JP4342628B2 - Structure-reinforced epoxy resin composition for fiber reinforcement and fiber-reinforced composite material - Google Patents
Structure-reinforced epoxy resin composition for fiber reinforcement and fiber-reinforced composite material Download PDFInfo
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- JP4342628B2 JP4342628B2 JP7662199A JP7662199A JP4342628B2 JP 4342628 B2 JP4342628 B2 JP 4342628B2 JP 7662199 A JP7662199 A JP 7662199A JP 7662199 A JP7662199 A JP 7662199A JP 4342628 B2 JP4342628 B2 JP 4342628B2
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- Prior art keywords
- fiber
- ether
- compound
- group
- resin composition
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 22
- 229920000647 polyepoxide Polymers 0.000 title claims description 19
- 239000000463 material Substances 0.000 title claims description 17
- 239000000835 fiber Substances 0.000 title claims description 16
- 239000003822 epoxy resin Substances 0.000 title claims description 14
- 239000003733 fiber-reinforced composite Substances 0.000 title claims description 14
- 230000002787 reinforcement Effects 0.000 title description 7
- -1 amino compound Chemical class 0.000 claims description 44
- 150000001875 compounds Chemical class 0.000 claims description 44
- 125000004432 carbon atom Chemical group C* 0.000 claims description 26
- 125000003700 epoxy group Chemical group 0.000 claims description 20
- 125000000623 heterocyclic group Chemical group 0.000 claims description 16
- 150000004292 cyclic ethers Chemical group 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- 229910052717 sulfur Inorganic materials 0.000 claims description 8
- 239000004567 concrete Substances 0.000 claims description 7
- 125000004434 sulfur atom Chemical group 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 5
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 27
- 229920000768 polyamine Polymers 0.000 description 25
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 24
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 18
- 239000011342 resin composition Substances 0.000 description 15
- 239000000843 powder Substances 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 10
- 125000001931 aliphatic group Chemical group 0.000 description 10
- 150000002391 heterocyclic compounds Chemical class 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical compound S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 8
- 150000002989 phenols Chemical class 0.000 description 8
- 239000012783 reinforcing fiber Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 6
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 229920006231 aramid fiber Polymers 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 150000002921 oxetanes Chemical class 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 125000005263 alkylenediamine group Chemical group 0.000 description 4
- 150000007514 bases Chemical class 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- QGJOPFRUJISHPQ-NJFSPNSNSA-N carbon disulfide-14c Chemical compound S=[14C]=S QGJOPFRUJISHPQ-NJFSPNSNSA-N 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 3
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- XVBLEUZLLURXTF-UHFFFAOYSA-N 2,4-dimethylbenzene-1,3-diamine Chemical compound CC1=CC=C(N)C(C)=C1N XVBLEUZLLURXTF-UHFFFAOYSA-N 0.000 description 2
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 2
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 2
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 2
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 2
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000004761 kevlar Substances 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- MERIEQHLDYSVSR-UHFFFAOYSA-N n-[[2-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C(=CC=CC=1)CN(CC1OC1)CC1OC1)CC1CO1 MERIEQHLDYSVSR-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 150000008442 polyphenolic compounds Chemical class 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- PFTAWBLQPZVEMU-DZGCQCFKSA-N (+)-catechin Chemical compound C1([C@H]2OC3=CC(O)=CC(O)=C3C[C@@H]2O)=CC=C(O)C(O)=C1 PFTAWBLQPZVEMU-DZGCQCFKSA-N 0.000 description 1
- LJCJRRKKAKAKRV-UHFFFAOYSA-N (2-amino-2-methylpropyl) 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(N)COC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 LJCJRRKKAKAKRV-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- PDZGUDFYWJIFLV-PPHPATTJSA-N (4r)-1-methyl-4-prop-1-en-2-ylcyclohexene;phenol Chemical compound OC1=CC=CC=C1.CC(=C)[C@@H]1CCC(C)=CC1 PDZGUDFYWJIFLV-PPHPATTJSA-N 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- BBIGOAXUVWIUJL-UHFFFAOYSA-N 1,5-dihydroxynaphthalene diglycidyl ether Chemical compound C1=CC2C3OC3COCC3OC3C2(O)C2=C1C(O)=CC=C2 BBIGOAXUVWIUJL-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- AEYNYHSOGNVQRY-UHFFFAOYSA-N 1-n,1-n-diethyl-4-methylbenzene-1,3-diamine Chemical compound CCN(CC)C1=CC=C(C)C(N)=C1 AEYNYHSOGNVQRY-UHFFFAOYSA-N 0.000 description 1
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Description
【0001】
【発明の属する技術分野】
本発明は繊維強化用樹脂組成物、およびその複合材料に関する。さらに詳しくはエポキシ樹脂系からなる繊維強化用エポキシ樹脂組成物、および繊維強化複合材料に関する。
【0002】
【従来の技術】
橋梁、トンネル、煙突、道路床版、建物の柱、壁および天井等、コンクリート構造物等について、長年の使用によるコンクリートの中性化、それに伴う鉄骨や鉄筋の錆発生による劣化、通行車輌重量規制緩和による負荷の増大、地震による損傷、大地震を想定した耐震基準強化等への対応からこれらの補強が行われている。補強方法としては、カーボン繊維やアラミド繊維等の連続繊維シートを巻き付けた後、樹脂を含浸させ硬化させる方法が行われるようになってきた。
用いられる樹脂として、エポキシ樹脂とシリコン樹脂の併用がある(特開平10−053956号公報)。
【0003】
【発明が解決しようとする課題】
しかし、上記樹脂を用いる方法では、吸湿により樹脂が加水分解する。その加水解生成物の揮発成分が、長期間にわたって環境へ放出されるため安全性に問題がある。またその不揮発成分は、繊維補強表面やコンクリートとの界面にブリードアウトし、表面の滑りや剥離を引き起こすという問題がある。本発明は常温ないし低温下で、低粘度、速硬化性を有する繊維強化用エポキシ樹脂組成物、及びそれと繊維を組み合わせて硬化させた高強度の繊維強化複合材料を提供することを目的とする。
