JPH0225752B2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a method for manufacturing a cutting blade, especially silicone,
The present invention relates to a method for manufacturing a cutting blade suitable for precision cutting of semiconductors such as germanium, crystal, ferrite, glass, and other hard and brittle materials by fixing cemented carbide abrasive grains to a base metal using a plating method.

Cutting blades manufactured by the Metsuki method include internal peripheral blades, external peripheral blades, multi-band saw blades, and high-speed band saw blades. Explain the background.

The inventor of this application previously proposed an inner circumferential cutter as shown in FIG. 1 (Japanese Patent Laid-Open No. 146678/1983). This inner peripheral blade has grooves 2 almost evenly formed on both the front and back sides of the edge of the base metal 1, and cemented carbide abrasive grains such as diamond are fixed to the grooves 2 by a plating method to form an abrasive grain layer 3. The base metal 1 is made of a sufficiently cold-worked thin steel plate such as SUS304, and the plating liquid used is one in which nickel is precipitated, and the nickel is used as a bond to be applied to the carbide abrasive. The grains are made to stick together.

The above-mentioned cutting blade has the advantage that even if the cutting blade portion becomes worn, new abrasive grains appear one after another in the depth direction of the groove portion 2, so that the sharpness does not deteriorate, and the life of the cutting blade is therefore long.

However, in the above cutting blade, the base metal 1
If a large tension is applied to the cutting edge, the cutting edge will undergo a zigzag displacement as shown in FIG.
When such a set displacement occurs at the cutting edge, the blade thickness increases and the cutting edge becomes unstable, making it impossible to perform accurate high-speed cutting.

Therefore, as shown by the chain line in FIG.
By providing another abrasive layer 3' on the opposite side of the
Although it is possible to increase the stability of the cutting edge, it is not possible to eliminate the increase in blade thickness due to set displacement.

Therefore, in such a cutting blade, it is necessary to reduce or eliminate the set displacement, but conventionally, as mentioned above, the base metal was made of sufficiently cold-worked SUS304. A thin steel plate is used, and the bond is an electrodeposited nickel bond made from a soft and ductile nickel sulfamic acid bath or a foot bath containing an appropriate brightening agent so as not to crack under tension.

However, there is a significant difference in elastic modulus and tensile strength between the base metal and the bond material, and it is thought that the set displacement is caused by these differences.

Therefore, an object of the present invention is to provide a method for manufacturing a cutting blade with little or no set displacement by improving the materials of the base metal and bond and the processing method thereof.

In order to achieve the above object, the present invention uses precipitation-hardening stainless steel before being subjected to aging treatment as the base metal, and uses a plating liquid that precipitates a nickel-phosphorus alloy, thereby achieving a super The cutting blade is manufactured by fixing hard abrasive grains to a base metal using a nickel-phosphorus alloy as a bond, and then precipitation hardening the base metal and the bond through heat treatment.

The above-mentioned precipitation hardening stainless steels (including maraging steels) are
) martensitic, ) semi-austenitic, ) austenitic-ferrite, and ) austenitic. By adjusting the substrate through appropriate heat treatment, cold working, etc., and then performing aging treatment, it is possible to obtain a high-strength stainless steel in which intermetallic compounds are finely dispersed and precipitated in the substrate.

For example, in the case of SUS630, which is a representative martensitic stainless steel, it is first subjected to solid solution treatment (A treatment) at 1020°C to 1060°C, and martensitic transformation occurs by cooling after the A treatment, and the matrix becomes martensite. This will be the site location. Then aging treatment at 370℃~600℃
When this is done, the Cu-rich precipitated phase is finely dispersed and precipitated in the martensitic matrix, resulting in hardening and high-strength stainless steel.

Furthermore, in the case of SUS631, which is a typical semi-austenitic stainless steel, it contains a large amount of alloying elements so that part or most of it remains as austenite at room temperature if it is converted into a solid solution. Next, it is necessary to transform this retained austenite into martensite, but the processing method is as follows.
There are three methods: a) performing strong cold working, a) cooling to a temperature below room temperature, and a) holding the material below the solution temperature and re-quenching. After carrying out either of these methods, a Ni-Al compound is precipitated in the martensitic matrix by aging treatment at 400°C to 600°C, thereby hardening and increasing the strength.

When using the above-mentioned SUS631 as the base metal of the cutting blade, the thin plate obtained as the material is already martensitic, as it is subjected to strong cold rolling to make it into a thin plate, so it is one of the preferred materials. It is.

Furthermore, Fig. 3 shows the elongation-tensile stress curve of SUS631 in comparison with other stainless steel thin plates. In the figure, curve a is SUS631 before aging treatment, curve b is after aging treatment, curve c is SUS304H material, and curve d is SUS631 material after aging treatment.
The material is SUS304H, and the size of these test pieces is as follows:
The size is 0.1 mm x 10 mm x 40 mm, and the tensile speed is 5 mm/min.

