JP6988284B2 - Manufacturing method of optical device - Google Patents

Description

The present invention relates to a method for manufacturing an optical device.

Patent Document 1 discloses a method for manufacturing a light emitting substrate. In this method of manufacturing a light emitting substrate, a plurality of long substrates are arranged in the lateral direction, adjacent substrates are connected by first connecting portions at a plurality of locations in the longitudinal direction, and the unit length is viewed from the lateral direction. It includes a step of preparing a substrate group having a first portion having a long first portion and a second portion having a short length of a hit connecting portion. Further, the method for manufacturing a light emitting substrate includes a step of mounting a component on the front surface of the substrate which is a first portion, a step of mounting a light emitting element on the back surface of the substrate, and a step of cutting a plurality of connecting portions.

JP-A-2015-066793

In the present invention, the position reference when mounting the component on the board is common to other boards, and the position accuracy of the component with respect to the housing is higher than that in the case where the board is assembled to the housing based on the outer shape of the board. It is an object of the present invention to provide a method for manufacturing an expensive optical device.

The invention of the first aspect is a preparatory step of preparing a substrate in which a groove defining the outer shape of the unit substrate to be cut out and a reference hole of the unit substrate are formed by the same tool, and an element in the unit substrate with the reference hole as a reference. And the mounting process of mounting the above, and the protrusion provided between the walls of the housing is inserted into the reference hole of the unit board cut out along the groove, and the unit board is assembled to the housing. It is a manufacturing method of an optical device including a process.

The invention of the second aspect is the method for manufacturing an optical device according to the first aspect , wherein the preparation step prepares the substrate in which the groove and the reference hole are formed by a router.

The invention of the third aspect is the method for manufacturing an optical device according to the second aspect , wherein the preparation step prepares the substrate through which the reference hole penetrates.

Invention of the fourth aspect, the preparation step is a method of manufacturing an optical device according to one any of the third aspect the first aspect of preparing the substrate on which the reference hole is formed with a plurality of said unit substrates be.

In the invention of the fifth aspect , in the mounting step, a plurality of the elements are mounted side by side on the unit substrate, and in the preparation step, the substrate having the reference holes formed on both ends in the arrangement direction of the elements is prepared. This is the method for manufacturing an optical device according to the fourth aspect.

The invention according to a sixth aspect is the optical device according to the fifth aspect , wherein in the preparation step, one of the reference holes formed on both ends in the alignment direction prepares the substrate having a long hole formed in the alignment direction. It is a manufacturing method of.

According to the first aspect , the position reference when mounting the component on the board is common to other boards, and the component with respect to the housing is compared with the case where the board is assembled to the housing based on the outer shape of the board. It is possible to provide a method for manufacturing an optical device having high position accuracy.

According to the second aspect , the machining accuracy of the outer shape of the reference hole is improved as compared with the case of press working.

According to the third aspect , the protrusion can be penetrated through the substrate as compared with the case where the reference hole is composed of the recess.

According to the fourth aspect , the rotation of the unit substrate can be suppressed as compared with the case where the reference hole is a single number.

According to the fifth aspect , the elements can be arranged with high accuracy based on the virtual straight line connecting both reference holes as compared with the case where the reference holes are formed regardless of the arrangement direction of the elements.

According to the sixth aspect , it is possible to absorb the molding error of the unit substrate as compared with the case where the reference holes on both ends in the arrangement direction are circular holes.

