JP7422331B2 - Parts mounting device - Google Patents

Description

The present disclosure relates to a component mounting device.

The component mounting device uses a suction nozzle attached to a mounting head to mount the suctioned components onto a board. The suction nozzle has a rubber pad as an accessory at the tip of the nozzle. The rubber pad deteriorates in proportion to the number of times it picks up parts. Attempts have been made to accurately and efficiently produce component mounting boards by having the degree of deterioration of the rubber pad as individual data for the nozzle tip (for example, see Patent Document 1).

JP2008-205318A

However, when a rubber pad constitutes a pad nozzle for picking up components, defects may occur in the rubber pad portion during use due to the mounting of many components, which may affect the sucking and mounting operation. In the conventional technology, it is not possible to directly detect a defect in the rubber pad, and the only way to notice a defect in the rubber pad is to indirectly discover a defect in the suction nozzle, for example, as a result of a mounting defect or a suction/attachment error.

The present disclosure was devised in view of the conventional situation described above, and aims to provide a component mounting device that can suppress the occurrence of suction/mounting errors and improve mounting quality.

The present disclosure relates to a component mounting device that mounts a component picked up from a component supply section onto a substrate by vacuum suction of a suction nozzle provided in a mounting head, wherein the suction nozzle is provided at the tip of the suction nozzle on the side where the component is suctioned. a pneumatic generation source connected to the nozzle opening through a conduit; a contact member provided around the nozzle opening and in contact with the component; and a storage unit that stores at least a specific area of the component mounting device. , a control unit that controls the contact member to contact the specific area based on the storage unit, and a control unit that measures the flow rate of the conduit when the contact member is brought into contact with the specific area. A component mounting device is provided that includes a flow rate sensor and a determination unit that determines whether the abutting member is defective based on the flow rate.

According to the present disclosure, it is possible to suppress the occurrence of suction/attachment errors and improve the mounting quality.

A plan view schematically showing a schematic configuration of a component mounting device according to Embodiment 1. A perspective view of the mounting head shown in Figure 1 Side view of the main parts of the suction nozzle with only the rubber pad in cross section Schematic diagram of the cushion end sensor installed in the suction nozzle A diagram showing an example of a pneumatic circuit that switches between vacuum pressure and blow pressure of a suction nozzle connected to a pneumatic generation source. Correlation diagram showing an example of the relationship between the state of the suction nozzle and the operation of each valve A block diagram showing the configuration of the control system of the component mounting device shown in Figure 1. Flowchart showing a method for determining a contact member by the component mounting device 11 according to the first embodiment Explanatory diagram showing changes in vacuum valve operation, pad internal pressure, and nozzle flow rate over time with respect to nozzle position Correlation diagram showing an example of the relationship between nozzle flow rate and normal and abnormal values

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments specifically disclosing a component mounting apparatus according to the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of well-known matters or redundant explanations of substantially the same configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

FIG. 1 is a plan view schematically showing a schematic configuration of a component mounting device 11 according to the first embodiment. In addition, in the attached drawings with arrows indicating directions, the X axis indicates the left and right direction with respect to the component mounting device 11, the Y axis indicates the front and rear direction with respect to the component mounting device 11, and the Z axis indicates the vertical direction with respect to the component mounting device 11. show. The X-axis and the Y-axis are orthogonal and included in the horizontal plane. The Z axis is included in the creeping plane.

In the component mounting apparatus 11 according to the first embodiment, a board transport section 15 is arranged on the upper surface of the base 13 in the X direction. The board transport unit 15 transports a board 17 received from an upstream device forming a production line, and positions and holds the board 17 at a mounting work position by a component mounting mechanism. Component supply units 19 are arranged on both sides of the board transfer unit 15 . For example, a plurality of tape feeders 21 are installed in the component supply section 19 in parallel. The tape feeder 21 pitch-feeds a carrier tape holding a component 23 (see FIG. 4), thereby positioning the component 23 at a feeding position to a mounting head 25 that constitutes a component mounting mechanism.

At one end of the upper surface of the base 13 in the X direction, a Y-axis beam 27 is disposed horizontally along the Y direction. A pair of X-axis beams 29 are attached to the Y-axis beam 27 so as to be slidable in the Y direction. The X-axis beam 29 is driven in the Y direction by a linear drive mechanism included in the Y-axis beam 27. A mounting head 25 is mounted on each X-axis beam 29 so as to be slidable in the X direction. The mounting head 25 includes a plurality of nozzle units 31 and is driven in the X direction by a linear drive mechanism provided by the X-axis beam 29.

By driving the Y-axis beam 27, the X-axis beam 29, and the mounting head 25, the mounting head 25 picks up the tape placed on each component supply section 19 by the suction nozzle 33 (see FIG. 2) provided in the nozzle unit 31. The component 23 (see FIG. 4) is taken out (in other words, picked up) from the feeder 21 by vacuum suction, moved above the board 17, and mounted on the mounting position of the board 17. In the above configuration, the Y-axis beam 27 and the X-axis beam 29 constitute a head moving mechanism 35 that moves the mounting head 25 in the horizontal direction (X direction, Y direction). Further, the Y-axis beam 27, the X-axis beam 29, and the mounting head 25 constitute a component mounting mechanism.

