JPH0212383B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a substrate cooling device for cooling a substrate such as a silicon wafer used in semiconductor manufacturing.

Generally, when a process such as ion implantation is performed on this type of substrate in a vacuum chamber, there is a risk of heat generation and damage to the substrate, so the substrate is held in a substrate holder in which cooling water is circulated.

In this case, as shown in Figure 3, when the substrate a in the vacuum chamber A is brought into direct contact with the normal cooling surface c of the substrate holder b, the substrate a is separated from the cooling surface c as shown by the dotted line due to thermal deformation. Since the cooling efficiency will deteriorate, the fourth
As shown in the figure, a cushion material d having relatively good thermal conductivity is provided on the cooling surface c of the substrate holder b, and the substrate a is brought into contact with the cushion material d through this. Since the elasticity of the cushion material d deteriorates over time, the contact area with the substrate a gradually decreases, resulting in a disadvantage that the cooling efficiency deteriorates.

The purpose of the present invention is to obtain an apparatus with high cooling efficiency by constantly increasing the contact area between the substrate and the substrate holder.The present invention aims to provide a device with high cooling efficiency by constantly increasing the contact area between the substrate and the substrate holder. In the case of a type in which the substrate is held by a substrate holder, thin wires having elasticity and good thermal conductivity are implanted on the surface of the substrate holder that comes into contact with the substrate.

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 indicates a substrate holder placed in a vacuum chamber 2, and the substrate holder 1 is made of, for example, Cu,
It is made of metal such as Al, and a cooling water circulation path 3 is provided inside it. Furthermore, thin wires 4 having elasticity and good thermal conductivity are implanted on the surface, that is, the cooling surface. The thin wire 4 is 0.1mm to 0.05mm of Cu, C, etc.
A bundle of thin wires 5 having a diameter of about 1 mm is made up of round wires with a diameter of about 1 mm.
is formed.

In the figure, 6 indicates a substrate such as a silicon wafer held by the substrate holder 1, and 7 indicates a presser plate that presses the periphery of the substrate 6 to bring the substrate 6 into contact with the substrate holder 1.

In the embodiment shown in the first drawing, there is a risk that the bundle of thin wires 5 may buckle when the substrate 6 is pressed by the holding plate 7. To prevent this, the embodiment shown in the second drawing is different from the one shown in the first drawing. Further, on the substrate holder 1, a hole 8 with a diameter of about 1 mm was bored into which the bundle of fine wires 5 was placed, corresponding to the position where the bundle of fine wires 5 was implanted.
A perforated plate 9 made of metal such as Cu or SUS is fixed by brazing or the like, and the tip of each thin wire bundle 5 is attached to the perforated plate 9.
It was made to peek out slightly from the surface.

Incidentally, the thin wire 4 may be configured in the shape of a flat plate. Next, to explain its operation, when the substrate 6 is pressed from above by the holding plate 7 to bring the substrate holder 1 into contact with the substrate 6 and processing of the substrate 6 is started, the substrate 6 will generate heat and deform. Since the substrate 6 is always in contact with the substrate holder 1 at multiple points via the thin wires 4 having elasticity and good thermal conductivity, the heat of the substrate 6 is reliably transmitted to the substrate holder 1 via the thin wires 4.

In this way, according to the present invention, thin wires with elasticity and good thermal conductivity are implanted on the surface of the substrate holder that comes into contact with the substrate, so even if the substrate is thermally deformed,
The thin wire follows its deformation and continues to make contact, and the contact area between the substrate and substrate holder is always maintained large.
The present invention has the advantage that it does not have the above-mentioned disadvantages of the conventional device, has good cooling efficiency, can prevent damage to the substrate due to heat, and can provide a device with excellent durability.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram showing one example of the proposed device;
The figures are explanatory diagrams showing modified examples, Figures 3 and 4.
The figure is an explanatory diagram of a conventional example. 1...Substrate holder, 4...Thin wire, 6...Substrate.

Claims (1)

[Claims] 1 In a type in which a substrate to be processed in a vacuum chamber is held by a substrate holder cooled by circulation of cooling water, etc., the surface of the substrate holder that comes into contact with the substrate has elasticity and good thermal conductivity. A cooling device for a board made of thin wires.