【0004】
【課題を解決するための手段】
本発明者らは、かかる現状に鑑み、繊維による補強用樹脂組成物において、上記目的を達成すべく鋭意検討を重ねた結果、本発明に到達した。すなわち、下記一般式(1)で表されるヘテロ環含有化合物(A)、分子中に2個以上のエポキシ基を有するポリエポキシ化合物(B)、並びに分子中に1級アミノ基及び/又は2級アミノ基に由来する活性水素を2個以上有するアミノ化合物(C)からなることを特徴とする、コンクリート構築物の補強用である繊維強化複合材料用エポキシ樹脂組成物である。
【0005】
【化5】
【0006】
[式(1)中、nは1〜10の整数、X1 は硫黄原子、Y1 、Z1は、一方が硫黄原子で他方が酸素原子;R1は環状エーテル基含有化合物(D)の残基又は水素原子;R2は炭素数2〜10の炭化水素基である。]
【0007】
【発明の実施の形態】
本発明においてヘテロ環含有化合物(A)は、前記一般式(1)で示される。式中、nは1〜10、好ましくは2〜8の整数、X1、Y1及びZ1は、それぞれ酸素又は硫黄原子である。好ましくはX1が硫黄原子(S)で、Y1、Z1の一方が硫黄原子(S)で他方が酸素原子(O)である。
R2 は、環状エーテル基中の酸素原子以外の環を構成する残基である。これは炭素数2〜10の炭化水素基であり、3価の炭化水素基>CH(CH2)m−(mは1〜9の整数)で示される基であり、例えば>CHCH2−、>CHCH2CH2−、>CHCH2CH2CH2−、>CHCH2CH2CH2CH2CH2−等;4価の炭化水素基>CH(CH2)mCH<(mは0〜8の整数)で示される基であり、例えば>CHCH<、>CHCH2CH<、>CHCH2CH2CH<、>CHCH2CH2CH2CH2CH<等が挙げられ、好ましくは、3価の炭化水素基であり、特に好ましくは>CHCH2−、>CHCH2CH2−である。
R1 は水素原子または環状エーテル基含有化合物(D)の残基であり、一般式(5)で示される。
一般式
【0008】
【化6】
【0009】
環状エーテル基としては、環内に酸素原子を1個有するものならば特に限定されず、分子内に環状エーテル基を1〜10個有する化合物があげられる。
環状エーテル基含有化合物(D)の例としては、後述するエポキシ基含有化合物(D1)、およびオキセタン化合物(D2)等が挙げられ、好ましくは、エポキシ基含有化合物(D1)である。
エポキシ基含有化合物(D1)としては、モノエポキサイド(d11)と分子中にエポキシ基を2個以上有するポリエポキサイド(D11)とがある。
モノエポキサイド(d11)としては、分子中に1個のエポキシ基を有していれば特に限定されず、用途、目的に応じて適宜選択することができる。その例としては以下のものが挙げられる。例えば、
(d11−1)炭素数2〜24の炭化水素系オキシド(エチレンオキシド、プロピレンオキシド、1−ブテンオキシド、2−ブテンオキシド、炭素数5〜24のα−オレフィンオキシド、スチレンオキシド等)、
(d11−2)炭素数3〜19の炭化水素のグリシジルエーテル(n−ブチルグリシジルエーテル、アリルグリシジルエーテル、2−エチル−ヘキシルグリシジルエーテル、2−メチルオクチルグリシジルエーテル、フェニルグリシジルエーテル、クレジルグリシジルエーテル、p−sec−ブチルフェニルグリシジルエーテル、P−tert−ブチルフェニルグリシジルエーテル等)、
(d11−3)炭素数3〜30のモノカルボン酸のグリシジルエステル(グリシジルアクリレート、グリシジルメタクリレート等)、エピクロルヒドリン、エピブロモヒドリン等のエピハロヒドリン及びグリシドール等の水酸基含有オキシド等が挙げられる。好ましいのは炭素数2〜24の炭化水素系オキシド、炭素数3〜19の炭化水素のグリシジルエーテルである。
【0010】
ポリエポキサイド(D11)は、分子中に2個以上のエポキシ基を有していれば、特に限定されず、用途、目的に応じて適宜選択することができる。好ましいのは、分子中にエポキシ基を2〜6個有するものである。ポリエポキサイドのエポキシ当量(エポキシ基1個当たりの分子量)は、通常65〜1000であり、好ましいのは90〜500である。エポキシ当量が1000以下であると、架橋構造がルーズにならず硬化物の耐水性、耐薬品性、機械的強度等の物性が良好であり、一方、エポキシ当量が65以上であると硬化物の耐水性、耐薬品性、機械強度等が良好な架橋構造となる。
ポリエポキサイド(D11)の例としては、下記(D11−1)から(D11−5)が挙げられる。
【0011】
(D11−1)グリシジルエーテル型
(i)2価フェノール類のジグリシジルエーテル
炭素数6〜30の2価フェノール類のジグリシジルエーテル例えば、ビスフェノールFジグリシジルエーテル、ビスフェノールAジグリシジルエーテル、ビスフェノールBジグリシジルエーテル、ビスフェノールADジグリシジルエーテル、ビスフェノールSジグリシジルエーテル、ハロゲン化ビスフェノールAジグリシジルエーテル、テトラクロロビスフェノールAジグリシジルエーテル、カテキンジグリシジルエーテル、レゾルシノールジグリシジルエーテル、ハイドロキノンジグリシジルエーテル、1,5−ジヒドロキシナフタレンジグリシジルエーテル、ジヒドロキシビフェニルジグリシジルエーテル、オクタクロロ−4,4’−ジヒドロキシビフェニルジグリシジルエーテル、テトラメチルビフェニルジグリシジルエーテル、9,9’−ビス(4−ヒドロキシフェニル)フロオレンジグリシジルエーテル、ビスフェノールA2モルとエピクロロヒドリン3モルの反応から得られるジグリシジルエーテル等;
【0012】
(ii)3〜6価又はそれ以上の、多価フェノール類のポリグリシジルエーテル
炭素数6〜50又はそれ以上で、分子量250〜3000の3〜6価又はそれ以上の多価フェノール類のポリグリシジルエーテル例えば、ピロガロールトリグリシジルエーテル、ジヒドロキシナフチルクレゾールトリグリシジルエーテル、トリス(ヒドロキシフェニル)メタントリグリシジルエーテル、ジナフチルトリオールトリグリシジルエーテル、テトラキス(4−ヒドロキシフェニル)エタンテトラグリシジルエーテル、p−グリシジルフェニルジメチルトリールビスフェノールAグリシジルエーテル、トリスメチル−tert−ブチル−ブチルヒドロキシメタントリグリシジルエーテル、4,4’−オキシビス(1,4−フェニルエチル)テトラクレゾールグリシジルエーテル、4,4’−オキシビス(1,4−フェニルエチル)フェニルグリシジルエーテル、ビス(ジヒドロキシナフタレン)テトラグリシジルエーテル、フェノール又はクレゾールノボラック樹脂(分子量400〜5000)のグリシジルエーテル、リモネンフェノールノボラック樹脂(分子量400〜5000)のグリシジルエーテル、フェノールとグリオキザール、グルタールアルデヒド、又はホルムアルデヒドの縮合反応によつて得られるポリフェノール(分子量400〜5000)のポリグリシジルエーテル、およびレゾルシンとアセトンの縮合反応によって得られる分子量400〜5000のポリフェノールのポリグリシジルエーテル等が挙げられる。
【0013】
(iii)脂肪族2価アルコールのジグリシジルエーテル
炭素数2〜100、分子量150〜5000のジオールのジグリシジルエーテル例えば、エチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、テトラメチレングリコールジグリシジルエーテル、1,6−ヘキサンジオールジグリシジルエーテル、ポリエチレングリコール(分子量150〜4000)ジグリシジルエーテル、ポリプロピレングリコール(分子量180〜5000)ジグリシジルエーテル、ポリテトラメチレングリコール(分子量200〜5000)ジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、ビスフェノールAのアルキレンオキシド〔エチレンオキシド又はプロピレンオキシド(1〜20モル)〕付加物のジグリシジルエーテル等;
(vi)3〜6価又はそれ以上の脂肪族アルコールのポリグリシジルエーテル炭素数3〜50又はそれ以上で、分子量92〜10000の3〜6価又はそれ以上の多価アルコール類のグリシジルエーテル例えば、トリメチロールプロパントリグリシジルエーテル、グリセリントリグリシジルエーテル、ペンタエリスリトールテトラグリシジルエーテル、ソルビトールヘキサグリシジルエーテル、ポリ(n=2〜5)グリセロールポリグリシジルエーテル等が挙げられる。
【0014】
(D11−2)グリシジルエステル型
炭素数6〜20又はそれ以上で、2〜6価又はそれ以上の芳香族ポリカルボン酸のグリシジルエステル、及び炭素数6〜20又はそれ以上で、2〜6価又はそれ以上の脂肪族もしくは脂環式ポリカルボン酸のグリシジルエステルが挙げられる。
(I)芳香族ポリカルボン酸、例えばフタル酸類のグリシジルエステルとしては、フタル酸ジグリシジルエステル、イソフタル酸ジグリシジルエステル、テレフタル酸ジグリシジルエステル、トリメリット酸トリグリシジルエステル等;
(II)脂肪族もしくは脂環式ポリカルボン酸のグリシジルエステルとしては、上記フェノール系のグリシジルエステルの芳香核水添加物、ダイマー酸ジグリシジルエステル、ジグリシジルオキサレート、ジグリシジルマレート、ジグリシジルスクシネート、ジグリシジルグルタレート、ジグリシジルアジペート、ジグリシジルピメレート、グリシジル(メタ)アクリレートの(共)重合体(重合度は例えば2〜10)、トリカルバリル酸トリグリシジルエステル等が挙げられる。
【0015】
(D11−3)グリシジルアミン型
炭素数6〜20又はそれ以上で、2〜10又はそれ以上の活性水素原子をもつ芳香族アミン類のグリシジルアミンおよび脂肪族、脂環式若しくは複素環式アミン類のグリシジルアミンが挙げられる。
芳香族アミン類のグリシジルアミンとしては、N,N−ジグリシジルアニリン、N,N−ジグリシジルトルイジン、N,N,N’,N’−テトラグリシジルジアミノジフェニルメタン、N,N,N’,N’−テトラグリシジルジアミノジフェニルスルホン、N,N,N’,N’−テトラグリシジルジエチルジフェニルメタン、N,N,O−トリグリシジルアミノフェノール等が挙げられる。
脂肪族アミンのグリシジルアミンとしてはN,N,N’,N’−テトラグリシジルキシリレンジアミン、N,N,N’,N’−テトラグリシジルヘキサメチレンジアミン等が挙げられる。
脂環式アミンとしてはN,N,N’,N’−テトラグリシジルキシリレンジアミンの水添化合物等が挙げられる。
複素環式アミンのグリシジルアミンとしてはトリスグリシジルメラミン等が挙げられる。
【0016】
(D11−4)鎖状脂肪族エポキサイド
炭素数6〜50又はそれ以上で2〜6価又はそれ以上の鎖状脂肪族エポキサイド、例えばエポキシ当量130〜1,000のエポキシ化ポリブタジエン(分子量90〜2,500)、エポキシ化大豆油(分子量130〜2,500)等が挙げられる。
(D11−5)脂環式エポキサイド
炭素数6〜50又はそれ以上で、分子量90〜2500、エポキシ基の数1〜4又はそれ以上の脂環式エポキサイド例えば、ビニルシクロヘキセンジオキシド、リモネンジオキシド、ジシクロペンタジエンジオキシド、ビス(2,3−エポキシシクロペンチル)エーテル、エチレングリコールビスエポキシジシクロペンチルエーテル、3,4エポキシ−6−メチルシクロヘキシルメチル3’、4’−エポキシ−6’−メチルシクロヘキサンカルボキシレート、ビス(3,4−エポキシ−6−メチルシクロヘキシルメチル)アジペート、およびビス(3,4−エポキシ−6−メチルシクロヘキシルメチル)ブチルアミン等が挙げられる。また、前記フェノール類のエポキシ化合物の核水添化物も含む。
なお(D11−1)〜(D11−5)以外のものでも、活性水素と反応可能なグリシジル基をもつエポキシ樹脂であれば使用できる。又、これらのポリエポキシ化合物は、二種以上併用できる。これらのうち、好ましいのはグリシジルエーテル型(D11−1)、およびグリシジルエステル型(D11−2)であり、特に好ましいのは、グリシジルエーテル型(D11−1)である。(D11−1)の内、好ましいのは2価フェノール類、2価脂肪族アルコールのジグリシジルエーテルである。
【0017】
オキセタン化合物(D2)としては、炭素数6〜20の脂肪族系オキセタン化合物(3−エチル−3−ヒドロキシメチルオキセタン等)、炭素数7〜30の芳香族系オキセタン化合物(ベンジルオキセタン、キシリレンビスオキセタン等)、炭素数6〜30の脂肪族カルボン酸系オキセタン化合物(アジペートビスオキセタン等)、炭素数8〜30の芳香族カルボン酸系オキセタン化合物(テレフタレートビスオキセタン等)、炭素数8〜30の脂環式カルボン酸系オキセタン化合物(シクロヘキサンジカルボン酸ビスオキセタン等)、芳香族イソシアネート系オキセタン化合物(MDIビスオキセタン等)、炭素数2〜20の硫黄系オキセタン化合物(チイラン、2−メチルチイラン、2,2−ジメチルチイラン、2−ヘキシルチイラン、2−フェニルチイラン等)等が挙げられる。
