JPS5837142B2 - Method for producing wholly aromatic polyamide film - Google Patents
Method for producing wholly aromatic polyamide filmInfo
- Publication number
- JPS5837142B2 JPS5837142B2 JP4709875A JP4709875A JPS5837142B2 JP S5837142 B2 JPS5837142 B2 JP S5837142B2 JP 4709875 A JP4709875 A JP 4709875A JP 4709875 A JP4709875 A JP 4709875A JP S5837142 B2 JPS5837142 B2 JP S5837142B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- wholly aromatic
- aromatic polyamide
- weight
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Description
【発明の詳細な説明】
本発明は、全芳香族ポリアミドフィルムの製造法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a wholly aromatic polyamide film.
芳香族ポリアミドは、その高い耐熱性と、優れた電気的
特性のため斯界の用途開発が盛んに行われてきた。Aromatic polyamides have been actively developed for use in this field because of their high heat resistance and excellent electrical properties.
全芳香族ポリアミドは不融性であるため溶融成形ができ
ないので、一般には後述の如きアミド系溶媒に溶解して
得たドーブから湿式成形あるいは乾式成形により成形さ
れている。Since fully aromatic polyamides are infusible and cannot be melt-molded, they are generally formed by wet molding or dry molding from a dove obtained by dissolving them in an amide solvent as described below.
しかしながら、湿式成形法または乾式成形法によってフ
イルムを成形する場合には経済上、技術上あるいは得ら
れるフィルムの性能上に次のごとき欠点を有している。However, when a film is formed by a wet molding method or a dry molding method, there are the following disadvantages in terms of economy, technology, and performance of the obtained film.
すなわち、前者においては凝固剤の選択が問題であり、
凝固剤の凝固力、凝固時間、凝固温度等に特別な配慮を
しても、なお不透明なフィルムとなり、すぐれた機械的
、電気的性能を有するフイルムを得にくいという欠点が
ある。In other words, in the former case, the problem is the selection of coagulant;
Even if special consideration is given to the coagulation power, coagulation time, coagulation temperature, etc. of the coagulant, the resulting film is still opaque and has the disadvantage that it is difficult to obtain a film with excellent mechanical and electrical performance.
また、後者は加熱雰囲気または加熱板に接触させて溶媒
を蒸発除去させる方法であるが、般に用いられるアミド
系溶媒は沸点が高<200℃前後もあるうえ、蒸発潜熱
が大きいので乾燥にはかなり高温で長時間を要するとい
う欠点がある。In addition, the latter is a method in which the solvent is evaporated and removed by contact with a heated atmosphere or a hot plate, but the commonly used amide solvents have a high boiling point of around <200°C and have a large latent heat of vaporization, so it is difficult to dry. The drawback is that it requires a long time at a fairly high temperature.
したがって、現在全芳香族ポリアミドの透明なフイルム
は市場にほとんど存在せず、電気絶縁材として一部に湿
式紡糸によって得られた繊維とフイツプリッドとから抄
紙された絶縁紙が存在するのみである。Therefore, there are almost no transparent films made of wholly aromatic polyamides on the market at present, and only insulating papers made from Fiplid and fibers obtained by wet spinning exist as electrical insulating materials.
しかし、絶縁紙では数千ポルトの電界中で絶縁機能を維
持することは困難である。However, it is difficult for insulating paper to maintain its insulating function in an electric field of several thousand ports.
本発明者らは、全芳香族ポリアミドからなるフイルムの
製造方法において上記の欠点を改善すべく鋭意検討した
結果、本発明に到達したものである。The present inventors have arrived at the present invention as a result of intensive studies aimed at improving the above-mentioned drawbacks in a method for producing a film made of wholly aromatic polyamide.
すなわち本発明は、全芳香族ポリアミドとアミド系溶媒
とからなる溶液から薄膜を形成し、該薄膜を熱風乾燥に
よってフィルムを製造するに当り、残存溶媒量(対薄膜
、以下同じ。That is, in the present invention, a thin film is formed from a solution consisting of a wholly aromatic polyamide and an amide solvent, and when the thin film is dried with hot air to produce a film, the amount of residual solvent (relative to the thin film, hereinafter the same) is determined.
