JP7650137B2 - Pick-up method, pickup device, and test device - Google Patents

Description

The present invention relates to a pickup method for picking up chips from a wafer unit, a pickup device, and a test device equipped with the pickup device.

A pickup device is used to peel off the chips from a wafer that has been divided into multiple chips and attached to a tape with the outer periphery of the tape attached to a ring frame (see, for example, Patent Documents 1 and 2).

The pickup devices shown in the above-mentioned Patent Documents 1 and 2 push up the chip with a push-up member to peel the chip off the tape, and then pick up the chip by holding it with a pickup head or suction nozzle.

JP 2018-063967 A JP 2013-033850 A

However, if the chip has damage such as a crack, it will break when it is pushed up. If a damaged chip is held by a pick-up head or suction nozzle, there is a risk that chip debris will adhere to the holding surface. If the next chip is picked up with damaged debris adhering to the holding surface, there is a risk that the held surface of the chip will be damaged or the chip itself will be damaged.

The present invention was made in consideration of these problems, and its purpose is to provide a pickup method, pickup device, and test device that can suppress damage to the chip.

In order to solve the above-mentioned problems and achieve the object, a pick-up method of the present invention is a method for picking up chips from a wafer unit in which a wafer divided into a plurality of chips with cut grooves formed between the chips and penetrating the wafer is attached to a tape and the outer periphery of the tape is attached to a ring frame, the method comprising: a holding step of holding the ring frame of the wafer unit with a frame holding unit; a push-up step of pushing up the chips through the tape from the tape side of the wafer unit with a push-up member after carrying out the holding step; and a damage detection step in which, before the pushing-up step is performed, light is irradiated onto the wafer through the tape from a light source unit, the chip pushed up in the pushing-up step is imaged with an imaging camera to form an image, and damage to the chip is detected from the image, and in the damage detection step, the imaging camera is disposed on one side of the wafer and the light source unit is disposed on the other side of the wafer to determine whether or not there is a scratch that penetrates the chip .

In the above pick-up method, the push-up step and the pick-up step may be performed if it is determined in the damage detection step that the chip has no penetrating damage .

The pickup device of the present invention is a pickup device that picks up chips from a wafer unit in which a wafer divided into a plurality of chips with cut grooves formed between the chips penetrating the wafer is attached to a tape and the outer periphery of the tape is attached to a ring frame, and includes a frame holding unit that holds the ring frame of the wafer unit, a push-up member that pushes up the chips through the tape of the wafer unit including the ring frame held by the frame holding unit, a pickup collet that faces the push-up member across the wafer unit, holds the chips pushed up by the push-up member, and picks up the chips from above the tape, and irradiates illumination light onto the wafer through the tape. The wafer W is provided with a light source unit, an imaging camera which images the chip being pushed up by the push-up member to form an image, and a controller which controls the frame holding unit, the push-up member, the pickup collet, and the imaging camera, and before the chip is pushed up by the push-up member, the controller irradiates light from the light source unit through the tape onto the wafer and images the chip being pushed up by the push-up member with the imaging camera to obtain an image, and when obtaining the image, the imaging camera is disposed on one side of the wafer and the light source unit is disposed on the other side of the wafer, and the controller has a damage detection unit which determines whether or not there is a scratch that penetrates the chip from the image.

The test device of the present invention is characterized by comprising the pickup device, a support unit having a pair of support parts arranged at a predetermined distance and supporting the underside of the chip, an indenter arranged above the support unit and between the pair of support parts, an indenter moving unit that moves the indenter relatively closer to the chip supported by the pair of support parts, a load measuring device that measures the load with which the indenter presses the test piece supported by the pair of support parts, and a transport unit that transports the chip picked up by the pickup collet to the support unit.

The present invention has the effect of suppressing damage to the chip.

FIG. 1 is a perspective view showing a part of a configuration example of a test apparatus according to the first embodiment. FIG. 2 is a perspective view of a main part of the testing apparatus shown in FIG. FIG. 3 is a perspective view of a wafer unit including a wafer to be measured by the test apparatus shown in FIG. FIG. 4 is a cross-sectional view showing a push-up mechanism and the like of the testing device shown in FIG. FIG. 5 is a perspective view of a pick-up mechanism of the test apparatus shown in FIG. FIG. 6 is a flowchart showing the flow of the pickup method according to the first embodiment. FIG. 7 is a cross-sectional view showing the holding step of the pick-up method shown in FIG. FIG. 8 is a cross-sectional view showing a damage detection step of the pick-up method shown in FIG. FIG. 9 is a plan view showing an imaging range of an imaging unit on a wafer in the damage detection step of the pick-up method shown in FIG. FIG. 10 is a diagram showing an example of a captured image acquired by the imaging unit in the damage detection step of the pick-up method shown in FIG. FIG. 11 is a diagram showing another example of the captured image acquired by the imaging unit in the damage detection step of the pick-up method shown in FIG. FIG. 12 is a cross-sectional view showing a state in which the chip and the push-up mechanism are aligned in the push-up step of the pick-up method shown in FIG. FIG. 13 is a cross-sectional view of a state in which the tape is sucked and held by the outer layer of the push-up mechanism in the push-up step of the pick-up method shown in FIG. FIG. 14 is a cross-sectional view of a state in which the bottom surface of the pickup collet is brought into contact with the chip to be picked up in the push-up step of the pickup method shown in FIG. FIG. 15 is a cross-sectional view of a state in which a chip to be picked up is sucked and held by the lower surface of a pickup collet in the pick-up step of the pick-up method shown in FIG. FIG. 16 is a cross-sectional view of a state in which the chip held by the pickup collet under suction is picked up from the tape in the pickup step of the pickup method shown in FIG. FIG. 17 is a cross-sectional view showing a state in which a pair of support portions of a support unit support a chip in the measurement step of the pick-up method shown in FIG. FIG. 18 is a cross-sectional view showing a state in which the tip shown in FIG. 17 is pressed by a presser and comes into contact with the upper end of the support protrusion of the support portion. FIG. 19 is a cross-sectional view showing a state in which the chip shown in FIG. 18 is broken. FIG. 20 is a perspective view illustrating a part of a configuration example of a test apparatus according to the second embodiment. FIG. 21 is a perspective view of a main part of the testing device shown in FIG. FIG. 22 is a flowchart showing the flow of the pickup method according to the second embodiment.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A test apparatus and a pickup apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a part of a configuration example of the test apparatus according to the first embodiment. Fig. 2 is a perspective view of a main part of the test apparatus shown in Fig. 1. Fig. 3 is a perspective view of a wafer unit including a wafer to be measured by the test apparatus shown in Fig. 1.

The test device 1 shown in Figures 1 and 2 according to the first embodiment is a device that picks up a chip 14, which is a test piece, from a wafer unit 17 shown in Figure 3, destroys the chip 14, and measures the flexural strength of the chip 14.

