JPS5923252B2 - Method for manufacturing patterned synthetic resin flooring - Google Patents
Method for manufacturing patterned synthetic resin flooringInfo
- Publication number
- JPS5923252B2 JPS5923252B2 JP5790978A JP5790978A JPS5923252B2 JP S5923252 B2 JPS5923252 B2 JP S5923252B2 JP 5790978 A JP5790978 A JP 5790978A JP 5790978 A JP5790978 A JP 5790978A JP S5923252 B2 JPS5923252 B2 JP S5923252B2
- Authority
- JP
- Japan
- Prior art keywords
- chips
- base material
- synthetic resin
- adhesive
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は、熱可塑性合成樹脂を主成分としたチップを用
いて模様入り床材を製造する方法に関するものである７
Ｐ）に従来このタイプの床材の製造方法としては、数種
類の色の大きさの異るビニル製チップを適当な方法で混
合し、振動板等を用いてこれを基材上に散布し、チップ
間の間隙に熱溶融性物質、例えばｐｖＣマトリックスを
充填し、加熱加圧して一体のシートを成形する方法が知
られている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing patterned flooring using chips mainly composed of thermoplastic synthetic resin.
P) The conventional method for producing this type of flooring material is to mix vinyl chips of several colors and different sizes using an appropriate method, and to spread this onto the base material using a vibrating plate or the like. A known method is to fill a gap between chips with a heat-fusible material, such as a pvC matrix, and then heat and press it to form an integral sheet.
しかしながらこの公知の方法によれば、チップの混合お
よび配列は全く不規則なものとなり、シート上に現われ
るチップによる模様のパターンは極めて単調となり、チ
ップを利用して製作者の希望する模様を得ることはでき
なかつた。そのため本発明においては、この欠点を改良
する方法として、先ずシート状基材表面にあらかじめ熱
活性を有する接着剤を塗布乾燥しておき、床材製造時に
おいてこのシート状基材表面を一定の模様状に照射加熱
し、当該加熱部の接着剤を溶融させて粘着性を生ぜしめ
、当溶融部にのみチップを粘着させる方法を何度か繰返
して行うことにより、色及び形状の異る複雑な模様を形
成する模様入り合成樹脂床材の製造方法を提供するもの
である。以下本発明に係る床材の製造方法に関し、図面
に従つて詳細に説明すれば、図中１はシート状基材であ
り、適当な巻出装置から順次繰出される様セットされて
ある。基材１は、アスベスト、布等の上にあらかじめ熱
活性を有する接着剤を塗布乾燥したものを用意して用い
る。２は模様状孔部２’を有する断熱型板であり、３は
照射型加熱器であるが、前記基材１に型板２を押当てた
場合、断熱型板２の背後より照射して基材、の断熱型板
２模様状孔部２’ のみを照射加熱し、この模様該当部
の接着剤を溶融し粘着効果を生ぜしめる様作用する。However, according to this known method, the mixing and arrangement of the chips is quite irregular, the pattern of the chips appearing on the sheet is extremely monotonous, and it is difficult to utilize the chips to obtain the pattern desired by the fabricator. I couldn't. Therefore, in the present invention, as a method to improve this drawback, firstly, a heat-activated adhesive is applied to the surface of the sheet-like base material and dried, and the surface of the sheet-like base material is patterned in a certain pattern during flooring production. By repeating this process several times, the adhesive in the heated area is irradiated and heated, the adhesive in the heated area is melted to create stickiness, and the chip is made to stick only to the melted area. The present invention provides a method for manufacturing a patterned synthetic resin flooring material that forms a pattern. The method for manufacturing flooring according to the present invention will be described below in detail with reference to the drawings. In the drawing, reference numeral 1 denotes a sheet-like base material, which is set to be sequentially unrolled from a suitable unwinding device. The base material 1 is prepared by coating asbestos, cloth, or the like with a heat-activated adhesive and drying it. 2 is a heat insulating template having patterned holes 2'; 3 is an irradiation type heater; when the template 2 is pressed against the base material 1, irradiation is performed from behind the heat insulating template 2; Only the patterned hole portions 2' of the heat insulating template 2 of the base material are irradiated and heated to melt the adhesive in the patterned portions and produce an adhesive effect.
