JP7557985B2 - Pick-up method and pickup device - Google Patents

Description

The present invention relates to a pickup method and a pickup device.

A pickup device is used to peel off the chips from a wafer that has been divided into multiple chips and attached to a tape with the outer periphery of the tape attached to a ring frame (see, for example, Patent Document 1).

When picking up a chip, the pickup device shown in the aforementioned Patent Document 1 first holds the top side of the chip by suction with a chip holder, and then pushes up the chip through the tape with a push-up member to peel the chip off the tape. The pickup device shown in the aforementioned Patent Document 1 pushes up the tape a predetermined amount with the push-up member, and then carries the chip out with the holder.

JP 2013-033850 A

However, when the pickup device shown in the aforementioned Patent Document 1 pushes up the chip, the chip is pulled by the tape and bends, and a force is applied to the outer periphery of the chip in a direction away from the holder.

For this reason, when the pickup device shown in the aforementioned Patent Document 1 pushes up the chip, a force is applied to the outer periphery of the chip in a direction away from the chip holder while the chip is being suction-held by the holding surface of the chip holder, which may damage the chip. In particular, the risk of damage is very high for thin chips with a thickness of 100 μm or less.

The present invention was made in consideration of these problems, and its purpose is to provide a pickup method and pickup device that can prevent damage to chips that peel off from the tape.

In order to solve the above-mentioned problems and achieve the object, the pick-up method of the present invention is a pick-up method for picking up a chip attached to a tape, in which the tape is suction-held by a tape holding part having a tape holding surface that suction-holds the tape around the chip to be picked up, the chip is supported via the tape by a push-up unit having an outer periphery push-up part that pushes up the outer periphery region of the chip to be picked up via the tape and a central push-up part that pushes up the center of the chip via the tape inside the outer periphery push-up part, and the chip is supported via the tape by a push-up unit having a chip holder that faces the push-up unit across the chip and has a holding surface that suction-holds the chip, and the holding surface is brought into contact with the chip without suction-holding the chip, thereby separating the chip holder and the push-up unit. a chip clamping step of clamping the chip between a central push-up unit and a chip holder; a tape peeling step of, after performing the chip clamping step, pushing up the clamped chip by the peripheral push-up unit and the central push-up unit to separate the tape holding unit and the peripheral push-up unit from the chip and hold the chip between the central push-up unit and the chip holder, thereby peeling the tape from the peripheral edge of the chip; a chip holding step of, after performing the tape peeling step, applying negative pressure to the holding surface of the chip holder to suction and hold the chip with the chip holder; and a pick-up step of, after performing the chip holding step, removing the chip held by the chip holder from above the tape.

The pickup device of the present invention is a pickup device which picks up a chip attached to a tape, and comprises a tape holding unit which holds the periphery of the chip to be picked up on the tape, a tape holding section having a tape holding surface which suction-holds the tape around the chip to be picked up, a push-up unit having an outer periphery push-up section which pushes up the outer periphery region of the chip to be picked up via the tape, and a central push-up section which pushes up the center of the chip via the tape inside the outer periphery push-up section, a chip holder which faces the push-up unit across the chip and has a holding surface which suction-holds the chip, a holder moving unit which moves the chip holder, and a control unit which controls the tape holding unit, the push-up unit, the chip holder, and the holder moving unit, and the control unit controls the push-up unit to hold the chip to be picked up. a chip clamping section which clamps the chip to be picked up between the knit and the chip holder without suction holding the chip on the holding surface of the chip holder ; a tape peeling section which, with the chip to be picked up being clamped between the push-up unit and the chip holder by the chip clamping section, causes the outer circumferential push-up section and the central push-up section to push up the chip, thereby moving the tape holding section and the outer circumferential push-up section away from the chip and holding the chip between the central push-up section and the chip holder, thereby peeling the tape from the outer circumferential edge of the chip; a chip holding section which, with the tape peeling section holding the chip between the central push-up section and the chip holder, suction holds the chip on the holding surface of the chip holder; and a pick-up section which, with the chip holding section suctioning and holding the chip on the holding surface by the chip holder, causes the holder moving unit to carry out the chip held by the chip holder from above the tape,
The present invention is characterized by comprising:

The present invention has the effect of suppressing damage to chips that peel off from the tape.

FIG. 1 is a perspective view showing a part of a configuration example of a test apparatus including a pickup device according to a first embodiment. FIG. 2 is a perspective view of a main part of the testing apparatus shown in FIG. FIG. 3 is a perspective view of a wafer unit including a wafer to be measured by the test apparatus shown in FIG. FIG. 4 is a cross-sectional view showing a schematic view of a push-up unit and the like of the testing device shown in FIG. FIG. 5 is a perspective view showing a push-up unit of the testing apparatus shown in FIG. FIG. 6 is a cross-sectional view showing a schematic view of the push-up unit shown in FIG. FIG. 7 is a perspective view of the pick-up mechanism of the test apparatus shown in FIG. 8 is a perspective view showing the underside of the chip holder of the pick-up mechanism shown in FIG. FIG. 9 is a flowchart showing the flow of the pickup method according to the first embodiment. FIG. 10 is a cross-sectional view that illustrates a typical holding step of the pick-up method illustrated in FIG. FIG. 11 is a cross-sectional view that typically shows a state in which the tape is suction-held by the tape holding portion of the push-up unit in the chip clamping step of the pick-up method shown in FIG. FIG. 12 is a cross-sectional view showing a schematic state in which the chip to be picked up is clamped between the chip holder and the push-up unit in the chip clamping step of the pick-up method shown in FIG. FIG. 13 is a cross-sectional view showing a schematic diagram of the chip to be picked up, the chip holder, the push-up unit, etc. shown in FIG. FIG. 14 is a cross-sectional view that typically shows a state in which all of the push-up members have been raised in the tape peeling step of the pick-up method shown in FIG. 15 is a cross-sectional view that typically shows a state in which the second push-up member and the third push-up member shown in FIG. 14 are further raised in the tape peeling step of the pick-up method shown in FIG. 16 is a cross-sectional view that typically shows a state in which the third push-up member shown in FIG. 15 is further raised in the tape peeling step of the pick-up method shown in FIG. FIG. 17 is a cross-sectional view that typically shows the chip holding step of the pick-up method shown in FIG. FIG. 18 is a cross-sectional view that illustrates a pick-up step of the pick-up method illustrated in FIG.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A pickup device according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a part of a configuration example of a test device including the pickup device according to the first embodiment. Fig. 2 is a perspective view of a main part of the test device shown in Fig. 1. Fig. 3 is a perspective view of a wafer unit including a wafer to be measured by the test device shown in Fig. 1.