A component recognition camera 37 is disposed on the base 13 between the board transport section 15 and each component supply section 19 . The component recognition camera 37 captures an image of the component 23 held by the suction nozzle 33 attached to the mounting head 25 as the mounting head 25 that has taken out the component 23 from the component supply section 19 moves above the component recognition camera 37. do.

On the coupling plate 39 to which the mounting head 25 is attached, a board recognition camera 41 that is located on the lower surface side of the X-axis beam 29 and moves integrally with the mounting head 25 is arranged with the imaging direction facing downward. Ru. The board recognition camera 41 can image a position recognition mark (not shown) on the board 17 by moving the mounting head 25 above the board 17 held by the board transport section 15 . Further, the board recognition camera 41 can image the component 23 mounted on the board 17 after the component is mounted.

The image data acquired by the component recognition camera 37 and the board recognition camera 41 are recognized and processed by the device control unit 93 (see FIG. 7) included in the component mounting device 11. Thereby, the component mounting device 11 can detect the positional deviation of the component 23 held by the suction nozzle 33 in the mounting head 25 and the positional deviation of the substrate 17 held by the substrate transport section 15. In the component mounting operation by the component mounting mechanism, the position of the mounting head 25 is corrected under the control of the device control section 93, taking these positional deviations into consideration.

FIG. 2 is a perspective view of the mounting head 25 shown in FIG. The mounting head 25 is attached to the X-axis beam 29 via a coupling plate 39. The mounting head 25 has a plurality of nozzle units 31 (12 in the example of FIG. 2) arranged in parallel, for example, in a configuration of 2 rows and 6 columns. Each nozzle unit 31 has a configuration in which a nozzle shaft 45 extends downward from a nozzle drive section 43, and the suction nozzle 33 is attached to and detached from a nozzle mounting section 47 connected to the lower end of the nozzle shaft 45. Can be attached freely. Each nozzle drive unit 43 includes a nozzle lifting mechanism (not shown) that raises and lowers an lifting shaft (not shown) coupled to the nozzle shaft 45 using a linear motor. By driving the nozzle drive section 43, the suction nozzles 33 mounted on the nozzle mounting section 47 are individually raised and lowered.

A plurality of types of suction nozzles 33 are prepared depending on the size and shape of the component 23 to be vacuum-suctioned. For example, for a component 23 having a large size, a suction nozzle 33 having a large suction holding surface 49 (see FIG. 4) at the lower end of the suction nozzle 33 is used. Further, a plurality of types of mounting heads 25 are prepared depending on the type of suction nozzle 33 to be mounted. For example, when mounting a large suction nozzle 33 for suctioning a component 23 having a large size, a mounting head 25 including a large nozzle unit 31 is used.

FIG. 3 is a side view of a main part of the suction nozzle 33 with only the rubber pad 51 in cross section. The suction nozzle 33 has a nozzle opening 55 formed at the tip 53 on the side that suctions the component 23 . In the suction nozzle 33 , a rubber pad 51 , which is a contact member that comes into contact with the component 23 , is attached around a nozzle opening 55 . The rubber pad 51 is made of rubber or silicone rubber, for example. For example, the top of the rubber pad 51 is formed so as to communicate with an inner space on the inner side of the hem side, which is expanded into a substantially conical shape and formed in a funnel shape. The rubber pad 51 is attached to the suction nozzle 33 by fitting the top portion into a circumferential groove 57 formed in the tip portion 53 . The contact surface 59 on the bottom side of the rubber pad 51 has a circular shape and is arranged coaxially with the nozzle opening 55 .

The contact surface 59 of the rubber pad 51 contacts a specific area 61 set on the component mounting device 11 . The contact surface 59 is formed around the nozzle opening 55 so that the substantially conical bottom side thereof is located concentrically. Note that the shape of the rubber pad 51 is not limited to this, and may have a bellows or the like.

The projection plane of the rubber pad 51 with respect to the specific area 61 is located inside the specific area 61 . In the first embodiment, the rubber pad 51 can vacuum-suction and transport the component 23 that is in contact with the contact surface 59, through which air is sucked by a vacuum pump from the nozzle opening 55 that opens in the inner space. Note that the rubber pad 51 may be configured to perform vacuum suction by supplying compressed air by providing an ejector (so-called vacuum generator) in the suction nozzle 33.

The surface of the specific region 61 that the contact surface 59 of the rubber pad 51 contacts is a flat surface. Since the specific region 61 of the rubber pad 51 is flat, the contact surface 59 of the rubber pad 51 uniformly contacts the flat surface of the specific region 61 around the entire circumference. As this flat surface, for example, the upper surface of the correction mark rail in the component mounting device 11 can be used.

FIG. 4 is a schematic diagram of a cushion end sensor provided in the suction nozzle 33. The suction nozzle 33 has a contact sensor 63 that detects whether the tip 53 has contacted a specific region 61. The contact sensor 63 is also called a cushion end sensor. In the component mounting device 11, a control unit (for example, the device control unit 93, see FIG. 7) measures the suction height of the component 23 using the contact sensor 63. The cushion end stroke Sc of the contact sensor 63 is used for measurement. The cushion end stroke Sc is, for example, approximately 3.0 mm±offset. When the suction nozzle 33 descends (moves in the -z axis direction) with the suction holding surface 49 of the tip 53 in contact with the upper surface of the component 23, the sensor dog 65 moves upward due to the reaction force from the component 23. (move in the +z-axis direction). The contact sensor 63 is activated by this movement of the sensor dog 65. To measure the suction height of the component 23 by the suction nozzle 33, the suction holding surface 49 of the tip portion 53 is pressed against the upper surface of the component 23 and lowered at low speed, and the contact sensor 63 is turned off by the movement of the sensor dog 65. Find the suction height from the height.