)が30重量φ以下になるまで乾燥したのち水洗するこ
とを要旨とするものである。) is dried until it has a weight of 30 φ or less, and then washed with water.
本発明にいう全芳香族ポリアミドとは、次の一般式で示
される単位から構成される主鎖が実質的に芳香族基から
なるものをいう。The wholly aromatic polyamide as used in the present invention refers to one whose main chain consisting of units represented by the following general formula consists essentially of aromatic groups.
式中、φ1およびφ2は次に示すグループより選ばれた
ものである。In the formula, φ1 and φ2 are selected from the following group.
−HN−φ,−NH−CO一φ2−co−および/また
はーHN一φ2−CO−
?た、本発明にいう全芳香族ボリアミドには重合体構成
単位の20モルφ以下が上記の構成単位以外の構成単位
より成っているものも含まれる。-HN-φ, -NH-CO-φ2-co- and/or -HN-φ2-CO-? In addition, the wholly aromatic polyamide referred to in the present invention includes those in which 20 moles φ or less of the polymer constitutional units consist of constitutional units other than the above-mentioned constitutional units.
本発明に用いるアミド系溶媒とは、次のグループから選
ばれる少なくとも一種の化合物をさし、ポリマーの種類
によって適宜選ばれ使用される。The amide solvent used in the present invention refers to at least one compound selected from the following group, and is appropriately selected and used depending on the type of polymer.
N,N′−ジメチルアセトアミド、N−メチル(2)ピ
ロリドン、N−メチルピペリドン、N−メチル力プロラ
クタム、N,N,N’,N’−テトラメチル尿素、N,
N,N′,N′,N′,N′−ヘキサメチルホスホルア
ミド。N,N'-dimethylacetamide, N-methyl(2)pyrrolidone, N-methylpiperidone, N-methylprolactam, N,N,N',N'-tetramethylurea, N,
N,N',N',N',N'-hexamethylphosphoramide.
これらのアミド系溶媒は、本発明において全芳香族ポリ
アミドの重合溶媒としても用いられるので、重合体溶液
は対応するジアミンとジカルボン酸ハライドあるいはア
ミノカルボン酸ハライド塩酸塩から、これらアミド系溶
媒中でいわゆる低温溶液重合法により直接得ることがで
きる。These amide solvents are also used as polymerization solvents for wholly aromatic polyamides in the present invention, so the polymer solution is prepared from the corresponding diamine and dicarboxylic acid halide or aminocarboxylic acid halide hydrochloride in these amide solvents. It can be obtained directly by low temperature solution polymerization method.
本発明においては上述の如く低温溶液重合法によって製
造される溶液をそのままフイルム製造用ドーブとして用
いることもできる。In the present invention, the solution produced by the low-temperature solution polymerization method as described above can also be used as it is as a dove for film production.
この場合、重合工程において生成するハロゲン化水素の
中和にはC a ( OH) 2 ,L 1 0H,M
g ( OH) 2 ,A I ( OH)a,Zn(
OH)2等の水酸化物を用うるためCaC l,LiC
ltAlcl3 ,ZnC12等の塩類が必然的にドー
ブ中に含まれることになる。In this case, C a (OH) 2 , L 1 0 H, M
g (OH) 2 , A I (OH) a, Zn (
Since hydroxides such as OH)2 can be used, CaCl, LiC
Salts such as ltAlcl3 and ZnC12 are inevitably contained in the dove.
ドーブ中に含有される上記塩類の存在は溶液の安定性お
よびポリマーの溶解性向上に著しく有効である。The presence of the above-mentioned salts contained in the dove is extremely effective in improving the stability of the solution and the solubility of the polymer.
すなわちフイルム製造の際のドープのゲル化防止やフイ
ルムの不透明化防止に役立っている。That is, it is useful for preventing dope from gelling and film from becoming opaque during film production.
しかしながら、電解質である塩類を含む場合は電気絶縁
性がわるくなるので、すぐれた電気絶縁性能を有するフ
イルムを得るためにはフイルムを水洗することによって
これらの種類を除去する必要がある。However, if it contains salts, which are electrolytes, the electrical insulation properties deteriorate, so in order to obtain a film with excellent electrical insulation performance, it is necessary to remove these types by washing the film with water.