The pickup device 20 according to the first embodiment constitutes a test device 1, as shown in Figs. 1 and 2. The test device 1 is a device that picks up a chip 14, which is a test piece, from the tape 15 of the wafer unit 17 shown in Fig. 3, destroys the chip 14, and measures the flexural strength of the chip 14.

(Wafer unit)
3, the wafer unit 17 is configured by attaching the wafer 10 divided into a plurality of chips 14 to a tape 15, and attaching the outer periphery of the tape 15 to an annular ring frame 16. The wafer 10 is a disk-shaped semiconductor wafer, an optical device wafer, or the like, with a substrate 11 made of silicon, sapphire, gallium, or the like.

The wafer 10 has devices 13 formed in areas partitioned by a plurality of planned division lines 12 formed in a grid pattern on the surface 11-1 of the substrate 11. In the first embodiment, the wafer 10 has a tape 15 attached to the bottom surface 11-2 with a ring frame 16 attached to its outer periphery, and is supported by the ring frame 16 to form a wafer unit 17. The wafer 10 is also cut along the planned division lines 12 to be divided into individual chips 14. That is, the wafer 10 has cutting grooves 18 formed between the chips 14, which penetrate the wafer 10 itself. The chips 14 include a part of the substrate 11 and the devices 13.

In the first embodiment, the wafer 10 has the devices 13 formed on the surface 11-1 of the substrate 11. However, in the present invention, when the test device 1 is used to evaluate the validity of the processing conditions of the so-called post-process in which the wafer 10 is divided into individual chips 14, the devices 13 do not have to be formed on the surface 11-1.

(Test Equipment)
As shown in FIG. 1, the testing apparatus 1 comprises a cassette mounting table 3 provided on an apparatus main body 2 on which a cassette 4 containing a plurality of wafer units 17 is placed, an input/output unit 5 for loading/unloading the wafer units 17 into/from the cassette 4, a pair of temporary placement rails 6 on which the wafer units 17 removed from the cassette 4 or the wafer units 17 before being loaded into the cassette 4 are temporarily placed, a pickup apparatus 20 relating to embodiment 1, a chip observation mechanism 100, and a strength measurement mechanism 200.

The cassette 4 is a storage container that stores multiple wafer units 17 spaced apart in the Z-axis direction, which is parallel to the vertical direction, and is provided with an opening 8 for inserting and removing the wafers 10. The cassette mounting table 3 has the cassette 4 placed on its upper surface and raises and lowers the cassette 4 in the Z-axis direction.

The pair of temporary placement rails 6 are provided on both ends of the width of the opening 8 of the cassette 4 placed on the cassette placement table 3 on the device main body 2, and extend linearly in the Y-axis direction parallel to the horizontal direction. The pair of temporary placement rails 6 are arranged parallel to each other and spaced apart from each other along the X-axis direction which is perpendicular to the Y-axis direction and parallel to the horizontal direction. The ring frame 16 of the wafer unit 17 is temporarily placed on the pair of temporary placement rails 6.

The loading/unloading unit 5 is provided so as to be movable in the Y-axis direction by a moving mechanism (not shown). The loading/unloading unit 5 unloads the wafer unit 17 from the cassette 4 and temporarily places it on the temporary placement rail 6, and then unloads the wafer unit 17 to the upper surface of the frame support member 22 to which the tape holding unit 7 of the pickup device 20 has been lowered, and places it on the upper surface of the frame support member 22. The loading/unloading unit 5 also unloads the wafer unit 17 from the upper surface of the frame support member 22 to which the tape holding unit 7 has been lowered, into the cassette 4 via the temporary placement rail 6.

(Pickup device)
The pickup device 20 is a device that picks up the chips 14 attached to the tape 15 of the above-mentioned wafer unit 17 from the tape 15. As shown in Fig. 2, the pickup device 20 includes a tape holding unit 7, a moving mechanism 30 that moves the tape holding unit 7 in the Y-axis direction and the X-axis direction, a push-up unit 40, a light source unit 50, an imaging camera 60, a pickup mechanism 70, a holder moving unit 80, and a control unit 400.

(Tape holding unit)
The tape holding unit 7 holds the periphery of the wafer 10 on the tape 15 of the wafer unit 17, i.e., the periphery of the chip 14 to be picked up. The tape holding unit 7 is installed on a moving table 21. The tape holding unit 7 includes an annular frame support member 22, an annular frame pressing member 23 disposed above and fixed to the frame support member 22, and an elevating mechanism (not shown) that elevates the frame support member 22.

Before being raised, the upper surface of the frame support member 22 is positioned on the same plane as the upper surface of the temporary placement rail 6, and the ring frame 16 of the wafer unit 17 is placed on it. When the ring frame 16 of the wafer unit 17 is placed on the upper surface of the frame support member 22, the lifting mechanism of the tape holding unit 7 raises the frame support member 22 and sandwiches the ring frame 16 between the frame holding member 23 and the frame support member 22. The tape holding unit 7 sandwiches the ring frame 16 between the frame holding member 23 and the frame support member 22, holds and fixes the periphery of the wafer 10 on the tape 15, and fixes the wafer unit 17.

(Moving mechanism)
The moving mechanism 30 includes an X-axis moving mechanism 31 that is provided on the device main body 2 and moves the moving table 21 in the X-axis direction, and a Y-axis moving mechanism 32 that is provided on the moving table 21 that is moved in the X-axis direction by the X-axis moving mechanism 31 and moves the tape holding unit 7 in the Y-axis direction. The X-axis moving mechanism 31 moves the moving table 21, i.e., the tape holding unit 7, in the X-axis direction between a position aligned with the pair of temporary placement rails 6 in the Y-axis direction and a position separated from the pair of temporary placement rails 6. Each of the moving mechanisms 31, 32 includes well-known ball screws 33, 34 that are provided rotatably about their axes, well-known motors 35, 36 that rotate the ball screws 33, 34 about their axes, and well-known guide rails 37, 38 that support the moving table 21 or the tape holding unit 7 movably in the X-axis or Y-axis directions.