環状エーテル基含有化合物(D)として、エポキシ基含有化合物(D1)を使用したヘテロ環含有化合物(A1)は、下記一般式(2)、(3)で示される。一般式
【0018】
【化7】
【0019】
式中、nは1〜10の整数。Y2 、Z2 は一方がSで他方がOであり、好ましくは、Y2 がO、Z2 がSである。R3はポリエポキシ化合物(D11)またはモノエポキシ化合物(d11)の残基である。R4は脂環式エポシサイドの残基である。ここで特に好ましくは、nは1、Y2 はO、Z2 はS、R3はモノグリシジル化合物(d11−2)のエポキシ基を除く残基である。
【0020】
本発明の組成物中のヘテロ環含有化合物(A)の製造方法は、特に限定されないが、例えば、環状エーテル基含有化合物(D)の環状エーテル基に対し、0.5〜10倍当量の二硫化炭素、硫化カルボニル及び二酸化炭素、好ましくは二硫化炭素を、溶剤中、触媒存在下で、反応させることにより得られる。
溶剤としては、反応を阻害せず、原料および生成物を溶解するものなら特に制限はなく、通常、非プロトン性溶剤が使用される。例えば、エーテル類(テトラヒドロフラン、ジオキサン、ジエチルセロソルブ、ジオキソラン、トリオキサン、ジブチルセロソルブ、ジエチルカービトール、ジブチルカービトール等)、ケトン類(アセトン、メチルエチルケトン、メチルイソブチルケトン、ジエチルケトン等)、エステル類(酢酸メチル、酢酸エチル、酢酸n−ブチル等)、その他極性溶剤(アセトニトリル、ジメチルホルムアミド、N−メチルピロリドン、ジメチルスルホキシド等)等が挙げられ、好ましくは、テトラヒドロフラン、アセトン、酢酸エチル等である。
触媒は、アルカリ金属またはアルカリ土類金属のハロゲン化物であり、例えば、塩化リチウム、臭化リチウム、沃化リチウム、塩化カリウム、臭化カルシウム等が挙げられ、好ましくは、臭化リチウムである。触媒の量は、(D)の環状エーテル基に対し、0.001〜1.0倍当量である。好ましくは0.01〜0.1倍当量である。
【0021】
反応温度は、通常、0〜100℃、好ましくは、20〜70℃である。
ヘテロ環含有化合物(A1)の製造方法は、環状エーテル基含有化合物(D)として分子中にエポキシ基含有化合物(D)を使用することである。エポキシ基含有化合物(D)としては、分子中にエポキシ基を1個または2個以上有する化合物であれば特に限定されない。
ヘテロ環含有化合物(A)の重量平均分子量は120〜12,000であり、好ましくは200〜8,000である。ヘテロ環当量は通常120〜1,200であり、好ましくは200〜800である。25℃での粘度は、通常20,000mPa・s以下であり、好ましくは10,000mPa・s以下、さらに好ましくは5,000mPa・s以下であり、特に好ましくは1,000mPa・s以下である。
上記の様にして得られるヘテロ環含有化合物(A)は具体的には表1に記載したものが挙げられる。
【0022】
【表1】
【0023】
本発明の、分子中にエポキシ基を2個以上有するポリエポキシ化合物(B)としては(D11)と同じものが挙げられる。好ましくは(D11−1)である。
【0024】
本発明のアミノ化合物(C)は、分子中に1級アミノ基及び/又は2級アミノ基に由来する活性水素を2個以上有する化合物であれば特に限定されず、用途、目的に応じて適宜選択することができる。好ましくは、分子中に1級アミノ基及び/又は2級アミノ基に由来する活性水素を2〜10個有する化合物であり、更に好ましくは、3〜6個有する化合物である。(C)の活性水素当量(活性水素1個当りの分子量)は、通常15〜500であり、好ましいのは20〜200である。活性水素当量が、500以下であると、架橋構造がルーズにならず硬化物の耐薬品性、機械的強度等の物性が良好である。一方、活性水素当量が15以上であると硬化物の耐薬品性、機械的強度等の物性が良好である。
【0025】
(C)のアミノ化合物の例としては、以下の(C1)〜(C9)がそれぞれ挙げられる。
(C1)脂肪族ポリアミン類(炭素数2〜18、官能基数2〜7、分子量60〜500):(i)脂肪族ポリアミン{炭素数2〜6のアルキレンジアミン(エチレンジアミン、プロピレンジアミン、トリメチレンジアミン、テトラメチレンジアミン、ヘキサメチレンジアミンなど)、ポリアルキレン(炭素数2〜6)ポリアミン〔ジエチレントリアミン、イミノビスプロピルアミン、ビス(ヘキサメチレン)トリアミン,トリエチレンテトラミン、テトラエチレンペンタミン、ペンタエチレンヘキサミン等〕};(ii)これらのアルキル(炭素数1〜4)またはヒドロキシアルキル(炭素数2〜4)置換体〔ジアルキル(炭素数1〜3)アミノプロピルアミン、トリメチルヘキサメチレンジアミン、アミノエチルエタノールアミン、2,5−ジメチル−2,5−ヘキサメチレンジアミン、メチルイミノビスプロピルアミンなど〕;(iii)脂環または複素環含有脂肪族ポリアミン〔3,9−ビス(3−アミノプロピル)−2,4,8,10−テトラオキサスピロ[5,5]ウンデカンなど〕;(iv)芳香環含有脂肪族アミン類(炭素数8〜15)(キシリレンジアミン、テトラクロル−p−キシリレンジアミン等);
(C2)脂環式ポリアミン(炭素数4〜15、官能基数2〜3):1,3−ジアミノシクロヘキサン、イソホロンジアミン、メンセンジアミン、4,4´−メチレンジシクロヘキサンジアミン(水添メチレンジアニリン)等;
(C3)複素環式ポリアミン(炭素数4〜15、官能基数2〜3):ピペラジン、N−アミノエチルピペラジン、1,4−ジアミノエチルピペラジン、1,4ビス(2−アミノ−2−メチルプロピル)ピペラジン等;
【0026】
(C4)芳香族ポリアミン類(炭素数6〜20、官能基数2〜3、分子量100〜1000):(i)非置換芳香族ポリアミン〔1,2−、1,3−及び1,4−フェニレンジアミン、2,4´−及び4,4´−ジフェニルメタンジアミン、クルードジフェニルメタンジアミン(ポリフェニルポリメチレンポリアミン)、ジアミノジフェニルスルホン、ベンジジン、チオジアニリン、ビス(3,4−ジアミノフェニル)スルホン、2,6−ジアミノピリジン、m−アミノベンジルアミン、トリフェニルメタン−4,4´,4”−トリアミン、ナフチレンジアミン等;(ii)核置換アルキル基〔メチル,エチル,n−およびi−プロピル、ブチル等の炭素数C1〜C4アルキル基)を有する芳香族ポリアミン、例えば2,4−及び2,6−トリレンジアミン、クルードトリレンジアミン、ジエチルトリレンジアミン、4,4´−ジアミノ−3,3´−ジメチルジフェニルメタン、4,4´−ビス(o−トルイジン)、ジアニシジン、ジアミノジトリルスルホン、1,3−ジメチル−2,4−ジアミノベンゼン、1,3−ジエチル−2,4−ジアミノベンゼン、1,3−ジメチル−2,6−ジアミノベンゼン、1,4−ジエチル−2,5−ジアミノベンゼン、1,4−ジイソプロピル−2,5−ジアミノベンゼン、1,4−ジブチル−2,5−ジアミノベンゼン、2,4−ジアミノメシチレン、1,3,5−トリエチル−2,4−ジアミノベンゼン、1,3,5−トリイソプロピル−2,4−ジアミノベンゼン、1−メチル−3,5−ジエチル−2,4−ジアミノベンゼン、1−メチル−3,5−ジエチル−2,6−ジアミノベンゼン、2,3−ジメチル−1,4−ジアミノナフタレン、2,6−ジメチル−1,5−ジアミノナフタレン、2,6−ジイソプロピル−1,5−ジアミノナフタレン、2,6−ジブチル−1,5−ジアミノナフタレン、3,3´,5,5´−テトラメチルベンジジン、3,3´,5,5´−テトライソプロピルベンジジン、3,3´,5,5´−テトラメチル−4,4´−ジアミノジフェニルメタン、3,3´,5,5´−テトラエチル−4,4´−ジアミノジフェニルメタン、3,3´,5,5´−テトライソプロピル−4,4´−ジアミノジフェニルメタン、3,3´,5,5´−テトラブチル−4,4´−ジアミノジフェニルメタン、3,5−ジエチル−3´−メチル−2´,4−ジアミノジフェニルメタン,3,5−ジイソプロピル−3´−メチル−2´,4−ジアミノジフェニルメタン、3,3´−ジエチル−2,2´−ジアミノジフェニルメタン、4,4´−ジアミノ−3,3´−ジメチルジフェニルメタン、3,3´,5,5´−テトラエチル−4,4´−ジアミノベンゾフェノン、3,3´,5,5´−テトライソプロピル−4,4´−ジアミノベンゾフェノン、3,3´,5,5´−テトラエチル−4,4´−ジアミノジフェニルエーテル、3,3´,5,5´−テトライソプロピル−4,4´−ジアミノジフェニルスルホン等〕、及びこれらの異性体の種々の割合の混合物;
【0027】
(iii)核置換電子吸引基(Cl,Br,I,F等のハロゲン;メトキシ、エトキシ等のアルコキシ基;ニトロ基等)を有する芳香族ポリアミン〔メチレンビス−o−クロロアニリン、4−クロロ−o−フェニレンジアミン、2−クロル−1,4−フェニレンジアミン、3−アミノ−4−クロロアニリン、4−ブロモ−1,3−フェニレンジアミン、2,5−ジクロル−1,4−フェニレンジアミン、5−ニトロ−1,3−フェニレンジアミン、3−ジメトキシ−4−アミノアニリン;4,4´−ジアミノ−3,3´−ジメチル−5,5´−ジブロモ−ジフェニルメタン、3,3´−ジクロロベンジジン、3,3´−ジメトキシベンジジン、ビス(4−アミノ−3−クロロフェニル)オキシド、ビス(4−アミノ−2−クロロフェニル)プロパン、ビス(4−アミノ−2−クロロフェニル)スルホン、ビス(4−アミノ−3−メトキシフェニル)デカン、ビス(4−アミノフェニル)スルフイド、ビス(4−アミノフェニル)テルリド、ビス(4−アミノフェニル)セレニド、ビス(4−アミノ−3−メトキシフェニル)ジスルフイド、4,4´−メチレンビス(2−ヨードアニリン)、4,4´−メチレンビス(2−ブロモアニリン)、4,4´−メチレンビス(2−フルオロアニリン)、4−アミノフェニル−2−クロロアニリン等〕;
【0028】
(iv)2級アミノ基を有する芳香族ポリアミン〔上記(i)〜(iii)の芳香族ポリアミンの−NH2の一部または全部が−NH−R´(R´はアルキル基例えばメチル、エチル等の低級アルキル基)で置き換ったもの〕〔4,4´−ジ(メチルアミノ)ジフェニルメタン、1−メチル−2−メチルアミノ−4−アミノベンゼン等〕;
(C5)ポリアミドポリアミン:ジカルボン酸(ダイマー酸等)と過剰の(酸1モル当り2モル以上の)ポリアミン類(官能基数2〜7の上記アルキレンジアミン,ポリアルキレンポリアミン等)との縮合により得られるポリアミドポリアミン(数平均分子量200〜1000)等;
(C6)ポリエーテルポリアミン:ポリエーテルポリオール(前述のポリアルキレングリコール等)のシアノエチル化物の水素化物(分子量100〜1000)等;
(C7)エポキシ付加ポリアミン:エポキシ化合物(上記ポリエポキサイド(B1)、並びに、モノエポキサイド(b))1モルをポリアミン類(上記アルキレンジアミン、ポリアルキレンポリアミン等)に1〜30モル付加させることによって得られるエポキシ付加ポリアミン(分子量100〜1000)等;
【0029】
(C8)シアノエチル化ポリアミン:アクリロニトリルとポリアミン類(上記アルキレンジアミン、ポリアルキレンポリアミン等)との付加反応により得られるシアノエチル化ポリアミン、(ビスシアノエチルジエチレントリアミン等)(分子量100〜500)等;
(C9)その他のポリアミン化合物:(i)ヒドラジン類(ヒドラジン、モノアルキルヒドラジン等);(ii)ジヒドラジッド類(コハク酸ジヒドラジッド,アジピン酸ジヒドラジッド,イソフタル酸ジヒドラジッド,テレフタル酸ジヒドラジッド等);(iii)グアニジン類(ブチルグアニジン,1−シアノグアニジン等);(iv)ジシアンジアミド等;並びにこれらの2種以上の混合物。
上記(C1)〜(C9)のうち、本発明の硬化性組成物に高速硬化性を与えるために、好ましいのは、(C1)、(C2)、(C3)および(C5)であり、特に好ましいのは、(C1)である。
【0030】
本発明の繊維強化用エポキシ樹脂組成物には、硬化剤としてアミノ化合物(C)が必須成分であるが、硬化性をより促進する目的で、必要により塩基性化合物(E)をさらに含有させることができる。
塩基性化合物(E)としては、3級アミン化合物(E1)、ソジウムメチラート、カセイソーダ、カセイカリ、炭酸リチウム等のアルカリ化合物(E2)、トリエチルフォスフィン、トリフェニルフォスフィン等のルイス塩基化合物(E3)等が挙げられる。これらにうち好ましいものは、3級アミン化合物(E1)である。
【0031】
上記の(E)として好ましい3級アミン化合物(E1)は、分子中に3級アミノ基を有する化合物であれば特に限定されないが、例としては、以下の(E1−1)から(E1−3)がそれぞれあげられる。