It is sectional drawing which showed the exposure apparatus manufactured by the manufacturing method of the optical apparatus which concerns on one Embodiment. It is an exploded perspective view which shows the exposure apparatus manufactured by the manufacturing method of the optical apparatus which concerns on the same embodiment. It is a top view which showed the light emitting substrate manufactured in the same embodiment. It is a top view which showed the flat substrate used in the manufacturing method which concerns on the same Embodiment. It is a flat board used in the manufacturing method which concerns on the same embodiment, and is the top view which shows the large board which formed the wiring pattern. FIG. 5 is a plan view showing a flat substrate used in the manufacturing method according to the same embodiment, which is a large-sized substrate in which holes are formed by a drill. It is a flat board used in the manufacturing method of the collective board which concerns on the same embodiment, and is the top view which shows the large board in which the slit and the like by a router are formed. FIG. 3 is a plan view showing a flat substrate used in the manufacturing method according to the same embodiment and in which the outer shape of the collective substrate is formed. It is a perspective view which shows the end mill used for manufacturing the assembly substrate which concerns on this embodiment. It is explanatory drawing which showed the side surface processing by an end mill. It is a top view which shows the assembly board manufactured by the manufacturing method which concerns on this embodiment. It is a top view which shows the assembly board which was manufactured by the manufacturing method which concerns on this embodiment, and which mounted the LED array. It is a top view which shows the light emitting substrate manufactured by the manufacturing method which concerns on this embodiment. It is explanatory drawing which shows the assembly process in the manufacturing method which concerns on the same embodiment. It is an enlarged view which shows the positioning state of one end side of the light emitting substrate which concerns on the same embodiment. It is an enlarged view which shows the positioning state of the other end side of the light emitting substrate which concerns on the same embodiment. It is explanatory drawing which shows the mounting state of the light emitting board which concerns on a comparative example. It is sectional drawing of the main part which shows the mounting state of another embodiment.

Hereinafter, an example of a method for manufacturing an optical device according to an embodiment will be described with reference to the drawings.

First, an exposure apparatus manufactured by the method for manufacturing an optical apparatus according to the present embodiment will be described. Next, a method of manufacturing an optical device will be described.

(Exposure device)
The exposure apparatus 10 which is an example of the optical apparatus will be described with reference to FIGS. 1 to 3. The arrow H shown in the figure indicates the device vertical direction (vertical direction), the arrow W indicates the device width direction (horizontal direction), and the arrow D indicates the device depth direction (horizontal direction).

As shown in FIG. 1, the exposure apparatus 10 is arranged so as to face the photoconductor drum 12 constituting the image forming apparatus (not shown) in the vertical direction of the apparatus. The exposure apparatus 10, as shown in FIGS. 1 and 2, a light emitting board 20, a housing 30 is configured to include a lens array 40 which is an example of an optical component.

[Light emitting board]
The light emitting substrate 20 is arranged so that the plate surface faces the photoconductor drum 12. As shown in FIGS. 2 and 3, the light emitting substrate 20 includes a rectangular unit substrate 22 extending in the depth direction D of the device and a plurality of LED arrays 24 mounted on the surface of the unit substrate 22. ..

A wiring pattern 26 extending in the longitudinal direction NH, which is the device depth direction D, is formed on the unit substrate 22. Further, a first reference hole 28A is formed on one side of the unit substrate 22 in the longitudinal direction NH, and a second reference hole 28B is formed on the other side of the longitudinal direction NH.

Each of the reference holes 28A and 28B is used when a component which is an intermediate concept of an element is mounted on a unit board 22 which is an example of a board. As a subordinate concept of the component, the LED array 24 is mentioned, and the reference holes 28A and 28B are used when the LED array 24 is mounted on the unit board 22. These reference holes 28A and 28B are arranged on both ends of the LED array 24 in the arrangement direction.

Further, the reference holes 28A and 28B are used for positioning when the light emitting board 20 on which the LED array 24 is mounted on the unit board 22 is attached to the housing 30.

The first reference hole 28A is formed of a circular hole, and the second reference hole 28B is formed of an elongated hole long in the arrangement direction of the LED array 24. Further, both the reference holes 28A and 28B are composed of through holes penetrating the unit substrate 22.

The first reference hole 28A and the second reference hole 28B are arranged at the center of the unit board 22 in the lateral direction TH, and as an example, the virtual straight line KC passing through the first reference hole 28A and the second reference hole 28B is , Located at the center of the unit substrate 22 in the lateral direction TH.