(Thrust-up unit)
FIG. 4 is a cross-sectional view showing a push-up unit of the test apparatus shown in FIG. 1. FIG. 5 is a perspective view showing the push-up unit of the test apparatus shown in FIG. 1. FIG. 6 is a cross-sectional view showing a push-up unit shown in FIG. 5. The push-up unit 40 is disposed below the tape holding unit 7 positioned at a position away from the pair of temporary placement rails 6 by the X-axis moving mechanism 31. The push-up unit 40 is provided in the recess 9 of the device body 2, and pushes up any one of the chips 14 through the tape 15 of the wafer unit 17 including the ring frame 16 held by the tape holding unit 7 positioned at a position away from the pair of temporary placement rails 6 by the X-axis moving mechanism 31.

The push-up unit 40 is connected as a whole to a lifting mechanism (not shown) composed of a motor or the like, and moves up and down along the Z-axis direction. As shown in Figures 4, 5, and 6, the push-up unit 40 has a tape holding part 41 formed in a hollow cylindrical shape and a quadrangular prism-shaped push-up part 42 arranged inside the tape holding part 41. The upper surface 48 of the tape holding part 41 is formed flat parallel to the horizontal direction, and is a tape holding surface that suction-holds the tape 15 around the chip 14 to be picked up. The upper surface 48 of the tape holding part 41 has a plurality of suction grooves 44 formed concentrically along the circumferential direction of the tape holding part 41. Each of the suction grooves 44 is connected to a suction source 47 composed of an ejector or the like via a suction path 45 and an opening/closing valve 46 formed inside the push-up unit 40.

The push-up section 42 has a rectangular top planar shape that is the same size as the chip 14. The push-up section 42 includes a first push-up member 42-1 formed in a rectangular tube shape, a second push-up member 42-2 formed in a rectangular tube shape and housed in the first push-up member 42-1, and a third push-up member 42-3 formed in a rectangular column shape and housed in the second push-up member 42-2. The first push-up member 42-1, the second push-up member 42-2, and the third push-up member 42-3 are each connected to a lifting unit 49 (shown in FIG. 5) comprised of a motor or the like, and move up and down along the Z-axis direction.

The first push-up member 42-1 and the second push-up member 42-2 are raised by the lifting unit 49, and push up the outer peripheral region of the chip 14 to be picked up via the tape 15. The first push-up member 42-1 and the second push-up member 42-2 are outer peripheral push-up sections. The third push-up member 42-3 is raised by the lifting unit 49, and pushes up the center of the chip 14 via the tape 15 inside the first push-up member 42-1 and the second push-up member 42-2. The third push-up member 42-3 is a central push-up section.

In the push-up unit 40, with the wafer unit 17 including the ring frame 16 held by the tape holding unit 7 positioned above, the suction grooves 44 on the upper surface 48 of the tape holding part 41 are sucked by the suction source 47, and the tape 15 around the chip 14 to be picked up is held by suction on the upper surface 48 of the tape holding part 41. The push-up unit 40 sucks and holds the tape 15 around the chip 14 to be picked up on the upper surface 48 of the tape holding part 41, and the push-up members 42-1, 42-2, and 42-3 of the push-up part 42 are raised, pushing the chip 14 above the tape 15 and peeling off the outer edge of the chip 14 from the tape 15. The dimensions of the push-up unit 40 are adjusted appropriately according to the size of the chip 14.

In the first embodiment, when the push-up unit 40 pushes up the chip 14, the lifting mechanism starts to raise the first push-up member 42-1, the second push-up member 42-2, and the third push-up member 42-3 simultaneously at the same speed, the second push-up member 42-2 is raised to a position higher than the first push-up member 42-1, and the third push-up member 42-3 is raised to a position higher than the second push-up member 42-2, and then the respective rises stop. In other words, when the push-up unit 40 pushes up the chip 14, the first push-up member 42-1, the second push-up member 42-2, and the third push-up member 42-3 start to rise simultaneously at the same speed, and the first push-up member 42-1, the second push-up member 42-2, and the third push-up member 42-3 stop rising in order.

(Light source unit)
The light source unit 50 is provided in the recess 9 of the device body 2, and irradiates illumination light onto the chip 14 pushed up by the push-up members 42-1, 42-2, 42-3 of the push-up unit 40 of the wafer 10 through the tape 15 of the wafer unit 17 including the ring frame 16 held by the tape holding unit 7, and onto the surroundings of the chip 14. The light source unit 50 is disposed next to the push-up unit 40 in the recess 9.

(Imaging camera)
The imaging camera 60 is disposed above the tape holding unit 7 that is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6. The imaging camera 60 images the chip 14 pushed up by the push-up members 42-1, 42-2, 42-3 of the push-up unit 40 of the wafer 10 of the wafer unit 17 including the ring frame 16 held by the tape holding unit 7 that is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6, and the surroundings of the chip 14, to form a captured image.

The imaging camera 60 is equipped with an imaging element (i.e., a pixel) that images the chip 14 pushed up by the push-up members 42-1, 42-2, and 42-3 of the push-up unit 40 of the wafer 10 of the wafer unit 17 including the ring frame 16 held by the tape holding unit 7, and the surroundings of the chip 14. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging camera 60 captures the chip 14 pushed up by the push-up members 42-1, 42-2, and 42-3 of the push-up unit 40 of the wafer 10 of the wafer unit 17 including the ring frame 16 held by the tape holding unit 7, and the surroundings of the chip 14, and obtains an image for aligning the chip 14 to be picked up pushed up by the push-up unit 40 of the wafer 10 with the push-up unit 40, and outputs the obtained image to the control unit 400.

(Pickup mechanism)
Fig. 7 is a perspective view of the pickup mechanism of the test apparatus shown in Fig. 1. Fig. 8 is a perspective view showing the bottom of the chip holder of the pickup mechanism shown in Fig. 7. The pickup mechanism 70 picks up the chips 14 pushed up by the push-up unit 40 from the wafer 10 which is divided into a plurality of chips 14 and supported by the tape 15. As shown in Fig. 7, the pickup mechanism 70 includes a moving base 72 which is moved in the Y-axis direction and the Z-axis direction by the holder moving unit 80, an arm 74 which extends in the X-axis direction from the moving base 72 in a direction away from the holder moving unit 80, and a chip holder 76 which is provided at the tip of the arm 74 and holds the chips 14.