本発明において用いる成形用ドープ中のポリマーの濃度
は、使用するポリマーの種類や溶媒の種類によって異な
るが、一般にはlO〜20重量多であることが好ましい
。The concentration of the polymer in the molding dope used in the present invention varies depending on the type of polymer and solvent used, but is generally preferably 10 to 20% by weight.
本発明の方法によりフイルムを製造するには、まず得ら
れたドープを薄膜状に流延し、その膜面に熱風を吹き付
けて溶媒を蒸発させ、残存溶媒量が30重量多以下、望
ましくは25重量多以下に達した時に熱風による乾燥を
終了し、ひき続いて水洗することにより残存溶媒、塩類
およびモノマー等を除去、精製する。To produce a film by the method of the present invention, first, the obtained dope is cast into a thin film, and the film surface is blown with hot air to evaporate the solvent, so that the remaining solvent amount is 30% by weight or less, preferably 25% by weight. When the weight reaches below the weight limit, drying with hot air is terminated, and the remaining solvent, salts, monomers, etc. are removed and purified by subsequent washing with water.
数百ボイズ以上もある薄膜状の高粘性液体の熱風乾燥は
減率乾燥であるため、残存溶媒量が30重量多以上にな
った場合は乾燥速度が著しく低くなる。Hot air drying of a highly viscous liquid in the form of a thin film with hundreds of voids or more is a lapse rate drying process, so if the amount of residual solvent exceeds 30% by weight, the drying rate becomes extremely low.
また、残存溶媒量が30重量袈、望ましくは25重量多
以下となった半乾燥状態のフィルムはもはや水その他の
液体凝固浴に浸漬しても不透明化しない。Further, a semi-dry film in which the amount of residual solvent is 30% by weight or less, preferably 25% by weight or less, will no longer become opaque even when immersed in water or other liquid coagulation baths.
したがって、残存溶媒量が30重量φ以下、望ましくは
25重量多以下になった任意の時点で熱風乾燥から溶媒
や塩類等の抽出速度の大きい水洗精練に切換えることに
よって透明で、かつ電気絶縁性能のすぐれたフィルムを
短時間に製造することが可能となる。Therefore, at any point when the amount of residual solvent becomes 30 wt.φ or less, preferably 25 wt. It becomes possible to produce excellent films in a short time.
さらに連続的にフイルムを製造するには、走行するロー
ラあるいはエンドレスのスチールベルト表面に成形用ト
ープを薄膜状に目的とするフイルムの厚さに合わせて流
延し、その膜面に熱風を吹きつけて溶媒を蒸発させ、残
存溶媒量30重量多以下、望ましくは25重量多以下に
なった時、かくシテ得た薄膜をローラーあるいはエンド
レスのスチールベルト表面から剥離して水洗し、必要に
応じて乾燥することによって透明で、かつ電気絶縁性の
優れた連続フイルムが容易に得られる。In order to manufacture films continuously, a thin film of molding tope is cast on the surface of a moving roller or an endless steel belt to match the thickness of the desired film, and hot air is blown onto the film surface. When the solvent is evaporated and the remaining solvent amount is 30% by weight or less, preferably 25% by weight or less, the thin film thus obtained is peeled off from the surface of the roller or endless steel belt, washed with water, and dried if necessary. By doing so, a continuous film that is transparent and has excellent electrical insulation properties can be easily obtained.
上記のごとくにして得た溶媒を除去したフイルムは、そ
のままでも実用に供することができるが、必要な場合に
は熱処理、熱延伸すれはよい。The film obtained as described above from which the solvent has been removed can be put to practical use as it is, but it may be heat-treated or hot-stretched if necessary.
たとえば得られたフイルムを緊張下に150℃以上で熱
処理することによって目的とする強度や伸度を有するフ
イルムを製造することができる。For example, by heat-treating the obtained film at 150° C. or higher under tension, a film having desired strength and elongation can be produced.
