、ジヒドロキシナフチルクレゾールトリグリシジルエーテル、トリス(ヒドロキシフェニル)メタントリグリシジルエーテル、ジナフチルトリオールトリグリシジルエーテル、テトラキス(4−ヒドロキシフェニル)エタンテトラグリシジルエーテル、p−グリシジルフェニルジメチルトリールビスフェノールAグリシジルエーテル、トリスメチル−tert−ブチル−ブチルヒドロキシメタントリグリシジルエーテル、4,4’−オキシビス(1,4−フェニルエチル)テトラクレゾールグリシジルエーテル、4,4’−オキシビス(1,4−フェニルエチル)フェニルグリシジルエーテル、ビス(ジヒドロキシナフタレン)テトラグリシジルエーテル、フェノール又はクレゾールノボラック樹脂(分子量400〜5000)のグリシジルエーテル、リモネンフェノールノボラック樹脂(分子量400〜5000)のグリシジルエーテル、フェノールとグリオキザール、グルタールアルデヒド、又はホルムアルデヒドの縮合反応によつて得られるポリフェノール(分子量400〜5000)のポリグリシジルエーテル、及びレゾルシンとアセトンの縮合反応によって得られる分子量400〜5000のポリフェノールのポリグリシジルエーテル等が挙げられる。
【0014】
(iii)脂肪族2価アルコールのジグリシジルエーテル
炭素数2〜100、分子量150〜5000のジオールのジグリシジルエーテル例えば、エチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、テトラメチレングリコールジグリシジルエーテル、1,6−ヘキサンジオールジグリシジルエーテル、ポリエチレングリコール(分子量150〜4000)ジグリシジルエーテル、ポリプロピレングリコール(分子量180〜5000)ジグリシジルエーテル、ポリテトラメチレングリコール(分子量200〜5000)ジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、ビスフェノールAのアルキレンオキシド〔エチレンオキシド又はプロピレンオキシド(1〜20モル)〕付加物のジグリシジルエーテル等が挙げられる。
(iv)3価〜6価又はそれ以上の脂肪族アルコールのポリグリシジルエーテル
炭素数3〜50又はそれ以上で、分子量92〜10000の3価〜6価又はそれ以上の多価アルコール類のグリシジルエーテル例えば、トリメチロールプロパントリグリシジルエーテル、グリセリントリグリシジルエーテル、ペンタエリスリトールテトラグリシジルエーテル、ソルビトールヘキサグリシジルエーテル、ポリ(n=2〜5)グリセロールポリグリシジルエーテル等が挙げられる。
【0015】
(D11−2)グリシジルエステル型
炭素数6〜20又はそれ以上で、2価〜6価又はそれ以上の芳香族ポリカルボン酸のグリシジルエステル、及び炭素数6〜20又はそれ以上で、2価〜6価又はそれ以上の脂肪族もしくは脂環式ポリカルボン酸のグリシジルエステルが挙げられる。
(i)芳香族ポリカルボン酸、例えばフタル酸類のグリシジルエステルとしては、フタル酸ジグリシジルエステル、イソフタル酸ジグリシジルエステル、テレフタル酸ジグリシジルエステル、トリメリット酸トリグリシジルエステル等;
(ii)脂肪族もしくは脂環式ポリカルボン酸のグリシジルエステルとしては、上記フェノール系のグリシジルエステルの芳香核水添加物、ダイマー酸ジグリシジルエステル、ジグリシジルオキサレート、ジグリシジルマレート、ジグリシジルスクシネート、ジグリシジルグルタレート、ジグリシジルアジペート、ジグリシジルピメレート、グリシジル(メタ)アクリレートの(共)重合体(重合度は例えば2〜10)、トリカルバリル酸トリグリシジルエステル等が挙げられる。
【0016】
(D11−3)グリシジルアミン型
炭素数6〜20又はそれ以上で、2〜10又はそれ以上の活性水素原子をもつ芳香族アミン類のグリシジルアミン及び脂肪族、脂環式若しくは複素環式アミン類のグリシジルアミンが挙げられる。
(i)芳香族アミン類のグリシジルアミンとしては、N,N−ジグリシジルアニリン、N,N−ジグリシジルトルイジン、N,N,N’,N’−テトラグリシジルジアミノジフェニルメタン、N,N,N’,N’−テトラグリシジルジアミノジフェニルスルホン、N,N,N’,N’−テトラグリシジルジエチルジフェニルメタン、N,N,O−トリグリシジルアミノフェノール等;
(ii)脂肪族アミン類のグリシジルアミンとしては、N,N,N’,N’−テトラグリシジルキシリレンジアミン、N,N,N’,N’−テトラグリシジルヘキサメチレンジアミン等;
(iii)脂環式アミン類のグリシジルアミンとしては、N,N,N’,N’−テトラグリシジルキシリレンジアミンの水添化合物等が挙げられる。
複素環式アミンのグリシジルアミンとしてはトリスグリシジルメラミン等が挙げられる。
【0017】
(D11−4)鎖状脂肪族エポキサイド
炭素数6〜50又はそれ以上で2〜6価又はそれ以上の鎖状脂肪族エポキサイド、例えばエポキシ当量130〜1,000のエポキシ化ポリブタジエン(分子量90〜2,500)、エポキシ化大豆油(分子量130〜2,500)等が挙げられる。
(D11−5)脂環式エポキサイド
炭素数6〜50又はそれ以上で、分子量90〜2500、エポキシ基の数1〜4又はそれ以上の脂環式エポキサイド例えば、ビニルシクロヘキセンジオキシド、リモネンジオキシド、ジシクロペンタジエンジオキシド、ビス(2,3−エポキシシクロペンチル)エーテル、エチレングリコールビスエポキシジシクロペンチルエーテル、3,4エポキシ−6−メチルシクロヘキシルメチル3’、4’−エポキシ−6’−メチルシクロヘキサンカルボキシレート、ビス(3,4−エポキシ−6−メチルシクロヘキシルメチル)アジペート、及びビス(3,4−エポキシ−6−メチルシクロヘキシルメチル)ブチルアミン等が挙げられる。また、前記フェノール類のエポキシ化合物の核水添化物も含む。
なお(D11−1)〜(D11−5)以外のものでも、活性水素と反応可能なグリシジル基をもつエポキシ樹脂であれば使用できる。又、これらのポリエポキシ化合物は、二種以上併用できる。これらのうち、好ましいのはグリシジルエーテル型(D11−1)、及びグリシジルエステル型(D11−2)であり、特に好ましいのは、グリシジルエーテル型(D11−1)である。(D11−1)の内、好ましいのは2価フェノール類、2価脂肪族アルコールのジグリシジルエーテルである。
【0018】
オキセタン化合物(D2)としては、炭素数6〜20の脂肪族系オキセタン化合物(3−エチル−3−ヒドロキシメチルオキセタン等)、炭素数7〜30の芳香族系オキセタン化合物(ベンジルオキセタン、キシリレンビスオキセタン等)、炭素数6〜30の脂肪族カルボン酸系オキセタン化合物(アジペートビスオキセタン等)、炭素数8〜30の芳香族カルボン酸系オキセタン化合物(テレフタレートビスオキセタン等)、炭素数8〜30の脂環式カルボン酸系オキセタン化合物(シクロヘキサンジカルボン酸ビスオキセタン等)、芳香族イソシアネート系オキセタン化合物(MDIビスオキセタン等)、炭素数2〜20の硫黄系オキセタン化合物(チイラン、2−メチルチイラン、2,2−ジメチルチイラン、2−ヘキシルチイラン、2−フェニルチイラン等)等が挙げられる。
環状エーテル基含有化合物(D)として、エポキシ基含有化合物(D1)を使用したヘテロ環含有化合物(A1)は、下記一般式(2)、(3)で示される。
一般式
【0019】
【化7】
【0020】
【化8】
【0021】
[式中、nは1〜10の整数。Y2 、Z2 は一方がSで他方がOであり、好ましくは、Y2 がO、Z2 がSである。R3はポリエポキシ化合物(D11)又はモノエポキシ化合物(d11)の残基である。R4は脂環式エポキサイドの残基である。ここで特に好ましくは、nは1、Y2 はO、Z2 はS、R3はモノグリシジル化合物(d11−2)のエポキシ基を除く残基である。]
【0022】
本発明のヘテロ環含有化合物(A)の製造方法は特に限定されないが、例えば環状エーテル基含有化合物(D)の環状エーテル基に対し、0.5〜10倍当量の二硫化炭素、硫化カルボニル及び二酸化炭素からなる群から選ばれる1種又は2種以上の化合物を、溶剤中触媒存在下で反応させることにより得られる。好ましくは二硫化炭素である。
溶剤としては、反応を阻害せず原料及び生成物を溶解するものなら特に制限はなく、通常非プロトン性溶剤が使用される。例えばエーテル類(テトラヒドロフラン、ジオキサン、ジエチルセロソルブ、ジオキソラン、トリオキサン、ジブチルセロソルブ、ジエチルカービトール、ジブチルカービトール等)、ケトン類(アセトン、メチルエチルケトン、メチルイソブチルケトン、ジエチルケトン等)、エステル類(酢酸メチル、酢酸エチル、酢酸n−ブチル等)、その他極性溶剤(アセトニトリル、ジメチルホルムアミド、N−メチルピロリドン、ジメチルスルホキシド等)等が挙げられ、好ましくはテトラヒドロフラン、アセトン、酢酸エチル等である。
触媒はアルカリ金属又はアルカリ土類金属のハロゲン化物であり、例えば、塩化リチウム、臭化リチウム、沃化リチウム、塩化カリウム、臭化カルシウム等が挙げられ、好ましくは臭化リチウムである。触媒の量は、(D)の環状エーテル基に対し、0.001〜1.0倍当量である。好ましくは0.01〜0.1倍当量である。
【0023】
反応温度は、通常0〜100℃、好ましくは20〜70℃である。
前記の通り製造されたヘテロ環含有化合物(A)の重量平均分子量は120〜12,000であり、好ましくは200〜8,000である。ヘテロ環当量は通常120〜1,200であり、好ましくは200〜800である。25℃での粘度は通常20Pa・s以下であり、好ましくは10Pa・s以下、さらに好ましくは5Pa・s以下であり、特に好ましくは1Pa・s以下である。
上記の様にして得られるヘテロ環含有化合物(A)は、具体的には表1に記載したものが挙げられる。
【0024】
【表1】
【0025】
本発明の分子中にエポキシ基を2個以上有するポリエポキシ化合物(B)としては(D11)と同じものが挙げられる。好ましくは(D11−1)である。
【0026】