(Wafer unit)
3, the wafer unit 17 is configured by attaching the wafer 10 divided into a plurality of chips 14 to a tape 15, and attaching the outer periphery of the tape 15 to an annular ring frame 16. The wafer 10 is a disk-shaped semiconductor wafer, an optical device wafer, or the like, with a substrate 11 made of silicon, sapphire, gallium, or the like.

The wafer 10 has devices 13 formed in areas partitioned by a plurality of planned division lines 12 formed in a grid pattern on the surface 11-1 of the substrate 11. In the first embodiment, the wafer 10 has a tape 15 attached to the bottom surface 11-2 with a ring frame 16 attached to its outer periphery, and is supported by the ring frame 16 to form a wafer unit 17. The wafer 10 is also cut along the planned division lines 12 to be divided into individual chips 14. That is, the wafer 10 has cutting grooves 18 formed between the chips 14, which penetrate the wafer 10 itself. The chips 14 include a part of the substrate 11 and the devices 13.

In the first embodiment, the wafer 10 has the devices 13 formed on the surface 11-1 of the substrate 11. However, in the present invention, when the test device 1 is used to evaluate the validity of the processing conditions of the so-called post-process in which the wafer 10 is divided into individual chips 14, the devices 13 do not have to be formed on the surface 11-1. Also, in the present invention, the surface 11-1 side of the wafer 10 may be attached to the tape 15.

(Test Equipment)
As shown in FIG. 1, the testing equipment 1 comprises a cassette mounting table 3 provided on an equipment main body 2 on which a cassette 4 containing a plurality of wafer units 17 is placed, an input/output unit 5 which moves the wafer units 17 into and out of the cassette 4, a pair of temporary placement rails 6 on which the wafer units 17 removed from the cassette 4 or the wafer units 17 before being loaded into the cassette 4 are temporarily placed, and a pickup device 20.

The cassette 4 is a storage container that stores multiple wafer units 17 spaced apart in the Z-axis direction, which is parallel to the vertical direction, and is provided with an opening 8 for inserting and removing the wafers 10. The cassette mounting table 3 has the cassette 4 placed on its upper surface and raises and lowers the cassette 4 in the Z-axis direction.

The pair of temporary placement rails 6 are provided on both ends of the width of the opening 8 of the cassette 4 placed on the cassette placement table 3 on the device main body 2, and extend linearly in the Y-axis direction parallel to the horizontal direction. The pair of temporary placement rails 6 are arranged parallel to each other and spaced apart from each other along the X-axis direction which is perpendicular to the Y-axis direction and parallel to the horizontal direction. The ring frame 16 of the wafer unit 17 is temporarily placed on the pair of temporary placement rails 6.

The loading/unloading unit 5 is provided so as to be movable in the Y-axis direction by a moving mechanism (not shown). The loading/unloading unit 5 unloads the wafer unit 17 from the cassette 4 and temporarily places it on the temporary placement rails 6, and then unloads the wafer unit 17 to the upper surface of the lowered frame support member 22 of the frame holding unit 7 of the pickup device 20 and places it on the upper surface of the frame support member 22. The loading/unloading unit 5 also unloads the wafer unit 17 from the upper surface of the lowered frame support member 22 of the frame holding unit 7 into the cassette 4 via the temporary placement rails 6.

(Pickup device)
The pickup device 20 is a device that picks up the chips 14 from the above-mentioned wafer unit 17. As shown in Fig. 2, the pickup device 20 includes a frame holding unit 7, a moving mechanism 30 that moves the frame holding unit 7 in the Y-axis direction and the X-axis direction, a push-up mechanism 40, a light source unit 50, an imaging camera 60, a pickup mechanism 70, and a control unit 400 that serves as a controller.

(Frame Holding Unit)
The frame holding unit 7 holds the ring frame 16 of the wafer unit 17. The frame holding unit 7 is installed on a moving table 21. The frame holding unit 7 includes an annular frame support member 22, an annular frame pressing member 23 disposed above and fixed to the frame support member 22, and a lifting mechanism (not shown) for lifting and lowering the frame support member 22. Before being lifted, the upper surface of the frame support member 22 is located on the same plane as the upper surface of the temporary placement rail 6, and the ring frame 16 of the wafer unit 17 is placed on the frame support member 22. When the ring frame 16 of the wafer unit 17 is placed on the upper surface of the frame support member 22, the lifting mechanism of the frame holding unit 7 lifts the frame support member 22, and the ring frame 16 is sandwiched between the frame pressing member 23 and the frame support member 22 to fix the wafer unit 17.

(Moving mechanism)
The moving mechanism 30 includes an X-axis moving mechanism 31 that is provided on the device body 2 and moves the moving table 21 in the X-axis direction, and a Y-axis moving mechanism 32 that is provided on the moving table 21 that is moved in the X-axis direction by the X-axis moving mechanism 31 and moves the frame holding unit 7 in the Y-axis direction. The X-axis moving mechanism 31 moves the moving table 21, i.e., the frame holding unit 7, in the X-axis direction between a position aligned with the pair of temporary placement rails 6 in the Y-axis direction and a position separated from the pair of temporary placement rails 6. Each of the moving mechanisms 31, 32 includes well-known ball screws 33, 34 that are provided rotatably about their axes, well-known motors 35, 36 that rotate the ball screws 33, 34 about their axes, and well-known guide rails 37, 38 that support the moving table 21 or the frame holding unit 7 movably in the X-axis or Y-axis directions.

(Push-up mechanism)
Fig. 4 is a cross-sectional view showing a push-up mechanism and the like of the testing apparatus shown in Fig. 1. The push-up mechanism 40 is disposed below the frame holding unit 7 which is positioned at a position away from the pair of temporary placement rails 6 by the X-axis moving mechanism 31. The push-up mechanism 40 is provided in the recess 9 of the apparatus main body 2, and pushes up any one of the chips 14 via the tape 15 of the wafer unit 17 including the ring frame 16 held by the frame holding unit 7 which is positioned at a position away from the pair of temporary placement rails 6 by the X-axis moving mechanism 31.

The push-up mechanism 40 is connected as a whole to a lifting mechanism (not shown) composed of a motor or the like, and moves up and down along the Z-axis direction. As shown in FIG. 4, the push-up mechanism 40 includes an outer layer 41 formed in a hollow cylindrical shape and a quadrangular prism-shaped push-up part 42 arranged inside the outer layer 41. A plurality of suction grooves 44 are formed on the upper surface of the outer layer 41 in a concentric shape along the circumferential direction of the outer layer 41. Each of the suction grooves 44 is connected to a suction source 47 composed of an ejector or the like via a suction passage 45 and an opening/closing valve 46 formed inside the push-up mechanism 40.

