JPS6053759B2 - Partial plating method and device - Google Patents
Partial plating method and deviceInfo
- Publication number
- JPS6053759B2 JPS6053759B2 JP10433778A JP10433778A JPS6053759B2 JP S6053759 B2 JPS6053759 B2 JP S6053759B2 JP 10433778 A JP10433778 A JP 10433778A JP 10433778 A JP10433778 A JP 10433778A JP S6053759 B2 JPS6053759 B2 JP S6053759B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- front side
- gap
- mask means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title claims description 70
- 238000000034 method Methods 0.000 title claims description 14
- 238000002347 injection Methods 0.000 claims description 23
- 239000007924 injection Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 20
- 239000000243 solution Substances 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 6
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 1
- 230000000873 masking effect Effects 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は部分メッキ、特にメッキ対象部分に間隙のあ
る被メッキ材(例えば集積回路用のリード フレーム)
にメッキするための部分メッキ方法及びその装置に関す
るものである。[Detailed Description of the Invention] The present invention is applicable to partial plating, particularly to materials to be plated (such as lead frames for integrated circuits) that have gaps in the plating target area.
The present invention relates to a partial plating method and apparatus for plating.
リードフレームの如き被メッキ材へのメッキ処理は、
種々の利点からメッキ液をジェット流にして被メッキ材
に施こす高速部分メッキ方法と装置が多用されており、
そのメッキ処理は金その他の貴金属メッキが殆んどであ
る。The plating process for plated materials such as lead frames is
High-speed partial plating methods and equipment that apply a jet stream of plating solution to the material to be plated are widely used due to various advantages.
Most of the plating treatments are gold or other noble metal plating.
そしてこの様な高速部分メッキでは被メッキ材のメッキ
対象部分をマスキングで区画露出するものであり、メッ
キ部分と非メッキ部分の明確化並びに経済性の向上とい
う観点よりマスキングの技術が極めて重要視される。と
ころで、メッキ対象部に間隙のない被メッキ材であれば
通常のマスキングが利用できるものの、間隙のある被メ
ッキ材であるとこの間隙内へのメッキ液の入り込みを止
むを得す許すか又は個々の被メッキ材の形状、構造に合
致させたマスク体を得て間隙内に嵌入し得る凸部をその
マスク体に形成するかしなければならない。そして、前
者では高価な金その他の貴金属メッキ液の無駄な・使用
を抑制できず又後者ではその都度被メッキ材のメッキ対
象部分の形状・構造、特に間隙の形状・構造、に合わせ
特殊なマスク体を作成せねばならないという不都合があ
る。 本発明は叙上の点に着目して開発された部分メ門
ツキ方法及びその装置であつて、その意図するところは
非メッキ部の表面にマスク体をあてがうだけでなくメッ
キ対象部の間隙内にエアーを導入噴射し其処へのメッキ
液の侵入・付着を防止することにあり、具体的には被メ
ッキ材の間隙のあるメッキ対象部を、開口部付きマスク
体で区画露出させそこにメッキ液をノズルより噴射する
ようにした部分メッキ方法に於いて、メッキ対象部の裏
面及び/又は表面側にエアーノズルを配してメッキ液の
噴射の際上記間隙内にエアーを噴射し同間隙内へのメッ
キ液の侵入を阻止するようにしたことを特徴とする部分
メッキ方法を提供せんとするものであつて、更にメッキ
液の噴射ノズルを備えたメッキ装置本体と、メッキ液の
噴射側に配置されるもので被メッキ材の間隙のあメッキ
対象部を区画露出する開口部付きの表側マスク手段と、
該表側マスク手段に対峙して配置されるものでメッキ対
象部の裏面相応部分に密着させられる裏当て部並びにこ
の裏当て部を囲繞する位置に形成されるエアー噴射部を
併せ有する裏側マスク手段と、そして該裏側マスク手段
を表側マスク手段に対し近接・離反せしめる押圧手段と
から成ることを特徴とする部分メッキ装置を提供せんと
するものである。In such high-speed partial plating, the parts to be plated on the material to be plated are sectioned and exposed by masking, and masking technology is extremely important from the viewpoint of clarifying the plated and non-plated parts and improving economic efficiency. Ru. By the way, if the material to be plated has no gaps, normal masking can be used, but if the material to be plated has gaps, it may be necessary to stop the plating solution from entering into the gaps, or it may be difficult to mask individually. It is necessary to obtain a mask body that matches the shape and structure of the material to be plated, and to form a convex portion on the mask body that can fit into the gap. In the former case, wasteful use of expensive gold and other precious metal plating solutions cannot be prevented, and in the latter case, a special mask is required to match the shape and structure of the part to be plated, especially the shape and structure of the gap. The disadvantage is that the body must be created. The present invention is a partial plating method and device developed with the above-mentioned points in mind, and its intended purpose is not only to apply a mask body to the surface of the non-plated part, but also to apply the mask body to the surface of the non-plated part. The purpose is to introduce and spray air to prevent the plating solution from entering or adhering there.Specifically, the part to be plated with a gap in the material to be plated is sectioned and exposed using a mask body with openings, and then the