In this component mounting apparatus 11, the contact sensor 63 detects that the tip portion 53 of the suction nozzle 33 has contacted the specific area 61 using this known suction height measurement function. Further, in the component mounting device 11, the control section (for example, the device control section 93, see FIG. 7) moves the tip 53 of the suction nozzle 33 a predetermined distance (see G described later) from the contact surface 59 of the rubber pad 51. The suction nozzle 33 may be controlled in a direction to raise it so that it is located above. This upward movement distance is determined by the pad protrusion G in which the contact surface 59 of the rubber pad 51 protrudes in the direction toward the component 23 from the tip 53 of the suction nozzle 33 (more specifically, the suction holding surface 49). minutes (see Figure 3). The pad protrusion G is set, for example, to about 0.1 mm to 0.2 mm.

FIG. 5 is a diagram showing an example of a pneumatic circuit that switches between vacuum pressure and blow pressure of the suction nozzle 33 connected to the pneumatic pressure generation source 67. The nozzle shaft 45 passes through the nozzle mounting portion 47 and communicates with the suction nozzle 33 . A suction hole (not shown) provided through the nozzle shaft 45 is connected to an output path connected to the output port A1 of the vacuum valve 71 via a flow rate sensor 69. The output path is a suction/air blow circuit that connects the vacuum valve 71 and the suction nozzle 33 via the flow rate sensor 69. The flow rate sensor 69 has two positive and reverse directions: a positive direction in which the flow flows from the flow rate sensor 69 in the direction of the nozzle shaft 45 (arrow a), and a negative direction (reverse direction) in which the flow flows from the nozzle shaft 45 in the direction of the flow rate sensor 69 (arrow b). Measure the flow rate of air in the direction. That is, the flow rate sensor 69 measures the flow rate of the pipe when the rubber pad 51 is brought into contact with the specific area 61 .

The vacuum valve 71 has two input ports R1 and P1, and an output port A1. The vacuum valve 71 is a 3-port, 2-position normally open directional switching valve operated by a solenoid valve and a return spring. In the vacuum valve 71, the input port R1 and the output port A1, which are normally connected in a non-energized state, are at a vacuum pressure. The vacuum valve 71 switches between a state in which a path from the input port R1 to the output port A1 is opened and a state in which a path from the input port P1 to the output port A1 is opened in response to a selection signal from the outside. The input port R1 of the vacuum valve 71 is connected to the vacuum pump 73, the input port P2 is connected to the output port A2 of the blow valve 75, and the output port A1 is connected to an output path leading to the flow rate sensor 69. Vacuum pump 73 generates negative pressure (vacuum).

Blow valve 75 has two input ports R2 and P2, and an output port A2. The blow valve 75 is a 3-port, 2-position normally open directional switching valve operated by a solenoid valve and a return spring. That is, the blow valve 75 has the same structure as the vacuum valve 71 described above. In the blow valve 75, the input port R2 and the output port A2, which are normally connected in a non-energized state, are at atmospheric pressure. The blow valve 75 switches between a state in which the path from the input port R2 to the output port A2 is opened and a state in which the path from the input port P2 to the output port A2 is opened in response to a selection signal from the outside. The input port P2 of the blow valve 75 is connected to the air supply source 77, the input port R2 is connected to the atmospheric supply source 79 (see FIG. 7), and the output port A2 is connected to the input port P1 of the vacuum valve 71. Air supply source 77 supplies positive pressure air. Atmospheric supply source 79 supplies air at atmospheric pressure. Note that the atmospheric supply source 79 can also be realized by opening the input port R2 of the blow valve 75.

In this specification, the air pressure generation source 67 refers to the vacuum pump 73 and the air supply source 77 collectively.

In the component mounting apparatus 11, a normally open directional switching valve is used for the vacuum valve 71 and the blow valve 75 to maintain the vacuum of the rubber pad 51 when the power is cut off (so-called fail-safe). Thereby, the component mounting device 11 can keep the component 23 suctioned even when the power is unexpectedly cut off, and can prevent the component 23 from falling.

The input port P2 of the blow valve 75 is connected to the output port A3 of the cleaning valve 81. Cleaning valve 81 has two input ports R3 and P3, and an output port A3. The cleaning valve 81 is a 3-port, 2-position normally open directional switching valve operated by a solenoid valve and a return spring. That is, the cleaning valve 81 has the same structure as the vacuum valve 71 described above. In the cleaning valve 81, the input port R3 and the output port A3, which are normally connected in a non-energized state, are at blow pressure. The input port R3 of the cleaning valve 81 is connected to the air supply source 77 via the vacuum break pressure reducing valve 83. The vacuum break pressure reducing valve 83 reduces the pressure of compressed air sent from the air supply source 77 and adjusts it to a predetermined vacuum break pressure. Input port P3 of cleaning valve 81 is connected to air supply source 77 via cleaning blow pressure reducing valve 85. The cleaning blow pressure reducing valve 85 reduces the pressure of compressed air sent from the air supply source 77 and adjusts it to a predetermined cleaning blow pressure.

