JPH0232781B2 - - Google Patents
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- Publication number
- JPH0232781B2 JPH0232781B2 JP58222929A JP22292983A JPH0232781B2 JP H0232781 B2 JPH0232781 B2 JP H0232781B2 JP 58222929 A JP58222929 A JP 58222929A JP 22292983 A JP22292983 A JP 22292983A JP H0232781 B2 JPH0232781 B2 JP H0232781B2
- Authority
- JP
- Japan
- Prior art keywords
- cell
- molecular beam
- source material
- substrate
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
【発明の詳細な説明】
本発明は、半導体装置に用いられる薄膜を形成
する為の分子線源用セル等の蒸着装置の蒸発源用
セルおよびその配置の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evaporation source cell of a vapor deposition apparatus such as a molecular beam source cell for forming a thin film used in a semiconductor device, and to improvements in its arrangement.
従来、質の良い半導体結晶薄膜をエピタキシヤ
ル成長させる技術として分子ビーム・エピタキシ
ヤル成長(以下、MBEと略す)法が用いられて
いる。そして、この技術を実施するには、超高真
空に維持された容器中に液体窒素温度の壁に囲ま
れた分子線源用セルを配置し、このセルの中に結
晶成長させようとする薄膜結晶のソース物質(構
成元素)を入れ、加熱することに依り分子線とし
て噴出させ、これを適当な温度に維持した基板上
に堆積させて単結晶薄膜を成長させるようにして
いる。 Conventionally, molecular beam epitaxial growth (hereinafter abbreviated as MBE) has been used as a technique for epitaxially growing high-quality semiconductor crystal thin films. To implement this technology, a molecular beam source cell surrounded by liquid nitrogen temperature walls is placed in a container maintained at ultra-high vacuum, and the thin film to be grown as a crystal is placed inside this cell. A crystal source material (constituent element) is put in and heated to eject it as a molecular beam, which is then deposited on a substrate maintained at an appropriate temperature to grow a single crystal thin film.
ところで、前記MBE法にて薄膜を形成すると、
その薄膜には膜厚の分布を生じ、セルの分子線噴
出口と真正面に向する部分が最も厚くなり、そこ
から周辺に向うにつれて厚さは減少する。 By the way, when a thin film is formed using the MBE method,
The thin film has a thickness distribution, being thickest at the part directly in front of the cell's molecular beam outlet, and decreasing from there toward the periphery.
従来はこの分布を小さくして、均一性の高い結
晶薄膜を成長させるためには、専ら基板上に強度
分布の少ない均一な分子線を投射する方策がとら
れて来た。例えば
(イ) 基板と分子線源用セルとの間の距離を大にす
る。 Conventionally, in order to reduce this distribution and grow a highly uniform crystal thin film, measures have been taken to exclusively project a uniform molecular beam with a small intensity distribution onto a substrate. For example, (a) increasing the distance between the substrate and the molecular beam source cell;
(ロ) 第1図に見られるように、分子線源用セル1
に於ける分子線噴出口1aを細長く傾斜させて
多数設ける。(b) As shown in Figure 1, molecular beam source cell 1
A large number of molecular beam jet ports 1a are provided in a slender and inclined manner.
(ハ) 第2,3図に見られるように、セル1内に於
いて、分子線噴出口1aの近傍に分子線散乱体
5を設置する。(c) As shown in FIGS. 2 and 3, a molecular beam scatterer 5 is installed in the cell 1 near the molecular beam outlet 1a.
などの方法が採用されている。但しこれらの図に
て、2はヒーター、4は熱電対である。(イ)に関し
ては、成長速度が遅くなり、(ロ)に関しては噴出口
が細長いためにその中にソース物質がつまりやす
い、(ハ)に関しては、蒸発物の量の変化に対して、
分子線の空間分布が変化する等の欠陥がある。本
発明の蒸発源用セルはセル内の蒸発物の量、及び
蒸発物の形状に関係なく、常に分子線の空間分布
を一定にすることにより窮極的には、膜厚分布の
改善を目的とするものである。methods have been adopted. However, in these figures, 2 is a heater and 4 is a thermocouple. For (a), the growth rate is slow, for (b), the ejection port is elongated and the source material tends to get clogged therein, and for (c), the growth rate decreases due to changes in the amount of evaporated matter.
