JPS6229902B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a test device for continuously testing the electrical characteristics of semiconductor devices, and particularly to a pre-test shoot in which semiconductor devices are arranged in a single row and shot to a test head. This relates to the fixed chute device of the section. [Technical background of the invention and its problems] For example, in the case of semiconductor devices such as ICs (semiconductor integrated circuit devices), electrical characteristic tests are conducted on each manufactured product to sort them into good and defective products. is required. And a large amount
In order to continuously and automatically perform the above-mentioned tests on IC products, etc., test equipment equipped with a so-called high-speed handler has been used. FIG. 1 is a schematic explanatory diagram showing the conventional test apparatus for semiconductor devices. In the figure, reference numeral 1 denotes a pre-test chute section for arranging continuously supplied semiconductor devices in a single row. The semiconductor devices a ₁ , a ₂ . There is. The test head section 2 tests the electrical characteristics of the shunted semiconductor devices, and the semiconductor devices determined to be good or defective are shunted to the sorting chute section 3. After the test head section 2 becomes empty, the next semiconductor device is thrown out from the pre-test shoot section 1. Note that the test of the semiconductor device described above is performed using a tester (not shown) connected to the test head section 2. On the other hand, the sorting chute section 3
If the semiconductor device thrown out from the test head section 2 is a good product, a command is obtained from the tester (not shown) and the semiconductor device is thrown to the good product shoot section 4 disposed immediately downstream. Also,
If the semiconductor device being shunted out is a defective product, the sorting chute section 3 is rotated by 90 degrees in response to a command from the tester (not shown) and transferred to the defective product chute section 5 arranged in the rotated direction. Defective semiconductor devices are now being shunted. In this way, conventional test equipment for semiconductor devices
Only one test head section 2 was provided, and the entire test head was constructed as a single-row shoot circuit system. Moreover, the test head section 2 was not configured to be able to test multiple samples at the same time.
It is necessary to adopt a system in which semiconductor devices are sequentially supplied to the test head section 2 one by one and tested one by one, and there is a problem in that the loss time during the process is quite large. Furthermore, when a semiconductor device determined to be a defective product is to be shunted to the defective product chute section 5, the sorting chute section 3 must be rotated, and there is a problem in that time is lost at this time as well. Due to these factors, in conventional test equipment for semiconductor devices, the overall machine index has to be quite large, approximately 1.0 to 15 seconds, which makes it difficult to improve work efficiency and overall productivity. This had become a major obstacle. By the way, as is clear from the above, the basic idea for constructing an efficient semiconductor device tester with a small machine index is that the test head section 2 can test multiple semiconductor devices at the same time. It is possible to do so. For this purpose, a mechanism is required for the test head 2 to reliably and efficiently shunt a plurality of semiconductor devices to be tested simultaneously as a unit. Incidentally, in the conventional semiconductor device testing apparatus shown in FIG. 1, the mechanism for shunting a semiconductor device from the pre-test shunt section 1 to the test head section 2 will be explained as follows. As shown in FIG. 2, the pre-test chute section consists of a supply section 1' and a fixed chute section 1''.The supply section 1' arranges semiconductor devices in a single row and supplies them separately one by one. The fixed chute section 1'' is a section for shunting supplied semiconductor devices to the test head section 2. A detector 6 is provided at the upper end of the fixed chute section 1'' to detect when a semiconductor device is being shunted from the supply section 1'. Cylinder (hereinafter referred to as pen air cylinder) 7, 8
A shoot blow nozzle 9 facing downstream is provided between the pen air cylinders 7 and 8. When a semiconductor device is thrown from the supply section 1' to the fixed chute section 1'', the detector 6 detects this and first protrudes the piston rod of the pen air cylinder 8 on the downstream side to lock the semiconductor device. In the following description, this operation will be referred to as "extending the pen air cylinder" and the opposite operation will be referred to as "retracting the pen air cylinder." When the next semiconductor device is shunted in this state, the detector 6 detects this and the pen air cylinder 7 on the upstream side is then projected to anchor the semiconductor device.