plating is applied to that area. In a partial plating method in which the liquid is injected from a nozzle, an air nozzle is placed on the back and/or front side of the part to be plated, and air is injected into the gap when the plating liquid is injected. The purpose of the present invention is to provide a partial plating method characterized in that the plating solution is prevented from entering the plating device, and further includes a plating device main body equipped with a plating solution injection nozzle, and a plating device main body equipped with a plating solution injection nozzle. a front side mask means with an opening for partitioning and exposing the part to be plated in the gap of the material to be plated;
A back side mask means that is arranged opposite to the front side mask means and has a backing part that is brought into close contact with a corresponding part of the back surface of the part to be plated, and an air injection part that is formed at a position surrounding this backing part. It is an object of the present invention to provide a partial plating apparatus comprising: and pressing means for moving the back side mask means toward and away from the front side mask means.
以下図面に基づき詳細を述べると、1はメッキ装置本体
て内部に上向きに配置されたメッキ液の噴射ノズル2を
備える。The details will be described below based on the drawings. Reference numeral 1 includes a plating liquid spray nozzle 2 disposed upward inside the plating apparatus main body.
この噴射ノズル2は先端にアノード3を有する。そして
、メッキ液の噴射ノズル2の上方、即ちメッキ液の噴射
側に表側マスク手段4が配置される。この表側マスク手
段4は一方でメッキ装置本体1の上蓋を構成し他方で押
圧手段(後述)の押圧を受止めるベース体5とその上面
側に固設されたマスク体6より成る。べ.ース体5は円
滑なメッキ液の流れをガイドするための傾斜面7付き噴
射開口8を有し、マスク体6はこの噴射開口に連通する
もので、被メッキ材9のメッキ対象部Aを区画露出させ
る開口部10を有する。ベース体5とマスク体6は予め
一体化し.てもよく又、ベース体5より上蓋の役目を除
くことも任意である。この様な表側マスク手段4に対峙
して裏側マスク手段11が配置される。裏側マスク手段
11には裏当て部12とエアー噴射部13が設けられ、
斯かる裏側マスク手段11を表側一マスク手段4と組合
わせ使用するところに本発明の特色がある。裏当て部1
2はメッキ対象部Aの裏面の相応部分、好ましくは表側
のメッキ対象部分より若干大サイズの裏側相応部分、に
密着させられるものでそれに見合う面積を有する。エア
ー噴射部13はエアーノズルとなるものでありこの裏当
て部12を囲繞する位置に形成されるもので、少くとも
メッキ対象部Aの間隙14の一部〔間隙14の連通部分
〕に対応する位置へ形成される。ところで図示の例で、
この裏側マスク手段11は裏側マスク体15と押え板1
6を備え、裏側マスク体15の中央部が前述の裏当て部
12に、又その外側が前述のエアー噴射部13と成つj
ており、更に残りの部分が押圧部17を形成する。押え
板16はその下面側に裏側マスク体15を固設するもの
でエアー噴射部13に連通させたエアー供給路18を有
する。この裏側マスク体15と押え板16は予め一体化
してもよくエアー供給路18はどの様に形成してもよい
。19は圧力シリンダーのような押圧手段で、裏側マス
ク手段11を表側マスク手段4に対して近接・離反せし
めるものである。This injection nozzle 2 has an anode 3 at its tip. A front mask means 4 is disposed above the plating solution spray nozzle 2, that is, on the plating solution spray side. The front side mask means 4 is composed of a base body 5 which constitutes the upper cover of the plating apparatus main body 1 on one side and which receives pressure from a pressing means (described later) on the other hand, and a mask body 6 fixedly provided on the upper surface side of the base body 5. Be. The base body 5 has a spray opening 8 with an inclined surface 7 for guiding the smooth flow of the plating solution, and the mask body 6 communicates with this spray opening to direct the plating target area A of the plated material 9. It has an opening 10 that exposes the section. The base body 5 and the mask body 6 are integrated in advance. Also, it is optional to remove the role of the upper cover from the base body 5. A back side mask means 11 is arranged opposite to such a front side mask means 4. The back mask means 11 is provided with a backing part 12 and an air injection part 13,
A feature of the present invention is that the back side masking means 11 is used in combination with the front side masking means 4. Backing part 1
2 is a part that can be brought into close contact with a corresponding part on the back side of the part A to be plated, preferably a corresponding part on the back side which is slightly larger in size than the part to be plated on the front side, and has an area corresponding to the part to be plated. The air injection part 13 serves as an air nozzle and is formed at a position surrounding this backing part 12, and corresponds to at least a part of the gap 14 of the plating target part A [the communicating part of the gap 14]. formed into position. By the way, in the illustrated example,
This back side mask means 11 includes a back side mask body 15 and a presser plate 1.