The push-up section 42 includes a first push-up pin 42-1 formed in a square prism shape, a second push-up pin 42-2 formed in a square tube shape surrounding the first push-up pin 42-1, and a third push-up pin 42-3 formed in a square tube shape surrounding the second push-up pin 42-2. The first push-up pin 42-1, the second push-up pin 42-2, and the third push-up pin 42-3 are each push-up members that push up any of the chips 14 through the tape 15 of the wafer unit 17 including the ring frame 16 held by the frame holding unit 7. The first push-up pin 42-1, the second push-up pin 42-2, and the third push-up pin 42-3 are each connected to a lifting mechanism (not shown) composed of a motor or the like, and move up and down along the Z-axis direction.

With the wafer unit 17 including the ring frame 16 held by the frame holding unit 7 positioned above, the push-up mechanism 40 sucks the suction grooves 44 on the upper surface of the outer layer 41 with the suction source 47, and holds the periphery of the chip 14 on the tape 15 on the upper surface of the outer layer 41. The push-up mechanism 40 holds the periphery of the chip 14 on the tape 15 on the upper surface of the outer layer 41 by suction, and push-up pins 42-1, 42-2, 42-3 of the push-up section 42 are raised, pushing up the chip 14 above the tape 15. The dimensions of the push-up mechanism 40 are adjusted appropriately according to the size of the chip 14.

In the first embodiment, when the push-up mechanism 40 pushes up the chip 14, the lifting mechanism starts to raise the first push-up pin 42-1, the second push-up pin 42-2, and the third push-up pin 42-3 simultaneously at the same speed, the second push-up pin 42-2 is raised above the third push-up pin 42-3, the first push-up pin 42-1 is raised above the second push-up pin 42-2, and the rise of each pin stops. That is, when the push-up mechanism 40 pushes up the chip 14, the first push-up pin 42-1, the second push-up pin 42-2, and the third push-up pin 42-3 start to rise simultaneously at the same speed, and the third push-up pin 42-3, the second push-up pin 42-2, and the first push-up pin 42-1 stop rising in order.

(Light source unit)
The light source unit 50 is provided in the recess 9 of the device body 2, and irradiates illumination light onto the chip 14 pushed up by the push-up pins 42-1, 42-2, 42-3 of the push-up mechanism 40 of the wafer 10 through the tape 15 of the wafer unit 17 including the ring frame 16 held by the frame holding unit 7, and onto the surroundings of the chip 14. The light source unit 50 is disposed next to the push-up mechanism 40 in the recess 9.

(Imaging camera)
The imaging camera 60 is disposed above the frame holding unit 7 that is positioned by the X-axis moving mechanism 31 at a position away from the pair of temporary placement rails 6. The imaging camera 60 images the chip 14 pushed up by the push-up pins 42-1, 42-2, 42-3 of the push-up mechanism 40 of the wafer 10 of the wafer unit 17 including the ring frame 16 held by the frame holding unit 7 that is positioned by the X-axis moving mechanism 31 at a position away from the pair of temporary placement rails 6, and the surroundings of the chip 14, to form captured images 501, 502 (shown in FIGS. 10 and 11).

The imaging camera 60 includes a chip 14 pushed up by the push-up pins 42-1, 42-2, 42-3 of the push-up mechanism 40 of the wafer 10 of the wafer unit 17 including the ring frame 16 held by the frame holding unit 7, and an imaging element (i.e., pixel) that captures an image of the chip 14 and its surroundings. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging camera 60 captures the chip 14 pushed up by the push-up pins 42-1, 42-2, and 42-3 of the push-up mechanism 40 of the wafer 10 of the wafer unit 17, which includes the ring frame 16 held by the frame holding unit 7, and the surroundings of the chip 14, and obtains captured images 501 and 502 for aligning the chip 14 pushed up by the push-up mechanism 40 of the wafer 10 with the push-up mechanism 40, and outputs the obtained captured images 501 and 502 to the control unit 400.

(Pickup mechanism)
Fig. 5 is a perspective view of the pickup mechanism of the testing apparatus shown in Fig. 1. The pickup mechanism 70 picks up the chips 14 pushed up by the push-up mechanism 40 from the wafer 10 which is divided into a plurality of chips 14 and supported by the tape 15. As shown in Fig. 5, the pickup mechanism 70 includes a moving base 72 which is moved in the Y-axis direction and the Z-axis direction by a collet moving mechanism 80 which will be described later, an arm 74 which extends in the X-axis direction from the moving base 72 in a direction away from the collet moving mechanism 80, and a pickup collet 76 which is provided at the tip of the arm 74 and holds the chips 14.

The pickup collet 76 faces the push-up pins 42-1, 42-2, and 42-3 of the push-up mechanism 40, sandwiching the wafer unit 17 held by the frame holding unit 7, which is positioned by the X-axis movement mechanism 31 at a position away from the pair of temporary placement rails 6, and holds the chip 14 pushed up by the push-up pins 42-1, 42-2, and 42-3 of the push-up mechanism 40, and picks it up from the tape 15. The pickup collet 76 is attached to the lower end of the tip of the arm 74. The pickup collet 76 has a suction groove 79 (shown in FIG. 4) formed on its lower surface 78, which is connected to a suction source 77 such as an ejector via a suction path 73 and an on-off valve 75.

With the chip 14 pushed up by the push-up pins 42-1, 42-2, and 42-3 in contact with the underside 78 of the pickup collet 76, the suction grooves 79 are sucked by the suction source 77, and the chip 14 is sucked and held on the underside 78. The pickup collet 76 sucks and holds the chip 14 pushed up by the push-up pins 42-1, 42-2, and 42-3 of the push-up mechanism 40 on the underside 78, and is raised by the collet movement mechanism 80 to pick up the chip 14 sucked and held on the underside 78 from the tape 15.

In addition, in the first embodiment, the test device 1 may be provided with a load cell, which is a measuring means for measuring the load applied to the chip 14 when it is picked up from the tape 15, on the upper surface side of the push-up mechanism 40. The load cell outputs the measurement result to the control unit 400. In the present invention, the load cell, which is a measuring means, may be provided on the lower surface 78 side of the pickup collet 76 of the pickup mechanism 70.

(Collet moving mechanism)
1 and 2, the testing device 1 includes a collet moving mechanism 80, a chip observation mechanism 100, and a strength measurement mechanism 200. The collet moving mechanism 80 moves the pickup collet 76 between a pick-up position where the chip 14 is picked up from the tape 15 and a placement position where the chip 14 is placed on a support protrusion 214 (shown in FIG. 8) of a support unit 210 (described later) of the strength measurement mechanism 200. The collet moving mechanism 80 is a transport unit that moves the pickup collet 76 between the pick-up position and the placement position, thereby transporting the chip 14 picked up by the pickup collet 76 to the support unit 210 of the strength measurement mechanism 200.

The collet movement mechanism 80 includes a second Y-axis movement mechanism 81 that is provided on the device body 2 and moves the moving table 83 in the Y-axis direction, and a Z-axis movement mechanism 82 that is provided on the moving table 83 that is moved in the Y-axis direction by the second Y-axis movement mechanism 81 and moves the moving base 72, i.e., the pickup mechanism 70, in the Z-axis direction.