As described above, any type of precipitation-hardening stainless steel can be hardened and strengthened by aging treatment without impairing its toughness.

On the other hand, in this invention, a plating liquid that precipitates a nickel-phosphorus alloy is used as a bond (binding material) for fixing cemented carbide abrasive grains such as diamond by a plating method. Examples include electroless Nickel Mekki liquid using sodium phosphate as a reducing agent. According to this electroless nickel plating solution, an alloy containing about 90 to 92% nickel and 8 to 10% phosphorus is precipitated, resulting in an amorphous and brittle precipitated layer. By heat-treating this at 300° to 600°C, the nickel phosphorus becomes crystalline, exhibits a precipitation hardening phenomenon, and significantly improves hardness, toughness, and adhesion. Figure 4 shows the change in hardness when heat treated. As can be seen from the figure, approximately
The maximum hardness is approx. by heat treatment at 400℃
Hv of about 1000 is obtained, and if heat treated at higher temperatures, the hardness will decrease, but the toughness and elongation will improve.

As mentioned above, this invention uses precipitation-hardening stainless steel before aging treatment as the base metal, and fixes the cemented carbide abrasive grains to the base metal with a plating solution that precipitates a nickel-phosphorous alloy, and then aging treatment. By performing this step, both the base metal and the bond are precipitation hardened.

Example 1 An inner peripheral blade was manufactured using the materials and steps shown below.

A SUS631 plate with a thickness of 0.14 mm was used as the base metal. Although the substrate of this plate material has been turned into martensite by cold rolling, it has not been subjected to aging treatment yet. A so-called 17-inch blade with an outer diameter of 434 mm and an inner diameter of 152 mm was manufactured using the above plate material.
The maximum width is 2.5 mm with a pitch of 5 mm on the front and back sides of the inner edge.
A groove with a depth of 0.65 mm and a depth of 0.075 mm was bored by the photoetching method.

In order to first lightly fix diamond abrasive grains having a grain size of 50 to 70 .mu.m in the grooves, nickel was deposited to a thickness of about 10 .mu.m in a Watts bath using the conventional method. Next, a nickel-phosphorous alloy was precipitated in an electroless nickel polishing solution containing sodium hypophosphite until the diamond abrasive grains were almost covered, thereby fixing the abrasive grains to the base metal.

These steps were repeated twice to form two diamond abrasive grain layers in the grooves, and the upper surface of the diamond abrasive grain layer was made to protrude 20 μm from the base metal surface.

Next, put this in a vacuum heating device and heat it at 490℃ for 30 minutes.
The entire process was completed by aging for a minute. Fig. 5 is an enlarged view of the inner circumferential cutter completed in this way, where 1 is the base metal, 2 is the groove, 4 is a temporary fixing layer made by electroplating, 5 is diamond abrasive grain, and 6 is electroless plating. It is a fixed layer due to

The blade thickness of the inner peripheral blade was 0.18 mm, and this inner peripheral blade was attached to a slicing machine and tensioned. As shown in Fig. 6, the commonly used tension measuring method is to apply a displacement probe to a point A 5 mm away from the tip of the cutting blade 7 in the radial direction, and then place a displacement probe at a point B 5 mm away from that position. By applying a load, the amount of deflection of the inner peripheral blade is measured by the displacement measuring element. The tension size is 50μm on the inner peripheral edge.
It is expressed as the value of the load that causes the displacement, and this is expressed as, for example, 350 g - 50 μm.

Conventional inner peripheral blade with only one layer of abrasive grains fixed to the base metal, base metal thickness 0.12mm, diamond grain size 50 ~
Tension is 340g when 70μm is fixed.
-50μm, and if it is larger than this, cracks will occur and it will not be usable.

When the inner circumferential cutter of the present invention cut silicon by applying a tension of 360 g to 50 μm, the cutting allowance was 205 μm. Taking into account irregularities in the cutting edge, diamond protrusion, and machine surface runout, the blade thickness is approximately 200 μm, and the set displacement is suppressed to approximately +10 μm per side. When the tension was further increased to 450g-50μm,
No cracks occurred on the inner peripheral blade, making stable cutting possible with less warping. The cutting allowance at this time was 210 μm, and it was found that the displacement due to the increase in tension was slight.

On the other hand, as a comparative example, the base metal was made of SUS304EH material, and a Watt bath was used as the nickel plating solution to produce an inner peripheral cutter having the same groove structure and diamond layer as in the above example. This inner peripheral blade
When cutting was performed using a tension of 340g-50μm, the cutting allowance was 255μm. The reason why the cutting allowance is larger than that of the above example is considered to be because the nickel layer formed by the Watt bath is weak and the set displacement is large. In order to further increase the tension, the tension was increased from the outer periphery, but the inner diameter was only expanded and the tension was not effectively increased. This is considered to be because the base metal has already passed the yield point. When the tension was increased to 380g-50μm, the base metal cracked and became unusable.