本発明のアミノ化合物(C)は、分子中にアミノ基に由来する活性水素を2個以上有する化合物であれば特に限定されず、用途、目的に応じて適宜選択することができる。好ましくは分子中に1級アミノ基及び/又は2級アミノ基に由来する活性水素を2〜10個有する化合物であり、更に好ましくは3〜6個有する化合物である。(C)の活性水素当量(活性水素1個当りの分子量)は、通常15〜500であり、好ましくは20〜200である。活性水素当量が500以下であると架橋構造がルーズにならず硬化物の接着性、耐久性等の物性が良好である。活性水素当量が15以上であると硬化物の接着性、耐久性、耐薬品性等の物性が良好である。
【0027】
(C)のアミノ化合物の例としては、以下の(C1)〜(C9)がそれぞれ挙げられる。
(C1)脂肪族ポリアミン類(炭素数2〜18、官能基数2〜7、分子量60〜500);
(i)脂肪族ポリアミン{炭素数2〜6のアルキレンジアミン(エチレンジアミン、プロピレンジアミン、トリメチレンジアミン、テトラメチレンジアミン、ヘキサメチレンジアミンなど)、ポリアルキレン(炭素数2〜6)ポリアミン〔ジエチレントリアミン、イミノビスプロピルアミン、ビス(ヘキサメチレン)トリアミン,トリエチレンテトラミン、テトラエチレンペンタミン、ペンタエチレンヘキサミン等〕};
(ii)これらのアルキル(炭素数1〜4)又はヒドロキシアルキル(炭素数2〜4)置換体〔ジアルキル(炭素数1〜3)アミノプロピルアミン、トリメチルヘキサメチレンジアミン、アミノエチルエタノールアミン、2,5−ジメチル−2,5−ヘキサメチレンジアミン、メチルイミノビスプロピルアミンなど〕;
(iii)脂環又は複素環含有脂肪族ポリアミン〔3,9−ビス(3−アミノプロピル)−2,4,8,10−テトラオキサスピロ[5,5]ウンデカンなど〕;
(iv)芳香環含有脂肪族アミン類(炭素数8〜15)(キシリレンジアミン、テトラクロル−p−キシリレンジアミン等);
【0028】
(C2)脂環式ポリアミン(炭素数4〜15、官能基数2〜3);1,3−ジアミノシクロヘキサン、イソホロンジアミン、メンセンジアミン、4,4´−メチレンジシクロヘキサンジアミン(水添メチレンジアニリン)等;
(C3)複素環式ポリアミン(炭素数4〜15、官能基数2〜3):ピペラジン、N−アミノエチルピペラジン、1,4−ジアミノエチルピペラジン、1,4ビス(2−アミノ−2−メチルプロピル)ピペラジン等;
(C4)芳香族ポリアミン類(炭素数6〜20、官能基数2〜3、分子量100〜1000);
(i)非置換芳香族ポリアミン〔1,2−、1,3−及び1,4−フェニレンジアミン、2,4´−及び4,4´−ジフェニルメタンジアミン、クルードジフェニルメタンジアミン(ポリフェニルポリメチレンポリアミン)、ジアミノジフェニルスルホン、ベンジジン、チオジアニリン、ビス(3,4−ジアミノフェニル)スルホン、2,6−ジアミノピリジン、m−アミノベンジルアミン、トリフェニルメタン−4,4´,4”−トリアミン、ナフチレンジアミン等;
【0029】
(ii)核置換アルキル基〔メチル,エチル,n−及びi−プロピル、ブチル等の炭素数C1〜C4アルキル基)を有する芳香族ポリアミン、例えば2,4−及び2,6−トリレンジアミン、クルードトリレンジアミン、ジエチルトリレンジアミン、4,4´−ジアミノ−3,3´−ジメチルジフェニルメタン、4,4´−ビス(o−トルイジン)、ジアニシジン、ジアミノジトリルスルホン、1,3−ジメチル−2,4−ジアミノベンゼン、1,3−ジエチル−2,4−ジアミノベンゼン、1,3−ジメチル−2,6−ジアミノベンゼン、1,4−ジエチル−2,5−ジアミノベンゼン、1,4−ジイソプロピル−2,5−ジアミノベンゼン、1,4−ジブチル−2,5−ジアミノベンゼン、2,4−ジアミノメシチレン、1,3,5−トリエチル−2,4−ジアミノベンゼン、1,3,5−トリイソプロピル−2,4−ジアミノベンゼン、1−メチル−3,5−ジエチル−2,4−ジアミノベンゼン、1−メチル−3,5−ジエチル−2,6−ジアミノベンゼン、2,3−ジメチル−1,4−ジアミノナフタレン、2,6−ジメチル−1,5−ジアミノナフタレン、2,6−ジイソプロピル−1,5−ジアミノナフタレン、2,6−ジブチル−1,5−ジアミノナフタレン、3,3´,5,5´−テトラメチルベンジジン、3,3´,5,5´−テトライソプロピルベンジジン、3,3´,5,5´−テトラメチル−4,4´−ジアミノジフェニルメタン、3,3´,5,5´−テトラエチル−4,4´−ジアミノジフェニルメタン、3,3´,5,5´−テトライソプロピル−4,4´−ジアミノジフェニルメタン、3,3´,5,5´−テトラブチル−4,4´−ジアミノジフェニルメタン、3,5−ジエチル−3´−メチル−2´,4−ジアミノジフェニルメタン,3,5−ジイソプロピル−3´−メチル−2´,4−ジアミノジフェニルメタン、3,3´−ジエチル−2,2´−ジアミノジフェニルメタン、4,4´−ジアミノ−3,3´−ジメチルジフェニルメタン、3,3´,5,5´−テトラエチル−4,4´−ジアミノベンゾフェノン、3,3´,5,5´−テトライソプロピル−4,4´−ジアミノベンゾフェノン、3,3´,5,5´−テトラエチル−4,4´−ジアミノジフェニルエーテル、3,3´,5,5´−テトライソプロピル−4,4´−ジアミノジフェニルスルホン等〕、及びこれらの異性体の種々の割合の混合物;
【0030】
(iii)核置換電子吸引基(Cl,Br,I,F等のハロゲン;メトキシ、エトキシ等のアルコキシ基;ニトロ基等)を有する芳香族ポリアミン〔メチレンビス−o−クロロアニリン、4−クロロ−o−フェニレンジアミン、2−クロル−1,4−フェニレンジアミン、3−アミノ−4−クロロアニリン、4−ブロモ−1,3−フェニレンジアミン、2,5−ジクロル−1,4−フェニレンジアミン、5−ニトロ−1,3−フェニレンジアミン、3−ジメトキシ−4−アミノアニリン;4,4´−ジアミノ−3,3´−ジメチル−5,5´−ジブロモ−ジフェニルメタン、3,3´−ジクロロベンジジン、3,3´−ジメトキシベンジジン、ビス(4−アミノ−3−クロロフェニル)オキシド、ビス(4−アミノ−2−クロロフェニル)プロパン、ビス(4−アミノ−2−クロロフェニル)スルホン、ビス(4−アミノ−3−メトキシフェニル)デカン、ビス(4−アミノフェニル)スルフイド、ビス(4−アミノフェニル)テルリド、ビス(4−アミノフェニル)セレニド、ビス(4−アミノ−3−メトキシフェニル)ジスルフイド、4,4´−メチレンビス(2−ヨードアニリン)、4,4´−メチレンビス(2−ブロモアニリン)、4,4´−メチレンビス(2−フルオロアニリン)、4−アミノフェニル−2−クロロアニリン等〕;
【0031】
(iv)2級アミノ基を有する芳香族ポリアミン〔上記(i)〜(iii)の芳香族ポリアミンの−NH2の一部又は全部が−NH−R´(R´はアルキル基例えばメチル、エチル等の低級アルキル基)で置き換ったもの〕〔4,4´−ジ(メチルアミノ)ジフェニルメタン、1−メチル−2−メチルアミノ−4−アミノベンゼン等〕;
(C5)ポリアミドポリアミン:ジカルボン酸(ダイマー酸等)と過剰の(酸1モル当り2モル以上の)ポリアミン類(官能基数2〜7の上記アルキレンジアミン,ポリアルキレンポリアミン等)との縮合により得られるポリアミドポリアミン(数平均分子量200〜1000)等;
(C6)ポリエーテルポリアミン:ポリエーテルポリオール(前述のポリアルキレングリコール等)のシアノエチル化物の水素化物(分子量100〜1000)等;
(C7)エポキシ付加ポリアミン:エポキシ化合物(上記ポリエポキサイド(B1)並びにモノエポキサイド(b))1モルをポリアミン類(上記アルキレンジアミン、ポリアルキレンポリアミン等)に1〜30モル付加させることによって得られるエポキシ付加ポリアミン(分子量100〜1000)等;
【0032】
(C8)シアノエチル化ポリアミン:アクリロニトリルとポリアミン類(上記アルキレンジアミン、ポリアルキレンポリアミン等)との付加反応により得られるシアノエチル化ポリアミン、(ビスシアノエチルジエチレントリアミン等)(分子量100〜500)等;
(C9)その他のポリアミノ化合物:(i)ヒドラジン類(ヒドラジン、モノアルキルヒドラジン等);(ii)ジヒドラジッド類(コハク酸ジヒドラジッド,アジピン酸ジヒドラジッド,イソフタル酸ジヒドラジッド,テレフタル酸ジヒドラジッド等);(iii)グアニジン類(ブチルグアニジン,1−シアノグアニジン等);(iv)ジシアンジアミド等;並びにこれらの2種以上の混合物。
上記(C1)〜(C9)のうち、本発明の硬化性組成物に高速硬化性を与えるために好ましいのは(C1)、(C2)、(C3)及び(C5)であり、特に好ましいのは(C1)である。
【0033】
本発明の塗り床材において、(A):(B):(C)の配合比は、全体を100としたときの重量%で、好ましくは5〜40:10〜90:5〜60であり、さらに好ましくは10〜40:10〜80:5〜50であり、特に好ましくは15〜40:10〜75:5〜30である。(A)が5以上であると低温硬化性が良好となり、40以下であると適度な可使時間を有し、作業性が良好となる。(B)が10以上であると床面と塗り床材との密着性が良好となり、90以下であると系の粘度が小さくなり作業性が良好となる。(C)が5以上であると床面と塗り床材との密着性が良好となり、60以下であるとアミンブラッシングを生じない。
【0034】
本発明のエポキシ樹脂系塗り床材には、硬化剤としてアミノ化合物(C)が必須成分であるが、硬化性をより促進する目的で、必要により硬化促進触媒として塩基性化合物(E)をさらに含有させることができる。
塩基性化合物(E)としては、3級アミノ化合物(E1)、ソジウムメチラート、カセイソーダ、カセイカリ、炭酸リチウム等のアルカリ化合物(E2)、トリエチルフォスフィン、トリフェニルフォスフィン等のルイス塩基化合物(E3)等が挙げられる。これらにうち好ましいものは3級アミノ化合物(E1)である。
【0035】
上記の(E)として好ましい3級アミノ化合物(E1)は分子中に3級アミノ基を有する化合物であれば特に限定されないが、例としては以下の(E1−1)から(E1−3)がそれぞれあげられる。