次に４はホッパー、４’は熱可塑性合成樹脂を主成分と
したチップであり、チップ作成に当つては、先ず合成樹
脂製シートを作成レ これをダイシングマシンで数−角
に切断したもの或いは粉砕機で不規則形状に粉砕したも
のを用いるが、チップの形状、大きさや色については製
作者の好みに合せて自由に選択出来る。５は傾斜振動板
であり、ホッパー４のチップ４’を基材上に散布する如
く作用する。Next, 4 is a hopper, and 4' is a chip whose main component is thermoplastic synthetic resin.When making chips, first a synthetic resin sheet is made, and this is cut into several squares with a dicing machine, or Chips are crushed into irregular shapes using a crusher, but the shape, size, and color of the chips can be freely selected according to the manufacturer's preference. Reference numeral 5 denotes a tilted diaphragm, which acts to scatter the chips 4' of the hopper 4 onto the substrate.
即ち、傾斜振動板５を介してチップは基材１全表面にま
んべんに散布されるのであるが・基材１の接着剤が溶融
している部分に散布されたチツプはそのまま基材に粘着
し、その他のチツプは基材に載置されているだけの状態
で次の工程に移行する。６は真空吸引機であり、先の散
布により基材１に粘着していないチツプを吸引除去し、
ホツパ一４に返送する。That is, the chips are evenly distributed over the entire surface of the base material 1 via the inclined diaphragm 5, but the chips that are scattered on the part of the base material 1 where the adhesive is melted remain on the base material. The chips adhere and the other chips remain on the base material before proceeding to the next step. 6 is a vacuum suction machine, which suctions and removes the chips that have not adhered to the base material 1 due to the previous scattering;
Return it to Hoppa-14.
そしてこの段階において、基材１表面上にはチツプＣｖ
ｃ．より一つの模様が形成されるものである。図中７，
７′，８，９，９１，１０，１１は、それぞれ別の断熱
型板〜断熱型板７の模様状孔部、照射型加熱器、ホツパ
熱可塑性合成樹脂を主成分としたチツプ、傾斜振動板及
び真空吸引器であり、前記工程においてチツプの粘着し
ていない基材１表面部に他のチツプによる模様を設ける
ために作用するものであるが、チツプの厚さについては
、同一であることが望ましく、又この一連の設備をさら
に設けて複雑なチツプ模様を設ける様設計することも可
能である。次に１２はプレスローノレ、１３はバツクア
ツプロールであり基材１表面に粘着したチツプ４１，９
１の接着を完全に定着させる様加圧する。１４は冷却用
たるみであるが、断熱型板及び加熱器を基材の移動速度
と同速度で接着剤を溶融させるのに必要な時間だけ移動
させ、クィツクリターン出来る装置を設ける場合は、基
材加本チツブ散布部の連続運転が可能であるからたるみ
１４は不安となり、代りに冷却ロールを入れて冷却する
ことも出来る。At this stage, there are chips Cv on the surface of the base material 1.
c. A single pattern is formed. 7 in the figure,
7', 8, 9, 91, 10, and 11 are respectively different heat insulation templates to patterned holes of heat insulation template 7, irradiation type heater, hopper chip mainly composed of thermoplastic synthetic resin, and tilt vibration. A plate and a vacuum suction device, which act in the above process to form a pattern with other chips on the surface of the base material 1 to which no chips have adhered, but the thickness of the chips must be the same. This is desirable, and it is also possible to design a complex chip pattern by further installing this series of equipment. Next, 12 is a press roll, 13 is a back-up roll, and chips 41 and 9 are attached to the surface of the base material 1.
Apply pressure to completely fix the adhesive in step 1. 14 is a slack for cooling, but when installing a device that allows quick return by moving the heat insulating template and heater at the same speed as the moving speed of the base material for the time necessary to melt the adhesive, Since the material processing and chipping distribution section can be operated continuously, the sagging 14 is a concern, and cooling rolls can be inserted instead to cool the material.