The chip holder 76 has a lower surface 78 that faces the push-up members 42-1, 42-2, and 42-3 of the push-up unit 40, sandwiching the chip 14 to be picked up of the wafer unit 17 held by the tape holding unit 7, which has been positioned away from the pair of temporary placement rails 6 by the X-axis movement mechanism 31. The planar shape of the lower surface 78 is formed into a rectangle of the same size as the chip 14. The lower surface 78 has a suction groove 79 formed therein, which is connected to a suction source 77 such as an ejector via a suction path 73 and an on-off valve 75. The lower surface 78 is a holding surface that suction-holds the chip 14 pushed up by the push-up members 42-1, 42-2, and 42-3 of the push-up unit 40.

With the chip holder 76 in contact with the chip 14 pushed up by the push-up members 42-1, 42-2, and 42-3 on its underside 78, the suction grooves 79 are sucked by the suction source 77 to hold the chip 14 on the underside 78. The chip holder 76 suction-holds the chip 14 pushed up by the push-up members 42-1, 42-2, and 42-3 of the push-up unit 40 on its underside 78, and is raised by the holder movement unit 80 to pick up the chip 14 held on the underside 78 from the tape 15.

In addition, in the first embodiment, the test device 1 may be provided with a load cell, which is a measuring means for measuring the load applied to the chip 14 when it is picked up from the tape 15, on the upper surface side of the push-up unit 40. The load cell outputs the measurement result to the control unit 400. In the present invention, the load cell, which is a measuring means, may be provided on the lower surface 78 side of the chip holder 76 of the pickup mechanism 70.

(Holder moving unit)
The holder moving unit 80 moves the chip holder 76 along the Z-axis direction and the Y-axis direction. The holder moving unit 80 moves the chip holder 76 between a pick-up position where the chip 14 is picked up from the tape 15 and a placement position where the chip 14 is placed on a pair of supports of the support unit 210 of the strength measurement mechanism 200. The holder moving unit 80 moves the chip holder 76 between the pick-up position and the placement position, thereby transporting the chip 14 picked up by the chip holder 76 to the support unit 210 of the strength measurement mechanism 200.

As shown in FIG. 2, the holder moving unit 80 includes a second Y-axis moving mechanism 81 that is provided on the device body 2 and moves the moving table 83 in the Y-axis direction, and a Z-axis moving mechanism 82 that is provided on the moving table 83 that is moved in the Y-axis direction by the second Y-axis moving mechanism 81 and moves the moving base 72, i.e., the pickup mechanism 70, in the Z-axis direction.

The second Y-axis moving mechanism 81 moves the moving table 83, i.e., the pickup mechanism 70, along the Y-axis direction from a pickup position where the upper surface of the tape holding part 41 of the push-up unit 40 and the lower surface 78 of the tip holder 76 face each other in the Z-axis direction toward the strength measuring mechanism 200. Each moving mechanism 81, 82 includes well-known ball screws 84, 85 that are rotatable about their axes, well-known motors 86, 87 that rotate the ball screws 84, 85 about their axes, and well-known guide rails 88, 89 that support the moving table 83 or pickup mechanism 70 so that it can move in the Y-axis or Z-axis direction.

(Chip observation mechanism)
The chip observation mechanism 100 captures and observes the front surface 11-1, the bottom surface 11-2, and the side surface of the chip 14. As shown in Figures 1 and 2, the chip observation mechanism 100 includes a lower imaging unit 102 arranged adjacent to the push-up unit 40 on the device body 2 in the Y-axis direction, a lateral imaging unit 112, and a chip inversion mechanism 150 that inverts the chip 14 upside down.

The lower imaging unit 102 includes a lower imaging camera 103 that captures an image of the chip 14 held by the chip holder 76 of the pickup mechanism 70 from below. The lower imaging camera 103 is disposed at a position that overlaps with the movement path of the chip holder 76. In the lower imaging unit 102, the lower imaging camera 103 captures an image of the chip 14 from below, and outputs the captured image to the control unit 400.

The lateral imaging unit 112 images the chip 14 from the side, i.e., the side of the chip 14. The lateral imaging unit 112 is disposed next to the lower imaging unit 102 in the Y-axis direction, and in the first embodiment, is disposed farther from the push-up unit 40 than the lower imaging unit 102.

The lateral imaging unit 112 includes a columnar chip support stand 114 that supports the chip 14, and a side imaging camera 113 that images the side of the chip 14.

The chip support table 114 extends upward from the device body 2 and is positioned in line with the lower imaging camera 103 in the Y-axis direction (i.e., overlaps with the movement path of the chip holder 76). The chip support table 114 has a flat upper surface that is parallel to the horizontal direction, and supports the chip 14 transported by the chip holder 76 of the pickup mechanism 70 on its upper surface. The chip support table 114 is also connected to a rotational drive source (not shown), and is rotated by the rotational drive source around an axis parallel to the Z-axis direction.

The side-image capturing camera 113 is positioned at a position where it can capture an image of the side of the chip 14 placed on the upper surface of the chip support stand 114. The side-image capturing camera 113 is equipped with an image capturing element that captures an image of the side of the chip 14. The image capturing element is, for example, a CCD (Charge-Coupled Device) image capturing element or a CMOS (Complementary MOS) image capturing element. The side-image capturing camera 113 captures an image of the side of the chip 14 placed on the upper surface of the chip support stand 114, and outputs the captured image to the control unit 400.

The test device 1 has a chip support table 114 at a position that overlaps with the movement path of the chip holder 76, so that the chip 14 can be placed on the upper surface of the chip support table 114 by the chip holder 76.

The lateral imaging unit 112 images one side of the chip 14 supported by the chip support base 114 using the side imaging camera 113. After that, the chip support base 114 is rotated by a predetermined angle, and the other side of the chip 14 is imaged by the side imaging camera 113. In this way, the lateral imaging unit 112 images all the sides of the chip 14 (for example, the four sides of the chip 14) using the side imaging camera 113, obtains an image including the thickness of the chip 14 and the size of any chipping formed in the chip 14, and outputs the obtained image to the control unit 400. In addition, the lateral imaging unit 112 can adjust the horizontal orientation (angle) of the chip 14 when the chip 14 is placed in the strength measurement mechanism 200 by controlling the rotation angle of the chip support base 114.