(E1−1)脂肪族3級アミン:トリメチルアミン、トリエチルアミン、ジメチルシクロヘキシルアミン、ジメチルベンジルアミン、1,3−ジメチルイミダゾリジノン、1,2−ジメチルイミダゾール、テトラエチルメチレンジアミン、テトラメチルプロパン−1,3−ジアミン、テトラメチルヘキサン−1,6−ジアミン、ペンタメチルジエチレントリアミン、ペンタメチルジプロピレントリアミン、テトラメチルグアニジン、ジメチルピペラジン、N−メチル−N’−(2−ジメチルアミノ)−エチルピペラジン、N−メチルモルホリン、N−(N’,N’−ジメチルアミノエチル)モルホリン、ジメチルアミノエタノール、ジメチルアミノエトキシエタノール、N,N,N’−トリメチルアミノエチル−エタノールアミン、N−メチル−N’−(2−ヒドロキシエチル)モルホリン、ビス(2−ジメチルアミノエチル)エーテル、エチレングリコール(3−ジメチル)アミノプロピルエーテル等、
(E1−2)フェノール核含有脂肪族3級アミン:N,N−ジメチルアミノメチルフェノール(通称「DMP−10」)、トリス(N,N−ジメチルアミノメチルフェノール(通称「DMP−30」)等、
(E1−3)含窒素複素環化合物 1,8−ジアザビシクロ(5,4,0)−ウンデセン−7(通称「DBU」)、1,5−ジアザビシクロ(4,3,0)−ノネン−5(通称「DBN」)、6−ジブチルアミノ−1,8−ジアザビシクロ(5,4,0)−ウンデセン−7(通称「DBA−DBU」)、トリエチレンジアミン、ヘキサメチレンテトラミン等があげられる。
【0036】
3級アミノ化合物(E1)は得ようとする硬化速度、可使時間に応じて種類、添加量とも適宜選択すればよいが、通常、ヘテロ環含有化合物(A)100重量部に対して0.1〜50重量部程度添加されるのが好ましい。
【0037】
本発明において使用する接着性付与剤としては、例えばシランカップリング剤、チタンカップリング剤、アルミカップリング剤等があげられる。
このようなシランカップリング剤としては、ビニルアルキル(炭素数1〜4)アルコキシ(炭素数1〜4)シラン[例えばビニルトリメトキシシラン、ビニルトリエトキシシラン等]、(メタ)アクリロイロキシアルキル(炭素数1〜4)シラン[例えばγ−メタクリロキシプロピルトリメトキシシラン等]、アルキル(炭素数1〜4)アルコキシ(炭素数1〜4)シラン[例えばメチルトリメトキシシラン、メチルトリエトキシシラン等]、アミノ(分子中に1〜4個)アルキル(炭素数2〜15)アルコキシ(炭素数1〜4)シラン[例えばγ−(2−アミノエチル)アミノプロピルトリメトキシシラン、アミノプロピルトリメトキシシラン、N−フェニルアミノプロピルメチルジメトキシシラン等]、エポキシ(分子中に1〜4個)アルキル(炭素数1〜4)アルコキシ(炭素数1〜4)シラン[例えばγ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン等]、メルカプト(分子中に1〜4個)アルキル(炭素数1〜4)アルコキシ(炭素数1〜4)シラン[例えばγ−メルカプトトリメトキシシラン等]等があげられる。
チタンカップリング剤としては、Ti(O−C17H35)4、Ti(O−i−C3H7)2[OC(CH3)HCOCH3]2Ti(O−n−C4H9)2[OC2H4N(C2H4OH)2]2、チタニウム−i−プロポキシオクチレングリコレート、i−プロポキシチタントリ−i−ステアレート、(エチレングリコラト)チタンビス(ジオクチルフォスフェート)等があげられる。
アルミカップリング剤としては、トリブトキシアルミ、トリステアロキシアルミ等があげられる。
これらのカップリング剤は、2種以上併用して使用しても差し支えない。また、いずれのカップリング剤も使用できるが、取り扱い、コスト面からシランカップリング剤が好ましい。このうち、好ましくはビニルアルキルアルコキシシラン、(メタ)アクリロイロキシアルキルアルコキシシラン、アミノアルキルアルコキシシラン、エポキシアルキルアルコキシシランであり、特に好ましくはビニルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−(2−アミノエチル)アミノプロピルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシランである。
【0038】
本発明のエポキシ樹脂系塗り床材には、必要に応じて(1)ヒンダードアミン類、ハイドロキノン類、ヒンダードフェノール類、硫黄含有化合物等の酸化防止剤、(2)ベンゾフェノン類、ベンゾトリアゾール類、サリチル酸エステル類、金属錯塩類等の紫外線吸収剤、(3)金属石けん類、重金属(例えば亜鉛、錫、鉛、カドミウム等)の無機及び有機塩類、有機錫化合物等の安定剤、(4)フタル酸エステル、リン酸エステル、脂肪酸エステル、エポキシ化大豆油、ひまし油、流動パラフィンアルキル多環芳香族炭化水素等の可塑剤、(5)パラフィンワックス、マイクロクリスタリンワックス、重合ワックス、密ロウ、鯨ロウ低分子量ポリオレフィン等のワックス類、(6)ベンジルアルコール、タール、ピチューメン等の非反応性希釈剤、(7)低分子脂肪族グリシジルエーテル、芳香族モノグリシジルエーテル等の反応性希釈剤、(8)炭酸カルシウム、カオリン、タルク、マイカ、ベントナイト、クレー、セリサイト、アスベスト、ガラス繊維粉、炭素繊維粉、アラミド繊維粉、ナイロン繊維粉、アクリル繊維粉、ガラス繊維粉、ガラスバルーン、シラスバルーン、石炭粉、アクリル樹脂粉、フェノール樹脂粉、金属粉末、セラミック粉末、ゼオライト、スレート粉等の充填剤、(9)活性炭、ゼオライト、シリカゾル、シリカゲルなどの脱臭剤(10)カーボンブラック、酸化チタン、赤色酸化鉄、鉛丹、パラレッド、紺青等の顔料又は染料、(11)酢酸エチル、トルエン、アルコール類、エーテル類、ケトン類等の溶剤、(12)発泡剤、(13)消泡剤、(14)脱水剤、(15)帯電防止剤、(16)抗菌剤、(17)防かび剤、(18)粘度調整剤、(19)香料、(20)難燃剤等を添加することができる。
【0039】
本発明のエポキシ樹脂系塗り床材の硬化機構は、まず(C)が(A)と反応して開環しSH基を発生し、そのSH基が(B)と反応する。この場合に(C)は(B)とも反応するが、(B)との反応速度は(C)よりもSH基の方が大きい。従って、本発明のエポキシ樹脂系塗り床材の各成分の貯蔵及び使用形態としては、以下の(i)又は(ii)が例示される。
(i)ヘテロ環含有化合物(A)、エポキシ基含有化合物(B)、アミノ化合物(C)を独立した3液の形で保存し、使用時に3成分を混合し硬化させる。(任意成分である塩基性化合物(D)は、第4成分として、単独で保存し、使用時に他の成分と混合して用いることも、(A)及び/又は(C)中に添加した形で保存することもできる。)
(ii)ヘテロ環含有化合物(A)及びエポキシ基含有化合物(B)の混合物、並びにアミノ化合物(C)の独立した2液の形で保存し、使用時に該2成分を混合し硬化させる。[任意成分である塩基性化合物(E)は、第3成分として、単独で保存し、使用時に他の成分と混合して用いることも、(C)中に添加した形で保存することもできる。]
【0040】
本発明のエポキシ樹脂系塗り床材は万能混合機等の通常の混合機を使用して(A)、(B)、(C)及びその他の配合物が混合される。(C)は通常使用時に配合される。該プライマーは、塗膜作業性、硬化性、接着性の点から25℃における粘度は、好ましくは2.5〜4Pa・sであり、0℃においては、好ましくは5〜7Pa・sである。該床材は低温硬化が可能であり、5℃以下のような低温環境下であっても十分硬化が可能である。その硬化物は接着性、耐久性、耐薬品性等の物性に優れる。
【0041】
本発明の塗り床材を使用した施工方法の工法操作については常法に従って実施することができる。塗り床としては、住宅又は各種工場等の構築物の床、壁、廊下、あるいは階段等の屋内の床面や外壁のほかに、レジャー施設、スポーツ施設、交通施設、道路、駐車場等の各床面が挙げられる。これらの床面に、塗布膜厚あるいは床面の形状により、流しのべ工法、モルタル工法、ライニング工法、コーティング工法のいずれかにより施工することが可能であるが、本発明の塗り床材の硬化形態から、流しのべ工法あるいはコーティング工法が好ましい。
コーティング工法の塗装方法としては、刷毛塗り、スプレー塗装、各種コーター塗装等の一般的な方法を用いることができる。
本発明の塗り床材の塗布量は、特に制限されるものではないが、プライマー塗りでは10〜300μm、ベースコート塗りでは50〜500μm、トップコート塗りでは、30〜300μmであることが好ましく、ベースコート塗りは1回〜3回行うことが可能である。さらにトップコート塗りにおいては、特に制限なく通常の上塗り塗料が使用でき、例えば、アルキド樹脂系、エポキシ樹脂系、ラテックス系、シリコンアルキド樹脂系、ウレタン樹脂系、シリコンアクリル樹脂系、フッ素樹脂系等の塗料が使用できる。
本発明のエポキシ樹脂系塗り床材の硬化物は床面との層間密着性に優れ、耐薬品性等の耐久性に優れる。
【0042】
【実施例】
以下、実施例により本発明を具体的に説明するが、本発明はこれらの実施例に限定されるものではない。実施例及び比較例中の部は質量部を表わす。
【0043】
また、実施例中の評価項目の試験方法は以下の通りである。
[指触乾燥性];表2及び3に示す配合の本発明のエポキシ樹脂塗り床材を、0℃及び25℃下で、レイタンス(浮き水に伴って出てくる微細な物質)を除去したコンクリート上にウールローラーB−23[大塚刷毛製造(株)製]でを厚さ1.5mm塗装した後、0℃及び25℃下に3時間放置した後の塗膜の指触乾燥性を判定した。(良好:指に指触が残らない、不良:指に指触が残る)
[美観]:塗膜表面の状態を目視で観察した。艶があり、膨れ、はがれ等のないものを○、膨れ、はがれ等のあるものを×とした。
[碁盤目試験及び耐薬品性];エポキシ樹脂塗り床材をJISA5400で定められた鋼板に0.1mmのフィルムアプリケーターを用いて塗布した後、0℃及び25℃下において硬化させた塗膜表面碁盤目試験及び耐薬品性をJIS5400に従い行った。尚、耐薬品性については、変化のないものを○、色褪せしたものを△、膨れやはがれが生じたものを×とした。
[混合粘度];0℃及び25℃下で、表2,3の組成で配合した本発明のエポキシ樹脂塗り床材を攪拌し2分後にBL型回転粘度計により測定した。
(単位;mPa・s)
[接着強度];0℃及び25℃下で、30×30×5cmの歩道用PC板の表面にウールローラーB−23で表2,3の組成で配合した本発明のエポキシ樹脂塗り床材を厚さ1.5mm塗装し、7日間養生硬化した後、建研式接着強度試験法にて測定した。(単位;Kgf/cm2)