Each LED array 24 is formed in a long length extending in the depth direction D of the device. The LED array 24 adjacent to the longitudinal NH of the unit substrate 22 is alternately arranged on one side and the other side of the virtual straight line KC passing through the first reference hole 28A and the second reference hole 28B, and is arranged in the longitudinal direction NH. It is arranged in a staggered pattern along the line. Further, each LED array 24 includes a plurality of LEDs 24A (Light Emitting Diodes) arranged in the longitudinal direction thereof.

[Lens array]
The lens array 40 is an example of an optical component, and as shown in FIGS. 1 and 2, is arranged between the light emitting substrate 20 and the photoconductor drum 12 and has a rectangular parallelepiped shape extending in the depth direction D of the device. ing.

[Case]
The housing 30 is made of synthetic resin and is arranged so as to face the photoconductor drum 12. The housing 30 has a trapezoidal shape when viewed from the device depth direction D, and extends in the device depth direction D.

Further, the housing 30 is formed with a hole 32 that penetrates in the vertical direction of the device and extends in the depth direction D of the device. A part of the lens array 40 is housed in the portion of the hole 32 on the photoconductor drum 12 side. The lens array 40 is supported by the housing 30 in a state of being sandwiched from the device width direction W by the wall 30B of the housing 30 surrounding the hole 32.

In this way, the lens array 40 is positioned on the housing 30 by bringing the wall surface 30A of the wall 30B surrounding the hole 32 into contact with the side surface 40A of the lens array 40 facing the device width direction W.

Further, a concave recess 34 is formed in the portion of the housing 30 opposite to the photoconductor drum 12. On the bottom surface 34A of the recess 34, a first protrusion 34B (see FIGS. 1, 14, and 15) corresponding to the first reference hole 28A of the light emitting substrate 20 and a second protrusion 34C corresponding to the second reference hole 28B are provided. (See FIGS. 14 and 16) are integrally formed with the housing 30.

The protrusions 34B and 34C are formed in a columnar shape, and the corners of the end faces are chamfered. The external dimensions of the first protrusion 34B are substantially the same as the inner diameters of the first reference hole 28A, and the light emitting substrate with respect to the housing 30 with the first reference hole 28A inserted in the first protrusion 34B. A positioning pin for positioning 20 is configured.

The outer diameter of the second protrusion 34C is substantially the same as the width of the second reference hole 28B, and the light emitting substrate 20 is in the lateral direction with the second protrusion 34C inserted into the second reference hole 28B. It constitutes a regulation pin that regulates the movement of TH. The length dimension of the second reference hole 28B is set longer than the external dimension of the second protrusion 34C, and absorbs the molding error of the longitudinal direction NH in the housing 30 or the light emitting substrate 20 to absorb the molding error of the longitudinal direction NH and the housing of the light emitting substrate 20. Easy to attach to 30.

Then, with the reference holes 28A and 28B of the light emitting substrate 20 inserted into the protrusions 34B and 34C of the housing 30, the light emitting substrate 20 is positioned with respect to the housing 30, and the light emitting substrate 20 is an adhesive or the like. Is fixed to the bottom surface 34A of the recess 34.

In this fixed state, the lens array 40 is arranged between the LED array 24 of the light emitting substrate 20 and the photoconductor drum 12, and each LED 24A of the LED array 24 and each lens formed in the lens array 40 are arranged. The positional relationship is defined.

(Action of exposure equipment)
Next, the operation of the exposure apparatus 10 will be described.

The LED array 24 of the exposure apparatus 10 emits the laser beam L toward the lens array 40 as shown in FIG. 1 based on the image data input from the outside. Then, the lens array 40 transmits the laser beam L emitted from the LED array 24 and forms an image on the charged photoconductor drum 12. As a result, an electrostatic latent image based on the image data is formed on the photoconductor drum 12.