The vacuum break pressure reducing valve 83 is set to a vacuum break pressure of 0.01 MPa (10 kPa), for example. The cleaning blow pressure reducing valve 85 is set to a cleaning blow pressure of, for example, 0.14 MPa (140 kPa).

FIG. 6 is a correlation diagram showing an example of the relationship between the state of the suction nozzle 33 and the operation of each valve. The suction/attachment of the suction nozzle 33 is controlled by ON/OFF control of the vacuum valve 71, the blow valve 75, and the cleaning valve 81. The vacuum valve 71 and the blow valve 75 are controlled on the mounting head 25 side. The cleaning valve 81 is controlled by the device main body (that is, the main body of the component mounting device 11). When the suction nozzle 33 is under vacuum, the vacuum valve 71 is controlled to be turned off. When the suction nozzle 33 is opened to the atmosphere, the vacuum valve 71 is controlled to be ON and the blow valve 75 is controlled to be OFF. When the vacuum is broken, the suction nozzle 33 is controlled so that the vacuum valve 71 is turned on, the blow valve 75 is turned on, and the cleaning valve 81 is turned off. During cleaning blowing, the suction nozzle 33 is controlled so that the vacuum valve 71 is turned on, the blow valve 75 is turned on, and the cleaning valve 81 is turned on. At the time of suction, the suction nozzle 33 is opened to the atmosphere and becomes a vacuum. When the suction nozzle 33 is installed, the vacuum is broken and the suction nozzle 33 is opened to the atmosphere.

The mounting head 25 is provided with a plurality of suction nozzles 33 (twelve in the example of FIG. 2). The mounting head 25 is provided with a vacuum valve 71 and a blow valve 75 corresponding to each suction nozzle 33 . The component mounting device 11 also includes a pneumatic pressure generation source 67 (vacuum pump 73 and air supply source 77), a cleaning valve 81, a vacuum break pressure reducing valve 83, and a cleaning blow pressure reducing valve 87 on a pedestal 87 that supports the base 13. A valve 85 is provided. The input port R1 of each vacuum valve 71 is connected to the vacuum pump 73 by a negative pressure branch line 89. The input port P2 of each blow valve 75 is connected to the output port A3 of the cleaning valve 81 by a positive pressure branch line 91. In the first embodiment, a case of a 12-nozzle head with 12 suction nozzles 33 is illustrated, but the basic pneumatic circuit is configured in the same way in the case of a 3-nozzle head and a 16-nozzle head. In the component mounting apparatus 11 of the first embodiment, the output ports of the cleaning blow pressure reducing valve 85 are connected to other beams in a distributed manner.

FIG. 7 is a block diagram showing the configuration of a control system of the component mounting apparatus 11 shown in FIG. 1. The component mounting device 11 includes a control section (device control section 93), a storage section (device storage section 95), a board transport section 15, a component supply section 19, a mounting head 25, a head movement mechanism 35, a component recognition camera 37, and a board recognition unit. It includes a camera 41, a vacuum pump 73, an air supply source 77, an atmospheric supply source 79, an input section 97, a display section 99, and a notification section 101 as a notification means. The mounting head 25 includes a nozzle drive section 43 and a nozzle control section 103. The nozzle control unit 103 includes a valve control unit 105, a determination unit 107, and a valve storage unit 109, and is connected to a flow rate sensor 69, a vacuum valve 71, a blow valve 75, and a cleaning valve 81.

The device control unit 93 is an arithmetic processing unit constituted by a processor such as a CPU (Central Processing Unit), and includes a mounting control unit 111 and an abnormality processing unit 113 as internal processing functions. Furthermore, the device control section 93 controls the rubber pad 51 to contact the specific area 61 based on the device storage section 95 .

The device storage unit 95 is a storage device such as an HDD (Hard Disk Drive), and stores mounting data 115, valve control data 117, determination control data 119, and the like. The device storage unit 95 also stores the specific area 61 of the component mounting device 11.

The mounting data 115 includes information such as the mounting position of the component 23 to be mounted on the board 17 and the type (component name) of the component 23 to be mounted.

The mounting control unit 111 controls the board transport unit 15, the component supply unit 19, the mounting head 25, the nozzle drive unit 43, and the head moving mechanism 35 based on the mounting data 115, and removes the components from the suction nozzle 33 onto the board 17. Controls the implementation of 23.

The valve control data 117 stores information such as timing when the valve control unit 105 switches the vacuum valve 71, the blow valve 75, and the cleaning valve 81 when mounting the component 23 vacuum-sucked by the suction nozzle 33 on the substrate 17. There is.

The determination control data 119 includes timing information for determining the measurement result of the flow rate sensor 69 by the determination unit 107 of the nozzle control unit 103, and a determination flow rate that is a threshold value for determining whether the measured air flow rate is normal. Value Ft etc. are stored.

The timing information of the valve control data 117, the timing information of the determination control data 119, and the determination flow rate value Ft are based on the type of mounting head 25 (number of nozzle units 31, etc.), the type of suction nozzle 33 to which the mounting head 25 is attached, and the suction A value corresponding to the type of rubber pad 51 attached to the nozzle 33 is determined in advance based on experiment or experience. Various data corresponding to the configuration of the component mounting device 11, such as the type of the mounting head 25 mounted on the component mounting device 11, the type of suction nozzle 33 mounted on the nozzle unit 31, and the type of rubber pad 51, are used for valve control. The data 117 and the determination control data 119 are transferred to the valve storage unit 109 included in the nozzle control unit 103 and stored in advance.