【0044】
製造例1
反応容器に二硫化炭素90部と臭化リチウム5部、テトラヒドロフラン(THF)120部を仕込んで攪拌溶解し、58部の2−エチルヘキシルグリシジルエーテルを20℃以下に保ちながら滴下した後、40℃で5時間熟成した。減圧下でTHF及び過剰の二硫化炭素を留去した後、ろ過して、25℃での粘度40mPa・s、ヘテロ環基当量262の淡黄色液体のヘテロ環化合物(A−1)を得た。
製造例2
反応容器に二硫化炭素90部と塩化リチウム5部、THF140部を仕込んで攪拌溶解した後、140部のトリメチロールプロパントリグリシジルエーテル(エポキシ当量140)を20℃以下に保ちながら滴下した後、40℃で5時間熟成した。減圧下でTHF及び過剰の二硫化炭素を留去した後、ろ過して、25℃での粘度130mPa・s、ヘテロ環基当量218の淡黄色液体のヘテロ環化合物(A−2)を得た。
【0045】
製造例3
反応容器に二硫化炭素90部と臭化リチウム5部、THF120部を仕込んで攪拌溶解した後、58部のトリメチレンオキサイドを20℃以下に保ちながら滴下した後、40℃で5時間熟成した。減圧下で、THF及び過剰の二硫化炭素を留去した後、ろ過して、25℃での粘度40mPa・s、ヘテロ環基当量140の微黄色液体のヘテロ環化合物(A−3)を得た。
【0046】
実施例1〜5、比較例1〜3
表2及び3に示した配合量で各成分を混合、攪拌し、前記の試験方法によりエポキシ樹脂塗り床材としての性能評価試験を行った。分子中に2個以上のエポキシ基を有する化合物(B)としては次のものを使用した。
ポリエポキサイド(B1);エピコート828(油化シェルエポキシ社製ビスフェノールAジグリシジルエーテル,エポキシ当量190,粘度11Pa・s)、及びネオペンチルグリコールジグリシジルエーテル(エポキシ当量154,粘度20mPa・s)
分子中にアミノ基に由来する活性水素を2個以上有するアミノ化合物(C)としては次のものを使用した。
(C1)脂肪族ポリアミン;キシリレンジアミン(活性水素当量36,粘度7mPa・s)
また、硬化促進剤として下記のものを使用した。
(E2)DMP−30;トリス(N,N−ジメチルアミノメチル)フェノールなお、表2及び表3中の三洋化成工業社製「リアクトCA−101」(活性水素当量75,粘度2.1Pa・s)はマンニッヒ変性ポリアミン化合物、ヘンケル社製「カプキュア3−800」(活性水素当量280,粘度1.8Pa・s)はポリメルカプタン化合物である。
上記実施例1〜5、比較例1〜3の0℃における評価結果を表2に、25℃における評価結果を表3に示す。
【0047】
【表2】
【0048】
【表3】
【0049】
【発明の効果】
本発明のエポキシ樹脂塗り床材は、
(1)有機溶剤を使用しないため、重ね塗りに適しており、また大気汚染等の安全性の問題の低減が図れる。
(2)常温ないし5℃のような低温でも塗布が可能であり、硬化性を有する。
(3)低粘度であり、適度な可使時間を有し、作業性に優れる。
(4)床面やその上に塗布される塗り床材との層間密着性に優れ、耐薬品等の硬化物性に優れる。
等の効果を奏する。[0001]
[Technical field to which the invention belongs]
The present invention relates to a coating floor material. More specifically, the present invention relates to a coating floor material made of a novel epoxy resin.
[0002]
[Prior art]
Conventionally, as a coating floor material, a one-pack type flooring material typified by an acrylic resin-based coating floor material has been widely used in consideration of the ease of use and construction method.
[Problems to be solved by the invention]
[0003]
However, the conventional flooring material often uses a volatile organic solvent, and when the repair is repeated with this type of one-component flooring material, the coating becomes thicker and the solvent contained in the flooring material to be applied repeatedly. The softened and swollen coating film is softened and swollen, which causes a situation where drying becomes extremely slow and cannot be used.
In addition, after applying the one-component coating floor material, a reactive coating material, for example, an epoxy resin-based coating material or a urethane resin-based coating material is tried to be applied repeatedly in order to demand higher durability and finish. Even in this case, similarly, the solvent contained in the reactive coating material dissolves, swells and softens the laminated coating film, and the coating film hardness is not expressed indefinitely, and inconveniences such as lifting occur.
Also, today, where air pollution problems are taken up, a coating floor material that does not use such a solvent is desired.
[0004]
The present invention solves these problems, and can be applied and cured even at a low temperature such as 5 ° C., has an appropriate pot life, has low viscosity and good workability, The present invention provides an epoxy resin-based flooring material excellent in adhesiveness.
[0005]
[Means for Solving the Problems]
The inventors of the present invention have arrived at the present invention as a result of intensive studies to achieve the above object.
That is, the present invention is derived from a heterocycle-containing compound (A) represented by the following general formula (1), a polyepoxy compound (B) having two or more epoxy groups in the molecule, and an amino group in the molecule. An epoxy resin-based flooring material comprising an amino compound (C) having two or more active hydrogens.
[0006]
[Chemical formula 5]
[0007]
[In Formula (1), n is an integer of 1-10, X 1 , Y 1 And Z 1 Each independently represents an oxygen or sulfur atom; R 1 Is a residue of a cyclic ether group-containing compound (D) or a hydrogen atom; R 2 Is a hydrocarbon group having 2 to 10 carbon atoms. ]
[0008]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, the heterocycle-containing compound (A) is represented by the general formula (1). In the formula, n is an integer of 1 to 10, preferably an integer of 2 to 8. X 1 , Y 1 And Z 1 Are oxygen or sulfur atoms, respectively. Preferably X 1 Is a sulfur atom (S), Y 1 , Z 1 One of these is a sulfur atom (S) and the other is an oxygen atom (O).