6, the center part of the back mask body 15 serves as the above-mentioned backing part 12, and the outside thereof becomes the above-mentioned air injection part 13.
The remaining portion forms a pressing portion 17. The press plate 16 has the back side mask body 15 fixedly attached to its lower surface side, and has an air supply path 18 communicating with the air injection section 13 . The back side mask body 15 and the presser plate 16 may be integrated in advance, and the air supply path 18 may be formed in any manner. Reference numeral 19 denotes a pressing means such as a pressure cylinder, which moves the back side mask means 11 toward and away from the front side mask means 4.
ところで上述の表側マスク手段4にもエヤー噴射部を形
成すること可能で、第5図を参照しこの点を説明すると
、表側マスク手段4aを構成するベース体5aにエアー
供給路18aが又マスク体6aにエアー噴射部13aが
各々形成される。By the way, it is possible to form an air injection part in the above-mentioned front side mask means 4, and to explain this point with reference to FIG. Air injection portions 13a are formed in each of the portions 6a.
該エアー噴射部13aはリング状ノズルを構成し開口部
10aを囲繞する位置に設けられる。尚、このエアー噴
射部13aは裏側マスク手段11のエアー噴射部13と
併用しても又選択的使用してもよく、要は被メッキ材の
メッキ対象部内にある間隙へエアーを導入・噴射し易い
方のエアー噴射部13及び/又は13aを使用すればよ
い。次に、被メッキ材9の詳細を述べ、併せて部分メッ
キ装置の作用と部分メッキ方法について説明する。The air injection part 13a constitutes a ring-shaped nozzle and is provided at a position surrounding the opening 10a. Note that this air injection section 13a may be used in combination with the air injection section 13 of the back side mask means 11, or may be used selectively.In short, it introduces and injects air into the gap in the part to be plated of the material to be plated. It is sufficient to use the air injection section 13 and/or 13a which is easier. Next, details of the material to be plated 9 will be described, as well as the operation of the partial plating apparatus and the partial plating method.
図示の被メッキ材9はリードフレームを概略化したもの
で、素子のマウント部分20と金属細線でボンディング
する部分21との一部に金メッキ処理が施されるもので
、各部分の間には複雑形状の間隙14が残されている。The plated material 9 shown in the figure is a schematic representation of a lead frame, in which gold plating is applied to a part of the mounting part 20 of the element and the part 21 to be bonded with a thin metal wire, and there is a complicated structure between each part. A shaped gap 14 is left.