The vacuum valve 71, the blow valve 75, and the cleaning valve 81 are connected to a valve control section 105 included in the nozzle control section 103. The measurement result of the flow rate sensor 69 is input to the determination unit 107 included in the nozzle control unit 103. The valve storage unit 109 included in the nozzle control unit 103 stores timing information for switching the states of the vacuum valve 71, blow valve 75, and cleaning valve 81 by the valve control unit 105, and the flow rate of air measured by the flow rate sensor 69 by the determination unit 107. Timing information and a determination flow rate value Ft for determining whether or not it is normal are stored. The nozzle control section 103 is disposed on the mounting head 25 and is connected to the device control section 93 with the mounting head 25 attached to the coupling plate 39 .

When the valve control unit 105 controls the vacuum valve 71 to open the path from the input port R1 to the output port A1, the vacuum pump 73 communicates with the suction nozzle 33 via the flow rate sensor 69, and the suction nozzle 33 performs vacuum suction through a nozzle opening 55 that opens in the suction holding surface 49 at the lower end. That is, the vacuum pump 73 serves as a vacuum suction means for sucking vacuum from the suction nozzle 33.

When vacuum suction is applied from the suction nozzle 33 while the component 23 is in contact with the suction holding surface 49, the component 23 is vacuum suctioned by the suction nozzle 33. At this time, the air flow rate F measured by the flow rate sensor 69 becomes a small value close to zero (see FIG. 10). When vacuum suction is performed from the suction nozzle 33 in a state where the component 23 is not in contact with the suction holding surface 49, outside air (air) is suctioned from the suction nozzle 33. Additionally, if the rubber pad 51 is defective due to tearing, deformation, wear, etc., outside air will flow into the inner space, and the air flow rate F measured by the flow rate sensor 69 will be larger than during normal vacuum suction ( (See Figure 10).

When the valve control unit 105 controls the vacuum valve 71 to open the path from the input port P1 to the output port A1, and controls the blow valve 75 to open the path from the input port P2 to the output port A2. , the air supply source 77 communicates with the suction nozzle 33 via the flow rate sensor 69, and positive pressure air is discharged from the suction nozzle 33. That is, the air supply source 77 serves as an air blowing means for discharging positive pressure air from the suction nozzle 33. At this time, the flow rate F of positive air is measured by the flow rate sensor 69.

When the valve control unit 105 controls the vacuum valve 71 to open the path from the input port P1 to the output port A1, and controls the blow valve 75 to open the path from the input port R2 to the output port A2. , the atmospheric supply source 79 communicates with the suction nozzle 33 via the flow rate sensor 69, and the suction nozzle 33 becomes at atmospheric pressure. At this time, the air flow rate F measured by the flow rate sensor 69 becomes almost zero.

In this manner, the vacuum valve 71 and the blow valve 75 serve as switching means for selectively connecting the vacuum pump 73, the air supply source 77, and the atmospheric supply source 79 to the suction nozzle 33. The flow rate sensor 69 is interposed in the suction/air blow circuit that connects the switching means (vacuum valve 71, blow valve 75, cleaning valve 81) and the suction nozzle 33, and is connected to the flow rate sensor 69, which is connected to the suction/air blow circuit that connects the switching means (vacuum valve 71, blow valve 75, cleaning valve 81) and the suction nozzle 33. Measure F in two directions: forward and reverse.

The determination unit 107 includes, for example, a comparator, and compares the air flow rate F measured by the flow rate sensor 69 with the determination flow rate value Ft stored in the valve storage unit 109, so that the air flow rate F becomes the determination flow rate. It is determined whether the value Ft has been exceeded. That is, the determination unit 107 determines whether the rubber pad 51 is defective based on the flow rate F. The timing determined by the determination unit 107 is controlled by the valve control unit 105 based on timing information stored in the valve storage unit 109. The determination result by the determination unit 107 is transmitted to the device control unit 93 via the valve control unit 105. If the rubber pad 51 is determined to be defective based on the determination section 107, the component mounting apparatus 11 notifies the notification section 101 that the rubber pad 51 is defective.

Next, a specific procedure for determining whether or not the rubber pad 51 is defective will be explained.

FIG. 8 is a flowchart showing a method for determining the rubber pad 51 by the component mounting apparatus 11 according to the first embodiment. Each process shown in FIG. 8 is mainly executed under the control of the device control section 93.

In FIG. 8, in the component mounting apparatus 11, a defect check of the rubber pad 51 attached to the suction nozzle 33 is started during maintenance or the like (St1). When a defect check is started, the device control unit 93 first attaches the rubber pad 51 to be checked above a flat inspection surface (specific area 61) such as a conveyor rail or correction post, which is a check position. The suction nozzle 33 is moved (St2).

Next, the device control unit 93 measures the height of the suction nozzle 33 to be checked. When measuring the height, the device control unit 93 lowers the suction nozzle 33 toward the inspection surface (St3). The device control unit 93 uses the contact sensor 63 to detect whether the suction holding surface 49 of the suction nozzle 33 has contacted the inspection surface (t0 in FIG. 9) (St4). After the suction holding surface 49 comes into contact with the inspection surface, the device control unit 93 raises the suction holding surface 49 of the suction nozzle 33 to a predetermined height (that is, pad protrusion amount G) above the inspection surface (St5). At this time, the height measurement function of the contact sensor 63 (that is, cushion end sensor) is utilized.