By using the above-mentioned lower imaging unit 102 and lateral imaging unit 112, the chip observation mechanism 100 images the front surface 11-1, bottom surface 11-2, and side surface of the chip 14 picked up by the chip holder 76. In the present invention, the side imaging camera 113 that images the side surface of the chip 14 may be provided in a position where it can image the side surface of the chip 14 while it is held by the chip holder 76. In this case, the side surface of the chip 14 can be observed without supporting the chip 14 on the chip support base 114, so that the bottom surface 11-2, etc. of the chip 14 can be prevented from being damaged by placing the chip 14 on the chip support base 114.

The chip inversion mechanism 150 is disposed above the chip support table 114 of the lateral imaging unit 112. The chip inversion mechanism 150 is configured to be able to rotate the base portion 151 180° around an axis parallel to the X-axis direction while holding the chip 14 at its tip.

When the chip inversion mechanism 150 inverts the chip 14 upside down, it rotates the base 151 180° from the position shown by the solid lines in Figures 1 and 2 relative to the upper surface of the chip support table 114 supporting the chip 14 to the position shown by the dotted lines in Figures 1 and 2. The chip inversion mechanism 150 suction-holds the chip 14 at its tip and rotates the base 151 180° to invert the chip 14 upside down.

The chip 14 inverted by the chip inversion mechanism 150 is sucked and held by the chip holder 76 of the pickup mechanism 70, and after the suction holding of the tip of the chip inversion mechanism 150 stops, the chip holder 76 is moved to the holder moving unit 80 and transported to the lower imaging unit 102 or the strength measuring mechanism 200. In this way, the chip inversion mechanism 150 inverts the chip 14 upside down.

(Strength measurement mechanism)
The strength measuring mechanism 200 is a measuring means that measures the flexural strength of the chip 14 picked up by the pickup mechanism 70. The strength measuring mechanism 200 is disposed next to the chip observation mechanism 100 in the Y-axis direction, and in the first embodiment, is disposed on the side farther from the push-up unit 40 than the chip observation mechanism 100. In the first embodiment, the strength measuring mechanism 200 is disposed at a position overlapping with the movement path of the chip holder 76.

The strength measurement mechanism 200 includes a support unit 210 and a pressing unit 220. The support unit 210 supports the chip 14 that has been picked up by the chip holder 76 of the pickup mechanism 70 and whose front surface 11-1, bottom surface 11-2 and side surfaces have been imaged by the chip observation mechanism 100. The support unit 210 is disposed at a position that overlaps with the movement path of the chip holder 76. For this reason, the holder movement unit 80 moves the chip holder 76 from a position facing the push-up unit 40 in the Z-axis direction to a position facing the support unit 210 in the Z-axis direction.

The support unit 210 is provided with a pair of support parts that are arranged at a predetermined interval and support the lower surface 11-2 of the chip 14. The pair of support parts are arranged at a predetermined interval from each other in the X-axis direction.

The pressing unit 220 presses the chip 14 supported by the support unit 210 with an indenter 221, measures the load acting on the pressing unit 220 when pressing the chip 14, and presses and destroys the chip 14 supported by the support unit 210. The pressing unit 220 is provided above the support unit 210.

As shown in Figures 1 and 2, the pressing unit 220 includes an indenter 221, an indenter moving unit 222, and a load measuring device 223.

The indenter 221 is disposed above the support unit 210 and between a pair of supports that support the lower surface 11-2 of the chip 14. The indenter movement unit 222 moves the indenter 221 along the Z-axis direction relatively closer to the chip 14 supported by the pair of supports. The indenter movement unit 222 supports the indenter 221 at its lower end, positions the indenter 221 facing the space between the pair of supports of the support unit 210 along the Z-axis direction, and moves the indenter 221 up and down along the Z-axis direction.

The load measuring device 223 measures the load with which the indenter 221 presses against the chip 14 supported by the support parts. In the first embodiment, the load measuring device 223 is moved up and down along the Z-axis direction together with the indenter 221 by the indenter moving unit 222. The load measuring device 223 is composed of a well-known load cell or the like, measures the load with which the indenter 221 presses against the chip 14 supported by a pair of supports, and outputs the measurement result to the control unit 400.

When the strength measuring mechanism 200 measures the flexural strength of the chip 14, the chip 14 is placed on a pair of supports by a chip holder 76 or the like. At this time, both ends of the chip 14 are supported by the pair of supports, and the center part overlaps between the pair of supports.

The strength measurement mechanism 200 lowers the indenter 221 using the indenter movement unit 222, presses the chip 14 with the indenter 221, measures the load (force in the Z-axis direction) applied to the indenter 221 pressing the chip 14 with a load measuring device 223, and destroys the chip 14 with the indenter 221 while outputting the measurement results to the control unit 400 as appropriate. The strength measurement mechanism 200 performs a three-point bending test using a pair of support parts of the chip 14 and the indenter 221, measures the bending strength (flexural strength) of the chip 14 through this three-point bending test, and outputs the measurement results to the control unit 400.

(Control Unit)
The control unit 400 controls each of the above-mentioned constituent units of the test apparatus 1, and causes the test apparatus 1 to perform a measurement operation for each chip 14, such as measuring the flexural strength of the chip 14. That is, the control unit 400 controls each of the above-mentioned constituent units of the pickup device 20, namely the tape holding unit 7, the push-up unit 40, the pickup mechanism 70, i.e., the chip holder 76, the holder moving unit 80, the light source unit 50, and the imaging camera 60, and causes the pickup device 20 to perform a pickup operation for picking up the chip 14 from the wafer unit 17.

The control unit 400 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. The arithmetic processing device of the control unit 400 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the test device 1 to each of the above-mentioned units of the test device 1 via the input/output interface device.

The control unit 400 is connected to a display unit 300, which is a display means having a display screen 301 that displays the status of the measurement operation, images, etc., and a touch panel 302, which is an input means used by an operator to input information, etc., to the control unit 400 of the test device 1. The display unit 300 is composed of a liquid crystal display device, etc. The touch panel 302 is overlaid on the display screen 301 of the display unit 300.

The control unit 400 also includes a chip clamping section 401, a tape peeling section 402, a chip holding section 403, and a pickup section 404. The chip clamping section 401 suction-holds the tape 15 around the chip 14 to be picked up on the upper surface 48 of the tape holding section 41, supports the chip 14 via the tape 15 between the upper surfaces of the first push-up member 42-1 and the second push-up member 42-2 and the upper surface of the third push-up member 42-3, and controls the push-up unit 40, the pickup mechanism 70, and the holder moving unit 80 so that the chip 14 to be picked up is clamped between the push-up unit 40 and the chip holder 76 by abutting the lower surface 78 of the chip holder 76 against the chip.

