Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS5927214B2 - Vapor phase growth equipment - Google Patents
[go: Go Back, main page]

JPS5927214B2 - Vapor phase growth equipment - Google Patents

Vapor phase growth equipment

Info

Publication number
JPS5927214B2
JPS5927214B2 JP54166678A JP16667879A JPS5927214B2 JP S5927214 B2 JPS5927214 B2 JP S5927214B2 JP 54166678 A JP54166678 A JP 54166678A JP 16667879 A JP16667879 A JP 16667879A JP S5927214 B2 JPS5927214 B2 JP S5927214B2
Authority
JP
Japan
Prior art keywords
electrode
vapor phase
phase growth
ions
glow discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54166678A
Other languages
Japanese (ja)
Other versions
JPS5689835A (en
Inventor
幸雄 武田
真治 西浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP54166678A priority Critical patent/JPS5927214B2/en
Publication of JPS5689835A publication Critical patent/JPS5689835A/en
Publication of JPS5927214B2 publication Critical patent/JPS5927214B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/503Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using DC or AC discharges
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Silicon Compounds (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)

Description

【発明の詳細な説明】 本発明は、グロー放電によりプラズマ状態を発生させ、
例えば太陽電池に用いる非晶質シリコン膜を生成する気
相成長装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention generates a plasma state by glow discharge,
For example, the present invention relates to a vapor phase growth apparatus for producing amorphous silicon films used in solar cells.

非晶質シリコンは、太陽電池の材料としてすぐれた光学
的、電気的性質を持ち、可視光領域での光吸収係数は、
結晶シリコンのそれたりもはるかに人きい。
Amorphous silicon has excellent optical and electrical properties as a material for solar cells, and its light absorption coefficient in the visible light region is
The deviation of crystalline silicon is also much better.

このような非晶質シリコン膜は、モノシランSiH4を
グロー放電によりプラズマ状態にし、分解したシリコン
原子のイオンを基板上に成長させることにより形成され
、大面積のものもきわめて経済的に得ることができる。
Such an amorphous silicon film is formed by turning monosilane SiH4 into a plasma state by glow discharge and growing ions of decomposed silicon atoms on a substrate, and can be obtained extremely economically even over a large area. .

グロー放電を発生させるには、反応容器内の対向電極間
に直流電圧または高周波電圧を印加するか、反応容器外
に設けたコイルに高周波電流を流す。
To generate glow discharge, a direct current voltage or high frequency voltage is applied between opposing electrodes inside the reaction vessel, or a high frequency current is passed through a coil provided outside the reaction vessel.

本発明は、グロー放電によりプラズマ状態を発生させ、
イオンを基板上に堆積させて気相成長膜を得る装置にお
いて、膜質の均一性などの特性をさらに向上することを
目的とする。
The present invention generates a plasma state by glow discharge,
The purpose of this invention is to further improve characteristics such as uniformity of film quality in an apparatus for depositing ions on a substrate to obtain a vapor-phase grown film.

この目的は、イオンの通過が可能な格子電極を中間にし
て2つの電極を対向配置し、一方の電極と格子電極の間
にはグロー放電を起す電圧を印加し、格子電極と他方の
電極との間には、直流電圧を印加することによって達成
される。
The purpose of this is to arrange two electrodes facing each other with a grid electrode in the middle that allows ions to pass through, apply a voltage that causes glow discharge between one electrode and the grid electrode, and connect the grid electrode to the other electrode. This is achieved by applying a DC voltage between.

本発明は、プラズマ状態におけるイオンが必ずしも均一
ではなく、異なる原子価や、さらには中性原子も含まれ
ており、これらが混合して基板上に堆積すると、均一な
、特性の優れた膜質が得られないとの認識に基づく。
In the present invention, ions in a plasma state are not necessarily uniform, and include atoms with different valences and even neutral atoms, and when these are mixed and deposited on a substrate, a uniform film with excellent properties is obtained. It is based on the recognition that it cannot be obtained.

即ち、基板上に堆積するイオンの性質をできる限り均一
化し、もって膜質の向上を図ろうとするものである。
That is, the aim is to make the properties of the ions deposited on the substrate as uniform as possible, thereby improving the film quality.

以下、図を用いて、本発明の実施例について説明する。Embodiments of the present invention will be described below with reference to the drawings.