(Main part composition)
Next, a method of manufacturing an optical device will be described with reference to FIGS. 4 to 16. In addition, the arrow X shown in FIGS. 4 to 8 and 11 to 13 is the substrate height direction of each substrate (flat substrate 70, large substrate 80, collective substrate 90, and unit substrate 22 described later), and the arrow Y is , The board width direction of each board is shown.

First, the collective substrate 90 will be described. Next, a method for manufacturing an assembly substrate, a method for manufacturing a light emitting substrate, and a method for manufacturing an optical device will be described in order.

[Assembly board]
As shown in FIG. 11, the collective substrate 90 is a substrate on which a plurality of unit substrates 22 (see FIG. 3) are formed, and has a rectangular shape when viewed from the plate thickness direction.

The collective substrate 90 is formed with a slit 92 as an example of a plurality of grooves defining the outer shape of each unit substrate 22, and a wiring pattern 26 formed on each unit substrate 22. Further, the first reference hole 28A and the second reference hole 28B are formed in the assembly substrate 90. These reference holes 28A and 28B are arranged on both ends of the length direction NH, which is the arrangement direction of the LED array 24.

The outer peripheral portion of the collective substrate 90 surrounding the plurality of unit substrates 22 is a discarded substrate 96. In this discarded substrate 96, circular holes 98 are formed at both ends in the substrate width direction Y at the lower portion (lower part in the figure) of the substrate height direction X.

The slit 92 is divided into a slit 92A extending in the height direction X of the unit substrate 22 in the lateral direction TH of the unit substrate 22 and a slit 92B extending in the width direction Y of the substrate 22 defining the longitudinal direction NH of the unit substrate 22. Divided.

A plurality of slits 92A are formed at intervals in the substrate height direction X. Further, a plurality of slits 92A spaced apart from each other in the height direction X of the substrate are formed at intervals in the lateral direction TH. The slit 92B is continuously formed in the slit 92A that defines one side of the unit substrate 22 in the longitudinal direction NH. The slits 92 are connected to each other as a connecting piece 94 for connecting the adjacent unit substrates 22 or connecting the unit substrate 22 and the discarded substrate 96.

These slits 92 are composed of elongated holes penetrating the collective substrate 90.

Here, in the present embodiment, the case where the groove for defining the outer shape of the unit substrate 22 is formed by the elongated hole penetrating the collective substrate 90 will be described as an example, but the present invention is not limited thereto. For example, if it can be separated by bending or the like, the groove defining the outer shape of the unit substrate 22 may be formed by a recessed groove. At this time, if it can be formed by the processing method described later, it is desirable to form a V-groove having a V-shaped cross section.

The wiring pattern 26 is formed on each of the unit substrates 22, and extends in the substrate height direction X.

[Manufacturing method of assembly board]
Next, a method for manufacturing the collective substrate will be described. The assembly board 90 is manufactured through a pattern forming step, a drilling step, and a router step.

[Pattern formation process]
In the pattern forming step, as shown in FIG. 4, a rectangular flat substrate 70 is prepared. The entire surface of the flat substrate 70 is covered with copper foil. The flat substrate 70 is formed in a size capable of cutting out three collective substrates 90 (see FIG. 8), and circular holes 72 used for positioning are formed at the four corners of the flat substrate 70.

The flat substrate 70 is positioned on the stage (not shown) using the holes 72 at the four corners. Then, the flat substrate 70 on which the dry film (not shown) is laminated is subjected to photosensitive, resist removal, etching and the like. As a result, as shown in FIG. 5, a wiring pattern 26 extending in the height direction X of the substrate is formed on the flat substrate 70.

Since three collective boards 90 are cut out from the flat substrate 70, a wiring pattern 26 is formed at a location corresponding to each collective board 90. By forming the wiring pattern 26 on the flat substrate 70 in this way, the flat substrate 70 becomes a large substrate 80. That is, the large substrate 80 is a substrate in which the wiring pattern 26 is formed on the flat substrate 70.