R 2 Is a residue constituting a ring other than an oxygen atom in the cyclic ether group. This is a hydrocarbon group having 2 to 10 carbon atoms, and a trivalent hydrocarbon group> CH (CH 2 ) m -(M is an integer of 1 to 9), for example,> CHCH 2 -,> CHCH 2 CH 2 -,> CHCH 2 CH 2 CH 2 -,> CHCH 2 CH 2 CH 2 CH 2 CH 2 -Etc .; tetravalent hydrocarbon group> CH (CH 2 ) m CH <(m is an integer of 0 to 8), for example,> CHCH <,> CHCH 2 CH <,> CHCH 2 CH 2 CH <,> CHCH 2 CH 2 CH 2 CH 2 CH <etc. are mentioned, Preferably it is a trivalent hydrocarbon group, Most preferably> CHCH 2 -,> CHCH 2 CH 2 -.
R 1 Is a residue of a hydrogen atom or a cyclic ether group-containing compound (D), and is represented by the general formula (5).
General formula
[0009]
[Chemical 6]
[00010]
The cyclic ether group is not particularly limited as long as it has one or more oxygen atoms in the ring, and examples thereof include compounds having 1 to 10 cyclic ether groups in the molecule.
Examples of the cyclic ether group-containing compound (D) include an epoxy group-containing compound (D1), an oxetane compound (D2), etc., which will be described later, and preferably an epoxy group-containing compound (D1).
Examples of the epoxy group-containing compound (D1) include a monoepoxide (d11) and a polyepoxide (D11) having two or more epoxy groups in the molecule.
The monoepoxide (d11) is not particularly limited as long as it has one epoxy group in the molecule, and can be appropriately selected according to the use and purpose. Examples include the following. For example,
(D11-1) a hydrocarbon oxide having 2 to 24 carbon atoms (ethylene oxide, propylene oxide, 1-butene oxide, 2-butene oxide, α-olefin oxide having 5 to 24 carbon atoms, styrene oxide, etc.),
(D11-2) C 3-19 hydrocarbon glycidyl ether (n-butyl glycidyl ether, allyl glycidyl ether, 2-ethyl-hexyl glycidyl ether, 2-methyloctyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether) P-sec-butylphenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, etc.),
(D11-3) Glycidyl esters of monocarboxylic acids having 3 to 30 carbon atoms (such as glycidyl acrylate and glycidyl methacrylate), epihalohydrins such as epichlorohydrin and epibromohydrin, and hydroxyl group-containing oxides such as glycidol. Preferred are hydrocarbon oxides having 2 to 24 carbon atoms and glycidyl ethers of hydrocarbons having 3 to 19 carbon atoms.
[0011]
The polyepoxide (D11) is not particularly limited as long as it has two or more epoxy groups in the molecule, and can be appropriately selected according to the use and purpose. Preferably, it has 2 to 6 epoxy groups in the molecule. The epoxy equivalent of the polyepoxide (molecular weight per epoxy group) is usually 65 to 1000, preferably 90 to 500. When the epoxy equivalent is 1000 or less, the crosslinked structure does not become loose, and the cured product has good physical properties such as water resistance, chemical resistance and mechanical strength. On the other hand, when the epoxy equivalent is 65 or more, A crosslinked structure with good water resistance, chemical resistance, mechanical strength and the like is obtained.
Examples of the polyepoxide (D11) include the following (D11-1) to (D11-5).
[0012]
(D11-1) Glycidyl ether type
(I) Diglycidyl ether of dihydric phenols Diglycidyl ether of dihydric phenols having 6 to 30 carbon atoms, for example, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, bisphenol B diglycidyl ether, bisphenol AD diglycidyl ether Bisphenol S diglycidyl ether, halogenated bisphenol A diglycidyl ether, tetrachlorobisphenol A diglycidyl ether, catechin diglycidyl ether, resorcinol diglycidyl ether, hydroquinone diglycidyl ether, 1,5-dihydroxynaphthalenediglycidyl ether, dihydroxybiphenyl Diglycidyl ether, octachloro-4,4'-dihydroxybiphenyl diglycidyl ether, Tet Methyl biphenyl diglycidyl ether, 9,9'-bis (4-hydroxyphenyl) furo diglycidyl ether, diglycidyl ether obtained from bisphenol A2 moles and 3 moles of epichlorohydrin in the reaction.
[0013]
(Ii) polyglycidyl ethers of polyhydric phenols having 3 to 6 or more valences
Polyglycidyl ethers of polyhydric phenols having 6 to 50 or more carbon atoms and a molecular weight of 250 to 5000, such as pyrogallol triglycidyl ether, dihydroxynaphthylcresol triglycidyl ether, tris (hydroxyphenyl) ) Methane triglycidyl ether, dinaphthyltriol triglycidyl ether, tetrakis (4-hydroxyphenyl) ethanetetraglycidyl ether, p-glycidylphenyldimethyltolyl bisphenol A glycidyl ether, trismethyl-tert-butyl-butylhydroxymethane triglycidyl ether, 4 , 4′-oxybis (1,4-phenylethyl) tetracresol glycidyl ether, 4,4′-oxybis (1,4-phenylethyl) fur Nyl glycidyl ether, bis (dihydroxynaphthalene) tetraglycidyl ether, glycidyl ether of phenol or cresol novolak resin (molecular weight 400-5000), glycidyl ether of limonene phenol novolak resin (molecular weight 400-5000), phenol and glyoxal, glutaraldehyde, Or the polyglycidyl ether of the polyphenol (molecular weight 400-5000) obtained by the condensation reaction of formaldehyde, the polyglycidyl ether of the polyphenol of molecular weight 400-5000 obtained by the condensation reaction of resorcin and acetone, etc. are mentioned.
[0014]
(Iii) Diglycidyl ether of aliphatic dihydric alcohol
Diglycidyl ether of a diol having 2 to 100 carbon atoms and a molecular weight of 150 to 5000, for example, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tetramethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, polyethylene glycol ( Molecular weight 150-4000) diglycidyl ether, polypropylene glycol (molecular weight 180-5000) diglycidyl ether, polytetramethylene glycol (molecular weight 200-5000) diglycidyl ether, neopentyl glycol diglycidyl ether, alkylene oxide of bisphenol A [ethylene oxide or Propylene oxide (1 to 20 mol)] diglycidyl ether of adducts and the like.
(Iv) polyglycidyl ethers of trihydric to hexahydric or higher aliphatic alcohols
Glycidyl ethers of polyhydric alcohols having 3 to 50 or more carbon atoms and a molecular weight of 92 to 10,000, such as trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether Sorbitol hexaglycidyl ether, poly (n = 2 to 5) glycerol polyglycidyl ether, and the like.
[0015]
(D11-2) Glycidyl ester type
A glycidyl ester of an aromatic polycarboxylic acid having 6 to 20 or more carbon atoms and a divalent to 6 or more carbon atoms, and an aliphatic having 6 to 20 or more carbon atoms and a divalent to 6 or more carbon atoms Or the glycidyl ester of alicyclic polycarboxylic acid is mentioned.
(I) Aromatic polycarboxylic acids such as glycidyl esters of phthalic acids include diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, and triglycidyl trimellitic acid;
(Ii) Examples of glycidyl esters of aliphatic or alicyclic polycarboxylic acids include aromatic nucleated water additives of the above-mentioned phenolic glycidyl esters, diglycidyl esters of dimer acid, diglycidyl oxalate, diglycidyl malate, diglycidyls Examples thereof include succinate, diglycidyl glutarate, diglycidyl adipate, diglycidyl pimelate, (co) polymer of glycidyl (meth) acrylate (degree of polymerization is 2 to 10 for example), tricarbyl acid triglycidyl ester, and the like.
[0016]
(D11-3) Glycidylamine type
Examples thereof include glycidylamines of aromatic amines having 6 to 20 or more carbon atoms and having 2 to 10 or more active hydrogen atoms, and glycidylamines of aliphatic, alicyclic or heterocyclic amines.
(I) As glycidylamines of aromatic amines, N, N-diglycidylaniline, N, N-diglycidyltoluidine, N, N, N ′, N′-tetraglycidyldiaminodiphenylmethane, N, N, N ′ , N′-tetraglycidyldiaminodiphenylsulfone, N, N, N ′, N′-tetraglycidyldiethyldiphenylmethane, N, N, O-triglycidylaminophenol and the like;
(Ii) Examples of glycidylamines of aliphatic amines include N, N, N ′, N′-tetraglycidylxylylenediamine, N, N, N ′, N′-tetraglycidylhexamethylenediamine and the like;
(Iii) Examples of glycidylamines of alicyclic amines include hydrogenated compounds of N, N, N ′, N′-tetraglycidylxylylenediamine.
Examples of the heterocyclic amine glycidylamine include trisglycidylmelamine.
[0017]
(D11-4) Chain aliphatic epoxide
A chain aliphatic epoxide having 6 to 50 or more carbon atoms and having 2 to 6 or more valences, for example, epoxidized polybutadiene having an epoxy equivalent of 130 to 1,000 (molecular weight 90 to 2,500), epoxidized soybean oil (molecular weight) 130-2,500).
(D11-5) Alicyclic epoxide
Alicyclic epoxides having 6 to 50 or more carbon atoms, 90 to 2500 molecular weight, and 1 to 4 or more epoxy groups such as vinylcyclohexene dioxide, limonene dioxide, dicyclopentadiene dioxide, bis (2 , 3-epoxycyclopentyl) ether, ethylene glycol bisepoxy dicyclopentyl ether, 3,4 epoxy-6-methylcyclohexylmethyl 3 ′, 4′-epoxy-6′-methylcyclohexanecarboxylate, bis (3,4-epoxy- 6-methylcyclohexylmethyl) adipate and bis (3,4-epoxy-6-methylcyclohexylmethyl) butylamine. Moreover, the nuclear hydrogenation thing of the epoxy compound of the said phenols is also included.