加熱によってフイルムは数多収縮を起こすので熱処理は
フイルムを緊張一Fに加熱するかまたはタテ方向、ヨコ
方向、あるいはタテ、ヨコ両方向に延伸しながら行う方
法が好ましい。Since the film undergoes many contractions upon heating, it is preferable that the heat treatment be carried out by heating the film to a tension of 1 F, or by stretching the film in the vertical direction, in the horizontal direction, or in both the vertical and horizontal directions.
加熱は熱板加熱、雰囲気加熱、赤外線加熱、マイクロ波
加熱などのいずれの方法でもよいが、特に250℃以上
の高温で処理する場合は熱劣化を防ぐために窒素ガス等
の不活性ガス中で行うことが望ましい。Heating may be done by any method such as hot plate heating, atmospheric heating, infrared heating, or microwave heating, but in particular, when processing at a high temperature of 250°C or higher, it is performed in an inert gas such as nitrogen gas to prevent thermal deterioration. This is desirable.
これらの熱処理条件はフイルムの用途、ポリマーの種類
等によって定められる。These heat treatment conditions are determined depending on the use of the film, the type of polymer, etc.
本発明の方法によれば透明性、強靭性、耐熱性、電気的
性質、特に電気絶縁性のすぐれたフィルムを経済的に連
続的に製造することができる。According to the method of the present invention, a film with excellent transparency, toughness, heat resistance, electrical properties, especially electrical insulation properties can be produced continuously and economically.
電気絶縁性能は絶縁破壊電圧で評価することができ、J
IS C 2518にもとづき測定して150kV
/Xi以上のものが本発明の方法で容易に得ることがで
きる。Electrical insulation performance can be evaluated by dielectric breakdown voltage, J
150kV measured according to IS C 2518
/Xi or more can be easily obtained by the method of the present invention.
さらにポリマーと成形条件、熱処理条件を好適な範囲に
選択することによって、絶縁破壊電圧が250kV/a
m以上のフィルムをうろこともできる。Furthermore, by selecting the polymer, molding conditions, and heat treatment conditions within suitable ranges, the dielectric breakdown voltage can be increased to 250 kV/a.
It is also possible to scale film over m.
このような高い絶縁破壊電圧を有する本発明の方法によ
って得られるフイルムは、数千ボルト以上の高圧電場に
さらされる大型電動機等の回転子、固定子の絶縁材なら
びに高圧線被覆材として特に適している。The film obtained by the method of the present invention, which has such a high dielectric breakdown voltage, is particularly suitable as an insulating material for rotors and stators of large electric motors, etc. that are exposed to high-voltage electric fields of several thousand volts or more, and as a high-voltage wire coating material. There is.
一般に、使用される電圧が高くなればなるほど高い発熱
が伴い、ときには使用材料が200℃以上になることが
あるから、通常の熱可塑性ポリマーをそのような用途に
使用した場合には熱分解や融解がおこるので、そのよう
な目的のためにはいわゆるポリイミド・ポリアミドイミ
ド系のラダー構造の高分子素材が開発されているが、そ
のようなポリマーは一般には高価なものであり、かつ製
造工程的にも複雑となるから、経済的に不利である。In general, the higher the voltage used, the more heat is generated, and sometimes the temperature of the material used can exceed 200°C, so if normal thermoplastic polymers are used in such applications, thermal decomposition or melting may occur. Therefore, so-called polyimide/polyamide-imide-based polymer materials with a ladder structure have been developed for such purposes, but such polymers are generally expensive and the manufacturing process is difficult. This is economically disadvantageous because it also becomes complicated.
これに対して本発明の方法によって得られる全芳香族ポ
リアミドフイルムは比較的安価な単量体、原料から得ら
れるので経済的にも有利である。In contrast, the wholly aromatic polyamide film obtained by the method of the present invention is economically advantageous because it can be obtained from relatively inexpensive monomers and raw materials.
以下に実施例と比較実施例を示して本発明をさらに具体
的に説明するが、本発明は実施例に限定されるものでは
ない。EXAMPLES The present invention will be explained in more detail by showing Examples and Comparative Examples below, but the present invention is not limited to the Examples.
なお、例中の「部」は「重量部」を意味する。Note that "parts" in the examples mean "parts by weight."