[Drill process]
In the drilling process, as shown in FIG. 6, a hole 98 is formed in the large substrate 80 by using a drill (not shown).

The large substrate 80 is positioned on the stage (not shown) using the holes 72 at the four corners, and the portion of the assembled substrate 90 cut out from the large substrate 80 to be the discarded substrate 96 (see FIG. 11) is located in the substrate height direction X. At the lower portion, circular holes 98 are formed at both ends in the substrate width direction Y.

[Router process]
In the router process, as shown in FIGS. 7 and 8, a router processing device is used to perform router processing on the large substrate 80 on which the holes 98 are formed. The router processing device performs router processing using a rotary cutting tool as an intermediate concept. As a subordinate concept of the rotary cutting tool, as shown in FIG. 9, an end mill 60 can be mentioned.

In this router process, as shown in FIG. 7, slits 92A and 92B, a first reference hole 28A, and a second reference hole 28B are formed in the large substrate 80. Further, in the router process, as shown in FIG. 8, a slit 82 is formed in the large substrate 80 along the outer shape of the collective substrate 90. In this router process, the same tool, the end mill 60, is used to form slits 92A and 92B, a first reference hole 28A, and a second reference hole 28B penetrating the large substrate 80.

To give a specific example, a drill that is an example of a cutting tool in a penetrating direction is used to drill a prepared hole through which a slit 92A, 92B, a first reference hole 28A, and a second reference hole 28B are formed in a large substrate 80. Pre-form.

Then, as shown in FIG. 10, the end mill 60 is inserted into the prepared hole 61, the blade 60A constituting the peripheral surface of the end mill 60 is applied to the opening edge portion 61A of the prepared hole 61, and the opening edge portion 61A of the prepared hole 61 is formed. Spread it out and finish it in the target shape. As a result, as shown in FIG. 8, the slits 92A and 92B, the first reference hole 28A, and the second reference hole 28B are formed.

Here, the slits 92A, 92B, and the second reference hole 28B are not circular but have a slit shape or an elongated hole shape. Therefore, by moving the end mill 60 along the plate surface of the large substrate 80, the slits 92A and 92B and the second reference hole 28B are formed.

As described above, since the slits 92A and 92B, the first reference hole 28A, and the second reference hole 28B are finished in the target shape by the end mill 60, the formed shape and the position accuracy are high. Further, the slits 92A and 92B that define the outer shape of the unit substrate 22, and the first reference hole 28A and the second reference hole 28B are formed by the same end mill 60 in the same router process.

Therefore, as compared with the case where the slits 92A and 92B and the reference holes 28A and 28B are formed by different tools, the position accuracy of the edge of the unit substrate 22 with respect to the reference holes 28A and 28B can be improved. ..

Here, in the present embodiment, after forming a pilot hole 61 in the large substrate 80 with a drill, the pilot hole 61 is expanded by an end mill 60 to form slits 92A, 92B, 82, a first reference hole 28A, and a second reference hole. A reference hole 28B is formed, but is not limited to this. For example, the slits 92A, 92B, 82, the first reference hole 28A, and the second reference hole 28B may be formed directly on the large substrate 80 by the end mill 60.

In this way, as shown in FIG. 11, the collective substrate 90 is cut out from the large substrate 80, and the collective substrate 90 having the unit substrate 22 provided with the reference hole 28 is prepared (preparation step).

[Manufacturing method of light emitting board]
Next, a method of manufacturing the light emitting substrate 20 shown in FIG. 3 will be described using the collective substrate 90 manufactured by the method of manufacturing the collective substrate. The light emitting substrate 20 is manufactured through a mounting step and a dividing step.

[Mounting process]
In the mounting step, as shown in FIG. 12, elements are mounted on each unit board 22 with reference to the first reference hole 28A and the second reference hole 28B formed in each unit board 22 in the assembly board 90.