The second Y-axis moving mechanism 81 moves the moving table 83, i.e., the pickup mechanism 70, along the Y-axis direction from a pick-up position where the upper and lower surfaces 78 of the outer layer 41 of the thrust-up mechanism 40 face each other in the Z-axis direction toward the strength measuring mechanism 200. Each moving mechanism 81, 82 includes well-known ball screws 84, 85 that are rotatable about their axes, well-known motors 86, 87 that rotate the ball screws 84, 85 about their axes, and well-known guide rails 88, 89 that support the moving table 83 or pickup mechanism 70 so that it can move in the Y-axis or Z-axis direction.

(Chip observation mechanism)
The chip observation mechanism 100 captures and observes the front surface 11-1, the bottom surface 11-2, and the side surface of the chip 14. As shown in Figures 1 and 2, the chip observation mechanism 100 includes a lower imaging unit 102 arranged adjacent to the push-up mechanism 40 on the device body 2 in the Y-axis direction, a lateral imaging unit 112, and a chip inversion mechanism 150 that inverts the chip 14 upside down.

The lower imaging unit 102 includes a lower imaging camera 103 that captures an image of the chip 14 held by the pickup collet 76 of the pickup mechanism 70 from below. The lower imaging camera 103 is disposed at a position that overlaps with the movement path of the pickup collet 76. In the lower imaging unit 102, the lower imaging camera 103 captures an image of the chip 14 from below, and outputs the captured image to the control unit 400.

The lateral imaging unit 112 images the chip 14 from the side, i.e., the side of the chip 14. The lateral imaging unit 112 is disposed next to the lower imaging unit 102 in the Y-axis direction, and in the first embodiment, is disposed farther from the push-up mechanism 40 than the lower imaging unit 102.

The lateral imaging unit 112 includes a columnar chip support stand 114 that supports the chip 14, and a side imaging camera 113 that images the side of the chip 14.

The chip support base 114 extends upward from the device body 2 and is positioned in line with the lower imaging camera 103 in the Y-axis direction (i.e., overlaps with the movement path of the pickup collet 76). The chip support base 114 has a flat upper surface that is parallel to the horizontal direction, and supports the chip 14 transported by the pickup collet 76 of the pickup mechanism 70 on its upper surface. The chip support base 114 is also connected to a rotational drive source (not shown), and is rotated by the rotational drive source around an axis parallel to the Z-axis direction.

The side-image capturing camera 113 is positioned at a position where it can capture an image of the side of the chip 14 placed on the upper surface of the chip support stand 114. The side-image capturing camera 113 is equipped with an image capturing element that captures an image of the side of the chip 14. The image capturing element is, for example, a CCD (Charge-Coupled Device) image capturing element or a CMOS (Complementary MOS) image capturing element. The side-image capturing camera 113 captures an image of the side of the chip 14 placed on the upper surface of the chip support stand 114, and outputs the captured image to the control unit 400.

In addition, the test device 1 has a chip support base 114 at a position that overlaps with the movement path of the pickup collet 76, so the pickup collet 76 can place the chip 14 on the upper surface of the chip support base 114.

The lateral imaging unit 112 images one side of the chip 14 supported by the chip support base 114 using the side imaging camera 113. After that, the chip support base 114 is rotated by a predetermined angle, and the other side of the chip 14 is imaged by the side imaging camera 113. In this way, the lateral imaging unit 112 images all the sides of the chip 14 (for example, the four sides of the chip 14) using the side imaging camera 113, obtains an image including the thickness of the chip 14 and the size of any chipping formed in the chip 14, and outputs the obtained image to the control unit 400. In addition, the lateral imaging unit 112 can adjust the horizontal orientation (angle) of the chip 14 when the chip 14 is placed in the strength measurement mechanism 200 by controlling the rotation angle of the chip support base 114.

By using the above-mentioned lower imaging unit 102 and lateral imaging unit 112, the chip observation mechanism 100 images the front surface 11-1, bottom surface 11-2, and side surface of the chip 14 picked up by the pickup collet 76. In the present invention, the side imaging camera 113 that images the side surface of the chip 14 may be provided in a position where it can image the side surface of the chip 14 while it is held by the pickup collet 76. In this case, the side surface of the chip 14 can be observed without supporting the chip 14 on the chip support base 114, so that the bottom surface 11-2, etc. of the chip 14 can be prevented from being damaged by placing the chip 14 on the chip support base 114.

The chip inversion mechanism 150 is disposed above the chip support base 114 of the lateral imaging unit 112. The chip inversion mechanism 150 is configured to be able to rotate the base portion 151 180° around an axis parallel to the X-axis direction while holding the chip 14 at its tip.

When the chip inversion mechanism 150 inverts the chip 14 upside down, it rotates the base 151 180° from the position shown by the solid line in Figures 1 and 2 relative to the upper surface of the chip support table 114 supporting the chip 14 to the position shown by the dotted line in Figures 1 and 2. The chip inversion mechanism 150 suction-holds the chip 14 at its tip and rotates the base 151 180° to invert the chip 14 upside down.

The chip 14 inverted by the chip inversion mechanism 150 is sucked and held by the pickup collet 76 of the pickup mechanism 70, and after the suction and holding of the tip of the chip inversion mechanism 150 stops, the pickup collet 76 is moved to the collet movement mechanism 80 and transported to the lower imaging unit 102 or the strength measurement mechanism 200. In this way, the chip inversion mechanism 150 inverts the chip 14 upside down.

(Strength measurement mechanism)
The strength measuring mechanism 200 is a measuring means that measures the flexural strength of the chip 14 picked up by the pickup mechanism 70. The strength measuring mechanism 200 is disposed next to the chip observation mechanism 100 in the Y-axis direction, and in the first embodiment, is disposed on the side farther from the push-up mechanism 40 than the chip observation mechanism 100. In the first embodiment, the strength measuring mechanism 200 is disposed at a position overlapping with the movement path of the pickup collet 76.

The strength measurement mechanism 200 includes a support unit 210 and a pressing unit 220. The support unit 210 supports the chip 14 that has been picked up by the pickup collet 76 of the pickup mechanism 70 and whose front surface 11-1, bottom surface 11-2 and side surfaces have been imaged by the chip observation mechanism 100. The support unit 210 is disposed at a position that overlaps with the movement path of the pickup collet 76. For this reason, the collet movement mechanism 80 moves the pickup collet 76 from a position facing the push-up mechanism 40 in the Z-axis direction to a position facing the support unit 210 in the Z-axis direction.

As shown in FIG. 17 etc., the support unit 210 is provided with a pair of support parts 211 arranged with a predetermined interval 212 therebetween and supporting the underside 11-2 of the chip 14, and a support base moving mechanism (not shown) that changes the position of each of the support parts 211 in the X-axis direction and the interval 212 between the pair of support parts 211. The pair of support parts 211 are arranged with a predetermined interval 212 between each other in the X-axis direction. Each support part 211 includes a support base 213 and a contact member 215.