Therefore, according to the present invention, it is possible to reduce the setting displacement of the inner circumferential cutting edge that has a groove structure on the front and back sides, and it is possible to manufacture a thin cutting edge, which reduces the cutting margin, and also improves the strength of the base metal and the bond of abrasive grains. It was found that the strength of the material increased and a large amount of tension was applied.

Example 2 A normal form as shown in FIGS. 7 and 8 on the inner periphery, that is, one in which the diamond abrasive layer 8 is further fixed to the inner periphery of the base metal 1 (FIG. 7), and An example will be described in which the method of the present invention is applied to a structure in which a plurality of diamond abrasive grain layers 8 are fixed (FIG. 8).

SUS631, plate thickness 0.12mm, plate material that has been turned into martensite by cold rolling and has not been aged.17
An inch blade was manufactured, and 2 mm wide diamond abrasive grains (particle size 50 to 70 μm) were first lightly fixed in a Watts bath using the conventional method on the inner peripheral edge of the base metal and on the front and back sides from the end surface, and then hypophosphorous Nickel-phosphorus alloy was precipitated in an electroless plating bath using acid soda as a reducing agent until about 60% of the diamond abrasive grains were buried, and the abrasive grains were fixed to the base metal.

Afterwards, it was aged at 490℃ for 30 minutes to create an inner peripheral edge. The thickness of this inner peripheral cutter was 280 μm, the same as that of a normal inner peripheral cutter. This inner peripheral blade was installed in a slicing machine and tested in comparison with a normally manufactured internal peripheral blade made of SUS304E material and nickel bond made from Watt bath.

When the tension size is 340g−50μm,
The inner peripheral blade according to the present invention had a smaller amount of deflection due to cutting resistance, and was able to cut a cut object with good quality and less warpage. This is due to the fact that the nickel-phosphorus layer at the cutting edge has been strengthened through aging treatment, increasing the apparent thickness of the base metal at the cutting edge only, and the tension at the cutting edge alone is considerably increased compared to normal ones. It is thought that there are.

According to this invention, if the tension is further increased, it is possible to increase the tension to 400 g - 50 μm, and by increasing the tension, it is possible to increase the cutting speed more stably and reduce warpage, but it is possible to increase the tension further by increasing the tension. It was impossible to apply a tension of 380 g - 50 μm or more to the circumferential blade because it would destroy the base metal.

As described above, when this invention is applied to a cutting blade that is used under tension, the base metal and the bond can be strengthened at the same time, so that the edges of the base metal can be formed almost evenly on both the front and back sides. A cutting blade with such a groove structure has less set displacement and a thin blade, and by increasing the strength of the base metal, a large tension can be applied to the base metal. In addition, in the case of a cutting blade with a normal structure, the tension can be made sufficiently large, and in order to strengthen the bond, the blade edge (the part to which carbide abrasive grains such as diamond are fixed) has a tension greater than that of the base metal. Due to the concentrated tensile stress of
Stable cutting is possible.

[Brief explanation of drawings]

Figure 1 is an end view of the conventional inner peripheral cutter, Figure 2 is an end view of the same as above with set displacement, Figure 3 is a graph showing the results of tensile tests on various stainless steel thin plates, and Figure 4. 5 is a graph showing the change in hardness of electroless nickel rimmetuki due to heat treatment temperature.
The figure is an enlarged sectional view of an embodiment of the present invention, FIG. 6 is a plan view showing the position for measuring the amount of deflection of the inner peripheral blade, and FIGS. 7 and 8 are enlarged sectional views of other embodiments of the invention. . DESCRIPTION OF SYMBOLS 1... Base metal, 2... Groove part, 3... Carbide abrasive grain layer, 4... Temporary fixing layer, 5... Diamond abrasive grain, 6... Fixed layer, 8
...Diamond abrasive layer.

Claims (1)

[Claims] 1 The base metal is immersed in a plating solution with carbide abrasive grains placed on the grooves provided almost evenly on both the front and back sides of the edge of the base metal, and the metal precipitated in the plating solution is used as a bond to form a carbide abrasive grain. In the manufacturing method of a cutting blade by the plating method in which abrasive grains are fixed to a base metal, precipitation hardening stainless steel before being subjected to aging treatment is used as the base metal, and a plating liquid that precipitates a nickel-phosphorus alloy is used as the plating liquid. A method for manufacturing a cutting blade, characterized in that the carbide abrasive grains are fixed to a base metal using a nickel-phosphorus alloy as a bond, and then the base metal and the bond are precipitation hardened by heat treatment.