There are defects such as changes in the spatial distribution of molecular beams. The evaporation source cell of the present invention ultimately aims to improve the film thickness distribution by always keeping the spatial distribution of molecular beams constant regardless of the amount of evaporated material in the cell and the shape of the evaporated material. It is something to do.
本願の発明者は、均一な膜厚分布を得るため従
来とは異なる方策を採つた。それを第4図で説明
する。 The inventor of the present application took a different measure from the conventional method in order to obtain a uniform film thickness distribution. This will be explained with reference to FIG.
従来は基板中心8cを通る軸8aの回りに回転
する基板8の該中心8cに向けてセル1から分子
線を噴出させるような構成がとられているが、こ
のセルを1a′の位置に移し分子線を基板中心8c
から逸らせて、わざと図の9の位置に向けて噴出
させたのである。この場合に、1a′−8c間の距
離、噴出角θ及びl/rに対し8c−9間の距離を
適当に選ぶときは、例えば4インチ径の基板8に
対しても±1%以内の膜厚の均一性を確保できる
ことを見出した。 Conventionally, a configuration has been adopted in which a molecular beam is ejected from the cell 1 toward the center 8c of the substrate 8 rotating around an axis 8a passing through the substrate center 8c, but this cell is moved to the position 1a'. Center the molecular beam on the substrate 8c
He deliberately made it eject in the direction of position 9 in the diagram. In this case, when appropriately selecting the distance between 1a' and 8c and the distance between 8c and 9 with respect to the ejection angle θ and l/r, the distance between 8c and 9 should be within ±1% even for a 4 inch diameter substrate 8. It has been found that uniformity of film thickness can be ensured.
ただし上述で、lはセルの入口Aからソース物
質の液面中央(ソース物質が昇華性のときは、上
面の中央)までの距離、2rはセルの内径である。 However, in the above, l is the distance from the inlet A of the cell to the center of the liquid surface of the source material (or the center of the top surface if the source material is sublimable), and 2r is the inner diameter of the cell.
この場合には分子線投射密度は、所謂余弦則で
近似されることが知られている。余弦則とは、第
5図にてセルの中心Aからセルの軸線Fと角θを
なす方向にてRの距離にある点Pにて、単位時間
単位面積上にうる膜厚Tは次の(1)式の如くになる
というものである。 In this case, it is known that the molecular beam projection density is approximated by the so-called cosine law. The law of cosines means that at a point P located at a distance R in a direction forming an angle θ with the cell axis F from the center A of the cell in Figure 5, the film thickness T that can be obtained on a unit area in a unit time is as follows. It is as shown in equation (1).