The support base 213 is formed in a rectangular parallelepiped shape. The support bases 213 of the pair of support parts 211 are spaced apart from each other in the X-axis direction, with a gap 212 provided between them. The pair of support bases 213 are also arranged with the longitudinal direction of their upper surfaces aligned along the Y-axis direction. The pair of support bases 213 have the chip 14, the flexural strength of which is to be measured, placed on the upper surface side by a pickup collet 76 or the like. In the first embodiment, the support base 213 is placed on the lower surface 11-2 side of the chip 14.

The support bases 213 each have a columnar (rod-shaped) support protrusion 214 formed on adjacent edges of the upper surface, protruding upward, and the upper surface other than the aforementioned edges is covered with a contact member 215. The support protrusions 214 are made of a metal such as stainless steel, are arranged parallel to the Y-axis direction, and support the lower surface 11-2 side of the chip 14. In the first embodiment, the cross-sectional shape of the upper surface of the support protrusions 214 is formed into an upwardly convex curved surface.

The contact member 215 is made of a material (e.g., sponge rubber) that is softer than the support protrusion 214, and is formed in a plate shape with a constant thickness. The contact member 215 is formed in a rectangular shape in plan view, and its thickness in an undeformed state is greater than the amount of protrusion from the upper surface of the support protrusion 214.

The contact member 215 supports the chip 14 with the lower surface 11-2 of the chip 14 overlapped on the upper surface. Therefore, the upper surface of the contact member 215 supports the lower surface 11-2 of the chip 14. In the first embodiment, the upper surface of the contact member 215 in an undeformed state is disposed approximately 1 mm above the upper end of the support protrusion 214. Therefore, the lower surface 11-2 of the chip 14 disposed on the support base 213 contacts the upper surface of the contact member 215 with a gap between it and the support protrusion 214. Also, when the indenter 221 presses the chip 14, the contact member 215 deforms and contacts the lower surface 11-2 of the chip 14 at the upper end 214-1 (corresponding to the fulcrum) of the support protrusion 214, supporting the lower surface 11-2. Therefore, the upper end 214-1 of the support protrusion 214 supports the lower surface 11-2 of the chip 14.

The pressing unit 220 presses the chip 14 supported by the support unit 210 with an indenter 221, measures the load acting on the pressing unit 220 when pressing the chip 14, and presses and destroys the chip 14 supported by the support unit 210. The pressing unit 220 is provided above the support unit 210.

As shown in Figures 1 and 2, the pressing unit 220 includes an indenter 221, an indenter moving unit 222, and a load measuring device 223.

The indenter 221 is disposed above the support unit 210 and between the pair of support parts 211 that support the lower surface 11-2 of the chip 14. The indenter movement unit 222 moves the indenter 221 along the Z-axis direction relatively closer to the chip 14 supported by the pair of support parts 211. The indenter movement unit 222 supports the indenter 221 at its lower end, positions the indenter 221 facing the space between the pair of support parts 211 of the support unit 210 along the Z-axis direction, and moves the indenter 221 up and down along the Z-axis direction.

The load measuring device 223 measures the load with which the indenter 221 presses the chip 14 supported by the support parts 211. In the first embodiment, the load measuring device 223 is moved up and down along the Z-axis direction together with the indenter 221 by the indenter moving unit 222. The load measuring device 223 is composed of a well-known load cell or the like, measures the load with which the indenter 221 presses the chip 14 supported by the pair of support parts 211, and outputs the measurement result to the control unit 400.

When the strength measuring mechanism 200 measures the flexural strength of the chip 14, the chip 14 is placed on a pair of supports 211 by a pickup collet 76 or the like. At this time, both ends of the chip 14 are supported by the pair of supports 211, and the center part overlaps with the gap 212.

The strength measurement mechanism 200 lowers the indenter 221 by the indenter movement unit 222, presses the chip 14 with the indenter 221, measures the load (force in the Z-axis direction) applied to the indenter 221 pressing the chip 14 with a load measuring device 223, and destroys the chip 14 with the indenter 221 while outputting the measurement results appropriately to the control unit 400. The strength measurement mechanism 200 performs a three-point bending test using a pair of support protrusions 214 of the chip 14 and the indenter 221, measures the bending strength (flexural strength) of the chip 14 through this three-point bending test, and outputs the measurement results to the control unit 400.

(Control Unit)
The control unit 400 controls each of the above-mentioned constituent units of the test device 1, and causes the test device 1 to perform a measurement operation for each chip 14, such as measuring the flexural strength of the chip 14. That is, the control unit 400 controls each of the above-mentioned constituent units of the pickup device 20, namely, the frame holding unit 7, the push-up mechanism 40, i.e., the push-up pins 42-1, 42-2, and 42-3, the pickup mechanism 70, i.e., the pickup collet 76, the light source unit 50, and the imaging camera 60, and causes the pickup device 20 to perform a pickup operation for picking up the chip 14 from the wafer unit 17.

The control unit 400 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. The arithmetic processing device of the control unit 400 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the test device 1 to each of the above-mentioned units of the test device 1 via the input/output interface device.

The control unit 400 is connected to a display unit 300, which is a display means having a display screen 301 that displays the status of the measurement operation, images, etc., and a touch panel 302, which is connected to the control unit 400 and is an input means used when an operator inputs information, etc., to the control unit 400 of the test device 1. The display unit 300 is composed of a liquid crystal display device or the like. The touch panel 302 is overlaid on the display screen 301 of the display unit 300.

The control unit 400 also includes a damage detection unit 401 that detects damage to the chip 14 from the captured images 501 and 502. The function of the damage detection unit 401 is realized by the arithmetic processing device performing arithmetic processing according to a computer program stored in the storage device.

(Pick-up method)
Next, this specification will explain a pick-up method according to the first embodiment with reference to the drawings. Fig. 6 is a flow chart showing the flow of the pick-up method according to the first embodiment. The pick-up method is a method for picking up the chip 14 from the wafer unit 17, and in the first embodiment, it is also a method for the test device 1 to perform a measurement operation on the chip 14 picked up from the wafer unit 17, i.e., a method for measuring the flexural strength of the chip 14. That is, in the first embodiment, the pick-up method is a measurement operation of the test device 1.

The pick-up method according to the first embodiment is performed by the test device 1 when an operator places a cassette 4 containing multiple wafer units 17 on the cassette mounting table 3, operates the touch panel 302 to input measurement content information to the control unit 400, and the control unit 400 receives an instruction from the operator to start measurement. The measurement content information includes the positions of the chips 14 that are pushed up by the push-up pins 42-1, 42-2, and 42-3 from the tape 15, which is the subject of measurement of flexural strength, etc., that is, the chips 14 to be picked up from the tape 15.

That is, the position of the chip 14 to be picked up from the tape 15 is registered in advance in the control unit 400 before the pick-up method according to the first embodiment is performed. Note that in this specification, during the performance of the pick-up method, the operator may operate a touch panel or the like to select the chip 14 to be picked up from the tape 15 each time a chip 14 is picked up. As shown in FIG. 6, the pick-up method includes a holding step 1001, a damage detection step 1002, a pushing-up step 1003, a pick-up step 1004, and a measurement step 1005.