The tape peeling unit 402 controls the push-up unit 40, the pickup mechanism 70, and the holder moving unit 80 so that, with the chip clamping unit 401 clamping the chip 14 to be picked up between the push-up unit 40 and the chip holder 76, the first push-up member 42-1, the second push-up member 42-2, and the third push-up member 42-3 push up the chip 14, moving the tape holding unit 41, the first push-up member 42-1, and the second push-up member 42-2 away from the chip 14, and holding the chip 14 between the third push-up member 42-3 and the chip holder 76, thereby peeling off the tape 15 from the outer periphery of the chip 14.

The chip holding unit 403 controls the pickup mechanism 70 to suck and hold the chip 14 on the lower surface 78 of the chip holder 76 in a state where the tape peeling unit 402 has sandwiched the chip 14 between the third push-up member 42-3 and the chip holder 76 and peeled off the tape 15 from the outer edge of the chip 14. The pickup unit 404 controls the holder moving unit 80 to move the chip holder 76 upward, which is a direction away from the tape 15, in a state where the chip holding unit 403 has sucked and held the chip 14 on the lower surface 78, and to cause the holder moving unit 80 to carry out the chip 14 sucked and held by the chip holder 76 from above the tape 15.

The functions of the chip clamping unit 401, the tape peeling unit 402, the chip holding unit 403, and the pickup unit 404 are each realized by the arithmetic processing unit performing arithmetic processing in accordance with a computer program stored in the storage device.

(Pick-up method)
Next, this specification will explain the pick-up method according to the first embodiment with reference to the drawings. Fig. 9 is a flow chart showing the flow of the pick-up method according to the first embodiment. The pick-up method is a method for picking up the chip 14 attached to the tape 15 of the wafer unit 17 from the tape 15, and in the first embodiment, it is also a method for the test device 1 to perform a measurement operation on the chip 14 picked up from the wafer unit 17, i.e., a method for measuring the flexural strength of the chip 14. That is, in the first embodiment, the pick-up method is a measurement operation of the test device 1.

The pick-up method according to the first embodiment is carried out by the test device 1 when an operator places a cassette 4 containing multiple wafer units 17 on the cassette mounting table 3, operates the touch panel 302 to input measurement content information to the control unit 400, and the control unit 400 receives an instruction from the operator to start measurement. The measurement content information includes the positions of the chips 14 pushed up by the push-up members 42-1, 42-2, and 42-3 from the tape 15, which is the subject of measurement of flexural strength, etc., that is, the chips 14 to be picked up from the tape 15.

That is, the position of the chip 14 to be picked up from the tape 15 is registered in advance in the control unit 400 before the pick-up method according to the first embodiment is performed. Note that in this specification, during the performance of the pick-up method, the operator may operate a touch panel or the like to select the chip 14 to be picked up from the tape 15 each time a chip 14 is picked up. As shown in FIG. 9, the pick-up method includes a holding step 1001, a chip clamping step 1002, a tape peeling step 1003, a chip holding step 1004, a pick-up step 1005, and a measurement step 1006.

(holding step)
Fig. 10 is a cross-sectional view showing a typical holding step of the pick-up method shown in Fig. 9. The holding step 1001 is a step in which the ring frame 16 of the wafer unit 17, i.e., the tape 15, around the chip 14 to be picked up is held by the tape holding unit 7.

In the holding step 1001, the control unit 400 controls the loading/unloading unit 5 to load the wafer unit 17 including the untested wafer 10 from the cassette 4 and temporarily place it on the pair of temporary placement rails 6, and controls the loading/unloading unit 5 to place the ring frame 16 of the wafer unit 17 temporarily placed on the temporary placement rails 6 on the lowered frame support member 22 of the tape holding unit 7. In the holding step 1001, the control unit 400 controls the tape holding unit 7 to raise the frame support member 22, and as shown in FIG. 10, the ring frame 16, i.e., the periphery of the chip 14 to be picked up on the tape 15 is sandwiched between the frame pressing member 23 and the frame support member 22, and the wafer unit 17 is fixed by the tape holding unit 7.

(Chip clamping step)
Fig. 11 is a cross-sectional view showing a state in which the tape is suction-held by the tape holding part of the push-up unit in the chip clamping step of the pick-up method shown in Fig. 9. Fig. 12 is a cross-sectional view showing a state in which the chip to be picked up is clamped between the chip holder and the push-up unit in the chip clamping step of the pick-up method shown in Fig. 9. Fig. 13 is a cross-sectional view showing a chip to be picked up, the chip holder, the push-up unit, etc. of Fig. 12.

In the chip clamping step 1002, the tape 15 around the chip 14 to be picked up is sucked and held by the upper surface 48 of the tape holding part 41, the chip 14 is supported by the push-up unit 40 via the tape 15, and the lower surface 78 of the chip holder 76 is brought into contact with the chip 14, so that the chip 14 to be picked up is clamped between the chip holder 76 and the push-up unit 40. In the chip clamping step 1002, the chip clamping part 401 of the control unit 400 controls the moving mechanism 30 based on the measurement content information to move the tape holding unit 7, and positions the chip 14 (hereinafter, indicated by the reference symbol 14-1) to be picked up of the wafer unit 17 held by the tape holding unit 7 above the push-up unit 40 and below the imaging camera 60.

In the chip clamping step 1002, the chip clamping section 401 of the control unit 400 irradiates the wafer 10 with light from the light source unit 50 through the tape 15, and causes the imaging camera 60 to capture an image of the chip 14-1 and the periphery of the chip 14-1 on the wafer 10 of the wafer unit 17 fixed to the tape holding unit 7, thereby acquiring an image. In the chip clamping step 1002, the chip clamping section 401 of the control unit 400 detects the position of the outer edge of the chip 14-1 to be picked up from the captured image, controls the moving mechanism 30 to adjust the position of the tape holding unit 7, and controls the holder moving unit 80 to move the chip holder 76, thereby aligning the chip 14-1 on the wafer 10, the push-up unit 40, and the chip holder 76. In the first embodiment, the alignment involves aligning the outer edge of the chip 14-1 to the outer edge of the push-up portion 42 in the vertical direction, and aligning the outer edge of the chip 14-1 to the outer edge of the lower surface 78 of the chip holder 76 in the vertical direction.