(Implementation definition)
Here, mounting refers to a state in which an element is bonded to a unit substrate 22 which is a substrate and terminals of the element are electrically connected to, for example, a wiring pattern 26 of the unit substrate 22.

An LED array 24 is mentioned as a subordinate concept of the element to be mounted, and in the present embodiment, a case where the LED array 24 is mounted will be described.

Specifically, the image pickup device used for mounting the LED array 24 is used to detect the position of the first reference hole 28A of the assembly board 90 set in the mounting device. Then, the whole image or a part of the detected image of the first reference hole 28A is imaged, and the center position coordinates of the first reference hole 28A are obtained from the captured image.

Similarly, the image pickup apparatus detects the position of the second reference hole 28B. Then, the whole image or a part of the detected image of the second reference hole 28B is imaged, and the center position coordinates of the second reference hole 28B are obtained from the captured image.

Then, as shown in FIG. 3, assuming a virtual straight line KC passing through the center position coordinates of the first reference hole 28A and the second reference hole 28B, for example, using the center position coordinates of the first reference hole 28A as a reference, the second The LED arrays 24 are alternately mounted on the reference hole 28B at regular intervals on one side and the other side of the virtual straight line KC (mounting step).

[Division process]
In the dividing step, each connecting piece 94 is punched out by a so-called punching method, and the light emitting substrate 20 is cut out from the collective substrate 90 as shown in FIG. As a result, a plurality of light emitting substrates 20 are manufactured from the single assembly substrate 90.

[Manufacturing method of optical device]
Next, a method of manufacturing the exposure apparatus 10 will be described as shown in FIG. 1 by using the light emitting substrate 20 manufactured by the method of manufacturing the light emitting substrate. The exposure apparatus 10 is manufactured by assembling the light emitting substrate 20 and the lens array 40 to the housing 30.

[Assembly process]
First, the light emitting board 20 is assembled to the housing 30 with the reference holes 28A and 28B of the light emitting board 20 as position reference (assembly step).

Specifically, as shown in FIG. 14, the central portions of the walls 30B and 30B of the housing 30 in the longitudinal direction are widened to both sides to expand the width of the recess 34 of the housing 30. This amount of expansion is constant. Then, the light emitting substrate 20 is attached to the recess 34 in this expanded state.

At this time, as shown in FIGS. 1, 14, and 15, the first reference hole 28A of the light emitting substrate 20 is aligned with the first protrusion 34B provided on the bottom surface 34A of the recess 34 of the housing 30. .. In this state, as shown in FIG. 15, the first protrusion 34B of the housing 30 is inserted into the first reference hole 28A of the light emitting board 20 and fitted, and one end side of the light emitting board 20 is positioned on the housing 30.

Further, as shown in FIGS. 14 and 16, the second reference hole 28B of the light emitting substrate 20 is aligned with the second protrusion 34C provided on the bottom surface 34A of the recess 34 of the housing 30. In this state, the second reference hole 28B of the light emitting board 20 is inserted into the second protrusion 34C of the housing 30 to restrict the movement of TH in the lateral direction on the other end side of the light emitting board 20.

Then, an adhesive is applied to the peripheral edge of the light emitting substrate 20 and the concave portion 34 of the housing 30, and the light emitting substrate 20 is fixed to the housing 30.

Next, as shown in FIG. 1, in the hole 32 formed in the housing 30, the lens array 40 is sandwiched from the device width direction W at the upper portion in the vertical direction of the device. The hole 32 is formed, and the wall surface 30A facing the device width direction W and the side surface 40A facing the device width direction W in the lens array 40 are brought into contact with each other, and the LED array 24 of the light emitting substrate 20 and the lens array 40 are opposed to each other. As a result, the lens array 40 is positioned on the housing 30.

Further, an adhesive is applied to the upper peripheral edge of the opening of the hole 32 and the lens array 40, and the lens array 40 is fixed to the housing 30.

(Action / effect)
Next, the operation of this embodiment will be described.