(holding step)
Fig. 7 is a cross-sectional view showing the holding step of the pick-up method shown in Fig. 6. The holding step 1001 is a step in which the ring frame 16 of the wafer unit 17 is held by the frame holding unit 7.

In the holding step 1001, the control unit 400 controls the loading/unloading unit 5 to load the wafer unit 17 including the untested wafer 10 from the cassette 4 and temporarily place it on the pair of temporary placement rails 6, and controls the loading/unloading unit 5 to place the ring frame 16 of the wafer unit 17 temporarily placed on the temporary placement rails 6 on the lowered frame support member 22 of the frame holding unit 7. In the holding step 1001, the control unit 400 controls the frame holding unit 7 to raise the frame support member 22, and as shown in FIG. 7, the ring frame 16 is sandwiched between the frame pressing member 23 and the frame support member 22, and the wafer unit 17 is fixed by the frame holding unit 7.

(Damage Detection Step)
Fig. 8 is a cross-sectional view showing the damage detection step of the pick-up method shown in Fig. 6. Fig. 9 is a plan view showing the imaging range of the imaging unit on the wafer in the damage detection step of the pick-up method shown in Fig. 6. Fig. 10 is a diagram showing an example of an image captured by the imaging unit in the damage detection step of the pick-up method shown in Fig. 6. Fig. 11 is a diagram showing another example of an image captured by the imaging unit in the damage detection step of the pick-up method shown in Fig. 6.

In the damage detection step 1002, before the push-up step 1003 is performed, the chip 14 pushed up by the push-up pins 42-1, 42-2, and 42-3 in the push-up step 1003 is imaged by the imaging camera 60 to form the imaged images 501 and 502, and the damage 141 of the chip 14 is detected from the imaged images 501 and 502. In the damage detection step 1002, the control unit 400 controls the moving mechanism 30 based on the measurement content information to move the frame holding unit 7, and positions the chip 14 picked up from the tape 15 of the wafer unit 17 including the ring frame 16 held by the frame holding unit 7 above the push-up mechanism 40 and below the imaging camera 60, as shown in FIG. 8.

At this time, in the first embodiment, the chip 14 (hereinafter, indicated by reference symbol 14-1) to be pushed up by the push-up pins 42-1, 42-2, and 42-3, i.e., the chip 14 to be picked up from the tape 15, is located in the center of the imaging range 61 (indicated by the dashed line in FIG. 9) of the imaging camera 60 on the surface 11-1 of the wafer 10. In the damage detection step 1002, the control unit 400 irradiates the wafer 10 with light from the light source unit 50 through the tape 15, and causes the imaging camera 60 to capture the chip 14-1 and the surroundings of the chip 14-1 on the wafer 10 of the wafer unit 17 fixed to the frame holding unit 7, thereby acquiring the captured images 501 and 502 shown in FIG. 10 and FIG. 11 (step 1002-1).

The captured images 501, 502 are obtained by irradiating light from the light source unit 50 and capturing images of the chip 14-1, etc. with the imaging camera 60, so that the cutting groove 18 (shown in white in Figures 10 and 11) is brighter (has a higher amount of light) than the chips 14-1, 14 (shown in black in Figures 10 and 11). The control unit 400 detects the pixels in the captured images 501, 502 where the amount of light exceeds a predetermined value as the cutting groove 18, and detects the position of the outer edge of the chip 14-1.

In the damage detection step 1002, the damage detection unit 401 of the control unit 400 judges whether the number of pixels whose light amount exceeds a predetermined value inside the outer edge of the chip 14-1 whose position has been detected exceeds a predetermined number, and judges whether the chip 14-1 has a scratch 141 (step 1002-2). If the chip 14-1 does not have a scratch 141, the captured image 501 has a light amount of all pixels inside the outer edge of the chip 14-1 that is equal to or less than a predetermined value, as shown in FIG. 10. Also, if the chip 14-1 has a scratch 141 penetrating the chip 14-1, the scratch 141 passes light from the light source unit 50, so that the captured image 502 has a number of pixels whose light amount indicates the scratch 141 inside the outer edge of the chip 14-1 that exceeds a predetermined value, as shown in FIG. 11. In the present invention, in the damage detection step 1002 , the damage detection section 401 of the control unit 400 may perform binarization processing or labeling processing on the captured images 501 and 502 .

In the damage detection step 1002, if the damage detection unit 401 of the control unit 400 determines that the number of pixels whose light amount exceeds a predetermined value inside the chip 14-1 from the outer edge of the chip 14-1 whose position has been detected is less than a predetermined number, as shown in FIG. 10, it determines that there is no scratch 141 on the chip 14-1 (step 1002-2: No) and proceeds to the push-up step 1003. In the first embodiment, in the damage detection step 1002, if the damage detection unit 401 of the control unit 400 determines that the number of pixels whose light amount exceeds a predetermined value inside the chip 14-1 from the outer edge of the chip 14-1 whose position has been detected is greater than a predetermined number, as shown in FIG. 11, it determines that there is a scratch 141 on the chip 14-1 (step 1002-2: Yes) and ends the pickup method.

(Upward thrust step)
Fig. 12 is a cross-sectional view of a state where the chip and the push-up mechanism are aligned in the push-up step of the pickup method shown in Fig. 6. Fig. 13 is a cross-sectional view of a state where the tape is suction-held on the outer layer of the push-up mechanism in the push-up step of the pickup method shown in Fig. 6. Fig. 14 is a cross-sectional view of a state where the bottom surface of the pickup collet is in contact with the chip to be picked up in the push-up step of the pickup method shown in Fig. 6.

In the push-up step 1003, after the holding step 1001 is performed, the chip 14-1 is pushed up from the tape 15 side of the wafer unit 17 by the push-up pins 42-1, 42-2, and 42-3 through the tape 15. In the push-up step 1003, the control unit 400, with the on-off valves 46 and 75 closed, controls the moving mechanism 30 to adjust the moving position of the frame holding unit 7 based on the position of the outer edge of the chip 14-1 detected in the damage detection step 1002, and controls the collet moving mechanism 80 to move the pickup collet 76, thereby performing alignment of the chip 14-1 of the wafer 10, the push-up mechanism 40, and the pickup collet 76, as shown in FIG. 12. In the first embodiment, in the alignment, the outer edge of the chip 14-1 and the outer edge of the push-up pins 42-3 are made to face each other along the vertical direction, and the outer edge of the chip 14-1 and the outer edge of the lower surface 78 of the pickup collet 76 are made to face each other along the vertical direction.

In the push-up step 1003, the control unit 400 controls the push-up mechanism 40 to lower the push-up pins 42-1, 42-2, and 42-3, and then raises the entire push-up mechanism 40 so that the outer layer 41 of the push-up mechanism 40 and the upper surfaces of the push-up pins 42-1, 42-2, and 42-3 come into contact with the tape 15. Also, in the push-up step 1003, the control unit 400 opens the opening/closing valve 46 to suction and hold the tape 15 on the upper surface of the outer layer 41 of the push-up mechanism 40, as shown in FIG. 13.

