JP3958591B2 - Clean room - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a clean room used for semiconductor manufacturing and the like, and more particularly to a structure of a wall and a ceiling of a clean room.
[0002]
[Prior art]
Conventionally, clean rooms such as semiconductor manufacturing factories and operating rooms are known.
[0003]
[Problems to be solved by the invention]
In conventional clean rooms, the antistatic measures for walls and ceilings are not perfect, and charges are accumulated on the walls and ceiling, and dust is attached due to static electricity, and gas is generated due to organic matter reaction caused by electrostatic sparks. Therefore, there has been a problem of causing trouble in semiconductor manufacturing and the like.
[0004]
[Means for Solving the Problems]
In the clean room according to claim 1 of the present invention, the upper end of the base board constituting the wall base surface is abutted against the surface of the deck plate forming the ceiling surface, and gas is diffused at the boundary between the base board and the surface of the deck plate. sealing processing is performed with less sealant, conductive processing is applied to the surface of the de Kkipureto, sheet-like wall coverings having conductivity to extend from the wall base surface to the surface of the deck plate is attached, the sheet-like wall The sheet-like wall finishing material and the deck plate were made conductive by fixing the finishing material to the conductive treatment surface of the deck plate by the conductor fixture .
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS. First, an outline of a clean room of a semiconductor manufacturing factory in the present embodiment will be described with reference to FIG. The clean room has a three-layer structure. That is, it includes a process area 10 in which precision equipment necessary for semiconductor manufacturing and inspection is installed, an underfloor area 20, and a ceiling area 30. The floor of the process area 10 is a perforated floor (grating) 11, and the ceiling of the process area 10 is a perforated ceiling 12. In the ceiling area 30, an air conditioner 31 and an air cleaning filter 32 are provided. An air circulation space 10A is provided on the side of the process area 10 so that the air is purified by the air cleaning filter 32 and circulates in the respective areas 10, 20, and 30 as indicated by arrows. A front room equipped with an air shower is provided between the entrance 40 and the outside, and a person entering the clean room enters the clean room after performing air cleaning in the front room. The front room becomes a sealed space with the door 40a on the clean room side and the door on the outside side. In addition, 41 is an entrance / exit between the air circulation space 10A and the process area 10, 41a is a door of the entrance / exit 41, 42 is a pillar, 43 and 44 are fireproof covering beams, 45 is a double window, 46 is a corridor, 47 is This is a wiring pit for storing wiring.
[0006]
Next, the structure of the wall and ceiling of the clean room will be described with reference to FIG. 1 taking the structure of the wall and ceiling in the portion A of the ceiling area 30 of FIG.
First, a plurality of molded concrete 1 such as ALC (lightweight aerated concrete) is built from the floor side to form a wall base, and the fire-resistant coated beam 44 is formed on the wall base, on the steel beam 43 and on the steel beam. A deck plate 2 is laid on the top, a reinforcing bar is placed thereon, and concrete is driven onto the deck plate 2 to form a ceiling. The space between the upper end of the wall base and the deck plate 2 is sealed with a sealing agent 50 to ensure airtightness. Then, by attaching a base board 4 such as a plaster board to the surface 1a side of the wall base by a GL method using a GL bond 3, a wall base surface is constituted by the surface 4a of the base board 4. At this time, the upper end 4 b of the base board 4 is pressed against the deck plate 2, and the sealing agent 5 is filled between the notch 4 s formed on the upper end 4 b of the base board 4 and the deck plate 2 to perform a sealing process. That is, a sealing process is performed with the sealing agent 5 at the boundary between the base board 4 and the deck plate 2. As this sealing agent 5, a urethane-based sealing agent having good adhesion to a cloth paste and having little gas emission is used. Further, the surface 2a of the deck plate 2 serving as the ceiling surface is subjected to a conductive treatment by applying a conductive paint 6 with less gas emission. As the conductive paint 6, a conductive epoxy resin paint or the like is used. Then, the conductive cloth 7 is attached to the wall base surface constituted by the surface 4 a of the base board 4. At this time, the conductive cloth 7 is attached so as to extend to the ceiling surface subjected to the conductive treatment. In other words, the back surface 7a of the conductive cloth 7 is attached to the ceiling surface subjected to the conductive treatment with a cloth paste or the like. Thereby, the conductive paint 6 and the conductive cloth 7 are electrically connected. Further, the conductive cloth 7 is fixed to the deck plate 2 with a metal screw 8 as a conductor fixing tool so that the conductive cloth 7 and the conductive paint 6 are reliably conducted. Reference numeral 8 a denotes a washer for holding the conductive cloth 7.
[0007]