Any epoxy resin other than (D11-1) to (D11-5) can be used as long as it is an epoxy resin having a glycidyl group capable of reacting with active hydrogen. These polyepoxy compounds can be used in combination of two or more. Of these, glycidyl ether type (D11-1) and glycidyl ester type (D11-2) are preferable, and glycidyl ether type (D11-1) is particularly preferable. Of (D11-1), preferred are dihydric phenols and diglycidyl ethers of dihydric aliphatic alcohols.
[0018]
Examples of the oxetane compound (D2) include aliphatic oxetane compounds having 6 to 20 carbon atoms (3-ethyl-3-hydroxymethyloxetane and the like), aromatic oxetane compounds having 7 to 30 carbon atoms (benzyl oxetane and xylylene bis). Oxetane, etc.), C6-C30 aliphatic carboxylic acid-based oxetane compounds (such as adipate bisoxetane), C8-C30 aromatic carboxylic acid-based oxetane compounds (such as terephthalate bisoxetane), C8-30, etc. Alicyclic carboxylic acid oxetane compounds (such as bisoxetane cyclohexanedicarboxylate), aromatic isocyanate oxetane compounds (such as MDI bisoxetane), sulfur oxetane compounds having 2 to 20 carbon atoms (thiirane, 2-methylthiirane, 2, 2-dimethylthiirane, 2-hexylthiirane, - it includes phenyl thiirane, etc.) and the like.
The heterocyclic compound (A1) using the epoxy group-containing compound (D1) as the cyclic ether group-containing compound (D) is represented by the following general formulas (2) and (3).
General formula
[0019]
[Chemical 7]
[0020]
[Chemical 8]
[0021]
[Wherein, n is an integer of 1 to 10. Y 2 , Z 2 One is S and the other is O, preferably Y 2 Is O, Z 2 Is S. R Three Is a residue of a polyepoxy compound (D11) or a monoepoxy compound (d11). R Four Is a residue of an alicyclic epoxide. Particularly preferably, n is 1, Y 2 Is O, Z 2 Is S, R Three Is a residue excluding the epoxy group of the monoglycidyl compound (d11-2). ]
[0022]
Although the manufacturing method of the heterocyclic containing compound (A) of this invention is not specifically limited, For example, 0.5-10 times equivalent carbon disulfide, carbonyl sulfide, and the cyclic ether group of cyclic ether group containing compound (D) and It can be obtained by reacting one or more compounds selected from the group consisting of carbon dioxide in the presence of a catalyst in a solvent. Preferably it is carbon disulfide.
The solvent is not particularly limited as long as it can dissolve the raw materials and products without inhibiting the reaction, and an aprotic solvent is usually used. For example, ethers (tetrahydrofuran, dioxane, diethyl cellosolve, dioxolane, trioxane, dibutyl cellosolve, diethyl carbitol, dibutyl carbitol, etc.), ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, etc.), esters (methyl acetate, And ethyl acetate, n-butyl acetate, etc.) and other polar solvents (acetonitrile, dimethylformamide, N-methylpyrrolidone, dimethyl sulfoxide, etc.) and the like, preferably tetrahydrofuran, acetone, ethyl acetate and the like.
The catalyst is a halide of an alkali metal or an alkaline earth metal, and examples thereof include lithium chloride, lithium bromide, lithium iodide, potassium chloride, calcium bromide and the like, preferably lithium bromide. The amount of the catalyst is 0.001 to 1.0 times equivalent to the cyclic ether group of (D). Preferably it is 0.01-0.1 times equivalent.
[0023]
The reaction temperature is usually 0 to 100 ° C., preferably 20 to 70 ° C.
The weight average molecular weight of the heterocycle-containing compound (A) produced as described above is 120 to 12,000, preferably 200 to 8,000. The heterocyclic equivalent is usually 120 to 1,200, preferably 200 to 800. The viscosity at 25 ° C. is usually 20 Pa · s or less, preferably 10 Pa · s or less, more preferably 5 Pa · s or less, and particularly preferably 1 Pa · s or less.
Specific examples of the heterocycle-containing compound (A) obtained as described above include those described in Table 1.
[0024]
[Table 1]
[0025]
Examples of the polyepoxy compound (B) having two or more epoxy groups in the molecule of the present invention include the same as (D11). Preferably it is (D11-1).
[0026]
The amino compound (C) of the present invention is not particularly limited as long as it is a compound having two or more active hydrogens derived from an amino group in the molecule, and can be appropriately selected according to use and purpose. Preferably, it is a compound having 2 to 10 active hydrogens derived from a primary amino group and / or a secondary amino group in the molecule, and more preferably 3 to 6 compounds. The active hydrogen equivalent (molecular weight per active hydrogen) of (C) is usually 15 to 500, preferably 20 to 200. When the active hydrogen equivalent is 500 or less, the crosslinked structure does not become loose, and the physical properties such as adhesion and durability of the cured product are good. When the active hydrogen equivalent is 15 or more, physical properties such as adhesion, durability and chemical resistance of the cured product are good.
[0027]
Examples of the amino compound (C) include the following (C1) to (C9).
(C1) aliphatic polyamines (2-18 carbon atoms, 2-7 functional groups, molecular weight 60-500);
(I) Aliphatic polyamines {C2-C6 alkylenediamine (ethylenediamine, propylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, etc.), polyalkylene (C2-6) polyamine [diethylenetriamine, iminobis Propylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, etc.]};
(Ii) These alkyl (carbon number 1 to 4) or hydroxyalkyl (carbon number 2 to 4) substituents [dialkyl (carbon number 1 to 3) aminopropylamine, trimethylhexamethylenediamine, aminoethylethanolamine, 2, 5-dimethyl-2,5-hexamethylenediamine, methyliminobispropylamine, etc.];
(Iii) Alicyclic or heterocyclic-containing aliphatic polyamine [3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro [5,5] undecane, etc.];
(Iv) Aromatic ring-containing aliphatic amines (8 to 15 carbon atoms) (xylylenediamine, tetrachloro-p-xylylenediamine, etc.);
[0028]
(C2) alicyclic polyamine (4 to 15 carbon atoms, 2 to 3 functional groups); 1,3-diaminocyclohexane, isophoronediamine, mensendiamine, 4,4'-methylenedicyclohexanediamine (hydrogenated methylenedianiline) )etc;
(C3) Heterocyclic polyamine (carbon number 4-15, functional group number 2-3): piperazine, N-aminoethylpiperazine, 1,4-diaminoethylpiperazine, 1,4bis (2-amino-2-methylpropyl) ) Piperazine etc .;
(C4) aromatic polyamines (carbon number 6-20, functional group number 2-3, molecular weight 100-1000);
(I) Unsubstituted aromatic polyamine [1,2-, 1,3- and 1,4-phenylenediamine, 2,4′- and 4,4′-diphenylmethanediamine, crude diphenylmethanediamine (polyphenylpolymethylenepolyamine) , Diaminodiphenylsulfone, benzidine, thiodianiline, bis (3,4-diaminophenyl) sulfone, 2,6-diaminopyridine, m-aminobenzylamine, triphenylmethane-4,4 ', 4 "-triamine, naphthylenediamine etc;
[0029]
(Ii) aromatic polyamines having a nucleus-substituted alkyl group [C1-C4 alkyl group such as methyl, ethyl, n- and i-propyl, butyl, etc.], for example, 2,4- and 2,6-tolylenediamine, Crudetolylenediamine, diethyltolylenediamine, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 4,4'-bis (o-toluidine), dianisidine, diaminoditolylsulfone, 1,3-dimethyl- 2,4-diaminobenzene, 1,3-diethyl-2,4-diaminobenzene, 1,3-dimethyl-2,6-diaminobenzene, 1,4-diethyl-2,5-diaminobenzene, 1,4- Diisopropyl-2,5-diaminobenzene, 1,4-dibutyl-2,5-diaminobenzene, 2,4-diaminomesitylene, 1,3,5-tri Til-2,4-diaminobenzene, 1,3,5-triisopropyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5- Diethyl-2,6-diaminobenzene, 2,3-dimethyl-1,4-diaminonaphthalene, 2,6-dimethyl-1,5-diaminonaphthalene, 2,6-diisopropyl-1,5-diaminonaphthalene, 2, 6-dibutyl-1,5-diaminonaphthalene, 3,3 ′, 5,5′-tetramethylbenzidine, 3,3 ′, 5,5′-tetraisopropylbenzidine, 3,3 ′, 5,5′-tetra Methyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5,5′-tetraethyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5,5′-tetraisopropyl-4,4′- Diaminodiphenylmethane, 3,3 ′, 5,5′-tetrabutyl-4,4′-diaminodiphenylmethane, 3,5-diethyl-3′-methyl-2 ′, 4-diaminodiphenylmethane, 3,5-diisopropyl-3 ′ -Methyl-2 ', 4-diaminodiphenylmethane, 3,3'-diethyl-2,2'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 3,3', 5,5 '-Tetraethyl-4,4'-diaminobenzophenone, 3,3 ', 5,5'-tetraisopropyl-4,4'-diaminobenzophenone, 3,3', 5,5'-tetraethyl-4,4'-diamino Diphenyl ether, 3,3 ′, 5,5′-tetraisopropyl-4,4′-diaminodiphenylsulfone, etc.), and mixtures of these isomers in various proportions object;
[0030]
(Iii) Aromatic polyamines [methylene bis-o-chloroaniline, 4-chloro-o] having nucleus-substituted electron withdrawing groups (halogens such as Cl, Br, I, F; alkoxy groups such as methoxy and ethoxy; nitro groups) -Phenylenediamine, 2-chloro-1,4-phenylenediamine, 3-amino-4-chloroaniline, 4-bromo-1,3-phenylenediamine, 2,5-dichloro-1,4-phenylenediamine, 5- Nitro-1,3-phenylenediamine, 3-dimethoxy-4-aminoaniline; 4,4'-diamino-3,3'-dimethyl-5,5'-dibromo-diphenylmethane, 3,3'-dichlorobenzidine, 3 , 3'-dimethoxybenzidine, bis (4-amino-3-chlorophenyl) oxide, bis (4-amino-2-chlorophenyl) propa Bis (4-amino-2-chlorophenyl) sulfone, bis (4-amino-3-methoxyphenyl) decane, bis (4-aminophenyl) sulfide, bis (4-aminophenyl) telluride, bis (4-amino) Phenyl) selenide, bis (4-amino-3-methoxyphenyl) disulfide, 4,4′-methylenebis (2-iodoaniline), 4,4′-methylenebis (2-bromoaniline), 4,4′-methylenebis ( 2-fluoroaniline), 4-aminophenyl-2-chloroaniline and the like];
[0031]
(Iv) An aromatic polyamine having a secondary amino group [a part or all of —NH 2 of the aromatic polyamine of the above (i) to (iii) is —NH—R ′ (R ′ is an alkyl group such as methyl, ethyl, etc.] A lower alkyl group)] [4,4'-di (methylamino) diphenylmethane, 1-methyl-2-methylamino-4-aminobenzene, etc.];
(C5) Polyamide polyamine: obtained by condensation of dicarboxylic acid (dimer acid, etc.) and excess (more than 2 moles per mole of acid) polyamines (the above-mentioned alkylene diamine, polyalkylene polyamine, etc. having 2 to 7 functional groups). Polyamide polyamine (number average molecular weight 200-1000) and the like;
(C6) polyether polyamine: hydride (molecular weight 100 to 1000) of cyanoethylated polyether polyol (such as the above-mentioned polyalkylene glycol);
(C7) Epoxy-added polyamine: an epoxy obtained by adding 1 to 30 mol of an epoxy compound (the above polyepoxide (B1) and monoepoxide (b)) to a polyamine (the above alkylenediamine, polyalkylenepolyamine, etc.). Addition polyamine (molecular weight 100-1000) and the like;
[0032]
(C8) Cyanoethylated polyamine: cyanoethylated polyamine obtained by addition reaction of acrylonitrile and polyamines (the above alkylenediamine, polyalkylenepolyamine, etc.), (biscyanoethyldiethylenetriamine, etc.) (molecular weight 100-500), etc .;
(C9) Other polyamino compounds: (i) hydrazines (hydrazine, monoalkylhydrazine, etc.); (ii) dihydrazides (succinic acid dihydrazide, adipic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, etc.); (iii) guanidine (Butyl guanidine, 1-cyanoguanidine, etc.); (iv) dicyandiamide, etc .; and mixtures of two or more thereof.