T=K1/R2cosnθ …(1)
ただし、Kは比例常数。nはl/rによつて変
る値で、例えばl/r=0のときn≒1、l/r
=2のときn≒4、l/r=4のときn≒7、
l/r=10のときn≒10である。(バリアン社説
明資料VR−152(Reprinted from
ELECTRONICS magazine;August、1980)
従つて本願の発明者は「均一な投射」をめざす
前述の(イ)、(ロ)、(ハ)の分子線投射とは明らかに異な
り、余弦則に従う不均一な投射をそのまゝ利用し
て高度の膜厚均一を実現したものである。この場
合は次のことが問題になる。 T=K1/R 2 cos n θ …(1) where K is a proportionality constant. n is a value that changes depending on l/r, for example, when l/r=0, n≒1, l/r
When =2, n≒4, when l/r=4, n≒7,
When l/r=10, n≈10. (Varian company explanatory material VR-152 (Reprinted from
ELECTRONICS magazine; August, 1980) Therefore, the inventor of the present application is clearly different from the above-mentioned molecular beam projections (a), (b), and (c), which aim for "uniform projection", and aim at nonuniform projection according to the cosine law. This method uses projection as is to achieve a highly uniform film thickness. In this case, the following issues arise:
MBE法では、極めて高い真空度が要求され、
このためMBE装置では長時間に亘るガス抜きが
行われ、その間にはセル内のソース物質は可成り
の量が蒸発する。またいつたん稼動状態に入つた
MBE装置は、その稼働率を上げるため、努めて
長時間稼働させようとするので、その間のセル内
のソース物質の蒸発量も多大であり、前述のl/
r従つてnの値は、はじめと終りでは大きく変化
する。 The MBE method requires an extremely high degree of vacuum,
For this reason, MBE devices require long periods of degassing during which a significant amount of the source material within the cell evaporates. It's finally up and running again
MBE equipment strives to operate for a long time in order to increase its operating rate, so the amount of evaporation of the source material in the cell during that time is also large, and the above-mentioned l/l/
The value of r and therefore n changes greatly from the beginning to the end.
nの値が大きく変るときは、分子線投射のパタ
ーンが変化し、このため前記した第4図のセル1
a′によつて得る基板8上の膜厚分布の均一性も悪
化する。 When the value of n changes greatly, the pattern of molecular beam projection changes, so that cell 1 in Figure 4 mentioned above changes.
The uniformity of the film thickness distribution on the substrate 8 obtained by a' also deteriorates.
本願の発明は、この問題の解決を目的とする。
また、セルを第4図の1a′の位置に置くか否かに
関係なく、一般にMBE装置では基板上又はセル
内に塵埃の形で不純物粒子の落下することを極端
に嫌う。そのため、例えば第4図の基板8とセル
1の互の関係位置を保ちつゝ、この全体を地軸に
対し45゜傾ける等の形で装置を構築することが多
い。このときはセルの軸線は地軸に対して大きく
傾斜するのでソース物質の液面はセルの軸線Fに
対し甚だしく傾くことになる。液面が傾く場合に
は、殊にセルが大口径で液面が入口Aに近接して
いるときは、分子線投射のパターンは軸線に対し
非対称形となり、これを(1)式で近似できなくなる
が、そのパターン形状は液面の低下によつて激変
する。分子線投財パターンの変化がMBE装置を
非常に扱い難いものとすることは明らかであり、
変化は可及的に阻止したい。 The invention of the present application aims to solve this problem.
Furthermore, regardless of whether the cell is placed at the position 1a' in FIG. 4, in general, MBE apparatuses extremely dislike impurity particles falling onto the substrate or into the cell in the form of dust. For this reason, the device is often constructed in such a way that, for example, while maintaining the relative position of the substrate 8 and cell 1 shown in FIG. 4, the entire structure is tilted at 45 degrees with respect to the earth's axis. At this time, the axis of the cell is greatly tilted with respect to the earth's axis, so the liquid level of the source material is significantly tilted with respect to the axis F of the cell. When the liquid level is tilted, especially when the cell has a large diameter and the liquid level is close to the inlet A, the molecular beam projection pattern becomes asymmetrical with respect to the axis, and this can be approximated by equation (1). However, the shape of the pattern changes dramatically as the liquid level drops. It is clear that changes in molecular beam investment patterns make MBE equipment very difficult to handle;
I want to prevent change as much as possible.
本発明はこの問題の解決を目的とする。 The present invention aims to solve this problem.
第6図a,bに本発明で使用される蒸発源用セ
ルの実施例を示す。 An embodiment of the evaporation source cell used in the present invention is shown in FIGS. 6a and 6b.
10はセルであつて大別して蒸気整流器とソー
ス物質収納30からなる。40はソース収納部3
0内に収納されたソース物質、44はその上面
(ソース物質が昇華性でないときは溶融液面)、6
0はセルを囲むスパイラル状のヒーター、70は
リフレクターである。 Reference numeral 10 denotes a cell, which is roughly divided into a steam rectifier and a source material storage 30. 40 is sauce storage section 3
0, 44 is its upper surface (molten liquid surface when the source material is not sublimable), 6
0 is a spiral heater surrounding the cell, and 70 is a reflector.