In chip clamping step 1002, the chip clamping section 401 of the control unit 400 controls the push-up unit 40 to raise the entire push-up unit 40 while lowering the push-up members 42-1, 42-2, and 42-3, so that the upper surface of the tape holding section 41 of the push-up unit 40 and the upper surfaces of the push-up members 42-1, 42-2, and 42-3 come into contact with the tape 15. Also, in chip clamping step 1002, the chip clamping section 401 of the control unit 400 opens the on-off valve 46, and as shown in FIG. 11, the tape 15 is sucked and held on the upper surface of the tape holding section 41 of the push-up unit 40, and the push-up section 42 of the push-up unit 40 supports the chip 14-1 to be picked up via the tape 15.

In the chip clamping step 1002, as shown in Figures 12 and 13, the chip clamping section 401 of the control unit 400 controls the holder moving unit 80 to lower the chip holder 76 and bring the lower surface 78 of the chip holder 76 into contact with the chip 14-1, so that the chip 14-1 to be picked up is clamped between the chip holder 76 and the push-up unit 40.

(Tape peeling step)
Fig. 14 is a cross-sectional view showing a state where all push-up members are raised in the tape peeling step of the pickup method shown in Fig. 9. Fig. 15 is a cross-sectional view showing a state where the second push-up member and the third push-up member shown in Fig. 14 are further raised in the tape peeling step of the pickup method shown in Fig. 9. Fig. 16 is a cross-sectional view showing a state where the third push-up member shown in Fig. 15 is further raised in the tape peeling step of the pickup method shown in Fig. 9.

In the tape peeling step 1003, after the chip clamping step 1002 is performed, the tape holding section 41 and the first and second push-up members 42-1 and 42-2 are moved away from the chip 14-1, and the chip 14-1 is clamped between the third push-up member 42-3 and the chip holder 76, thereby peeling off the tape 15 from the outer periphery of the chip 14-1. In the tape peeling step 1003, the tape peeling section 402 of the control unit 400 controls the push-up unit 40 to raise the push-up members 42-1, 42-2, and 42-3, and controls the holder moving unit 80 to raise the chip holder 76, as shown in FIG. At this time, in the tape peeling step 1003, the tape peeling section 402 of the control unit 400 links the upward movement of the push-up members 42-1, 42-2, and 42-3 and the upward movement of the chip holder 76 so that the distance between the upper surfaces of the push-up members 42-1, 42-1, and 42-3 and the lower surface 78 of the chip holder 76 corresponds to the thickness of the chip 14-1 (in the first embodiment, the combined distance is the thickness of the chip 14-1 and the thickness of the tape 15).

In the tape peeling step 1003, the tape peeling section 402 of the control unit 400 controls the push-up unit 40 to stop the ascent of the first push-up member 42-1 at the position shown in FIG. 14, and as shown in FIG. 15, raises the second push-up member 42-2 and the third push-up member 42-3 above the first push-up member 42-1, moving the tape holding section 41 and the first push-up member 42-1 away from the chip 14-1, and sandwiching the chip 14-1 between the second push-up member 42-2 and the third push-up member 42-3, thereby peeling the tape 15 from the outer periphery of the chip 14-1.

In addition, in the tape peeling step 1003, the tape peeling section 402 of the control unit 400 controls the push-up unit 40 to stop the ascent of the second push-up member 42-2 at a position above the first push-up member 42-1 as shown in FIG. 15, and to raise the third push-up member 42-3 above the second push-up member 42-2 as shown in FIG. 16, to move the second push-up member 42-2 away from the chip 14-1 and sandwich the chip 14-1 between the second push-up member 42-2 and the third push-up member 42-3, thereby peeling the tape 15 from the outer periphery of the chip 14-1.

In the tape peeling step 1003, the tape peeling section 402 of the control unit 400 controls the push-up unit 40 to stop the rise of the third push-up member 42-3 at a position above the second push-up member 42-2, as shown in FIG. 16. Thus, in the tape peeling step 1003, the push-up members 42-1, 42-2, and 42-3 push up the chip 14-1 through the tape 15, and in particular peel off the outer edge of the chip 14-1 from the tape 15 on the first push-up member 42-1 and the second push-up member 42-2.

(Chip holding step)
Fig. 17 is a cross-sectional view showing a schematic diagram of the chip holding step of the pick-up method shown in Fig. 9. In the chip holding step 1004, after the tape peeling step 1003 is performed, negative pressure is applied to the lower surface 78 of the chip holder 76 to suction and hold the chip 14-1 by the chip holder 76. In the chip holding step 1004, the chip holding section 403 of the control unit 400 opens the on-off valve 75 as shown in Fig. 17, sucks the lower surface 78 of the chip holder 76 with the suction source 77, applies negative pressure to the lower surface 78, and suction-holds the chip 14-1 on the lower surface 78.

(Pickup step)
Fig. 18 is a cross-sectional view showing a typical pick-up step of the pick-up method shown in Fig. 9. The pick-up step 1005 is a step of carrying out the chip 14-1 held by the chip holder 76 from on the tape 15 after the chip holding step 1004 is performed.

In the pick-up step 1005, the pick-up section 404 of the control unit 400 controls the holder moving unit 80 to raise the chip holder 76, and picks up the chip 14-1 held by suction on the lower surface 78 of the chip holder 76 from the tape 15 and removes it from the tape 15, as shown in FIG. 18.

(Measurement step)
The measurement step 1006 is a step in which the chip 14-1 supported by the chip holder 76 is placed on a pair of supports of the support unit 210, the chip 14-1 supported by the pair of supports is then pressed by the indenter 221 to break, and the load at which the chip 14-1 breaks is detected by the load measuring device 223. In the first embodiment, in the measurement step 1006, the control unit 400 controls the holder moving unit 80 to appropriately move the chip holder 76, controls the chip observation mechanism 100 to capture images of the front surface 11-1, the bottom surface 11-2, and the side surface defined by the measurement content information, acquires these images, stores them in a storage device, and then places the bottom surface 11-2 of the chip 14-1 on the pair of supports of the support unit 210 of the strength measurement mechanism 200.