比較実施例 1
特公昭35−14399号公報に記載された方法にした
がって蒸留、精製されたm−フエニレンジアミン64,
8部と酸化バリウム存在下に蒸留された無水N,d−ジ
メチルアセトアミド5 6 7. 6部とを580rI
Ll容器の内径70mmφ、高さ150朋の円筒形ガラ
ス製容器に入れN2気流中にて容器内壁とのクリアラン
ス3朋のラセン形攪拌棒で激しくかきまぜ均一に溶解後
、容器を氷冷し粉末のイソフタロイルクロライド121
.8部を内温が30℃をこえないように注意しながら加
えた。Comparative Example 1 m-phenylenediamine 64, distilled and purified according to the method described in Japanese Patent Publication No. 35-14399,
8 parts of anhydrous N,d-dimethylacetamide distilled in the presence of barium oxide 5 6 7. 6 parts and 580rI
Place the powder in a cylindrical glass container with an inner diameter of 70 mmφ and a height of 150 mm in a N2 gas flow with a helical stirring rod having a clearance of 3 mm from the inner wall of the container to uniformly dissolve the powder. Isophthaloyl chloride 121
.. 8 parts were added while being careful not to allow the internal temperature to exceed 30°C.
添加には約2分を要した。Addition took approximately 2 minutes.
イソフタロイルクロライドを添加後30分間室温で攪拌
を続けたところ、反応物は淡黄色の粘稠な液体となった
。After adding isophthaloyl chloride, stirring was continued at room temperature for 30 minutes, and the reaction product became a pale yellow viscous liquid.
かくして得られた反応物中にはポリ・m−フェニレンイ
ソフタラミドが18重量饅含有されていた。The reaction product thus obtained contained 18 weight portions of polym-phenylene isophthalamide.
大量の冷水を入れたミキサーを激しく攪拌しつつ取り出
した反応物の一部を滴下し、生じた沈澱を果て乾燥し、
N,N’−ジメチルアセトアミド中25℃、濃度0.5
,i/7100mA’C”ウヘローデ型粘度計を用いて
測定された値から求めたηinhは154であった。A portion of the reactant taken out was dropped into a mixer containing a large amount of cold water while stirring vigorously, and the resulting precipitate was dried.
25°C in N,N'-dimethylacetamide, concentration 0.5
, i/7100mA'C" ηinh was 154, which was determined from the value measured using an Uherode viscometer.
残りの反応物に粉末の水酸化カルシウム22.2部を冷
却下に加えて中和してフィルム成形用ドープを得た。22.2 parts of powdered calcium hydroxide was added to the remaining reaction product under cooling to neutralize it to obtain a film-forming dope.
このドープをアブリケーターで200n角の硬質ガラス
板に300μの厚さに均一に塗付した。This dope was uniformly coated to a thickness of 300 μm on a 200 nm square hard glass plate using an ablator.
ドープを塗付したガラス板を100℃の熱風循環乾燥機
に入れ20分間乾燥した後、フィルムの一部を切り取り
残存溶媒量を測定し、残りの大部分を常温の水中に入れ
残存溶媒、含有塩類およびモノマーなどを水洗除去した
。After putting the glass plate coated with the dope in a hot air circulation dryer at 100°C and drying it for 20 minutes, a part of the film was cut off to measure the amount of remaining solvent, and most of the remaining film was put in water at room temperature to determine the remaining solvent and content. Salts, monomers, etc. were removed by washing with water.
60分間水洗したところ、フイルムは完全に白化不透明
となった。After washing with water for 60 minutes, the film became completely white and opaque.
水洗後のフイルムを乾燥してから枠に固定して300℃
で2分間熱処理をしたが外観は変らなかった。After washing the film, dry it and fix it on the frame at 300℃.
Although it was heat treated for 2 minutes, the appearance did not change.
なお、水洗前の残存溶媒量は37重量係であった。Note that the amount of residual solvent before washing with water was 37% by weight.
得られたフィルムの強度は7Kg/tnri, 伸度8
7係、絶縁破壊電圧は30kV/ramであった。The strength of the obtained film was 7Kg/tnri, and the elongation was 8.
In Section 7, the dielectric breakdown voltage was 30 kV/ram.