(E1−1)脂肪族3級アミン トリメチルアミン、トリエチルアミン、ジメチルシクロヘキシルアミン、ジメチルベンジルアミン、1,3−ジメチルイミダゾリジノン、1,2−ジメチルイミダゾール、テトラエチルメチレンジアミン、テトラメチルプロパン−1,3−ジアミン、テトラメチルヘキサン−1,6−ジアミン、ペンタメチルジエチレントリアミン、ペンタメチルジプロピレントリアミン、テトラメチルグアニジン、ジメチルピペラジン、N−メチル−N’−(2−ジメチルアミノ)−エチルピペラジン、N−メチルモルホリン、N−(N’,N’−ジメチルアミノエチル)モルホリン、ジメチルアミノエタノール、ジメチルアミノエトキシエタノール、N,N,N’−トリメチルアミノエチル−エタノールアミン、N−メチル−N’−(2−ヒドロキシエチル)モルホリン、ビス(2−ジメチルアミノエチル)エーテル、エチレングリコール(3−ジメチル)アミノプロピルエーテル等、
(E1−2)フェノール核含有脂肪族3級アミン:N,N−ジメチルアミノメチルフェノール(通称「DMP−10」)、トリス(N,N−ジメチルアミノメチルフェノール(通称「DMP−30」)等、
(E1−3)含窒素複素環化合物 1,8−ジアザビシクロ(5,4,0)−ウンデセン−7(通称「DBU」)、1,5−ジアザビシクロ(4,3,0)−ノネン−5(通称「DBN」)、6−ジブチルアミノ−1,8−ジアザビシクロ(5,4,0)−ウンデセン−7(通称「DBA−DBU」)、トリエチレンジアミン、ヘキサメチレンテトラミン等があげられる。
【0032】
3級アミン化合物(E1)は、得ようとする硬化速度、可使時間に応じて、種類、添加量とも適宜選択すればよいが、通常、ヘテロ環含有化合物(A)100重量部に対して、0.1〜50重量部程度添加されるのが好ましい。
本発明の繊維強化用エポキシ樹脂組成物には、必要に応じて、(1)シランカップリング剤、チタンカップリング剤等の密着性向上剤、(2)ヒンダードアミン類、ハイドロキノン類、ヒンダードフェノール類、硫黄含有化合物等の酸化防止剤、(3)ベンゾフェノン類、ベンゾトリアゾール類、サリチル酸エステル類、金属錯塩類等の紫外線吸収剤、(4)金属石けん類、重金属(例えば亜鉛、錫、鉛、カドミウム等)の無機および有機塩類、有機錫化合物等の安定剤、(5)フタル酸エステル、リン酸エステル、脂肪酸エステル、エポキシ化大豆油、ひまし油、流動パラフィンアルキル多環芳香族炭化水素等の可塑剤、(6)パラフィンワックス、マイクロクリスタリンワックス、重合ワックス、密ロウ、鯨ロウ低分子量ポリオレフィン等のワックス類、(7)ベンジルアルコール、タール、ピチューメン等の非反応性希釈剤、(8)低分子脂肪族グリシジルエーテル、芳香族モノグリシジルエーテル等の反応性希釈剤、(9)炭酸カルシウム、カオリン、タルク、マイカ、ベントナイト、クレー、セリサイト、アスベスト、ガラス繊維粉、炭素繊維粉、アラミド繊維粉、ナイロン繊維粉、アクリル繊維粉、ガラス繊維粉、ガラスバルーン、シラスバルーン、石炭粉、アクリル樹脂粉、フェノール樹脂粉、金属粉末、セラミック粉末、ゼオライト、スレート粉等の充填剤、(10)活性炭、ゼオライト、シリカゾル、シリカゲルなどの脱臭剤(11)カーボンブラック、酸化チタン、赤色酸化鉄、鉛丹、パラレッド、紺青等の顔料または染料、(12)酢酸エチル、トルエン、アルコール類、エーテル類、ケトン類等の溶剤、(13)発泡剤、(14)消泡剤、(15)脱水剤、(16)帯電防止剤、(17)抗菌剤、(18)防かび剤、(19)粘度調整剤、(20)香料、(21)難燃剤等を添加することができる。
【0033】
本発明の組成物の各成分の貯蔵および使用形態としては、以下の(i)または(ii)が例示される。
(i)ヘテロ環含有化合物(A)、エポキシ基含有化合物(B)、アミノ化合物(C)を独立した3液の形で保存し、使用時に3成分を混合し硬化させる。(任意成分である塩基性化合物(D)は、第4成分として、単独で保存し、使用時に他の成分と混合して用いることも、(A)および/または(C)中に添加した形で保存することもできる。)
(ii)ヘテロ環含有化合物(A)およびエポキシ基含有化合物(B)の混合物、並びに、アミノ化合物(C)の独立した2液の形で保存し、使用時に該2成分を混合し硬化させる。[任意成分である塩基性化合物(E)は、第3成分として、単独で保存し、使用時に他の成分と混合して用いることも、(C)中に添加した形で保存することもできる。]
【0034】
本発明の樹脂組成物は万能混合機等の通常の混合機を使用して混合される。樹脂組成物の粘度は通常500〜30,000mPa・s、好ましくは1,000〜10,000mPa・s、特に好ましくは2,000〜6,000mPa・sである。本発明の樹脂組成物は通常の低温硬化が可能であり、5℃以下ののような低温環境下であっても十分硬化が可能である。その硬化物は耐水性、耐薬品性、機械的物性、接着性に優れる。指触乾燥時間は、樹脂配合量、添加剤量、環境温度などにより異なるが、通常、概ね6〜18時間である。
【0035】
本発明の繊維強化複合材料は、上記したエポキシ樹脂組成物を繊維に含浸することにより製造できる。本発明の対象となる繊維は、ポリアミド、アラミド、ケブラー、ポリエチレン、ポリエステル、ガラス、炭素繊維およびその他の無機繊維からなる繊維群から選ばれるものであり、構築物に供される材料である。単独または2種以上の組み合わせても使用できる。構築物に高強度を与える目的には、特にケブラー、アラミドおよび炭素繊維が使用される。ここで、構築物とは例えば家屋、ビル、橋梁、ダム、トンネル等のコンクリート構築物を指す。
【0036】
繊維複合材の製造法は、汎用の不飽和ポリエステル等の熱硬化性樹脂組成物を用いた繊維強化複合材料と同様の方法が適用できる。その一例として次の方法が挙げられる。(1)(A)、(B)、および(C)、必要に応じて(E)を混合し調製する。(2)その混合樹脂組成物を、構造物の面に塗布する。塗布方法は、特に限定されないが、例えば、ヘラ塗り、刷毛塗り、ローラー塗り、流し塗り、スプレー塗り等が挙げられる。(3)塗布面に強化繊維を配設する。(4)硬質のヘラまたはローラー等で圧着させ、下層の樹脂組成物を湧き上げさせ、構造物および強化繊維中に含まれる気泡を追い出しつつ、構造物および強化繊維に含浸させ、次いで硬化させる。(5)必要があれば、含浸させた強化繊維面に、樹脂組成物を上塗りさせることもできる。また、(1)〜(5)を同一構造物面上に繰り返し行ってもよい。
また、予めプライマーを塗布していてもよく、そのプライマーとして、種類は特に限定されないが、本樹脂組成物または本樹脂組成物の希釈物が好ましい。
塗布する樹脂組成物の量は、0.5〜2.0kg/m2が好ましく、0.5未満であれば、強化繊維への樹脂組成物の含浸量が少なく、構造物に対する接着強度が低下する。2.0を超えると、樹脂組成物のダレが発生する場合がある。
【0037】
本発明の繊維強化複合材料は樹脂組成物を強化繊維に含浸させ硬化させたものであって、低温硬化が可能であり、5℃以下のような低温環境下であっても十分硬化が可能である。指触乾燥時間は、樹脂配合量、添加剤量、環境温度などにより異なるが、通常、概ね6〜18時間である。硬化乾燥時間は5℃環境下で14日で硬化乾燥に至る。得られる繊維強化複合材料は引張り強さに代表される強度の大きい材料となる。繊維強化複合材料の引張り強度は3GPa以上あればよく、それ以下であると、特に引張り応力がかかる部材補強において、用いた剛性繊維の強度を発現することができない。ここでの引張り強さは、JIS R7601に従い測定したものである。
【0038】
以下本発明を実施例により具体的に説明するが、本発明はこれらの実施例に限定されるものではない。なお、部は重量部を表わす。
また、試験方法は以下の通りである。
(i)指触乾燥時間:表2及び表3に示す配合の組成物を、ガラス板上に膜厚500μで塗布し、0℃、30%RHの雰囲気に放置し、塗膜表面にべたつきがなくなるまでの時間を測定した。
(ii)引張強さ:表2及び表3に示す配合の組成物を0℃、30%RHの雰囲気下で14日間放置し、硬化させた後、0℃での引張強さを測定した。
(vi)FRP引張り強さ:表2及び表3に示す配合の組成物をアラミド繊維束に含浸させ0℃、30%RHの雰囲気下で14日間放置し、硬化させた後、0℃での引張強さを測定した。
【0039】
製造例1
反応容器に二硫化炭素90部と臭化リチウム5部、テトラヒドロフラン(THF)120部を仕込んで攪拌溶解した後、58部の2−エチルヘキシルグリシジルエーテルを20℃以下に保ちながら滴下した後、40℃で5時間熟成した。減圧下で、THF及び過剰の二硫化炭素を留去した後、ろ過して、25℃での粘度40cP、ヘテロ環基当量262の淡黄色液体のヘテロ環化合物(A−1)を得た。
【0040】
製造例2
反応容器に二硫化炭素90部と塩化リチウム5部、THF140部を仕込んで攪拌溶解した後、140部のトリメチロールプロパントリグリシジルエーテル(エポキシ当量140)を20℃以下に保ちながら滴下した後、40℃で5時間熟成した。減圧下で、THF及び過剰の二硫化炭素を留去した後、ろ過して、25℃での粘度130cP、ヘテロ環基当量218の淡黄色液体のヘテロ環化合物(A−2)を得た。
【0041】
製造例3
反応容器に二硫化炭素90部と臭化リチウム5部、THF120部を仕込んで攪拌溶解した後、58部のトリメチレンオキサイドを20℃以下に保ちながら滴下した後、40℃で5時間熟成した。減圧下で、THFおよび過剰の二硫化炭素を留去した後、ろ過して、25℃での粘度40cP、ヘテロ環基当量140の微黄色液体のヘテロ環化合物(A−3)を得た。
【0042】
実施例1〜4、比較例1〜2
表2に示した配合量で、各成分を混合、攪拌し、前記の(i)〜(vi)の性能評価試験を行った。結果を表2に示した。分子中に2個以上のエポキシ基を有する化合物(B)としては、次のものを使用した。
ポリエポキサイド(B1);ビスフェノールAジグリシジルエーテル(油化シェルエポキシ社製「エピコート828」;エポキシ当量190,粘度11,000)、及びネオペンチルグリコールジグリシジルエーテル(エポキシ当量154、粘度20cP)
分子中に1級アミノ基及び/又は2級アミノ基に由来する活性水素を2個以上有するアミノ化合物(C)としては、次のものを使用した。
(C1)脂肪族ポリアミン:キシリレンジアミン(活性水素当量36,粘度7cP)
また、硬化促進剤として下記のものを使用した。
(E1)「DMP−10」;N,N−ジメチルアミノメチルフェノール
本発明の繊維補強複合材料作成に使用した強化用繊維は、シート状に編んだものを用い、材質はアラミドを使用した。
強化用繊維:アラミド繊維(帝人社製「テクノーラシートAT−90」)
【0043】
【表2】
【0044】
表中の引張り強さ(MPa)はエポキシ樹脂組成物のみの硬化物の値を示し、FRP引張り強さ(GPa)は繊維強化複合材料の値を示している。
【発明の効果】
本発明の繊維強化用エポキシ樹脂組成物は、常温ないし低温下で、低粘度、速硬化性を有し、繊維と組み合わせて硬化させると高強度の繊維強化複合材料となる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a fiber-reinforced resin composition and a composite material thereof. More specifically, the present invention relates to an epoxy resin composition for fiber reinforcement made of an epoxy resin system and a fiber reinforced composite material.
[0002]
[Prior art]
For concrete structures such as bridges, tunnels, chimneys, road slabs, building columns, walls and ceilings, neutralization of concrete due to long-term use, deterioration due to rusting of steel frames and reinforcing bars, traffic vehicle weight restrictions These reinforcements are carried out in response to the increase in load due to mitigation, damage due to earthquakes, and the strengthening of seismic standards assuming large earthquakes. As a reinforcing method, a method in which a continuous fiber sheet such as a carbon fiber or an aramid fiber is wound and then impregnated with a resin and cured has been used.