この被メッキ材9を表側のマスク体6に載置し、押圧手
段19を働かせて裏側マスク体15を第1図中の下方へ
押圧し両マスク体6,15間に被メッキ材9を挟持した
状態下でメッキ処理を行なう。メッキ液は噴射ノズル2
より噴射されるが、それに先立ちエアーノズルを構成す
るエアー噴射部13よりエアーを噴出させ続ける。噴射
されたエアーは間隙14を通過し被メッキ材9の表側(
第1図下面側)へ噴出される。他方、噴射ノズル2より
上向きに噴射されたメッキ液は表側のマスク体6の開口
部10が区画露出させている被メッキ材のメッキ対象部
Aに到り、メッキ対象部A内にある被メッキ材の表側の
露出面上でのみ析出するが、間隙14内への浸入は対向
するエアー噴射流で邪魔され阻止される。尚、この際、
表側マスク手段4aのエアー噴射部13aよりエアーを
間隙14内に導入・噴射することもでき、前記エアー噴
射部13と併用又は選択的に使用できる。従つて、マウ
ント部分20とポンデインングされる部分21の肉厚に
相応する側面部分へメッキ液は施されない状態を呈する
。そして、どの様な複雑形状・構造の1間隙ョであつて
も、噴射されたエアーはそこを通過しつつ裏面側より表
面側へ抜けてゆくので、メッキ液は1間隙ョ内に浸入で
きず、又当然に1間隙ョ内で拡散したり表・裏両マスク
体間のメッキ対象部以外の0間隙ョの部分へ流れ込むこ
ともない。図面上この状態を判り易くするため、裏当て
部12でマスクされる部分を?で、エアー噴射部13の
あてがわれる部分を\で、そして、メッキ液の施される
部分をZて図示した。尚、第3図中Iで図示される部分
はメッキされた部分を示す。以上説明したことく、本発
明の方法及び装置に拠れば、対向するエアー流の存在で
メッキ液流の浸入を阻止するので、被メッキ材のメッキ
対象部にどの様な複雑形状・構造の間隙があつても、其
処へはエアー流が流れ込み必ずメッキ液流が入り込むの
を防ぐから微細部分にも正確なマスキング処理ができる
上に、メッキ対象部内の表面部分のみメッキされ表面に
連らなる側面部分にはメッキが施されず、しかもメッキ
対象部以外へのメッキ液の漏出は勿論阻止され、メッキ
液の無駄な使用の抑制と非メッキ部とメッキ部の境界の
明確化が達成でき、メッキ対象部の裏面及び/又は表面
側に配するエアーノズルの構成・形成も比較的容易で装
置として製造し易くしかも従来のジェット流式のスポッ
トメッキ装置に組込み使用可能で、汎用性が高く、繁雑
なマスキング処理も不要なので迅速なメッキ処理ができ
るという多くの利点がある。This material to be plated 9 is placed on the front side mask body 6, and the pressing means 19 is activated to press the back side mask body 15 downward in FIG. The plating process is carried out under the following conditions. Plating liquid is sprayed from spray nozzle 2
However, prior to that, the air continues to be ejected from the air injection part 13 that constitutes the air nozzle. The injected air passes through the gap 14 and reaches the front side (
It is ejected to the bottom side of Figure 1). On the other hand, the plating liquid sprayed upward from the spray nozzle 2 reaches the plating target part A of the plated material which is sectioned and exposed by the opening 10 of the mask body 6 on the front side, and the plating liquid inside the plating target part A. It is deposited only on the exposed front surface of the material, but its penetration into the gap 14 is blocked and prevented by the opposing air jets. Furthermore, at this time,
Air can also be introduced and injected into the gap 14 from the air injection part 13a of the front side mask means 4a, and can be used in combination with or selectively with the air injection part 13. Therefore, the plating solution is not applied to the side surface portion corresponding to the wall thickness of the portion 21 that is bonded to the mount portion 20. No matter how complex the shape or structure of the gap, the injected air passes through it and escapes from the back side to the front side, so the plating solution cannot penetrate into the gap. Also, of course, it does not diffuse within one gap or flow into the 0 gap area other than the area to be plated between the front and back mask bodies. In order to make this state easier to understand in the drawing, the part masked by the backing part 12 is shown as ? The part to which the air injection part 13 is applied is shown by \, and the part to which the plating solution is applied is shown by Z. Note that the portion indicated by I in FIG. 3 indicates a plated portion. As explained above, according to the method and apparatus of the present invention, the existence of opposing air flows prevents the infiltration of the plating liquid flow. Even if there is a problem, the air flow will flow into that area and prevent the plating liquid flow from entering, allowing accurate masking even on minute parts. No plating is applied to the parts, and the leakage of the plating solution to areas other than those to be plated is of course prevented, which reduces wasteful use of the plating solution and clarifies the boundaries between non-plated parts and plated parts. The configuration and formation of the air nozzle placed on the back and/or front side of the target part is relatively easy and easy to manufacture as a device.Moreover, it can be incorporated into a conventional jet stream spot plating device, making it highly versatile and easy to use. It has many advantages such as rapid plating processing because no masking processing is required.