In the present embodiment, the LED array 24, which is an example of an element, is mounted on the unit board 22 with reference to the positions of the reference holes 28A and 28B provided in the unit board 22 which is an example of the substrate. Further, the unit boards 22 are assembled to the housing 30 by inserting and positioning the reference holes 28A and 28B into the protrusions 34B and 34C of the housing 30 with the position reference.

As described above, in the present embodiment, the reference holes 28A and 28B for positioning on the housing 30 and the reference holes 28A and 28B for positioning the LED array 24, which is an example of the element, are shared. Therefore, as compared with the case where the reference for positioning on the housing 30 and the reference for mounting the LED array 24 are different, it is possible to suppress the misalignment due to the error that may occur between the two references, and the housing can be suppressed. The position accuracy of the LED array 24 with respect to the body 30 can be improved.

Further, the outer shape of the unit substrate 22 assembled to the housing 30 is composed of slits 92A and 92B formed by the same tool as the tool forming the reference holes 28A and 28B. Therefore, as compared with the case where the outer shape of the unit board 22 and the reference holes 28A and 28B are formed by different tools, the unit board 22 with respect to the reference holes 28A and 28B which are the reference of the fixed position to the housing 30. The position accuracy of the outer shape is high.

Here, a comparative example in which the outer shape of the unit substrate 22 and the reference holes 28A and 28B are formed by different tools will be described with reference to FIG. FIG. 17 shows the assembled state of the unit substrate 22 corresponding to FIG.

In this comparative example, the position accuracy of the outer shape of the unit substrate 22 with respect to the reference holes 28A and 28B, which are the reference of the fixed position to the housing 30, is low. Therefore, the unit board 22 is slanted when the reference holes 28A and 28B of the unit board 22 are inserted into the protrusions 34B and 34C of the housing 30. As a result, the edge 22A of the unit substrate 22 and the rising portion 30B1 of the wall 30B on the peripheral edge of the recess 34 of the housing 30 may interfere with each other, and the unit substrate 22 may not be inserted into the recess 34.

On the other hand, in the present embodiment, since the position accuracy of the outer shape of the unit board 22 is high with respect to the reference holes 28A and 28B which are the reference of the fixed position to the housing 30, the edge 22A of the unit board 22 and the housing 30 The unit board 22 can be assembled to the housing 30 while suppressing interference with the housing 30.

Therefore, the position reference when mounting the LED array 24, which is a component, on the unit board 22 is common to other boards, and compared with the case where the unit board 22 is assembled to the housing 30 based on the outer shape of the unit board 22. Therefore, the position accuracy of the LED array 24 with respect to the housing 30 is high.
In FIG. 17, all the LED arrays 24 are alternately mounted on the wiring pattern 26 formed on the unit substrate 22. However, it goes without saying that if the positional accuracy of the outer shape of the unit board 22 with respect to the reference holes 28A and 28B is low, one of the LED arrays 24 may not be mounted on the wiring pattern 26 formed on the unit board 22. There is no.

Further, in the preparatory step, the slits 92A and 92B and the reference holes 28A and 28B, which are grooves, are formed by a router.

Therefore, the processing accuracy of these outer shapes is improved as compared with the case where the slits 92A and 92B and the reference holes 28A and 28B are press-processed.

Further, in the preparation step, the reference holes 28A and 28B penetrate through the reference holes 28A and 28B.

Therefore, the protrusions 34B and 34C can be penetrated through the unit substrate 22 as compared with the case where the reference holes 28A and 28B are formed of recesses. Further, as compared with the case where the reference holes 28A and 28B do not penetrate the unit substrate 22, the protrusions 34B and 34C can be easily inserted into the reference holes 28A and 28B.

Then, in the preparation step, the first reference hole 28A and the second reference hole 28B, which are a plurality of reference holes, are formed on the unit substrate 22.

As a result, the rotation of the unit substrate 22 can be suppressed as compared with the case where the reference hole is a single number.