As a resin used, there is a combined use of an epoxy resin and a silicon resin (Japanese Patent Laid-Open No. 10-053956).
[0003]
[Problems to be solved by the invention]
However, in the method using the above resin, the resin is hydrolyzed by moisture absorption. Since the volatile component of the hydrolysis product is released to the environment over a long period of time, there is a problem in safety. Moreover, the non-volatile component bleeds out to the fiber reinforced surface or the interface with concrete, causing a problem that the surface slips or peels off. An object of the present invention is to provide a fiber-reinforced epoxy resin composition having a low viscosity and a fast curing property at a room temperature to a low temperature, and a high-strength fiber-reinforced composite material cured by combining it with fibers.
[0004]
[Means for Solving the Problems]
In view of the present situation, the present inventors have reached the present invention as a result of intensive studies to achieve the above object in a reinforcing resin composition using fibers. That is, the heterocycle-containing compound (A) represented by the following general formula (1), a polyepoxy compound (B) having two or more epoxy groups in the molecule, and a primary amino group and / or 2 in the molecule It consists of an amino compound (C) having two or more active hydrogens derived from a secondary amino groupFor reinforcing concrete structuresFiber reinforcedComposite materialEpoxy resin composition.
[0005]
[Chemical formula 5]
[0006]
[In Formula (1), n is an integer of 1-10, X1 Is a sulfur atom, Y1 ,Z1IsOne is a sulfur atom and the other is an oxygen atomR1Is a residue of a cyclic ether group-containing compound (D) or a hydrogen atom; R2Is a hydrocarbon group having 2 to 10 carbon atoms. ]
[0007]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, the heterocycle-containing compound (A) is represented by the general formula (1). In the formula, n is an integer of 1 to 10, preferably 2 to 8, X1, Y1And Z1Are oxygen or sulfur atoms, respectively. Preferably X1Is a sulfur atom (S), Y1, Z1One of these is a sulfur atom (S) and the other is an oxygen atom (O).
R2Is a residue constituting a ring other than an oxygen atom in the cyclic ether group. This is a hydrocarbon group having 2 to 10 carbon atoms, and a trivalent hydrocarbon group> CH (CH2)m-(M is an integer of 1 to 9), for example,> CHCH2-,> CHCH2CH2-,> CHCH2CH2CH2-,> CHCH2CH2CH2CH2CH2-Etc .; tetravalent hydrocarbon group> CH (CH2)mCH <(m is an integer of 0 to 8), for example,> CHCH <,> CHCH2CH <,> CHCH2CH2CH <,> CHCH2CH2CH2CH2CH <etc. are mentioned, Preferably it is a trivalent hydrocarbon group, Especially preferably,> CHCH2-,> CHCH2CH2-.
R1Is a residue of a hydrogen atom or a cyclic ether group-containing compound (D), and is represented by the general formula (5).
General formula
[0008]
[Chemical 6]
[0009]
The cyclic ether group is not particularly limited as long as it has one oxygen atom in the ring, and examples thereof include compounds having 1 to 10 cyclic ether groups in the molecule.
Examples of the cyclic ether group-containing compound (D) include an epoxy group-containing compound (D1), an oxetane compound (D2), etc., which will be described later, and preferably an epoxy group-containing compound (D1).
Examples of the epoxy group-containing compound (D1) include a monoepoxide (d11) and a polyepoxide (D11) having two or more epoxy groups in the molecule.
The monoepoxide (d11) is not particularly limited as long as it has one epoxy group in the molecule, and can be appropriately selected according to the use and purpose. Examples include the following. For example,
(D11-1) a hydrocarbon oxide having 2 to 24 carbon atoms (ethylene oxide, propylene oxide, 1-butene oxide, 2-butene oxide, α-olefin oxide having 5 to 24 carbon atoms, styrene oxide, etc.),
(D11-2) C 3-19 hydrocarbon glycidyl ether (n-butyl glycidyl ether, allyl glycidyl ether, 2-ethyl-hexyl glycidyl ether, 2-methyloctyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ether) P-sec-butylphenyl glycidyl ether, P-tert-butylphenyl glycidyl ether, etc.),
(D11-3) Glycidyl esters of monocarboxylic acids having 3 to 30 carbon atoms (such as glycidyl acrylate and glycidyl methacrylate), epihalohydrins such as epichlorohydrin and epibromohydrin, and hydroxyl group-containing oxides such as glycidol. Preferred are hydrocarbon oxides having 2 to 24 carbon atoms and glycidyl ethers of hydrocarbons having 3 to 19 carbon atoms.
[0010]
The polyepoxide (D11) is not particularly limited as long as it has two or more epoxy groups in the molecule, and can be appropriately selected according to the use and purpose. Preference is given to those having 2 to 6 epoxy groups in the molecule. The epoxy equivalent (molecular weight per epoxy group) of the polyepoxide is usually 65 to 1000, preferably 90 to 500. When the epoxy equivalent is 1000 or less, the crosslinked structure does not become loose, and the cured product has good physical properties such as water resistance, chemical resistance and mechanical strength. On the other hand, when the epoxy equivalent is 65 or more, A crosslinked structure with good water resistance, chemical resistance, mechanical strength and the like is obtained.
Examples of the polyepoxide (D11) include the following (D11-1) to (D11-5).