In the push-up step 1003, as shown in FIG. 14, the control unit 400 controls the collet movement mechanism 80 to lower the pickup collet 76 and bring the bottom surface 78 of the pickup collet 76 into contact with the chip 14-1. In the push-up step 1003, the control unit 400 controls the push-up mechanism 40 to raise the push-up pins 42-1, 42-2, and 42-3, and controls the collet movement mechanism 80 to raise the pickup collet 76. At this time, in the push-up step 1003, the control unit 400 links the raising operation of the push-up pins 42-1, 42-2, and 42-3 and the raising operation of the pickup collet 76 so that the distance between the top surface of the first push-up pin 42-1 and the bottom surface 78 of the pickup collet 76 corresponds to the thickness of the chip 14-1 (in the first embodiment, the distance is the sum of the thickness of the chip 14-1 and the thickness of the tape 15). Thus, in the push-up step 1003, the push-up pins 42-1, 42-2, and 42-3 push up through the tape 15, and in particular, the chip 14 is peeled off from the tape 15 on the second push-up pin 42-2 and the third push-up pin 42-3.

(Pickup step)
Fig. 15 is a cross-sectional view of a state in which a chip to be picked up is sucked and held by the lower surface of a pickup collet in the pickup step of the pickup method shown in Fig. 6. Fig. 16 is a cross-sectional view of a state in which a chip sucked and held by a pickup collet is picked up from a tape in the pickup step of the pickup method shown in Fig. 6. Pick-up step 1004 is a step in which pickup collet 76 facing push-up pins 42-1, 42-2, 42-3 with wafer unit 17 between them holds chip 14-1 pushed up by push-up pins 42-1, 42-2, 42-3, and picks it up from tape 15.

In the pick-up step, the control unit 400 opens the on-off valve 75 to suck and hold the chip 14-1 on the lower surface 78 of the pick-up collet 76, as shown in FIG. 15. In the pick-up step, the control unit 400 controls the collet movement mechanism 80 to raise the pick-up collet 76, and picks up the chip 14-1, which is sucked and held on the lower surface 78 of the pick-up collet 76, from the tape 15, as shown in FIG. 16.

(Measurement step)
Fig. 17 is a cross-sectional view showing a state where a pair of support parts of a support unit support a chip in the measurement step of the pick-up method shown in Fig. 6. Fig. 18 is a cross-sectional view showing a state where the chip shown in Fig. 17 is pressed by an indenter and contacts an upper end of a support protrusion of a support part. Fig. 19 is a cross-sectional view showing a state where the chip shown in Fig. 18 is broken.

The measurement step 1005 is a step in which the chip 14-1 supported by the pickup collet 76 is placed on a pair of supports 211, the chip 14-1 supported by the pair of supports 211 is then pressed by the indenter 221 to break, and the load at which the chip 14-1 breaks is detected by the load measuring device 223. In the first embodiment, in the measurement step 1005, the control unit 400 controls the collet moving mechanism 80 to move the pickup collet 76 appropriately, controls the chip observation mechanism 100 to capture images of the front surface 11-1, the bottom surface 11-2, and the side surface defined in the measurement content information, acquires these images, stores them in a storage device, and then places the bottom surface 11-2 of the chip 14-1 on the pair of supports 211 of the strength measurement mechanism 200.

In embodiment 1, in the measurement step 1005, the control unit 400 controls the strength measurement mechanism 200 to lower the indenter 221 using the indenter moving unit 222, and as shown in FIG. 17, the tip of the indenter 221 is brought into contact with the surface 11-1 side of the chip 14-1, and the chip 14-1 is pressed by the indenter 221. In addition, the load (force in the Z-axis direction) applied to the indenter 221 by the pressing of the chip 14-1 is measured by the load measuring device 223, and the measurement result is output to the control unit 400 as appropriate.

In the measurement step 1005, the control unit 400 controls the strength measurement mechanism 200 to further lower the indenter 221, etc., and press the chip 14-1 further with the indenter 221, deforming the contact member 215 supporting the chip 14-1 and bending the chip 14-1. As a result, as shown in FIG. 18, the lower surface 11-2 side of the chip 14-1 comes into contact with the support protrusions 214 of the support base 213, the chip 14-1 is supported by the pair of support protrusions 214, and the load on the indenter 221 pressing the chip 14-1 increases. At this time, depending on the flexibility of the contact member 215, there may be cases where only the contact member 215 is deformed and the chip 14-1 is not bent.

In the measurement step 1005, the control unit 400 controls the strength measurement mechanism 200 to further lower the indenter 221, and destroy the chip 14-1, as shown in Fig. 19. When the chip 14-1 is destroyed, the load measured by the load measuring instrument 223 goes from a maximum value to zero. Therefore, the strength measurement mechanism 200 can detect the timing at which the chip 14-1 is destroyed from the change in the value of the load measured by the load measuring instrument 223. Also, the maximum value of the load measured by the load measuring instrument 223 corresponds to the flexural strength of the chip 14-1. In the present invention, in measurement step 1005, control unit 400 calculates the flexural strength value σ from σ = 3LW/2bh ² (L: distance between fulcrums (mm), W: load value (N) of indenter 221, b: width (mm) of tip 14-1, h: thickness (mm) of tip 14-1) based on the maximum value of the measured load, the distance between fulcrums 214-1 of support part 211, the thickness of tip 14-1, and the width of tip 14-1 (direction perpendicular to the direction between the fulcrums), and stores the flexural strength value σ in control unit 400 together with the position information of tip 14-1 and whether or not tip 14-1 is damaged.

When the control unit 400 of the test device 1 has measured the flexural strength of all of the chips 14-1 whose positions have been entered into the measurement content information, it ends the measurement method.

Thus, the pickup method according to embodiment 1 performs push-up step 1003, pickup step 1004, and measurement step 1005 if no damage, ie, scratch 141, is detected in damage detection step 1002.

As described above, the pick-up method according to the first embodiment performs a damage detection step 1002 in which scratches 141 on the chip 14-1 are detected before performing the push-up step 1003. Therefore, the pick-up method can prevent the pick-up of a chip 14-1 having scratches 141 by detecting the presence or absence of scratches 141 on the chip 14-1 in the damage detection step 1002. As a result, the pick-up method has the effect of preventing broken chips of the chip 14-1 from adhering to the lower surface 78 of the pick-up collet 76, thereby preventing damage to the chip 14-1.

In addition, the pickup device 20 and test device 1 according to the first embodiment implement the pickup method described above, which has the effect of preventing debris from the chip 14-1 from adhering to the lower surface 78 of the pickup collet 76, thereby preventing damage to the chip 14-1.