実施例 1
比較実施例1で用いたのと同じドーブを比較実施例1と
全く同じ方法でガラス板に塗付したものを130℃の熱
風循環乾燥機に入れ15分間乾燥した後、比較実施例l
と同様に残存溶媒量の測定と水洗による精練を行った。Example 1 The same dove used in Comparative Example 1 was applied to a glass plate in exactly the same manner as in Comparative Example 1, and after drying for 15 minutes in a hot air circulation dryer at 130°C, Comparative Example l
In the same manner as above, the amount of residual solvent was measured and scouring was performed by washing with water.
残存溶媒量は24.2重量饅であった。The amount of residual solvent was 24.2 weight cakes.
得られたフィルムの透明度は非常に高く、すぐれた外観
を呈していた。The resulting film had very high transparency and an excellent appearance.
かくして得られたフイルムをさらに300℃で2分間、
N2気流中で熱処理を行ったところ、強度1 5.3k
y/rat、伸度79.3俤、絶縁破壊電圧196k■
/Bのフィルムが得られた。The film thus obtained was further heated at 300°C for 2 minutes.
When heat treated in a N2 stream, the strength was 1 5.3k.
y/rat, elongation 79.3 yen, dielectric breakdown voltage 196k■
/B film was obtained.
゛実施例2〜6および比較実施例2〜6
表1に示した各例は、フィルムの製造条件と得られたフ
イルムの機械的性能と絶縁破壊電圧を示したものである
。゛Examples 2 to 6 and Comparative Examples 2 to 6 Each example shown in Table 1 shows the film manufacturing conditions and the mechanical performance and dielectric breakdown voltage of the obtained film.
なお、各例とも熱風乾燥後に30〜50℃の温水で水洗
、精練を行った。In each case, after drying with hot air, washing and scouring were performed with warm water of 30 to 50°C.
〔A〕:ジアミン
〔C〕.ジカルボン酸クロリド
MPD:m−フエニレンジアミン
DDPM: 4 ,4−ンアミノジフェニルメタンPA
BC:P−アミノベンゾイルクロリド塩酸塩IPC:イ
ソフタロイルクロライド
TPC:テレフタ口イルクロライド
DMAC:N,N’−ジメチルアセトアミドNMP:
N−メチル−2−ピロリドン
TMU:テトラメチル尿素
(a)96%硫酸中、C=0.5,25℃で測定(b)
ポリマー濃度(重量多)対全溶液実施例 7
比較実施例lで用いたドープをTダイのスリット巾が0
.12mmで長さが500j!mのスリットから吐出量
3Qcc/分で吐出させ、50CIIL/分で走行する
エンドレススチールベルト上に125μの厚さに均一に
流延し、この流延薄膜面に150℃の熱風を向流方向か
ら吹き付け10分間乾燥した。[A]: Diamine [C]. Dicarboxylic acid chloride MPD: m-phenylenediamine DDPM: 4,4-aminodiphenylmethane PA
BC: P-aminobenzoyl chloride hydrochloride IPC: Isophthaloyl chloride TPC: Terephthaloyl chloride DMAC: N,N'-dimethylacetamide NMP:
N-Methyl-2-pyrrolidone TMU: Tetramethylurea (a) C=0.5 in 96% sulfuric acid, measured at 25°C (b)
Polymer concentration (weight) vs. total solution Example 7 The dope used in Comparative Example 1 was used when the slit width of the T die was 0.
.. 12mm and length 500j! It was discharged from a slit of m at a discharge rate of 3 Qcc/min, and was uniformly cast to a thickness of 125 μ on an endless steel belt running at 50 CIIL/min. Sprayed and dried for 10 minutes.
乾燥終了時点でエンドレススチールベルトからフイルム
を剥し、その一部を採取して残存溶媒量を測定したとこ
ろ12.3重量多であった。At the end of drying, the film was peeled off from the endless steel belt, a portion of it was sampled, and the amount of remaining solvent was measured, and it was found to be 12.3% by weight.