After the movement of the suction nozzle 33 to the detection height is completed, the device control unit 93 turns on the vacuum of the suction nozzle 33 to be checked (St6).

The device control unit 93 waits for the time when the vacuum becomes stable (t2-t1 in FIG. 9), and then measures the flow rate F with the flow rate sensor 69 provided on the mounting head 25 (St7).

The device control unit 93 determines whether the nozzle is defective based on the measured flow rate F. In the nozzle defect determination, it is determined whether the flow rate F is larger than a threshold value (determination flow rate value Ft shown in FIG. 10). When the flow rate F>judgment flow rate value Ft, the device control unit 93 determines that the nozzle is defective (St9). If the nozzle is defective, a vacuum leak (inflow of outside air shown in FIG. 9) will occur, so the device control unit 93 can determine the defect by detecting the flow rate F. Judgment can be made based on the difference in flow rate between the normal state (judgment flow rate value Ft) and the defective state (flow rate F). On the other hand, if the flow rate F is smaller than the determined flow rate value Ft, the device control unit 93 determines that the rubber pad 51 is normal (St10), and ends the check.

Next, the operation of the component mounting device 11 according to the first embodiment will be explained.

The component mounting device 11 according to the first embodiment is a component mounting device 11 that mounts a component 23 picked up from a component supply section 19 onto a substrate 17 by vacuum suction of a suction nozzle 33 provided in a mounting head 25. This component mounting device 11 includes a pneumatic generation source 67 connected through a pipe to a nozzle opening 55 provided at the tip 53 of the suction nozzle 33 on the side where the component 23 is suctioned, and a pneumatic pressure generation source 67 provided around the nozzle opening 55. , a contact member (e.g., rubber pad 51) that contacts the component 23, a storage section (e.g., device storage section 95) that stores at least the specific area 61 of the component mounting device 11; 61, a flow rate sensor 69 that measures the flow rate F of the pipe when the rubber pad 51 is brought into contact with the specific area 61, and A determination unit 107 that determines whether the rubber pad 51 is defective is provided.

In the component mounting apparatus 11 according to the first embodiment, the component 23 is vacuum-suctioned by the suction nozzle 33 provided on the mounting head 25 . The suction nozzle 33 has a nozzle opening 55 at its tip 53 for suctioning the component 23 . The nozzle opening 55 is connected to a pneumatic pressure source 67 through a conduit. Note that the air pressure generation source 67 includes a vacuum pump 73 that generates negative pressure and a compressor that generates positive pressure.

A rubber pad 51 that comes into contact with the component 23 is provided around the nozzle opening 55 . In the component mounting apparatus 11, the position of the specific area 61 within the apparatus with which the rubber pad 51 is brought into contact is stored in the storage section. That is, in the component mounting apparatus 11, the rubber pad 51 is placed in this specific area 61 when the rubber pad 51 is inspected during maintenance or the like. The component mounting device 11 then controls the rubber pad 51 to come into contact with the specific area 61 using the control unit.

In the component mounting apparatus 11, the flow rate F of air passing through the nozzle opening 55 is measured by the flow rate sensor 69 while the rubber pad 51 is in contact with the specific area 61. The flow rate sensor 69 is interposed between the nozzle opening 55 of the suction nozzle 33 provided on the mounting head 25 and the vacuum valve 71 also provided on the mounting head 25. Note that the flow rate sensor 69 is capable of measuring both the flow rate F when air is sucked through the nozzle opening 55 and the flow rate F when air is blown out from the nozzle opening 55. The flow rate sensor 69 may be one that detects the flow rate F at the time of measurement or one that integrates and detects the flow rate within a predetermined period of time. Further, the detection method may be a differential pressure method, an electromagnetic method, a thermal method, or an ultrasonic method.

The value of the flow rate F measured by the flow rate sensor 69 is used as a parameter (for example, the flow rate F) when the determination unit 107 determines whether or not the rubber pad 51 is defective. The determination unit 107 determines that the flow rate is defective when the flow rate F is larger than a preset determination flow rate value Ft (flow rate F>determination flow rate value Ft).

In this way, in the component mounting device 11, when the rubber pad 51 is checked during maintenance or the like, the rubber pad 51 provided around the nozzle opening 55 comes into contact with a specific area 61 within the device. When the rubber pad 51 comes into contact with the specific area 61, the inner space is in a sealed state under normal conditions. In this state, negative pressure or positive pressure is applied to the inner space of the rubber pad 51 by the air pressure generation source 67. In the rubber pad 51 without tearing, deformation, wear, etc., the flow rate F when air is sucked or the flow rate F when air is supplied to the inner space of the rubber pad 51 is within the range of the determined flow rate value Ft. The flow rate F at this time is measured by the flow rate sensor 69.

When the rubber pad 51 is normal without tearing, deformation, wear, etc., no inflow of outside air or excessive leakage occurs, so the flow rate F falls within the range of the determination flow rate value Ft, and the determination unit 107 determines that it is not defective.