In embodiment 1, in measurement step 1006, the control unit 400 controls the strength measurement mechanism 200 to lower the indenter 221 using the indenter movement unit 222, bring the tip of the indenter 221 into contact with the surface 11-1 side of the chip 14-1, and press the chip 14-1 with the indenter 221. In addition, the load (force in the Z-axis direction) applied to the indenter 221 by the pressing of the chip 14-1 is measured by the load measuring device 223, and the measurement result is output to the control unit 400 as appropriate.

In measurement step 1006, the control unit 400 controls the strength measurement mechanism 200 to further lower the indenter 221 and destroy the chip 14-1. When the chip 14-1 is destroyed, the load measured by the load measuring instrument 223 goes from a maximum value to zero. Therefore, the strength measurement mechanism 200 can detect the timing at which the chip 14-1 is destroyed from the change in the value of the load measured by the load measuring instrument 223. In addition, the maximum value of the load measured by the load measuring instrument 223 corresponds to the flexural strength of the chip 14-1.

When the control unit 400 of the test device 1 has measured the flexural strength of all of the chips 14-1 whose positions have been entered into the measurement content information, it ends the measurement method.

As described above, in the pickup method according to the first embodiment, the chip 14 is pushed up in the tape peeling step 1003, the chip 14-1 is clamped between the third push-up member 42-3 and the chip holder 76, the tape 15 is peeled off from the outer periphery of the chip 14-1, and then the chip 14-1 is suction-held on the lower surface 78 of the chip holder 76 in the chip holding step 1004. In this way, the pickup method pushes up the chip 14-1 in the tape peeling step 1003, and after the outer periphery of the chip 14-1 naturally peels off from the tape 15, the chip 14-1 is suction-held in the chip holding step 1004, so that excessive force is not applied to the chip 14-1, and the risk of damage can be reduced. As a result, the pickup method according to the first embodiment has the effect of suppressing damage to the chip 14-1 peeled off from the tape 15.

In addition, the pickup device 20 and test device 1 according to the first embodiment implement the pickup method described above, which has the effect of suppressing damage to the chip 14-1.

The present invention is not limited to the above-mentioned embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the embodiment, the test device 1 measures the flexural strength of the chip 14-1, but in the present invention, the strength of various test pieces may be measured, not limited to the chip 14-1. Also, in the first embodiment, the pickup device 20 constitutes a part of the test device 1, but in the present invention, the pickup device 20 is not limited to this, and may be a standalone device without constituting another device such as the test device 1.

In the present invention, the chip 14-1 is clamped between the third push-up member 42-3 and the chip holder 76, and then the chip 14-1 is suction-held by the chip holder 76. However, in the present invention, the chip 14-1 may be clamped between the second push-up member 42-2 and the third push-up member 42-3 and the chip holder 76, and then the chip 14-1 may be suction-held by the chip holder 76. In the first embodiment, the push-up section 42 of the push-up unit 40 includes three push-up members 42-1, 42-2, and 42-3, but the present invention is not limited to this. The push-up section 42 of the push-up unit 40 may not include a peripheral push-up section, and may include only one push-up member that is a central push-up section smaller than the chip 14-1, or may include two or four or more push-up members.

7 Tape holding unit 10 Wafer 11-2 Underside 14, 14-1 Chip 15 Tape 20 Pickup device 40 Push-up unit 41 Tape holding section 42-1 First push-up member (periphery push-up section)
42-2 Second push-up member (periphery push-up part)
42-3 Third thrust member (central thrust part)
48 Top surface (tape holding surface)
76 Chip holder 78 Lower surface (holding surface)
80 Holder moving unit (transport unit)
400 Control unit 401 Chip clamping section 402 Tape peeling section 403 Chip holding section 404 Pick-up section 1002 Chip clamping step 1003 Tape peeling step 1004 Chip holding step 1005 Pick-up step

Claims (2)

A method for picking up a chip attached to a tape, comprising the steps of:
a chip clamping step in which the tape is suction-held by a tape holding section having a tape holding surface that suction-holds the tape around the chip to be picked up, and the chip is supported via the tape by a push-up unit having an outer circumferential push-up section that pushes up the outer circumferential region of the chip to be picked up via the tape and a central push-up section that pushes up the center of the chip via the tape inside the outer circumferential push-up section, and a chip holder that faces the push-up unit across the chip and has a holding surface that suction-holds the chip is brought into contact with the chip without suction -holding the holding surface to clamp the chip between the chip holder and the push-up unit;
a tape peeling step of, after carrying out the chip clamping step, pushing up the clamped chip by the outer circumferential push-up portion and the central push-up portion, and separating the tape holding portion and the outer circumferential push-up portion from the chip, thereby leaving the chip clamped between the central push-up portion and the chip holder, thereby peeling off the tape from the outer circumferential edge of the chip;
a chip holding step of applying a negative pressure to the holding surface of the chip holder to suction and hold the chip with the chip holder after the tape peeling step is performed;
a pick-up step of carrying out the chip held by the chip holder from above the tape after carrying out the chip holding step. A pickup device for picking up a chip attached to a tape, comprising:
a tape holding unit that holds the periphery of the chip to be picked up on the tape;
a push-up unit including a tape holding section having a tape holding surface for suction-holding the tape around the chip to be picked up, an outer periphery push-up section for pushing up the outer periphery region of the chip to be picked up via the tape, and a central push-up section for pushing up the center of the chip via the tape inside the outer periphery push-up section;
a tip holder having a holding surface that faces the push-up unit with the tip sandwiched therebetween and sucks and holds the tip;
a holder moving unit for moving the chip holder;
a control unit for controlling the tape holding unit, the push-up unit, the chip holding tool, and the holding tool moving unit;
The control unit
a chip holding section for holding the chip to be picked up between the push-up unit and the chip holder without suction holding the chip on the holding surface of the chip holder ;
a tape peeling section which, in a state in which the chip to be picked up is sandwiched between the push-up unit and the chip holder by the chip holding section, causes the outer circumferential push-up section and the central push-up section to push up the chip, thereby separating the tape holding section and the outer circumferential push-up section from the chip, and thereby peeling off the tape from the outer circumferential edge of the chip, thereby leaving the chip sandwiched between the central push-up section and the chip holder;
a chip holding portion that holds the chip by suction on the holding surface of the chip holder in a state in which the tape peeling portion holds the chip between the central push-up portion and the chip holder;
a pickup section for causing the holder moving unit to carry out the chip held by the chip holder from above the tape while the chip holder holds the chip by suction on the holding surface;
A pickup device comprising:

Images