他の大部分を直ちに水洗槽に導入し40’Cの温水で3
0分間洗浄し、次いで乾燥してから320℃の熱処理機
中で連続的に定長熱処理を行って透明度のすぐれた厚さ
26μのフィルムを得た。Immediately introduce most of the other parts into the washing tank and rinse with 40'C hot water for 3 minutes.
The film was washed for 0 minutes, then dried, and then subjected to continuous heat treatment at a constant length in a heat treatment machine at 320°C to obtain a 26 μm thick film with excellent transparency.
得られたフィルムの強度は15−7k9/mm、伸度は
50%、絶縁破壊電圧は2 4 5kV/xiであった
。The obtained film had a strength of 15-7k9/mm, an elongation of 50%, and a dielectric breakdown voltage of 245 kV/xi.
実施例 8
洗浄、乾燥までは実施例7と同一条件で処理したフイル
ムを320℃でタテ,ヨコ、2軸方向に同時にそれぞれ
1.2倍熱延伸処理をして伸さl8μのフイルムを得た
。Example 8 A film treated under the same conditions as Example 7 until washing and drying was subjected to hot stretching treatment at 320° C. by 1.2 times in the vertical, horizontal, and biaxial directions at the same time to obtain a film with an elongation of 18μ. .
タテ方向の強度は22.3k!9/yxti,伸度は4
3%、ヨコ方向の強度は21.0〜/d、伸度は51%
、絶縁破壊電圧は2 6 0kV/dで極めて透明度の
よいフィルムであった。The strength in the vertical direction is 22.3k! 9/yxti, elongation is 4
3%, horizontal strength 21.0~/d, elongation 51%
The dielectric breakdown voltage was 260 kV/d, and the film was extremely transparent.
実施例 9
実施例5で用いたドープを直径loocIrL、長さ5
0(mのキャスティングドラム表面にキーサで厚さ30
0μに流延し、流延薄膜面に並流で145℃の熱風を2
0分間吹付けて乾燥して連続的にフイルムを剥しとった
。Example 9 The dope used in Example 5 had a diameter loocIrL and a length of 5.
Thickness of 30 m with Keysa on the surface of the casting drum.
0μ, and hot air at 145℃ was applied to the cast film surface in parallel flow for 2 hours.
The film was sprayed for 0 minutes, dried, and then continuously peeled off.
このフィルム中の残存溶媒量は18.8重量饅であった
。The amount of residual solvent in this film was 18.8 weight cakes.
ひき続き50℃の温水中で30分間洗浄し、次いで乾燥
後300’Cで3分間熱処理した。Subsequently, it was washed in warm water at 50° C. for 30 minutes, then dried and heat-treated at 300° C. for 3 minutes.
得られたフィルムの強度は20.3kg/xi、伸度は
68饅、絶縁破壊電圧は193k■/Rmであり、透明
度のよい厚さ55μのフイルムであった。The obtained film had a strength of 20.3 kg/xi, an elongation of 68 m, a dielectric breakdown voltage of 193 k/Rm, and a film with good transparency and a thickness of 55 μm.
Claims (1)
から薄膜を形成し、該薄膜を熱風乾燥してフイルムを製
造するに当り、残存溶媒量(対薄謝が30重量多以下に
なるまで乾燥したのち水洗することを特徴とする全芳香
族ポリアミドフィルムの製造法。1 A thin film is formed from a solution consisting of a wholly aromatic polyamide and an amide solvent, and the thin film is dried with hot air to produce a film. A method for producing a wholly aromatic polyamide film, which is characterized by washing with water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4709875A JPS5837142B2 (en) | 1975-04-17 | 1975-04-17 | Method for producing wholly aromatic polyamide film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4709875A JPS5837142B2 (en) | 1975-04-17 | 1975-04-17 | Method for producing wholly aromatic polyamide film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51122167A JPS51122167A (en) | 1976-10-26 |
| JPS5837142B2 true JPS5837142B2 (en) | 1983-08-13 |
Family
ID=12765694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4709875A Expired JPS5837142B2 (en) | 1975-04-17 | 1975-04-17 | Method for producing wholly aromatic polyamide film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837142B2 (en) |
-
1975
- 1975-04-17 JP JP4709875A patent/JPS5837142B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51122167A (en) | 1976-10-26 |
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