[Embodiment 2]
A pickup method, pickup device, and test device according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 20 is a perspective view showing a part of a configuration example of the test device according to the second embodiment. Fig. 21 is a perspective view of a main part of the test device shown in Fig. 20. Fig. 22 is a flow chart showing the flow of the pickup method according to the second embodiment. In Figs. 20, 21, and 22, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

As shown in Figs. 20 and 21, the pickup device 20-2 and test device 1-2 according to the second embodiment are the same as the pickup device 20 and test device 1 according to the first embodiment, except that they are provided with a cleaning tool support part 91 that supports a cleaning tool 90 that cleans the lower surface 78 of the pickup collet 76. In the second embodiment, the cleaning tool support part 91 is disposed next to the lower imaging unit 102 in the Y-axis direction (i.e., at a position that overlaps with the movement path of the pickup collet 76). In the second embodiment, the cleaning tool support part 91 is disposed between the lower imaging camera 103 of the lower imaging unit 102 and the chip support base 114. The cleaning tool support part 91 is formed in a columnar shape erected from the device main body 2, and is sucked and held on the upper surface by being sucked from a suction source.

In the first embodiment, the cleaning tool 90 is formed into a plate shape with a square planar shape and a constant thickness. In the first embodiment, the cleaning tool 90 is made of nonwoven fabric.

As shown in FIG. 22, the pickup method according to the second embodiment is the same as the pickup method according to the first embodiment except that, after performing the damage detection step 1002, the push-up step 1003, the pickup step 1004, and the measurement step 1005 are performed regardless of the result of the determination in the damage detection step 1002, i.e., the presence or absence of a scratch 141 on the chip 14, and after the measurement step 1005, it is determined (step 1006) whether or not a scratch 141 was detected on the chip 14-1 in the damage detection step 1002, and if it is determined that the scratch 141 was detected (step 1006: Yes), the cleaning step 1007 is performed, and if it is determined that the scratch 141 was not detected (step 1006: No), the process ends.

Cleaning step 1007 is a step for cleaning the underside 78, which is the holding surface that holds the chip 14-1 of the pickup collet 76. In cleaning step 1007, the control unit 400 controls the collet movement mechanism 80 to slide the underside 78 of the pickup collet 76 a predetermined number of times over the cleaning tool 90 supported by the cleaning tool support portion 91, thereby removing broken debris from the underside 78 of the pickup collet 76.

The pickup method, pickup device 20-2, and test device 1-2 according to the second embodiment perform a damage detection step 1002 to detect damage to the chip 14-1 before performing the push-up step 1003. For this reason, the pickup method, pickup device 20-2, and test device 1-2 according to the second embodiment detect the presence or absence of damage to the chip 14-1 in the damage detection step 1002, and thus, when a damaged chip 14-1 is picked up, the underside 78 of the pickup collet 76 is cleaned in the cleaning step 1007, and the damaged debris is prevented from being removed from the underside 78. As a result, the pickup method, pickup device 20-2, and test device 1-2 according to the second embodiment have the effect of preventing damage to the chip 14-1 peeled off from the tape 15, similar to the first embodiment.

The present invention is not limited to the above-mentioned embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the embodiment, the test device 1 measures the flexural strength of the chip 14-1, but in the present invention, the strength of various test pieces may be measured, not limited to the chip 14-1. Also, in the first embodiment, the pickup devices 20 and 20-2 constitute a part of the test devices 1 and 1-2, but in the present invention, the pickup devices 20 and 20-2 are not limited to this, and may be standalone devices without constituting other devices such as the test devices 1 and 1-2.

1, 1-2 Test device 7 Frame holding unit 10 Wafer 11-2 Lower surface 14, 14-1 Chip (test piece)
15 Tape 16 Ring frame 17 Wafer unit 20, 20-2 Pick-up device 42-1 First push-up pin (push-up member)
42-2 Second push-up pin (pushing up member)
42-3 Third push-up pin (pushing up member)
60: Imaging camera 76: Pickup collet 80: Collet moving mechanism (transport unit)
141 Wound (damage)
210 Support unit 211 Support portion 212 Predetermined interval 221 Indenter 222 Indenter moving unit 223 Load measuring device (load measuring means)
400 Control unit (controller)
401 Damage detection unit 501, 502 Captured image 1001 Holding step 1002 Damage detection step 1003 Push-up step 1004 Pick-up step

Claims (4)

A pick-up method for picking up chips from a wafer unit in which a wafer is divided into a plurality of chips by forming cutting grooves penetrating the wafer between the chips and the chips are attached to a tape and the outer periphery of the tape is attached to a ring frame, comprising:
a holding step of holding the ring frame of the wafer unit by a frame holding unit;
a push-up step of pushing up the chips through the tape from the tape side of the wafer unit by a push-up member after carrying out the holding step;
a pick-up step of holding the chip pushed up by the push-up member with a pick-up collet facing the push-up member across the wafer unit and picking up the chip from the tape;
a damage detection step of, before carrying out the push-up step, irradiating the wafer with light from a light source unit through the tape, capturing an image of the chip pushed up in the push-up step with an imaging camera to form an image, and detecting damage to the chip from the captured image,
In the damage detection step, the imaging camera is disposed on one side of the wafer, and the light source unit is disposed on the other side of the wafer to determine whether or not the chip has a through-hole scratch . 2. The pick-up method according to claim 1, wherein the pushing up step and the pick-up step are carried out when it is determined in the damage detection step that the chip has no penetrating damage. A pickup device for picking up chips from a wafer unit in which a wafer is divided into a plurality of chips by forming cutting grooves penetrating the wafer between the chips and the chips are attached to a tape and the outer periphery of the tape is attached to a ring frame, comprising:
a frame holding unit that holds a ring frame of the wafer unit;
a push-up member for pushing up a chip through the tape of the wafer unit including the ring frame held by the frame holding unit;
a pickup collet which faces the push-up member across the wafer unit and holds the chip pushed up by the push-up member and picks it up from the tape;
a light source unit for irradiating the wafer with illumination light through the tape;
an imaging camera for imaging the tip pushed up by the push-up member to form an image;
a controller for controlling the frame holding unit, the push-up member, the pickup collet, and the imaging camera;
Before pushing up the chip with the push-up member, the controller irradiates light from the light source unit through the tape onto the wafer, and captures an image of the chip pushed up by the push-up member with an imaging camera to obtain an image, and when obtaining the image, the imaging camera is disposed on one side of the wafer and the light source unit is disposed on the other side of the wafer,
The controller includes a damage detection unit that determines whether or not the chip has a through-hole scratch from the captured image. The pickup device according to claim 3 ;
a support unit having a pair of support parts arranged at a predetermined interval and supporting a lower surface of the chip;
an indenter disposed above the support unit and between the pair of support portions;
an indenter moving unit that moves the indenter relatively close to the tip supported by the pair of support parts;
a load measuring device that measures a load applied by the indenter to the test piece supported by the pair of support portions;
and a transport unit that transports the chip picked up by the pickup collet to the support unit.

Images