図において1は真空容器を示し、排気口2より真空ポン
プで排気しつつ、ガス導入口3よりSiH4ガスを導入
することで、10トル以下、例えば1〜5トルの真空に
保たれている。
In the figure, reference numeral 1 indicates a vacuum container, which is maintained at a vacuum of 10 Torr or less, for example, 1 to 5 Torr, by evacuating from the exhaust port 2 with a vacuum pump and introducing SiH4 gas from the gas introduction port 3.

真空容器内には、電極4および5ならひにその中間に格
子電極6が配置されている。
A grid electrode 6 is arranged between the electrodes 4 and 5 in the vacuum vessel.

この内電極4と格子電極6はプラズマ発生電極として用
いられ、例えば電極4には+500Vの電圧力鄭r17
7Dされ、電極6/i大地電位とされて、両電極間には
グロー放電が生ずる。
Among them, the electrode 4 and the grid electrode 6 are used as plasma generation electrodes, and for example, the electrode 4 has a voltage of +500V.
7D, and the electrode 6/i is brought to the ground potential, and a glow discharge is generated between the two electrodes.

電極5には一100Vの電圧が印加されており、グロー
放電によりSiH4が分解してできたイオンを電極5上
もしくはその近傍に置かれる基板(図示せず)に向って
加速する電界を格子電極6との間に形成する。
A voltage of -100 V is applied to the electrode 5, and the grid electrode generates an electric field that accelerates ions formed by decomposing SiH4 due to glow discharge toward a substrate (not shown) placed on or near the electrode 5. Formed between 6 and 6.

電極6はグロー放電域から加速域へのイオンの流入を可
能とするために網目状にされている。
The electrode 6 is meshed to allow the flow of ions from the glow discharge region to the acceleration region.

仮りに基板を電極6の上かまたはその近傍に置いだとし
たならば、電極4,6間に存在するイオンあるいは原子
のほとんどが基板上に堆積することとなり、所期の膜質
を得ることができない。
If the substrate were placed on or near the electrode 6, most of the ions or atoms existing between the electrodes 4 and 6 would be deposited on the substrate, making it impossible to obtain the desired film quality. Can not.

しかるに本装置によれば、電極6,5間の電界によりイ
オンのみ力助謎されて電極5の上−!!たけその近傍に
置かれた基板上に堆積するので、膜質の均一化を図るこ
とが可能である。
However, according to this device, the electric field between the electrodes 6 and 5 causes only the ions to be suppressed, and the ions above the electrode 5 -! ! Since it is deposited on a substrate placed near the bamboo shoots, it is possible to achieve uniform film quality.

さらに電極6,50間隔および電圧を変化させることに
より、基板に到達するイオンの性質を限定することも可
能で、成長膜の膜質をより均一に[ることもできる。
Furthermore, by changing the distance between the electrodes 6 and 50 and the voltage, it is possible to limit the properties of ions that reach the substrate, and it is also possible to make the quality of the grown film more uniform.

同様の効果は電極4と格子電極6との間に高周波電圧を
印加してグロー放電を起し、シリコン原子をイオン化す
る場合にも得ることができる。
A similar effect can also be obtained when a high frequency voltage is applied between the electrode 4 and the grid electrode 6 to cause a glow discharge and ionize silicon atoms.

なお電極5と格子電極6との間にグロー放電を起させ、
格子電極6と電極40間の電界によってイオンを電極4
の下側に置いた基板の下面に成長させるようにすること
も可能であり、この場合には上部の電極に付着した粒子
が基板上落下して膜質を損なうのを防ぐことができる。
Note that a glow discharge is caused between the electrode 5 and the grid electrode 6,
Ions are transferred to the electrode 4 by the electric field between the grid electrode 6 and the electrode 40.
It is also possible to grow the particles on the lower surface of the substrate placed under the electrode, in which case it is possible to prevent particles attached to the upper electrode from falling onto the substrate and damaging the film quality.