[0011]
(D11-1) Glycidyl ether type
(I) Diglycidyl ether of dihydric phenols
Diglycidyl ethers of dihydric phenols having 6 to 30 carbon atoms, for example, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, bisphenol B diglycidyl ether, bisphenol AD diglycidyl ether, bisphenol S diglycidyl ether, halogenated bisphenol A Diglycidyl ether, tetrachlorobisphenol A diglycidyl ether, catechin diglycidyl ether, resorcinol diglycidyl ether, hydroquinone diglycidyl ether, 1,5-dihydroxynaphthalenediglycidyl ether, dihydroxybiphenyl diglycidyl ether, octachloro-4,4'- Dihydroxybiphenyl diglycidyl ether, tetramethylbiphenyl diglycidyl ether, 9, '- bis (4-hydroxyphenyl) furo diglycidyl ether, diglycidyl ether obtained from bisphenol A2 moles and 3 moles of epichlorohydrin in the reaction, and the like;
[0012]
(Ii) Polyglycidyl ethers of polyhydric phenols having 3 to 6 or more valences
Polyglycidyl ethers of 3 to 6 or more polyhydric phenols having 6 to 50 or more carbon atoms and a molecular weight of 250 to 3000, such as pyrogallol triglycidyl ether, dihydroxynaphthylcresol triglycidyl ether, tris (hydroxyphenyl) Methane triglycidyl ether, dinaphthyltriol triglycidyl ether, tetrakis (4-hydroxyphenyl) ethanetetraglycidyl ether, p-glycidylphenyldimethyltolylbisphenol A glycidyl ether, trismethyl-tert-butyl-butylhydroxymethane triglycidyl ether, 4, 4′-oxybis (1,4-phenylethyl) tetracresol glycidyl ether, 4,4′-oxybis (1,4-phenylethyl) fur Nyl glycidyl ether, bis (dihydroxynaphthalene) tetraglycidyl ether, glycidyl ether of phenol or cresol novolak resin (molecular weight 400-5000), glycidyl ether of limonene phenol novolac resin (molecular weight 400-5000), phenol and glyoxal, glutaraldehyde, Or the polyglycidyl ether of polyphenol (molecular weight 400-5000) obtained by the condensation reaction of formaldehyde, the polyglycidyl ether of polyphenol of molecular weight 400-5000 obtained by the condensation reaction of resorcin and acetone, etc. are mentioned.
[0013]
(Iii) Diglycidyl ether of aliphatic dihydric alcohol
Diglycidyl ether of a diol having 2 to 100 carbon atoms and a molecular weight of 150 to 5000, for example, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tetramethylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, polyethylene glycol ( Molecular weight 150-4000) diglycidyl ether, polypropylene glycol (molecular weight 180-5000) diglycidyl ether, polytetramethylene glycol (molecular weight 200-5000) diglycidyl ether, neopentyl glycol diglycidyl ether, alkylene oxide of bisphenol A [ethylene oxide or Propylene oxide (1-20 mol)] diglycidyl ether of adducts, etc .;
(Vi) a polyglycidyl ether of a 3-6 valent or higher aliphatic alcohol, a glycidyl ether of a 3-6 valent or higher polyhydric alcohol having 3 to 50 or more carbon atoms and a molecular weight of 92 to 10,000, for example, Examples include trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol hexaglycidyl ether, poly (n = 2 to 5) glycerol polyglycidyl ether, and the like.
[0014]
(D11-2) Glycidyl ester type
A glycidyl ester of an aromatic polycarboxylic acid having 6 to 20 or more carbon atoms and having 2 to 6 or more carbon atoms, and an aliphatic or fat having 6 to 20 or more carbon atoms and having 2 to 6 or more carbon atoms Examples thereof include glycidyl esters of cyclic polycarboxylic acids.
(I) Aromatic polycarboxylic acids such as glycidyl esters of phthalic acids include diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, and triglycidyl trimellitic acid;
(II) As the glycidyl ester of the aliphatic or alicyclic polycarboxylic acid, the aromatic nucleated water additive of the above phenolic glycidyl ester, diglycidyl dimer acid ester, diglycidyl oxalate, diglycidyl malate, diglycidyl ester Examples thereof include succinate, diglycidyl glutarate, diglycidyl adipate, diglycidyl pimelate, (co) polymer of glycidyl (meth) acrylate (degree of polymerization is 2 to 10 for example), tricarbyl acid triglycidyl ester, and the like.
[0015]
(D11-3) Glycidylamine type
Examples thereof include glycidylamines of aromatic amines having 6 to 20 or more carbon atoms and having 2 to 10 or more active hydrogen atoms, and glycidylamines of aliphatic, alicyclic or heterocyclic amines.
As glycidylamines of aromatic amines, N, N-diglycidylaniline, N, N-diglycidyltoluidine, N, N, N ′, N′-tetraglycidyldiaminodiphenylmethane, N, N, N ′, N ′ -Tetraglycidyldiaminodiphenylsulfone, N, N, N ', N'-tetraglycidyldiethyldiphenylmethane, N, N, O-triglycidylaminophenol and the like.
Examples of the aliphatic amine glycidylamine include N, N, N ′, N′-tetraglycidylxylylenediamine, N, N, N ′, N′-tetraglycidylhexamethylenediamine and the like.
Examples of the alicyclic amine include hydrogenated compounds of N, N, N ′, N′-tetraglycidylxylylenediamine.
Examples of the heterocyclic amine glycidylamine include trisglycidylmelamine.
[0016]
(D11-4) Chain aliphatic epoxide
A chain aliphatic epoxide having 6 to 50 or more carbon atoms and 2 to 6 or more valences, for example, epoxidized polybutadiene having an epoxy equivalent of 130 to 1,000 (molecular weight 90 to 2,500), epoxidized soybean oil (molecular weight) 130-2,500).
(D11-5) Alicyclic epoxide
Alicyclic epoxides having 6 to 50 or more carbon atoms, 90 to 2500 molecular weight, and 1 to 4 or more epoxy groups such as vinylcyclohexene dioxide, limonene dioxide, dicyclopentadiene dioxide, bis (2 , 3-epoxycyclopentyl) ether, ethylene glycol bisepoxy dicyclopentyl ether, 3,4 epoxy-6-methylcyclohexylmethyl 3 ′, 4′-epoxy-6′-methylcyclohexanecarboxylate, bis (3,4-epoxy- 6-methylcyclohexylmethyl) adipate and bis (3,4-epoxy-6-methylcyclohexylmethyl) butylamine. Moreover, the nuclear hydrogenation thing of the epoxy compound of the said phenols is also included.
Any epoxy resin other than (D11-1) to (D11-5) can be used as long as it is an epoxy resin having a glycidyl group capable of reacting with active hydrogen. These polyepoxy compounds can be used in combination of two or more. Of these, glycidyl ether type (D11-1) and glycidyl ester type (D11-2) are preferable, and glycidyl ether type (D11-1) is particularly preferable. Of (D11-1), preferred are dihydric phenols and diglycidyl ethers of dihydric aliphatic alcohols.
[0017]
Examples of the oxetane compound (D2) include aliphatic oxetane compounds having 6 to 20 carbon atoms (3-ethyl-3-hydroxymethyloxetane and the like), aromatic oxetane compounds having 7 to 30 carbon atoms (benzyl oxetane and xylylene bis). Oxetane, etc.), C6-C30 aliphatic carboxylic acid-based oxetane compounds (such as adipate bisoxetane), C8-C30 aromatic carboxylic acid-based oxetane compounds (such as terephthalate bisoxetane), C8-30, etc. Alicyclic carboxylic acid-based oxetane compounds (such as bisoxetane cyclohexanedicarboxylate), aromatic isocyanate-based oxetane compounds (such as MDI bisoxetane), sulfur-based oxetane compounds having 2 to 20 carbon atoms (thiirane, 2-methylthiirane, 2, 2-dimethylthiirane, 2-hexylthiirane, - it includes phenyl thiirane, etc.) and the like.
The heterocyclic compound (A1) using the epoxy group-containing compound (D1) as the cyclic ether group-containing compound (D) is represented by the following general formulas (2) and (3). General formula
[0018]
[Chemical 7]
[0019]
In formula, n is an integer of 1-10. Y2, Z2One is S and the other is O, preferably Y2Is O, Z2Is S. RThreeIs the residue of the polyepoxy compound (D11) or monoepoxy compound (d11). RFourIs a residue of an alicyclic epoxide. Particularly preferably, n is 1, Y2Is O, Z2Is S, RThreeIs a residue excluding the epoxy group of the monoglycidyl compound (d11-2).
[0020]
Although the manufacturing method of the heterocyclic containing compound (A) in the composition of this invention is not specifically limited, For example, it is 0.5-10 times equivalent of 2 with respect to the cyclic ether group of a cyclic ether group containing compound (D). It can be obtained by reacting carbon sulfide, carbonyl sulfide and carbon dioxide, preferably carbon disulfide, in a solvent in the presence of a catalyst.
The solvent is not particularly limited as long as it does not inhibit the reaction and dissolves raw materials and products, and an aprotic solvent is usually used. For example, ethers (tetrahydrofuran, dioxane, diethyl cellosolve, dioxolane, trioxane, dibutyl cellosolve, diethyl carbitol, dibutyl carbitol, etc.), ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, etc.), esters (methyl acetate) , Ethyl acetate, n-butyl acetate, etc.) and other polar solvents (acetonitrile, dimethylformamide, N-methylpyrrolidone, dimethyl sulfoxide, etc.), etc., preferably tetrahydrofuran, acetone, ethyl acetate and the like.
The catalyst is a halide of an alkali metal or an alkaline earth metal, and examples thereof include lithium chloride, lithium bromide, lithium iodide, potassium chloride, calcium bromide, and preferably lithium bromide. The amount of the catalyst is 0.001 to 1.0 times equivalent to the cyclic ether group of (D). Preferably it is 0.01-0.1 times equivalent.
[0021]
The reaction temperature is usually 0 to 100 ° C., preferably 20 to 70 ° C.
The manufacturing method of a heterocyclic containing compound (A1) is using an epoxy group containing compound (D) in a molecule | numerator as a cyclic ether group containing compound (D). The epoxy group-containing compound (D) is not particularly limited as long as it is a compound having one or more epoxy groups in the molecule.
The weight average molecular weight of the heterocycle-containing compound (A) is 120 to 12,000, preferably 200 to 8,000. The heterocyclic equivalent is usually 120 to 1,200, preferably 200 to 800. The viscosity at 25 ° C. is usually 20,000 mPa · s or less, preferably 10,000 mPa · s or less, more preferably 5,000 mPa · s or less, and particularly preferably 1,000 mPa · s or less.
Specific examples of the heterocycle-containing compound (A) obtained as described above include those described in Table 1.
[0022]
[Table 1]
[0023]
The same thing as (D11) is mentioned as a polyepoxy compound (B) which has 2 or more of epoxy groups in a molecule | numerator of this invention. Preferably it is (D11-1).
[0024]
The amino compound (C) of the present invention is not particularly limited as long as it is a compound having two or more active hydrogens derived from a primary amino group and / or a secondary amino group in the molecule, and is appropriately selected depending on the use and purpose. You can choose. A compound having 2 to 10 active hydrogens derived from a primary amino group and / or a secondary amino group in the molecule is preferable, and a compound having 3 to 6 active hydrogens is more preferable. The active hydrogen equivalent (molecular weight per active hydrogen) of (C) is usually 15 to 500, and preferably 20 to 200. When the active hydrogen equivalent is 500 or less, the crosslinked structure does not become loose, and physical properties such as chemical resistance and mechanical strength of the cured product are good. On the other hand, when the active hydrogen equivalent is 15 or more, the cured product has good physical properties such as chemical resistance and mechanical strength.