Subsequently, only the pen air cylinder 8 is retracted to release the mooring of the semiconductor device, and at the same time, the blow nozzle 9 blows out the unmoored semiconductor device to the test head section 2. At this time, the pen air cylinder 8 continues to tether the semiconductor device. Then, the pen air cylinder 8 protrudes again, and at the same time, the pen air cylinder 7 retracts, and the unmoored semiconductor device falls and is moored to the pen air cylinder 8. Then, when a new semiconductor device is thrown out from the supply section 1', the pen air cylinder 7 protrudes again in response to a detection signal from the detector 6 and anchors it. Thereafter, the semiconductor devices are shunted one by one to the test head section 2 by the same operation. Now, as far as the above-mentioned shunt mechanism used to shunt the semiconductor device to the test head in the conventional test equipment for semiconductor devices is concerned, the basic concept described above can be realized and the efficiency of the machine index can be reduced. It is not possible to construct a complete test equipment. That is, in the above-mentioned shoot mechanism, the number of semiconductor devices for which the shoot timing can be completely controlled, that is, the number of semiconductor devices that can be shunted by the blowing from the blow nozzle 9 is only one. On the other hand, the test head section 2
If you set up and test multiple semiconductor devices at the same time, you must completely control the shoot timing for the same number of semiconductor devices, and if this is not possible, test head 2
It is not possible to reliably set a plurality of semiconductor devices at the same time. Therefore, as long as the above-mentioned shoot mechanism is used, it is not possible to realize a configuration in which the test head section 2 tests a plurality of semiconductor devices at the same time. [Object of the Invention] The present invention has been made in view of the above-mentioned circumstances, and aims to realize a semiconductor device testing apparatus that can simultaneously test a plurality of semiconductor devices in a test head. The object of the present invention is to provide a fixed chute device that can be used as a unit and can completely control the timing of all of its shoots to shoot to a test head. Note that in order to simultaneously test a plurality of semiconductor devices, a suitable mechanism is required for the test head itself, but this is outside the scope of the present invention. [Summary of the Invention] The fixed chute device of the present invention is fixed between a supply chute section and a test head section in a semiconductor device testing apparatus, and is disposed in communication with the chute rows of both. A plurality of semiconductor devices, which are shot one by one from the test head, are accommodated in the chute row, and the shoot timing of all the accommodated semiconductor devices is completely controlled to shoot them to the test head section. It is something. Its specific configuration includes a detector for detecting that a semiconductor device has been shunted from the supply chute, a pen air cylinder for locking and unlocking the detected semiconductor device,
The present invention is characterized in that a plurality of sets of shoot timing control mechanisms each including a blow nozzle for shooting a semiconductor device to a test head are provided along a shoot row of a fixed shoot device. Example] FIG. 3 is a plan view of a fixed chute device according to an embodiment of the present invention, and FIG. 4 is a side view thereof. In these figures, 11 is a fixed chute device. The fixed chute device 11 has a chute row 14 defined by a lower support frame 12 and an upper support frame 13 as shown in FIG. A detector 15a is located below the chute row 14 for detecting semiconductor devices that have been shunted.
is provided. An optical fiber sensor embedded in the lower support frame 12 is used as the detector 15a. Further, a pen air cylinder 16a is provided on the upper support frame 13 on the downstream side of the detector 15a, and a blow nozzle 17a inclined toward the downstream direction is provided on the upstream side of the upper support frame 13.
It is provided in 3. When the detector 15a detects a chute of a semiconductor device, the pen air cylinder 16a protrudes into the chute row 14 and locks the chute. Further, the blow nozzle 17a blows out air in synchronization with the movement of the pen air cylinder 16a to retreat from the chute row 14, thereby shunting the semiconductor device whose lock of the pen air cylinder 16a is released to the next stage. It's summery. In this way, the detector 15a, pen air cylinder 16a, and blow nozzle 17a constitute one set of shoot timing control mechanism.
A similar shoot timing control mechanism consisting of a detector 15b, a pen air cylinder 16b and a blow nozzle 17b is also provided in the upper part of the shoot row 14. In addition, 20 is a supply chute portion disposed immediately before the fixed chute device 11 in the semiconductor device testing apparatus, and 30 is a test head portion disposed immediately after the fixed chute device 11 . As shown, these are fixedly disposed with their chute rows communicating with each other. The operation of the fixed chute device 11 having the above configuration will be explained as follows. Supply chute section 2
From No. 0, semiconductor devices are separated one by one and thrown into the chute row 14 of the fixed chute device 11 , as in the conventional case. When the semiconductor device is shunted, the detector 15a first detects this and causes the pen air cylinder 16a to protrude, whereby the semiconductor device is moored to the pen air cylinder 16a.