Of the above (C1) to (C9), (C1), (C2), (C3) and (C5) are particularly preferable for imparting high-speed curability to the curable composition of the present invention. Is (C1).
[0033]
In the coated flooring of the present invention, the blending ratio of (A) :( B) :( C) is weight% when the total is 100, preferably 5-40: 10-90: 5-60. More preferably, it is 10-40: 10-80: 5-50, Most preferably, it is 15-40: 10-75: 5-30. When (A) is 5 or more, low-temperature curability is good, and when it is 40 or less, it has an appropriate pot life and workability is good. When (B) is 10 or more, the adhesion between the floor surface and the coated flooring material becomes good, and when it is 90 or less, the viscosity of the system becomes small and the workability becomes good. When (C) is 5 or more, the adhesion between the floor surface and the coated floor material is good, and when it is 60 or less, amine brushing does not occur.
[0034]
In the epoxy resin-based flooring material of the present invention, the amino compound (C) is an essential component as a curing agent, but for the purpose of further promoting curability, a basic compound (E) is further added as a curing acceleration catalyst as necessary. It can be included.
Examples of the basic compound (E) include tertiary amino compounds (E1), alkali compounds (E2) such as sodium methylate, caustic soda, caustic potash and lithium carbonate, Lewis basic compounds such as triethylphosphine and triphenylphosphine ( E3) and the like. Of these, the tertiary amino compound (E1) is preferred.
[0035]
The tertiary amino compound (E1) preferred as the above (E) is not particularly limited as long as it has a tertiary amino group in the molecule. Examples thereof include the following (E1-1) to (E1-3). You can give each.
(E1-1) Aliphatic tertiary amine: trimethylamine, triethylamine, dimethylcyclohexylamine, dimethylbenzylamine, 1,3-dimethylimidazolidinone, 1,2-dimethylimidazole, tetraethylmethylenediamine, tetramethylpropane-1,3 -Diamine, tetramethylhexane-1,6-diamine, pentamethyldiethylenetriamine, pentamethyldipropylenetriamine, tetramethylguanidine, dimethylpiperazine, N-methyl-N '-(2-dimethylamino) -ethylpiperazine, N-methyl Morpholine, N- (N ′, N′-dimethylaminoethyl) morpholine, dimethylaminoethanol, dimethylaminoethoxyethanol, N, N, N′-trimethylaminoethyl-ethanolamine, N-methyl-N '-(2-hydroxyethyl) morpholine, bis (2-dimethylaminoethyl) ether, ethylene glycol (3-dimethyl) aminopropyl ether, etc.
(E1-2) Phenol nucleus-containing aliphatic tertiary amine: N, N-dimethylaminomethylphenol (common name “DMP-10”), tris (N, N-dimethylaminomethylphenol (common name “DMP-30”), etc. ,
(E1-3) Nitrogen-containing heterocyclic compound 1,8-diazabicyclo (5,4,0) -undecene-7 (common name “DBU”), 1,5-diazabicyclo (4,3,0) -nonene-5 ( (Commonly called “DBN”), 6-dibutylamino-1,8-diazabicyclo (5,4,0) -undecene-7 (commonly called “DBA-DBU”), triethylenediamine, hexamethylenetetramine and the like.
[0036]
The type and amount of the tertiary amino compound (E1) may be appropriately selected according to the curing rate to be obtained and the pot life, but it is usually 0. 10 parts by weight with respect to 100 parts by weight of the heterocyclic compound (A). It is preferable to add about 1 to 50 parts by weight.
[0037]
Examples of the adhesion-imparting agent used in the present invention include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent.
Examples of such silane coupling agents include vinylalkyl (1 to 4 carbon atoms) alkoxy (1 to 4 carbon atoms) silane [eg, vinyltrimethoxysilane, vinyltriethoxysilane, etc.], (meth) acryloyloxyalkyl ( C1-C4) silane [for example, [gamma] -methacryloxypropyltrimethoxysilane], alkyl (C1-C4) alkoxy (C1-C4) silane [for example, methyltrimethoxysilane, methyltriethoxysilane, etc.] , Amino (1 to 4 in the molecule) alkyl (2 to 15 carbon atoms) alkoxy (1 to 4 carbon atoms) silane [for example, γ- (2-aminoethyl) aminopropyltrimethoxysilane, aminopropyltrimethoxysilane, N-phenylaminopropylmethyldimethoxysilane etc.], epoxy (1-4 in the molecule) al Kill (1 to 4 carbon atoms) alkoxy (1 to 4 carbon atoms) silane [eg γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, etc.], mercapto (1 to 4 in the molecule) ) Alkyl (1 to 4 carbon atoms) alkoxy (1 to 4 carbon atoms) silane [for example, γ-mercaptotrimethoxysilane] and the like.
As the titanium coupling agent, Ti (O—C 17 H 35 ) Four , Ti (O-i-C Three H 7 ) 2 [OC (CH Three ) HCOCH Three ] 2 Ti (On-C Four H 9 ) 2 [OC 2 H Four N (C 2 H Four OH) 2 ] 2 , Titanium-i-propoxyoctylene glycolate, i-propoxytitanium tri-i-stearate, (ethylene glycolato) titanium bis (dioctyl phosphate) and the like.
Examples of the aluminum coupling agent include tributoxy aluminum, tristeoxy aluminum and the like.
These coupling agents may be used in combination of two or more. Any coupling agent can be used, but a silane coupling agent is preferable from the viewpoint of handling and cost. Of these, vinylalkylalkoxysilane, (meth) acryloyloxyalkylalkoxysilane, aminoalkylalkoxysilane, and epoxyalkylalkoxysilane are preferable, and vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ are particularly preferable. -(2-aminoethyl) aminopropyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane.
[0038]
The epoxy resin-based flooring material of the present invention includes (1) antioxidants such as hindered amines, hydroquinones, hindered phenols, sulfur-containing compounds, and (2) benzophenones, benzotriazoles, salicylic acid as necessary. UV absorbers such as esters and metal complex salts, (3) metal soaps, inorganic and organic salts of heavy metals (eg zinc, tin, lead, cadmium, etc.), stabilizers such as organic tin compounds, (4) phthalic acid Esters, phosphate esters, fatty acid esters, epoxidized soybean oil, castor oil, plasticizers such as liquid paraffin alkyl polycyclic aromatic hydrocarbons, (5) paraffin wax, microcrystalline wax, polymer wax, beeswax, whale wax low molecular weight Waxes such as polyolefins, (6) non-reactive diluents such as benzyl alcohol, tar and pitumen, (7) low molecular weight aliphatic greases Reactive diluents such as dil ether, aromatic monoglycidyl ether, (8) calcium carbonate, kaolin, talc, mica, bentonite, clay, sericite, asbestos, glass fiber powder, carbon fiber powder, aramid fiber powder, nylon fiber Powder, Acrylic fiber powder, Glass fiber powder, Glass balloon, Shirasu balloon, Coal powder, Acrylic resin powder, Phenol resin powder, Metal powder, Ceramic powder, Zeolite, Slate powder, etc., (9) Activated carbon, Zeolite, Silica sol Deodorizers such as silica gel (10) Pigments or dyes such as carbon black, titanium oxide, red iron oxide, red lead, para red, and bitumen, (11) solvents such as ethyl acetate, toluene, alcohols, ethers, ketones , (12) Foaming agent, (13) Antifoaming agent, (14) Dehydrating agent, (15) Antistatic agent, (16) Antibacterial agent, (17) Antifungal agent, (18) Viscosity control Preparations, (19) fragrance, (20) flame retardant, etc. can be added.