[0025]
Examples of the amino compound (C) include the following (C1) to (C9).
(C1) Aliphatic polyamines (2-18 carbon atoms, 2-7 functional groups, molecular weight 60-500): (i) Aliphatic polyamine {C2-C6 alkylenediamine (ethylenediamine, propylenediamine, trimethylenediamine) , Tetramethylenediamine, hexamethylenediamine, etc.), polyalkylene (2 to 6 carbon atoms) polyamine [diethylenetriamine, iminobispropylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, etc.] }; (Ii) these alkyl (carbon number 1 to 4) or hydroxyalkyl (carbon number 2 to 4) substituents [dialkyl (carbon number 1 to 3) aminopropylamine, trimethylhexamethylenediamine, aminoethylethanolamine, 2,5-di Til-2,5-hexamethylenediamine, methyliminobispropylamine, etc.]; (iii) Alicyclic or heterocyclic-containing aliphatic polyamine [3,9-bis (3-aminopropyl) -2,4,8,10 -Tetraoxaspiro [5,5] undecane, etc.]; (iv) aromatic ring-containing aliphatic amines (8 to 15 carbon atoms) (xylylenediamine, tetrachloro-p-xylylenediamine, etc.);
(C2) Alicyclic polyamine (4 to 15 carbon atoms, 2 to 3 functional groups): 1,3-diaminocyclohexane, isophoronediamine, mensendiamine, 4,4'-methylenedicyclohexanediamine (hydrogenated methylenedianiline) )etc;
(C3) Heterocyclic polyamine (carbon number 4-15, functional group number 2-3): piperazine, N-aminoethylpiperazine, 1,4-diaminoethylpiperazine, 1,4bis (2-amino-2-methylpropyl) ) Piperazine etc .;
[0026]
(C4) Aromatic polyamines (carbon number 6-20, functional group number 2-3, molecular weight 100-1000): (i) unsubstituted aromatic polyamine [1,2-, 1,3- and 1,4-phenylene Diamine, 2,4′- and 4,4′-diphenylmethanediamine, crude diphenylmethanediamine (polyphenylpolymethylenepolyamine), diaminodiphenylsulfone, benzidine, thiodianiline, bis (3,4-diaminophenyl) sulfone, 2,6- Diaminopyridine, m-aminobenzylamine, triphenylmethane-4,4 ′, 4 ″ -triamine, naphthylenediamine, etc .; (ii) nucleus-substituted alkyl groups [methyl, ethyl, n- and i-propyl, butyl, etc. Aromatic polyamines having a C1-C4 alkyl group) such as 2,4- and 2,6-tolylenediamine , Crude tolylenediamine, diethyltolylenediamine, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 4,4'-bis (o-toluidine), dianisidine, diaminoditolylsulfone, 1,3- Dimethyl-2,4-diaminobenzene, 1,3-diethyl-2,4-diaminobenzene, 1,3-dimethyl-2,6-diaminobenzene, 1,4-diethyl-2,5-diaminobenzene, 1, 4-diisopropyl-2,5-diaminobenzene, 1,4-dibutyl-2,5-diaminobenzene, 2,4-diaminomesitylene, 1,3,5-triethyl-2,4-diaminobenzene, 1,3 5-triisopropyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-di Til-2,6-diaminobenzene, 2,3-dimethyl-1,4-diaminonaphthalene, 2,6-dimethyl-1,5-diaminonaphthalene, 2,6-diisopropyl-1,5-diaminonaphthalene, 2, 6-dibutyl-1,5-diaminonaphthalene, 3,3 ′, 5,5′-tetramethylbenzidine, 3,3 ′, 5,5′-tetraisopropylbenzidine, 3,3 ′, 5,5′-tetra Methyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5,5′-tetraethyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5,5′-tetraisopropyl-4,4′-diaminodiphenylmethane 3,3 ′, 5,5′-tetrabutyl-4,4′-diaminodiphenylmethane, 3,5-diethyl-3′-methyl-2 ′, 4-diaminodiphenylmethane, 3,5 Diisopropyl-3'-methyl-2 ', 4-diaminodiphenylmethane, 3,3'-diethyl-2,2'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 3,3', 5,5′-tetraethyl-4,4′-diaminobenzophenone, 3,3 ′, 5,5′-tetraisopropyl-4,4′-diaminobenzophenone, 3,3 ′, 5,5′-tetraethyl-4, 4′-diaminodiphenyl ether, 3,3 ′, 5,5′-tetraisopropyl-4,4′-diaminodiphenyl sulfone, etc.), and mixtures of these isomers in various proportions;
[0027]
(iii) Aromatic polyamines [methylene bis-o-chloroaniline, 4-chloro-o] having a nucleus-substituted electron withdrawing group (halogens such as Cl, Br, I, F; alkoxy groups such as methoxy and ethoxy; nitro groups) -Phenylenediamine, 2-chloro-1,4-phenylenediamine, 3-amino-4-chloroaniline, 4-bromo-1,3-phenylenediamine, 2,5-dichloro-1,4-phenylenediamine, 5- Nitro-1,3-phenylenediamine, 3-dimethoxy-4-aminoaniline; 4,4'-diamino-3,3'-dimethyl-5,5'-dibromo-diphenylmethane, 3,3'-dichlorobenzidine, 3 , 3'-dimethoxybenzidine, bis (4-amino-3-chlorophenyl) oxide, bis (4-amino-2-chlorophenyl) propane, bi (4-amino-2-chlorophenyl) sulfone, bis (4-amino-3-methoxyphenyl) decane, bis (4-aminophenyl) sulfide, bis (4-aminophenyl) telluride, bis (4-aminophenyl) selenide Bis (4-amino-3-methoxyphenyl) disulfide, 4,4'-methylenebis (2-iodoaniline), 4,4'-methylenebis (2-bromoaniline), 4,4'-methylenebis (2-fluoro) Aniline), 4-aminophenyl-2-chloroaniline, etc.];
[0028]
(iv) Aromatic polyamines having secondary amino groups [partially or all of —NH2 of the aromatic polyamines (i) to (iii) above are —NH—R ′ (R ′ is an alkyl group such as methyl, ethyl, etc.] Substituted with lower alkyl group)] [4,4′-di (methylamino) diphenylmethane, 1-methyl-2-methylamino-4-aminobenzene, etc.];
(C5) Polyamide polyamine: obtained by condensation of dicarboxylic acid (dimer acid, etc.) and excess (more than 2 moles per mole of acid) polyamines (the above-mentioned alkylene diamine, polyalkylene polyamine, etc. having 2 to 7 functional groups). Polyamide polyamine (number average molecular weight 200-1000) and the like;
(C6) polyether polyamine: hydride (molecular weight 100 to 1000) of cyanoethylated polyether polyol (such as the above-mentioned polyalkylene glycol);
(C7) Epoxy-added polyamine: obtained by adding 1 to 30 mol of an epoxy compound (the above polyepoxide (B1) and monoepoxide (b)) to a polyamine (the above alkylenediamine, polyalkylenepolyamine, etc.). Epoxy-added polyamines (molecular weight 100-1000) and the like;
[0029]
(C8) Cyanoethylated polyamine: cyanoethylated polyamine obtained by addition reaction of acrylonitrile and polyamines (the above alkylenediamine, polyalkylenepolyamine, etc.), (biscyanoethyldiethylenetriamine, etc.) (molecular weight 100-500), etc .;
(C9) Other polyamine compounds: (i) hydrazines (hydrazine, monoalkylhydrazine, etc.); (ii) dihydrazides (succinic acid dihydrazide, adipic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, etc.); (iii) guanidine (Butylguanidine, 1-cyanoguanidine, etc.); (iv) Dicyandiamide, etc .; and a mixture of two or more thereof.
Of the above (C1) to (C9), in order to give high-speed curability to the curable composition of the present invention, (C1), (C2), (C3) and (C5) are particularly preferable. Preference is given to (C1).
[0030]
In the epoxy resin composition for fiber reinforcement of the present invention, an amino compound (C) is an essential component as a curing agent, but for the purpose of further promoting curability, a basic compound (E) is further contained as necessary. Can do.
Examples of the basic compound (E) include tertiary amine compounds (E1), alkali compounds (E2) such as sodium methylate, caustic soda, caustic potash and lithium carbonate, Lewis basic compounds such as triethylphosphine and triphenylphosphine ( E3) and the like. Of these, the tertiary amine compound (E1) is preferred.
[0031]
The tertiary amine compound (E1) preferred as the above (E) is not particularly limited as long as it has a tertiary amino group in the molecule, but examples thereof include the following (E1-1) to (E1-3). ).
(E1-1) Aliphatic tertiary amine Trimethylamine, triethylamine, dimethylcyclohexylamine, dimethylbenzylamine, 1,3-dimethylimidazolidinone, 1,2-dimethylimidazole, tetraethylmethylenediamine, tetramethylpropane-1,3- Diamine, tetramethylhexane-1,6-diamine, pentamethyldiethylenetriamine, pentamethyldipropylenetriamine, tetramethylguanidine, dimethylpiperazine, N-methyl-N '-(2-dimethylamino) -ethylpiperazine, N-methylmorpholine N- (N ′, N′-dimethylaminoethyl) morpholine, dimethylaminoethanol, dimethylaminoethoxyethanol, N, N, N′-trimethylaminoethyl-ethanolamine, N-methyl -N '- (2-hydroxyethyl) morpholine, bis (2-dimethylaminoethyl) ether, ethylene glycol (3-dimethylaminopropyl) aminopropyl ether,
(E1-2) Phenol nucleus-containing aliphatic tertiary amine: N, N-dimethylaminomethylphenol (common name “DMP-10”), tris (N, N-dimethylaminomethylphenol (common name “DMP-30”), etc. ,
(E1-3) Nitrogen-containing heterocyclic compound 1,8-diazabicyclo (5,4,0) -undecene-7 (common name “DBU”), 1,5-diazabicyclo (4,3,0) -nonene-5 ( (Commonly called “DBN”), 6-dibutylamino-1,8-diazabicyclo (5,4,0) -undecene-7 (commonly called “DBA-DBU”), triethylenediamine, hexamethylenetetramine and the like.
[0032]
The tertiary amine compound (E1) may be selected as appropriate depending on the curing speed to be obtained and the pot life, and the amount and amount of addition may be selected as appropriate. Usually, with respect to 100 parts by weight of the heterocyclic compound (A). About 0.1 to 50 parts by weight are preferably added.