When the next semiconductor device is thrown out, the detector 15b detects this and causes the pen air cylinder 16b to protrude, and the semiconductor device is moored within the shoot row 14 by the pen air cylinder 16b. After the two semiconductor devices are housed in the fixed chute device 11 in this way, the pen air cylinder 16a
At the same time as the semiconductor device retreats from the chute row 14, air is blown out from the blow nozzle 17a, and the unmoored semiconductor device is shunted to the test head section 30. Next, the pen air cylinder 16a remains retracted, and at the same time as the pen air cylinder 16b retracts, air is blown out from the blow nozzle 17b, and the semiconductor device moored above the chute row 14 is moved to the test head section 30. shot. Note that the test head section 30 is connected to the fixed chute device 1.
The supply chute unit 20 is configured to set two semiconductor devices that have been chuteed from the supply chute unit 11 and simultaneously test their electrical characteristics. Although the configuration is such that the device is not supplied, these configurations themselves are outside the scope of the present invention and will therefore be omitted. According to the fixed chute device 11 of the above embodiment,
The two semiconductor devices that are separately chuteed one by one from the supply chute section 20 are transferred to the chute row 1.
4 and can be shunted one by one to the test head section 30 as one unit. Moreover, at this time, the shoot timings of the two semiconductor devices are completely controlled by independent shoot timing control mechanisms provided at the respective mooring positions. Therefore, according to this fixed chute device, two semiconductor devices are set as one unit in the test head section 30,
Moreover, it is possible to shoot the individual semiconductor devices one by one at the timing when they are reliably set at the predetermined test position, thereby making it possible to use a shooting system for testing two semiconductor devices at the same time in the test head section 30. It can be realized. Note that the present invention is not limited to the above embodiments, and various modifications are possible. For example, by providing three or more sets of shoot timing control mechanisms in the shoot row 14, three or more semiconductor devices can be shot as one unit to the test head section. Further, as the detectors 15a and 15b, in addition to the optical fiber sensor, various commonly used sensors such as a micro switch can be used. [Effects of the Invention] As detailed above, according to the fixed chute device of the present invention, it is systemically possible to adopt a configuration in which a plurality of semiconductor devices are tested simultaneously in the test head portion of the semiconductor device test device. As a result, it is possible to realize an efficient test apparatus for semiconductor devices with a small machine index.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram schematically showing a conventional semiconductor device testing device, and FIG. 2 is a plan view showing the structure of a fixed chute for shunting a semiconductor device to a test head in the conventional semiconductor device testing device. 3 is a plan view of a fixed chute device according to an embodiment of the present invention, and FIG. 4 is a side view thereof. 11 ... fixed chute device, 12... lower support frame,
13...Upper support frame, 14...Chute row, 15a,
15b...detector, 16a, 16b...pen air cylinder, 17a, 17b...blow nozzle, 20...supply chute section, 30...test head section.

Claims (1)

[Scope of Claims] 1. A test device for semiconductor devices that accommodates a plurality of semiconductor devices that are separated and thrown one by one from a supply chute section, and that also shoots the semiconductor devices to a test head section disposed downstream thereof. a fixed chute device comprising a single chute row through which semiconductor devices are thrown; a detector for detecting semiconductor devices thrown into the chute row; A shoot timing control mechanism consisting of an air cylinder that projects a piston rod to the chute row in response to a detection signal to moor the semiconductor device, and a blow nozzle that shoots the semiconductor device to the next stage in synchronization with the unmooring operation of the air cylinder. A fixed chute device characterized in that a plurality of sets are provided along the chute row. 2. The fixed chute device according to claim 1, wherein an optical fiber sensor is used as the detector. 3. The fixed chute device according to claim 2, wherein the optical fiber sensor is embedded in a wall defining the chute row. 4. The blow nozzle according to any one of claims 1 to 3, wherein the blow nozzle is embedded in a wall defining the chute row at a predetermined angle with the wall. Fixed chute device. 5. The fixed chute device according to any one of claims 1 to 4, wherein the air cylinder is embedded in a wall defining the chute row.