In the mounting step, the LED arrays 24, which are a plurality of elements, are mounted side by side on the unit substrate 22, and in the preparatory step, the reference holes 28A and 28B are formed on both ends of the LED array 24 in the arranging direction.

As a result, the LED arrays 24 are arranged more accurately with reference to the virtual straight line KC connecting both the reference holes 28A and 28B, as compared with the case where the reference holes 28A and 28B are formed regardless of the arrangement direction of the LED arrays 24. can.

Then, one of the reference holes 28A and 28B formed on both ends in the alignment direction was made into an elongated hole long in the alignment direction.

As a result, it is possible to mount the unit substrate 22 in consideration of the molding error, as compared with the case where the reference holes 28A and 28B on both ends in the alignment direction are circular holes. Thereby, the molding error of the unit substrate 22 can be absorbed.

In this embodiment, the case where each of the reference holes 28A and 28B is composed of through holes penetrating the unit substrate 22 will be described as an example, but the present invention is not limited to this, and the "reference hole" is not limited to this. Is a concept including a hole penetrating the substrate and a recess not penetrating the substrate. For example, it may be composed of both reference holes 28A and 28B or holes that do not penetrate either of the reference holes 28A and 28B, in other words, recessed recesses.

(Other embodiments)
FIG. 18 is a diagram showing other embodiments, and the same or equivalent portions as those in the above-described embodiment are designated by the same reference numerals, the description thereof will be omitted, and only the different portions will be described.

That is, in the router step in the preparation step described above, the first reference hole 28A and the second reference hole 28B are formed in the large substrate 80 by the recessed recesses that do not penetrate the large substrate 80.

As a result, the unit substrate 22 is formed with a first reference hole 28A and a second reference hole 28B formed of recesses.

Further, the heights of the first protrusion 34B and the second protrusion 34C formed on the housing 30 (only the first protrusion 34B side is shown) are lower than the depths of the first reference hole 28A and the second reference hole 28B.

Also in this embodiment, the same effect as that of the above-described embodiment can be obtained.

Further, in the present embodiment, in the state where the unit board 22 is assembled to the housing 30, the unit board 22 is the housing with the protrusions 34B and 34C corresponding to the reference holes 28A and 28B of the unit board 22 inserted. Positioned at 30.

In each embodiment, the optical device is described as the exposure device 10, but the optical device may be a reading unit (for example, a Contact Image Sensor).

Further, in the preparatory step, the slits 92A and 92B, the first reference hole 28A, and the second reference hole 28B are formed by using the same end mill 60 in the router processing device, but the present invention is not limited thereto. For example, the slits 92A and 92B, the first reference hole 28A, and the second reference hole 28B may be formed by another machine tool.

10 Exposure device 20 Light emitting board 22 Unit board 24 LED array 28A First reference hole 28B Second reference hole 30 Housing 30A Wall surface 30B Wall 32 Hole 34 Recess 34 B First protrusion 34C Second protrusion 60 End mill 80 Large board 82 Slit 92 Slit 92A Slit 92B Slit 98 Hole KC Virtual straight line NH Longitudinal direction TH Short direction

Claims (2)

Extending in one direction, preparation step of a wiring pattern extending in said one direction of the groove and the unit substrate defining the outer shape of the unit substrate has two reference holes sandwiching in the one direction to prepare a substrate formed of the same tool to be cut When,
In the board, a mounting process of arranging and mounting a plurality of elements in the wiring pattern of the unit board with reference to a virtual straight line connecting the center position coordinates of the two reference holes.
The assembly step of inserting the protrusions provided between the walls of the housing into the two reference holes of the unit board cut out from the board along the groove and assembling the unit board to the housing. ,
A method of manufacturing an optical device equipped with. The mounting process, a manufacturing method of a plurality of said elements, said alternately virtual straight line and the one side and the other side boundary, the optical device according to claim 1 that implements arranged on the wiring pattern of the unit substrate ..

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