In the epoxy resin composition for fiber reinforcement of the present invention, if necessary, (1) an adhesion improver such as a silane coupling agent and a titanium coupling agent, (2) hindered amines, hydroquinones, hindered phenols , Antioxidants such as sulfur-containing compounds, (3) UV absorbers such as benzophenones, benzotriazoles, salicylic acid esters, metal complexes, (4) metal soaps, heavy metals (eg, zinc, tin, lead, cadmium) Etc.) Stabilizers such as inorganic and organic salts, organotin compounds, (5) Plasticizers such as phthalate esters, phosphate esters, fatty acid esters, epoxidized soybean oil, castor oil, liquid paraffin alkyl polycyclic aromatic hydrocarbons, etc. (6) Waxes such as paraffin wax, microcrystalline wax, polymer wax, beeswax, whale wax low molecular weight polyolefin, (7) benzine Non-reactive diluents such as alcohol, tar and pitumen, (8) Reactive diluents such as low molecular weight aliphatic glycidyl ether and aromatic monoglycidyl ether, (9) Calcium carbonate, kaolin, talc, mica, bentonite, clay Sericite, asbestos, glass fiber powder, carbon fiber powder, aramid fiber powder, nylon fiber powder, acrylic fiber powder, glass fiber powder, glass balloon, shirasu balloon, coal powder, acrylic resin powder, phenol resin powder, metal powder, Fillers such as ceramic powder, zeolite, slate powder, (10) Deodorizers such as activated carbon, zeolite, silica sol, silica gel (11) Pigments or dyes such as carbon black, titanium oxide, red iron oxide, red lead, para red, bitumen , (12) solvents such as ethyl acetate, toluene, alcohols, ethers, ketones, (13) foaming Agent, (14) antifoam agent, (15) dehydrating agent, (16) antistatic agent, (17) antibacterial agent, (18) antifungal agent, (19) viscosity modifier, (20) perfume, (21) A flame retardant etc. can be added.
[0033]
The following (i) or (ii) is exemplified as the form of storage and use of each component of the composition of the present invention.
(i) The heterocycle-containing compound (A), the epoxy group-containing compound (B), and the amino compound (C) are stored in the form of three independent liquids. (The basic compound (D), which is an optional component, is stored alone as the fourth component, and can be used as a mixture with other components at the time of use, or it can be added to (A) and / or (C). You can also save it with
(ii) A mixture of the heterocycle-containing compound (A) and the epoxy group-containing compound (B) and the amino compound (C) are stored in the form of two independent liquids, and the two components are mixed and cured at the time of use. [The basic component (E), which is an optional component, can be stored alone as the third component, and can be mixed with other components at the time of use, or can be stored in the form added in (C)] . ]
[0034]
The resin composition of the present invention is mixed using an ordinary mixer such as a universal mixer. The viscosity of the resin composition is usually 500 to 30,000 mPa · s, preferably 1,000 to 10,000 mPa · s, particularly preferably 2,000 to 6,000 mPa · s. The resin composition of the present invention can be cured at a normal low temperature, and can be sufficiently cured even in a low temperature environment such as 5 ° C. or lower. The cured product is excellent in water resistance, chemical resistance, mechanical properties, and adhesiveness. The touch-drying time varies depending on the resin blending amount, the additive amount, the environmental temperature, and the like, but is generally about 6 to 18 hours.
[0035]
The fiber-reinforced composite material of the present invention can be produced by impregnating fibers with the above-described epoxy resin composition. The fiber which is the object of the present invention is selected from the group of fibers consisting of polyamide, aramid, kevlar, polyethylene, polyester, glass, carbon fiber and other inorganic fibers, and is a material used for the construction. It can be used alone or in combination of two or more. Kevlar, aramid and carbon fibers are used in particular for the purpose of giving the structure high strength. Here, the structure refers to a concrete structure such as a house, a building, a bridge, a dam, or a tunnel.
[0036]
As a method for producing the fiber composite material, the same method as that for the fiber reinforced composite material using a thermosetting resin composition such as a general-purpose unsaturated polyester can be applied. The following method is mentioned as an example. (1) Prepare (A), (B), and (C), and (E) if necessary. (2) The mixed resin composition is applied to the surface of the structure. The application method is not particularly limited, and examples thereof include spatula coating, brush coating, roller coating, flow coating, and spray coating. (3) A reinforcing fiber is disposed on the coated surface. (4) Pressure bonding is performed with a hard spatula or a roller, and the lower layer resin composition is swollen, and the structure and the reinforcing fiber are impregnated while expelling bubbles contained in the structure and the reinforcing fiber, and then cured. (5) If necessary, the resin composition can be overcoated on the impregnated reinforcing fiber surface. Moreover, you may repeat (1)-(5) on the same structure surface.
Further, a primer may be applied in advance, and the type of the primer is not particularly limited, but the present resin composition or a dilution of the present resin composition is preferable.
The amount of the resin composition to be applied is 0.5 to 2.0 kg / m.2If it is less than 0.5, the amount of the resin composition impregnated into the reinforcing fiber is small, and the adhesive strength to the structure is lowered. If it exceeds 2.0, sagging of the resin composition may occur.
[0037]
The fiber-reinforced composite material of the present invention is obtained by impregnating a resin composition into a reinforcing fiber and cured, and can be cured at low temperature, and can be sufficiently cured even in a low temperature environment of 5 ° C. or less. is there. The touch drying time varies depending on the resin blending amount, the additive amount, the environmental temperature, and the like, but is generally about 6 to 18 hours. The curing and drying time reaches curing and drying in 14 days in an environment of 5 ° C. The obtained fiber reinforced composite material becomes a material having a large strength represented by tensile strength. The tensile strength of the fiber reinforced composite material only needs to be 3 GPa or more, and if it is less than that, the strength of the rigid fiber used cannot be expressed particularly in the reinforcement of a member to which a tensile stress is applied. The tensile strength here is JISR7601It was measured according to.
[0038]
EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In addition, a part represents a weight part.
The test method is as follows.
(i) Touch touch drying time: A composition having the composition shown in Tables 2 and 3 was applied to a glass plate with a film thickness of 500 μm and left in an atmosphere of 0 ° C. and 30% RH, and the coating film surface was not sticky. The time until disappearance was measured.
(ii) Tensile strength: The compositions shown in Tables 2 and 3 were allowed to stand for 14 days in an atmosphere of 0 ° C. and 30% RH and cured, and then the tensile strength at 0 ° C. was measured.
(vi) Tensile strength of FRP: Aramid fiber bundles impregnated with the compositions shown in Tables 2 and 3 were allowed to stand for 14 days in an atmosphere of 0 ° C. and 30% RH, cured, and then at 0 ° C. Tensile strength was measured.
[0039]
Production Example 1
After charging 90 parts of carbon disulfide, 5 parts of lithium bromide and 120 parts of tetrahydrofuran (THF) in a reaction vessel and stirring and dissolving, 58 parts of 2-ethylhexyl glycidyl ether was added dropwise while keeping the temperature at 20 ° C. or lower, and then 40 ° C. For 5 hours. Under reduced pressure, THF and excess carbon disulfide were distilled off, followed by filtration to obtain a pale yellow liquid heterocyclic compound (A-1) having a viscosity of 40 cP at 25 ° C. and a heterocyclic group equivalent of 262.
[0040]
Production Example 2
After charging 90 parts of carbon disulfide, 5 parts of lithium chloride, and 140 parts of THF in a reaction vessel and stirring and dissolving, 140 parts of trimethylolpropane triglycidyl ether (epoxy equivalent 140) was added dropwise while maintaining the temperature at 20 ° C. or lower. Aging was carried out at 5 ° C for 5 hours. Under reduced pressure, THF and excess carbon disulfide were distilled off, followed by filtration to obtain a pale yellow liquid heterocyclic compound (A-2) having a viscosity at 25 ° C. of 130 cP and a heterocyclic group equivalent of 218.
[0041]
Production Example 3
After charging 90 parts of carbon disulfide, 5 parts of lithium bromide and 120 parts of THF in a reaction vessel and stirring and dissolving, 58 parts of trimethylene oxide was added dropwise while keeping the temperature at 20 ° C. or lower, and then aged at 40 ° C. for 5 hours. Under reduced pressure, THF and excess carbon disulfide were distilled off, followed by filtration to obtain a slightly yellow liquid heterocyclic compound (A-3) having a viscosity of 40 cP at 25 ° C. and a heterocyclic group equivalent of 140.
[0042]
Examples 1-4, Comparative Examples 1-2
The components shown in Table 2 were mixed and stirred, and the performance evaluation tests (i) to (vi) were performed. The results are shown in Table 2. As the compound (B) having two or more epoxy groups in the molecule, the following was used.
Polyepoxide (B1); bisphenol A diglycidyl ether (“Epicoat 828” manufactured by Yuka Shell Epoxy; epoxy equivalent 190, viscosity 11,000), and neopentyl glycol diglycidyl ether (epoxy equivalent 154, viscosity 20 cP)
The following were used as the amino compound (C) having two or more active hydrogens derived from a primary amino group and / or a secondary amino group in the molecule.
(C1) Aliphatic polyamine: xylylenediamine (active hydrogen equivalent 36, viscosity 7 cP)
Moreover, the following were used as a hardening accelerator.
(E1) “DMP-10”; N, N-dimethylaminomethylphenol
The reinforcing fibers used in the production of the fiber-reinforced composite material of the present invention were knitted into a sheet shape, and the material used was aramid.
Reinforcing fiber: Aramid fiber (“Technora sheet AT-90” manufactured by Teijin Limited)
[0043]
[Table 2]
[0044]
The tensile strength (MPa) in the table indicates the value of the cured product of only the epoxy resin composition, and the FRP tensile strength (GPa) indicates the value of the fiber-reinforced composite material.
【The invention's effect】
The epoxy resin composition for fiber reinforcement of the present invention has a low viscosity and a fast curing property at room temperature or low temperature, and becomes a high-strength fiber-reinforced composite material when cured in combination with fibers.
Claims (2)
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| JP7662199A JP4342628B2 (en) | 1999-03-19 | 1999-03-19 | Structure-reinforced epoxy resin composition for fiber reinforcement and fiber-reinforced composite material |
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| JP7662199A JP4342628B2 (en) | 1999-03-19 | 1999-03-19 | Structure-reinforced epoxy resin composition for fiber reinforcement and fiber-reinforced composite material |
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| JP2003201337A (en) * | 2001-09-28 | 2003-07-18 | Nippon Oil Corp | Method for adjusting curing time of cold-setting epoxy resin composition and method for reinforcing concrete structure |
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