According to the above configuration, since the conductive paint 6 applied to the surface 2a of the deck plate 2 serving as the ceiling surface is electrically connected to the conductive cloth 7, the conductive treatment ceiling subjected to the conductive treatment with the conductive paint 6 is used. The conductivity of the conductive treatment wall surface 17 subjected to the conductive treatment by the surface 16 and the conductive cloth 7 is ensured, and the conductive treatment wall surface 17 and the conductive treatment ceiling surface 16 are removed by dropping the conductive treatment wall surface 17 and the conductive treatment ceiling surface 16 to the ground. Therefore, the charging current charged on the conductive processing wall surface 17 and the conductive processing ceiling surface 16 can be quickly released to the ground. Therefore, a clean room having a wall and a ceiling with an excellent antistatic effect can be obtained. Further, since the conductive paint 6 and the conductive cloth 7 are connected by the metal screw 8, the conductive treatment ceiling surface 16 and the conductive treatment wall surface 17 are more conductive, and a clean room having an excellent antistatic effect. Wall and ceiling. In addition, when conduction between the conductive treatment ceiling surface 16 and the conductive treatment wall surface 17 is not ensured, the conductive treatment ceiling surface 16 and the conductive treatment wall surface 17 cannot be made to have a uniform potential. The charging current of the wall surface 17 or the conductive treatment ceiling surface 16 cannot be quickly released to the ground.
Further, since the conductive paint 6 and the sealing agent 5 with less gas divergence are used, it is possible to suppress the generation of gas that causes trouble in semiconductor manufacturing.
[0008]
In the above description, the conductive cloth 7 is attached to the wall foundation surface formed by the foundation board 4. However, the conductive cloth 7 is attached to the concrete wall foundation surface or coated with a conductive paint to conduct the conductive treatment. Alternatively, a conductive treatment with a conductive cloth or conductive paint may be applied to the wall base surface of the base board attached to the steel base.
In the above description, the ceiling and wall portions of the ceiling area 30 in FIG. 3 have been described as an example, but the present invention can also be applied to the ceiling and wall portions of the front room.
The present invention can also be applied to the ceiling and wall of a clean room such as an operating room, thereby reducing static electricity and gas that cause malfunction of computer machines in the operating room.
[0009]
Next, the structure of the ceiling and the fireproof covering beam in the clean room will be described with reference to FIG. 2 by taking the structure of the ceiling and the fireproof covering beam in the portion B of the ceiling area 30 in FIG. 3 as an example.
The refractory coated beam 44 is a steel beam such as H-shaped steel covered with a calcium silicate plate or the like, and extends from the surface of the refractory coated beam 44 to the ceiling surface subjected to the conductive treatment with the conductive paint 6. A conductive cloth 7 is attached as a sheet material having conductivity. That is, the back surface 7a of the conductive cloth 7 is attached to the ceiling surface subjected to the conductive treatment with a cloth paste or the like.
In this case, the conductive cloth 7 may be fixed to the deck plate 2 with a conductor screw. However, since the length of the fireproof covering beam 44 is shorter than the wall and the displacement at the time of deformation of the building is small, the screw is not fixed. Good. According to this, the charging current charged on the conductive fireproof covering beam surface 70 by the conductive cloth 7 can be released to the ground via the conductive processing ceiling surface 16 and the conductive processing wall surface 17, so that the antistatic effect is achieved. A clean room with excellent fire-resistant coated beams can be obtained.
[0010]
【The invention's effect】
According to claim 1 of the present invention, since the surface of the deck plate that forms the conductive treatment ceiling surface of the clean room and the sheet-like wall finishing material that forms the conductive treatment wall surface are made conductive, a clean room having an excellent antistatic effect is obtained. In addition, since the sealing process at the boundary between the base board constituting the wall base surface and the surface of the deck plate is performed with a sealing agent having a low gas emission, an effect of preventing gas generation can be obtained .
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a structure of a wall and a ceiling of a clean room according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a structure of a fireproof covering beam and a ceiling of a clean room according to the embodiment.
FIG. 3 is a cross-sectional view showing an outline of a clean room according to the embodiment.
[Explanation of symbols]
2 Deck plate, 2a Deck plate surface (ceiling surface),
4 Base board, 4a Surface of base board (wall base surface), 5 Sealing agent,
6 conductive paint, 7 conductive cloth, 8 metal screw (conductor fixture).

Claims (1)

The upper end of the base board that forms the wall base surface is pressed against the surface of the deck plate that forms the ceiling surface, and the boundary between the base board and the surface of the deck plate is sealed with a sealing agent that emits less gas. Conductive treatment is applied to the surface of the plate plate, and conductive sheet-like wall finishing material is attached so as to extend from the wall base surface to the surface of the deck plate. The sheet-like wall finishing material is electrically connected to the deck plate by a conductor fixture. A clean room characterized in that the sheet-like wall finishing material and the deck plate are electrically connected by being fixed to the processing surface .

Images