[0039]
In the curing mechanism of the epoxy resin coating floor material of the present invention, (C) first reacts with (A) to open a ring to generate SH groups, and the SH groups react with (B). In this case, (C) also reacts with (B), but the reaction rate with (B) is greater for the SH group than for (C). Therefore, the following (i) or (ii) is illustrated as a storage and usage form of each component of the epoxy resin-based flooring of the present invention.
(I) The heterocycle-containing compound (A), the epoxy group-containing compound (B), and the amino compound (C) are stored in the form of three independent liquids, and the three components are mixed and cured at the time of use. (The basic compound (D), which is an optional component, is stored alone as the fourth component, and can be used as a mixture with other components at the time of use. Alternatively, the basic compound (D) can be added to (A) and / or (C). You can also save it with
(Ii) A mixture of the heterocycle-containing compound (A) and the epoxy group-containing compound (B) and the amino compound (C) are stored in the form of two independent liquids, and the two components are mixed and cured at the time of use. [The basic component (E), which is an optional component, can be stored alone as the third component, and can be mixed with other components at the time of use, or can be stored in the form added in (C)] . ]
[0040]
The epoxy resin-based coating material of the present invention is mixed with (A), (B), (C) and other blends using an ordinary mixer such as a universal mixer. (C) is blended during normal use. The primer preferably has a viscosity at 25 ° C. of 2.5 to 4 Pa · s and preferably 5 to 7 Pa · s at 0 ° C. from the viewpoint of coating workability, curability and adhesiveness. The flooring can be cured at a low temperature, and can be sufficiently cured even in a low temperature environment of 5 ° C. or less. The cured product is excellent in physical properties such as adhesiveness, durability and chemical resistance.
[0041]
About the construction method operation of the construction method using the coating floor material of this invention, it can implement according to a conventional method. As painted floors, floors of buildings such as houses or various factories, indoor floors and exterior walls such as walls, corridors, or stairs, as well as floors of leisure facilities, sports facilities, transportation facilities, roads, parking lots, etc. Face. Depending on the coating film thickness or the shape of the floor surface, these floor surfaces can be constructed by any of the ladle method, mortar method, lining method, and coating method. From the form, a ladle method or a coating method is preferred.
As a coating method of the coating method, general methods such as brush coating, spray coating, and various coater coatings can be used.
The coating amount of the coating floor material of the present invention is not particularly limited, but is preferably 10 to 300 μm for primer coating, 50 to 500 μm for base coating, and 30 to 300 μm for top coating. Can be performed 1 to 3 times. Further, in the top coat coating, a normal top coating can be used without any particular limitation, for example, alkyd resin type, epoxy resin type, latex type, silicon alkyd resin type, urethane resin type, silicon acrylic resin type, fluorine resin type, etc. Paint can be used.
The cured product of the epoxy resin coating floor material of the present invention is excellent in interlayer adhesion with the floor surface and excellent in durability such as chemical resistance.
[0042]
【Example】
EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. The part in an Example and a comparative example represents a mass part.
[0043]
Moreover, the test method of the evaluation item in an Example is as follows.
[Finger dryness]: Latex (a fine substance that comes out with floating water) was removed from the epoxy resin-coated flooring of the present invention having the composition shown in Tables 2 and 3 at 0 ° C and 25 ° C. After coating 1.5 mm thick on concrete with Wool Roller B-23 [Otsuka Brush Manufacturing Co., Ltd.], determine the dryness to touch of the coating after leaving at 0 ° C and 25 ° C for 3 hours. did. (Good: No finger touch left, Bad: Finger touch left)
[Beautiful appearance]: The state of the coating film surface was visually observed. A sample having gloss and no blistering or peeling was marked with ◯, and a sample having blistering or peeling was marked with ×.
[Cross-cut test and chemical resistance]: Coating surface of a coating film obtained by applying an epoxy resin coated flooring material to a steel plate defined in JIS A5400 using a 0.1 mm film applicator and then curing at 0 ° C. and 25 ° C. An eye test and chemical resistance were conducted according to JIS5400. In addition, regarding chemical resistance, the case where there was no change was indicated as ◯, the case where the color faded was indicated as △, and the case where swelling or peeling occurred was indicated as ×.
[Mixed viscosity]: The epoxy resin-coated flooring material of the present invention blended with the compositions shown in Tables 2 and 3 was stirred at 0 ° C. and 25 ° C., and measured with a BL type rotational viscometer after 2 minutes.
(Unit: mPa · s)
[Adhesion strength]: The epoxy resin-coated flooring of the present invention blended with the composition of Tables 2 and 3 with a wool roller B-23 on the surface of a 30 × 30 × 5 cm sidewalk PC board at 0 ° C. and 25 ° C. After coating with a thickness of 1.5 mm and curing for 7 days, it was measured by the Kenken-type adhesive strength test method. (Unit: Kgf / cm 2 )
[0044]
Production Example 1
In a reaction vessel, 90 parts of carbon disulfide, 5 parts of lithium bromide and 120 parts of tetrahydrofuran (THF) were stirred and dissolved, and 58 parts of 2-ethylhexyl glycidyl ether was added dropwise while maintaining the temperature at 20 ° C. or lower. Aged for 5 hours. The THF and excess carbon disulfide were distilled off under reduced pressure, followed by filtration to obtain a pale yellow liquid heterocyclic compound (A-1) having a viscosity of 40 mPa · s at 25 ° C. and a heterocyclic group equivalent of 262. .
Production Example 2
After charging 90 parts of carbon disulfide, 5 parts of lithium chloride, and 140 parts of THF in a reaction vessel and stirring and dissolving, 140 parts of trimethylolpropane triglycidyl ether (epoxy equivalent 140) was added dropwise while maintaining the temperature at 20 ° C. or lower. Aging was carried out at 5 ° C. for 5 hours. The THF and excess carbon disulfide were distilled off under reduced pressure, followed by filtration to obtain a pale yellow liquid heterocyclic compound (A-2) having a viscosity of 130 mPa · s at 25 ° C. and a heterocyclic group equivalent of 218. .
[0045]
Production Example 3
After charging 90 parts of carbon disulfide, 5 parts of lithium bromide and 120 parts of THF in a reaction vessel and stirring and dissolving, 58 parts of trimethylene oxide was added dropwise while keeping the temperature at 20 ° C. or lower, and then aged at 40 ° C. for 5 hours. Under reduced pressure, THF and excess carbon disulfide were distilled off, followed by filtration to obtain a slightly yellow liquid heterocyclic compound (A-3) having a viscosity of 40 mPa · s at 25 ° C. and a heterocyclic group equivalent of 140. It was.
[0046]
Examples 1-5, Comparative Examples 1-3
Each component was mixed and stirred at the blending amounts shown in Tables 2 and 3, and a performance evaluation test as an epoxy resin-coated flooring material was performed by the above test method. The following were used as the compound (B) having two or more epoxy groups in the molecule.
Polyepoxide (B1); Epicoat 828 (Bisphenol A diglycidyl ether, epoxy equivalent 190, viscosity 11 Pa · s, manufactured by Yuka Shell Epoxy), and neopentyl glycol diglycidyl ether (epoxy equivalent 154, viscosity 20 mPa · s)
The following was used as the amino compound (C) having two or more active hydrogens derived from amino groups in the molecule.
(C1) Aliphatic polyamine; xylylenediamine (active hydrogen equivalent 36, viscosity 7 mPa · s)
Moreover, the following were used as a hardening accelerator.
(E2) DMP-30; Tris (N, N-dimethylaminomethyl) phenol In addition, “React CA-101” (active hydrogen equivalent 75, viscosity 2.1 Pa · s, manufactured by Sanyo Chemical Industries, Ltd. in Table 2 and Table 3) ) Is a Mannich-modified polyamine compound, “Capcure 3-800” (active hydrogen equivalent 280, viscosity 1.8 Pa · s) manufactured by Henkel is a polymercaptan compound.
The evaluation results at 0 ° C. of Examples 1 to 5 and Comparative Examples 1 to 3 are shown in Table 2, and the evaluation results at 25 ° C. are shown in Table 3.
[0047]
[Table 2]
[0048]
[Table 3]
[0049]
【The invention's effect】
The epoxy resin-coated flooring of the present invention is
(1) Since an organic solvent is not used, it is suitable for overcoating and can reduce safety problems such as air pollution.
(2) It can be applied even at a low temperature such as room temperature to 5 ° C. and has curability.
(3) Low viscosity, moderate pot life, and excellent workability.
(4) Excellent interlayer adhesion with the floor surface and the coated floor material applied thereon, and excellent cured properties such as chemical resistance.
There are effects such as.
Claims (8)
一般式
式(3)中、R4は脂環式エポキサイドの残基である。]The epoxy resin-based coating material according to claim 1, wherein the (A) is a heterocycle-containing compound (A1) represented by the following general formula (2) or (3).
General formula
In formula (3), R 4 is a residue of an alicyclic epoxide. ]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32945399A JP3837455B2 (en) | 1999-11-19 | 1999-11-19 | Epoxy resin coating flooring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32945399A JP3837455B2 (en) | 1999-11-19 | 1999-11-19 | Epoxy resin coating flooring |
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| Publication Number | Publication Date |
|---|---|
| JP2001146566A JP2001146566A (en) | 2001-05-29 |
| JP3837455B2 true JP3837455B2 (en) | 2006-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP32945399A Expired - Fee Related JP3837455B2 (en) | 1999-11-19 | 1999-11-19 | Epoxy resin coating flooring |
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| JP (1) | JP3837455B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4473089B2 (en) * | 2004-10-14 | 2010-06-02 | 株式会社エービーシー建材研究所 | Resin composition for coating floor material and coating film for coating floor material |
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