図中１５は、熱可塑性合成樹脂粉末１５′用ホツパ一で
あり、ホツパ一１５下部ロールから熱可塑性合成樹脂粉
末１５１を基材１上に散布す −る。１６はドクターナ
イフ、１７はロータリークリーナーブラシ、１８は吸引
機であり、ドクターナイフ１６ロータリークリーナーブ
ラシ１７により粉末１５１をまんべんなく基材１上にお
けるチツプ間の間隙に配分し、余剰粉末は吸引器１８で
吸引し、３ホツバ一１５に返却する。In the figure, 15 is a hopper for thermoplastic synthetic resin powder 15', and the thermoplastic synthetic resin powder 151 is sprinkled onto the substrate 1 from the lower roll of the hopper 15. 16 is a doctor knife, 17 is a rotary cleaner brush, and 18 is a suction device. The doctor knife 16 and the rotary cleaner brush 17 evenly distribute the powder 151 to the gaps between the chips on the base material 1, and the suction device 18 removes the excess powder. Aspirate it and return it to 3 Hotsuba-15.
１９は加熱器、２０はロトキユアタイプロータリープレ
スであり、基材１表面にチツプを固定し、チツプ間の間
隙に熱可塑性樹脂粉末を充満した上、再度加熱加圧展延
することにより一体のシート状物となすものである。19 is a heater, and 20 is a rotocure type rotary press, which fixes chips on the surface of the base material 1, fills the gaps between the chips with thermoplastic resin powder, and then heats and presses it again to form a single piece. It is made into a sheet-like material.
２１は冷却ロールであるが他にフエストン放冷法を用い
ることも可能である。21 is a cooling roll, but it is also possible to use the Feston cooling method.
本発明に係る模様入り床材の製造法は以上の如きもので
ある力ξ次に良効果を得た本発明の実施例について述べ
れば尚床材作成時における
フνスロール１２とバツクアツプロール１３間加圧力以
上により所定の模様を有する合成樹脂床材を連続的に作
成することが出来た。The method for manufacturing patterned flooring according to the present invention is as described above.Examples of the present invention which achieved good effects on the force ξ will be described. It was possible to continuously create synthetic resin flooring with a predetermined pattern by applying pressure greater than or equal to the pressure.
尚本発明における成形方法の大なる特徴は、あらかじめ
熱活性を有する接着剤を塗布乾燥した基材を用いたため
、接着効果を必要とする基材表面のチツブ間のすみづみ
まで、充分に接着剤の効果を出すことが出来た点にある
。そして又断熱型材、チツプの色、形、大きさ、材質を
自由に選択することにより、相当複雑なチツプ模様を製
造する方法に係るものであり、産業上利用効果は大きい
。The major feature of the molding method of the present invention is that it uses a base material that has been coated with a heat-activated adhesive and dried. The reason is that we were able to produce the following effects. The present invention also relates to a method of manufacturing fairly complex chip patterns by freely selecting the color, shape, size, and material of the heat insulating material and chips, and has great industrial effects.
第１図は、本発明により製造された模様入り合成樹脂床
材の一部平面図、第２図は、本発明に使用する装置の全
体を示す説明図、第３図、第４図は、各種断熱型板の拡
大平面図、第５図は、第３図Ａ−Ａ１部断面拡大図であ
る。
符号の説明、１・・・・・・シート状基材、２・・・・
・・断熱型板、２１・・・・・・断熱型板の模様状孔部
、３・・・・・・照射型加熱器、４・・・・・・ホツパ
一、４１・・・・・・チツプ、５・・・・・・傾斜振動
板、６・・・・・・真空吸引機、７・・・・・・断熱型
板、７１・・・・・・断熱型板の模様状孔部、８・・・
・・・照射型加熱器、９・・・・・・ホツパ一、９Ｉ・
・・・・・チツブ、１０・・・・・・傾斜振動板、１１
・・・・・・真空吸引機、１２・・・・・・プレスロー
ル、１３・・・・●・バツクアツプロール、１４・・・
・・・冷却用たるみ、１５・・・・・・ホツパ一、１５
′・・・・・・熱可塑性合成樹脂粉末、１６・・・・・
・ドクターナイフ、１７・・・・・・ロータリークリー
ナーブラシ、１８・・・・・・吸引Ａｌ９・・・・・・
加熱器、２０・・・・・・ロトキユアタイプロータリー
プレス、２１・・・・・・冷却ロール。FIG. 1 is a partial plan view of a patterned synthetic resin flooring material manufactured according to the present invention, FIG. 2 is an explanatory diagram showing the entire apparatus used in the present invention, and FIGS. 3 and 4 are: FIG. 5 is an enlarged plan view of various heat insulating templates, and FIG. 5 is an enlarged cross-sectional view of a portion taken along line A-A1 in FIG. Explanation of symbols, 1... Sheet-like base material, 2...