On the other hand, if the rubber pad 51 is torn, deformed, worn, etc., outside air may enter or excessively leak. Therefore, the flow rate F falls outside the range of the determined flow rate value Ft, and the determination unit 107 determines that the rubber pad 51 is defective.

Thereby, in the component mounting apparatus 11, a defect in the rubber pad 51 can be directly discovered, regardless of the result of a mounting defect, a suction/mounting error, or the like. As a result, the component mounting device 11 is able to suppress the effects of suction errors, suction misalignment, component drops, poor placement accuracy, and the like that occur on the suction and placement operations, thereby improving the mounting quality.

Further, in this component mounting apparatus 11, the air pressure generation source 67 is a vacuum pump 73.

FIG. 9 is an explanatory diagram showing changes in vacuum valve operation, pad internal pressure, and nozzle flow rate with respect to nozzle position over time. In this component mounting apparatus 11, the air pressure generation source 67 is a vacuum pump 73. When the suction nozzle 33 holds the component 23 by suction, the flow rate F of air sucked from the nozzle opening 55 by the negative pressure of the vacuum pump 73 is measured by the flow rate sensor 69 .

Note that, in the case of suction, for example, the flow rate F is the flow rate after a certain period of time (t2-t1) from the start of suction (t1) when the vacuum valve 71 is opened to when the flow rate becomes stable (t2) (for example, after 100 ms). It is desirable to obtain the value of the flow rate F from the sensor 69 by reading it.

When vacuum suction is performed by the air pressure generation source 67, the rubber pad 51 further comes into close contact with the specific area 61 in the rubber pad 51 that is not torn, deformed, or worn, and air is sucked from inside the rubber pad 51, reducing the internal pressure to a vacuum. approach. At this time, the flow rate F of air sucked from the inner space of the rubber pad 51 is measured by the flow rate sensor 69.

FIG. 10 is a correlation diagram showing an example of the relationship between the nozzle flow rate and normal and abnormal values. When the rubber pad 51 is in a normal state without tearing, deformation, wear, etc., no outside air flows into the rubber pad 51, so the internal pressure approaches a vacuum. Therefore, the flow rate F decreases as the suction time passes, and finally reaches zero (note that whether or not it becomes zero depends on the device settings). Therefore, the flow rate sensor 69 waits for a period of time until the internal pressure is stabilized, and once the vacuum is stabilized, it measures the flow rate F at that time (t2). If the value of the flow rate F obtained here is smaller than the determination flow rate value Ft, it is considered that outside air is not flowing in, and the determination unit 107 determines that the rubber pad 51 is not defective.

On the other hand, if the rubber pad 51 is torn, deformed, worn, etc., outside air will flow in (the outside air inflow shown in FIG. 9), so the internal pressure will not drop completely and it will be difficult to reach a vacuum. Therefore, the flow rate F does not decrease even after the suction time has elapsed, and does not easily reach zero. The flow rate sensor 69 originally waits for the internal pressure to become vacuum stable, and then measures the flow rate F at that time (t2). If the value of the flow rate F obtained here is larger than the determination flow rate value Ft, it is considered that outside air is flowing in, and the determination unit 107 determines that the rubber pad 51 is defective.

Further, in the component mounting device 11, the rubber pad 51 has a contact surface 59 that contacts the specific area 61, and the contact surface 59 is formed to be located around the nozzle opening 55.

Furthermore, in this component mounting device 11 , the rubber pad 51 has a contact surface 59 that contacts the specific area 61 . The contact surface 59 is formed to be located around the nozzle opening 55. The circular contact surface 59 makes line contact by contacting the specific area 61 and closes the inside. A nozzle opening 55 opens inside this sealed space. Therefore, when vacuum suction is applied to the rubber pad 51 from the nozzle opening 55, the internal pressure of the pad decreases, and the rubber pad 51 is elastically deformed by being pushed by atmospheric pressure from the outside, and is attracted to the specific area 61 with higher adhesion force.

Conversely, when air for vacuum breaking or cleaning air is supplied from the nozzle opening 55, the contact surface 59 in contact with the specific area 61 is elastically deformed to form a gap with the specific area 61, Air is expelled from the gap. In the component mounting device 11, the rubber pad 51 can also be checked by using this vacuum breaking air or cleaning air.

Furthermore, the component mounting device 11 further includes a contact sensor 63 that detects whether or not the tip portion 53 has contacted the specific region 61. The control unit (for example, the device control unit 93) positions the tip 53 above the contact surface 59 when the contact sensor 63 detects that the tip 53 has contacted the specific area 61. More control.

In this component mounting device 11, the suction nozzle 33 has a contact sensor 63. The contact sensor 63 detects whether the tip 53 of the suction nozzle 33 has contacted the specific area 61 . The suction nozzle 33 is provided with a rubber pad 51 around a nozzle opening 55 that comes into contact with the component 23 . In the rubber pad 51, a pad end surface, which is a contact surface 59, protrudes by a pad protrusion amount G in a direction closer to the component 23 than the end portion 53 where the nozzle opening 55 is provided. That is, when the suction nozzle 33 picks up a component, the pad tip first contacts the component 23, and after the rubber pad 51 is elastically deformed in the compression direction by the amount of pad protrusion G, the tip portion 53 comes into contact with the component 23. The height (gap) of the rubber pad 51 from the tip of the pad that first contacts the component 23 to the nozzle opening 55 is the pad protrusion G.