更に、これらの効果は本発明の方法・装置を水平方向に
メッキ液を噴射するタイプの部分メッキ方法及びその装
置に適用しても十分期待できるものである。Further, these effects can be fully expected even when the method and apparatus of the present invention are applied to a type of partial plating method and apparatus in which a plating solution is sprayed horizontally.
第1図は本発明の装置一例を概略的に示す断面図、第2
図は第1図中■方向より眺めた被メッキ材とメッキ液噴
射開口との位置関係を示す説明図、第3図は第1図■方
向より眺めた被メッキ材とエアー噴射部との位置関係を
示す説明図、第4図は間隙内でのメッキ液とエアー流の
対向状態を示す説明図、そして第5図はエアー噴射部の
変形例を示す表側マスク手段の部分断面図てある。FIG. 1 is a sectional view schematically showing an example of the device of the present invention, and FIG.
The figure is an explanatory diagram showing the positional relationship between the material to be plated and the plating solution injection opening viewed from the direction ■ in Figure 1, and Figure 3 is the position of the material to be plated and the air injection part viewed from the direction ■ in Figure 1. FIG. 4 is an explanatory diagram showing the opposing state of the plating solution and air flow within the gap, and FIG. 5 is a partial sectional view of the front side mask means showing a modification of the air injection part.
Claims (1)
きマスク体で区画露出させそこにメッキ液をノズルより
噴射するようにした部分メッキ方法に於いて、メッキ対
象部の裏面及び/又は表面側にエアーノズルを配してメ
ッキ液の噴射の際上記間隙内にエアーを噴射し同間隙内
へのメッキ液の入を阻止するようにしたことを特徴とす
る部分メッキ方法。 2 メッキ液の噴射ノズルを備えたメッキ装置本体と、
メッキ液の噴射側に配置されるもので被メッキ材の間隙
のあるメッキ対象部を区画露出する開口部付きの表側マ
スク手段と、該表側マスク手段に対峙して配置されるも
のでメッキ対象部の裏面相応部分に密着させられる裏当
て部並びにこの裏当て部を囲繞する位置に形成されるエ
アー噴射部を併せ有する裏側マスク手段と、そして該裏
側マスク手段を表側マスク手段に対し近接・離反せしめ
る押圧手段とから成ることを特徴とする部分メッキ装置
。 3 上記表側マスク手段にはその開口部を囲繞する位置
にエアー噴射部が形成されているものである、特許請求
の範囲第2項記載の部分メッキ装置。[Scope of Claims] 1. In a partial plating method in which a plating target part with a gap in a plating material is sectioned and exposed using a mask body with an opening, and a plating solution is sprayed thereon from a nozzle, the plating target part Partial plating characterized in that an air nozzle is disposed on the back side and/or the front side of the plate to inject air into the gap when the plating liquid is injected to prevent the plating liquid from entering into the gap. Method. 2. A plating device body equipped with a plating liquid spray nozzle,
A front side mask means is placed on the spraying side of the plating solution and has an opening for partitioning and exposing the part to be plated with a gap in the material to be plated, and a part placed opposite to the front side mask means is the part to be plated. a back side mask means having both a backing part that is brought into close contact with a corresponding part of the back side and an air injection part formed at a position surrounding the backing part, and the back side mask means is brought close to and separated from the front side mask means. A partial plating device comprising a pressing means. 3. The partial plating apparatus according to claim 2, wherein the front side mask means has an air injection section formed at a position surrounding the opening thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10433778A JPS6053759B2 (en) | 1978-08-29 | 1978-08-29 | Partial plating method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10433778A JPS6053759B2 (en) | 1978-08-29 | 1978-08-29 | Partial plating method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5531168A JPS5531168A (en) | 1980-03-05 |
| JPS6053759B2 true JPS6053759B2 (en) | 1985-11-27 |
Family
ID=14378107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10433778A Expired JPS6053759B2 (en) | 1978-08-29 | 1978-08-29 | Partial plating method and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053759B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5852034B2 (en) * | 1981-08-26 | 1983-11-19 | 株式会社ソニツクス | Partial plating method and device |
-
1978
- 1978-08-29 JP JP10433778A patent/JPS6053759B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5531168A (en) | 1980-03-05 |
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