...Insulation template, 21...Patterned hole portion of heat insulation template, 3...Irradiation type heater, 4...Hopper, 41...・Chip, 5... Inclined diaphragm, 6... Vacuum suction machine, 7... Heat insulation mold plate, 71... Patterned hole of heat insulation mold plate. Part 8...
...Irradiation type heater, 9...Hotspa, 9I.
...Chitsubu, 10...Tilted diaphragm, 11
...Vacuum suction machine, 12...Press roll, 13...●・Backup roll, 14...
... Cooling slack, 15 ... Hotsupa one, 15
'...Thermoplastic synthetic resin powder, 16...
・Doctor knife, 17... Rotary cleaner brush, 18... Suction Al9...
Heating device, 20... Rotokyure type rotary press, 21... Cooling roll.
Claims (1)
表面を、一定の模様状孔部を有する断熱性の型板を介し
て照射加熱し、この模様該当部の接着剤が粘着性を有す
る程度に溶融せしめた後、同基材表面に熱可塑性樹脂を
主成分としたチップを散布し、該チップの重なりのない
敷設層を形成し、接着剤溶融部のチップを粘着させ、続
いて同基材表面に粘着していないチップを吸引除去し、
次に同基材表面の前記チップの粘着していない部分にお
いて、別途型板及びチップを用いて、前記と同様の作業
を繰返して行なうことにより、同基材表面に、チップに
よる所定の模様を形成し、続いて同基材を加熱加圧して
チップを同基材表面に充分に固定させ、しかる後チップ
間の間隙に熱可塑性合成樹脂粉末を充填した上、全体を
再度加熱加圧展延して一体のシート状物となすことを特
徴とする模様入り合成樹脂粉末の製造方法。1 The surface of a sheet-like base material coated with a heat-activated adhesive and dried is irradiated and heated through an insulating template having a certain pattern of holes, so that the adhesive in the areas corresponding to the pattern becomes sticky. After melting the adhesive to a certain extent, chips mainly composed of thermoplastic resin are sprinkled on the surface of the base material, a non-overlapping layer of the chips is formed, the chips in the adhesive melted part are adhered, and then the same chips are spread on the surface of the substrate. Suction removes chips that are not attached to the base material surface,
Next, by repeating the same operation as above using a separate template and chip on the part of the surface of the base material where the chip is not attached, a predetermined pattern with the chip is created on the surface of the base material. Then, the base material is heated and pressurized to sufficiently fix the chips to the surface of the base material, and then the gap between the chips is filled with thermoplastic synthetic resin powder, and the whole is heated and pressure-rolled again. A method for producing a patterned synthetic resin powder, the method comprising: forming a patterned synthetic resin powder into an integral sheet-like product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5790978A JPS5923252B2 (en) | 1978-05-15 | 1978-05-15 | Method for manufacturing patterned synthetic resin flooring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5790978A JPS5923252B2 (en) | 1978-05-15 | 1978-05-15 | Method for manufacturing patterned synthetic resin flooring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54148878A JPS54148878A (en) | 1979-11-21 |
| JPS5923252B2 true JPS5923252B2 (en) | 1984-05-31 |
Family
ID=13069110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5790978A Expired JPS5923252B2 (en) | 1978-05-15 | 1978-05-15 | Method for manufacturing patterned synthetic resin flooring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5923252B2 (en) |
-
1978
- 1978-05-15 JP JP5790978A patent/JPS5923252B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54148878A (en) | 1979-11-21 |
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