上述のように本発明に基づく気相成長装置は、プラズマ
発生のだめの電界とイオン流制御のだめの電界を分離す
ることにより容易に気相成長膜の膜質を向上させるもの
であり、太陽電池に用いる非晶質シリコン膜の成長ばか
りでなく、プラズマ状態のガスよりの気相成長装置全般
に適用することができる。
As mentioned above, the vapor phase growth apparatus based on the present invention easily improves the film quality of vapor phase growth films by separating the electric field for plasma generation and the electric field for ion flow control, and is suitable for use in solar cells. It can be applied not only to the growth of amorphous silicon films, but also to general vapor phase growth equipment using gas in a plasma state.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の一実施例の構造を図式的に示す断面図であ
る。 1・・・・・・真空容器、2・・・・・・ガス導入口、
4,5・・・・・・電極、6・・・・・・格子電極。
The figure is a sectional view schematically showing the structure of an embodiment of the present invention. 1... Vacuum container, 2... Gas inlet,
4, 5...electrode, 6...grid electrode.

Claims (1)

【特許請求の範囲】[Claims] 1 真空容器内に化合物ガスを導入し、グロー放電によ
りプラズマ状態として生成したイオンを基体上に堆積さ
せるものにおいて、イオンの通過が可能な格子電極を中
間にして2つの電極を対向配置し、一方の電極と格子電
極の間にはグロー放電を起す電圧を印加し、格子電極と
他方の電極との間には直流電圧を印加することを特徴と
する気相成長装置。
1 In a device in which a compound gas is introduced into a vacuum container and ions generated in a plasma state by glow discharge are deposited on a substrate, two electrodes are arranged facing each other with a grid electrode that allows ions to pass between them, and one A vapor phase growth apparatus characterized in that a voltage for causing glow discharge is applied between one electrode and the other grid electrode, and a DC voltage is applied between the grid electrode and the other electrode.
JP54166678A 1979-12-21 1979-12-21 Vapor phase growth equipment Expired JPS5927214B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54166678A JPS5927214B2 (en) 1979-12-21 1979-12-21 Vapor phase growth equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54166678A JPS5927214B2 (en) 1979-12-21 1979-12-21 Vapor phase growth equipment

Publications (2)

Publication Number Publication Date
JPS5689835A JPS5689835A (en) 1981-07-21
JPS5927214B2 true JPS5927214B2 (en) 1984-07-04

Family

ID=15835688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54166678A Expired JPS5927214B2 (en) 1979-12-21 1979-12-21 Vapor phase growth equipment

Country Status (1)

Country Link
JP (1) JPS5927214B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04189908A (en) * 1990-09-12 1992-07-08 Just Japan Kk Placement type post and guard fence using the same post

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59192833U (en) * 1983-06-08 1984-12-21 日本電子株式会社 Optical CVD equipment
JPS6077413A (en) * 1983-10-04 1985-05-02 Ulvac Corp Laser excitation process apparatus
JPH0645897B2 (en) * 1987-03-25 1994-06-15 神奈川県 Vapor phase synthesis of carbon thin film or carbon particles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04189908A (en) * 1990-09-12 1992-07-08 Just Japan Kk Placement type post and guard fence using the same post

Also Published As

Publication number Publication date
JPS5689835A (en) 1981-07-21

Similar Documents

Publication Publication Date Title
JPH06105691B2 (en) Method for producing carbon-doped amorphous silicon thin film
WO2010110099A1 (en) Plasma processing apparatus and method of producing amorphous silicon thin film using same
JPS62103372A (en) Apparatus for forming membrane by chemical vapor deposition using plasma and its use
JP2990668B2 (en) Thin film forming equipment
JPS5927214B2 (en) Vapor phase growth equipment
JPS6114652B2 (en)
JPH079059B2 (en) Method for producing carbon thin film
JPH0568097B2 (en)
JP3615919B2 (en) Plasma CVD equipment
JPS6132415A (en) Thin film forming equipment
JPH06179968A (en) High frequency sputtering equipment
JPH0645254A (en) Method and apparatus for manufacturing amorphous silicon film
JPS619577A (en) Plasma chemical vapor phase growing method
JPH03146673A (en) Thin film deposition method and thin film deposition equipment
JPH01216523A (en) Manufacture of plasma cvd thin film
JPS6091646A (en) Plasma vapor growth
JPS61115354A (en) Amorphous semiconductor solar cell
JPS6132430A (en) Device for formation of thin film
JP2680702B2 (en) Method for producing amorphous alloy semiconductor thin film
JPS609657B2 (en) Ion plating method and device
JPS584920A (en) Manufacture of semiconductor
JPS5915985B2 (en) Decomposed species selective ion beam deposition method
JPH06207274A (en) Synthesizing method of cubic boron nitride film
JPS59211219A (en) Plasma cvd apparatus
JPH0124536B2 (en)