In the component mounting device 11, when the contact sensor 63 detects that the tip portion 53 has contacted the specific area 61 when determining the rubber pad 51, the control unit positions the tip portion 53 above the contact surface 59. . This upper position is, for example, a distance corresponding to the pad protrusion G. Thereby, the suction nozzle 33 brings the tip end surface of the pad into contact with the specific region 61 while the rubber pad 51 is not deformed. In this state, if vacuum suction is performed from the nozzle opening 55 as described above, the internal pressure of the pad will decrease and the pad tip surface will stick to the specific area 61, and conversely, air for vacuum breaking etc. will be released from the nozzle opening 55. When supplied, the pad tip surface elastically deforms and discharges air from the gap with the specific region 61. In the component mounting device 11, the air flow rate F at this time is measured by the flow rate sensor 69.

Thereby, the component mounting device 11 can determine whether the rubber pad 51 is in a state that is not deformed or the like. As a result, the rubber pad 51 is compressed and deformed so that defects such as cracks, holes, and unevenness are not blocked, and tears, deformation, wear, etc. can be detected with higher accuracy.

Furthermore, in the component mounting apparatus 11 , the projection plane of the rubber pad 51 with respect to the specific area 61 is located inside the specific area 61 .

In this component mounting apparatus 11 , the projected plane of the rubber pad 51 is inside the specific area 61 in a plan view when the rubber pad 51 is projected onto the specific area 61 . This arrangement is controlled by the control section while referring to the position information of the specific area 61 stored in the storage section. This positioning ensures that the bottom surface of the contour of the rubber pad 51 in the projection plane, that is, the pad tip surface that is the contact surface 59 of the tip portion 53 does not protrude from the specific region 61 . As a result, when measuring the flow rate F, the rubber pad 51 maintains a stable contact state with its tip end surface, and can appropriately suck and discharge air.

Further, in the component mounting apparatus 11, the surface of the specific area 61 is flat.

In this component mounting apparatus 11, the surface of the specific area 61 is flat. The tip end surface of the rubber pad 51 surrounding the nozzle opening 55 is in uniform contact with the flat surface of the specific region 61 around the entire circumference. Thereby, the rubber pad 51 can uniformly suck and discharge air around the entire circumference of the pad tip surface.

In addition, when the determination unit 107 determines that the rubber pad 51 is defective, the component mounting device 11 sends a notification that the rubber pad 51 is defective under the control of the control unit (for example, the device control unit 93). It further includes means (for example, a notification section 101).

In this component mounting apparatus 11, when the determining section 107 determines that the rubber pad 51 is defective, the notifying section 101 notifies that it is defective. The notification unit 101 can be, for example, a notification light, a flash lamp, a buzzer, etc., or a notification screen displayed on the display unit 99 of the device, and notifies the operator of an abnormality in the rubber pad 51. Thereby, the component mounting apparatus 11 can easily prevent the occurrence of mounting defects, suction/mounting errors, etc.

Therefore, according to the component mounting apparatus 11 according to the first embodiment, it is possible to suppress the occurrence of suction/mounting errors and improve the mounting quality.

Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that those skilled in the art can come up with various changes, modifications, substitutions, additions, deletions, and equivalents within the scope of the claims, and It is understood that it naturally falls within the technical scope of the present disclosure. Further, each of the constituent elements in the various embodiments described above may be arbitrarily combined without departing from the spirit of the invention.

The present disclosure is useful as a component mounting device that can suppress the occurrence of suction/mounting errors and improve mounting quality.

11 Component mounting device 17 Board 19 Component supply unit 23 Component 25 Mounting head 33 Suction nozzle 51 Rubber pad 53 Tip portion 55 Nozzle opening 59 Contact surface 61 Specific area 63 Contact sensor 67 Air pressure source 69 Flow rate sensor 73 Vacuum pump 93 Device Control section 95 Device storage section 101 Notification section 107 Judgment section

Claims (7)

A component mounting device that mounts components picked up from a component supply section onto a board by vacuum suction of a suction nozzle provided in a mounting head,
a pneumatic pressure generation source connected through a conduit to a nozzle opening provided at the tip of the suction nozzle on the side that suctions the component;
an abutting member provided around the nozzle opening and abutting the component;
a storage unit that stores at least a specific area of the component mounting device;
a control unit that controls the contact member to contact the specific area based on the storage unit;
a flow rate sensor that measures the flow rate of the conduit when the contact member is brought into contact with the specific area;
a determination unit that determines whether the abutting member is defective based on the flow rate;
Parts mounting device. the pneumatic pressure generation source is a vacuum pump;
The component mounting device according to claim 1. The contact member has a contact surface that contacts the specific area,
the contact surface is formed to be located around the nozzle opening;
The component mounting device according to claim 1 or 2. The tip further includes a contact sensor that detects whether or not the tip has contacted the specific area,
The control unit further controls the tip to be located above the contact surface when the contact sensor detects that the tip comes into contact with the specific area.
The component mounting device according to claim 3. A projection plane of the abutting member with respect to the specific area is located inside the specific area,
A component mounting device according to any one of claims 1 to 4. the surface of the specific area is flat;
A component mounting device according to any one of claims 1 to 5. further comprising a notification unit that, when the determination unit determines that the abutment member is defective, notifies under the control unit that the abutment member is defective;
A component mounting device according to any one of claims 1 to 6.

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