セル10は、すべてPBN(熱分解窒化硼素)製
の鍔22付き円筒21と、鍔32付き円筒(底つ
き)31と、両者を鍔部で接続するコの字形断面
の三分割環50a,50b,50cで組立てられ
ている。80は熱電対、90は熱電対用絶縁碍管
である。 The cell 10 includes a cylinder 21 with a flange 22 made of PBN (pyrolytic boron nitride), a cylinder 31 with a flange 32 (with a bottom), and three-part rings 50a and 50b with a U-shaped cross section that connect the two at the flange. , 50c. 80 is a thermocouple, and 90 is an insulating tube for the thermocouple.
本発明のセル10の特徴は、この実施例のよう
に蒸気整流部20が筒形でかつ単一であり、その
開口径D1よりも深さLの方が大であること、こ
の蒸気整流部20に接続されるソース物質収納部
30の開口面積が整流部20の開口面積よりも大
なること即ち開口径D2がD1よりも大であるこ
と、及び蒸気整流部20の容積よりもソース物質
収納部30の容積を大にしてあることである。 The characteristics of the cell 10 of the present invention are that the steam rectifying section 20 is cylindrical and single as in this embodiment, and the depth L is larger than the opening diameter D1; The opening area of the source material storage section 30 connected to the steam rectification section 20 is larger than the opening area of the rectification section 20, that is, the opening diameter D2 is larger than D1, and the source material storage section 30 connected to the steam rectification section 20 has a larger opening area than the rectification section 20. The volume of the section 30 is increased.
この構成は次記の効果を生む。即ち、効果を一
つは、〔A〕ソース物質40を収納部30内に収
納する限り、その上面(液面)が上方即ち44の
位置にあるときも、下方44aの位置にあるとき
も、前述の分子線投射のパターンは殆んど変ら
ず、従つてnの値に大きい変化を生じないことで
ある。これは、セル10が傾いた構造でソース物
質の上面(液面)が46のように傾斜し、それが
46aの如く低下したときも同様である。 This configuration produces the following effects. That is, one effect is [A] As long as the source material 40 is stored in the storage part 30, whether the upper surface (liquid level) is at the upper position 44 or the lower position 44a, The above-mentioned molecular beam projection pattern hardly changes, and therefore the value of n does not change significantly. This also applies when the cell 10 has an inclined structure and the upper surface (liquid level) of the source material is inclined as shown at 46 and is lowered as shown at 46a.
効果の他の1つは〔B〕、ソース物質収納部3
0を極めて大容積にしうることである。この大容
積は収納部の径D2を大きくして達成でき、セル
の外形はさ程大きくならない。しかも、径D2を
大きくすればする程〔A〕の効果は増すという長
所がある。 Another effect is [B], source material storage section 3
0 can have an extremely large volume. This large volume can be achieved by increasing the diameter D2 of the accommodating portion, and the external shape of the cell does not become very large. Moreover, it has the advantage that the effect of [A] increases as the diameter D2 becomes larger.
蒸発投射のパターンは、ソース物質の上面44
から直接蒸発投射される蒸気のパターンと、上面
44から投射された蒸気が蒸気整流部20の内面
で反射して間接的に投射される蒸気のパターンと
の合成である。 The pattern of evaporative projection is the top surface 44 of the source material.
This is a combination of a steam pattern that is directly evaporated and projected from the upper surface 44 and a steam pattern that is indirectly projected by reflecting the steam that is projected from the upper surface 44 on the inner surface of the steam rectifying section 20.
L及びD2の値をD1に比して大きくすればする
ほど合成パターンが変化し難くなることは容易に
首肯できるが、前記のようにD1<L、D1<D2に
選べば、nは大きくは変らず、第4図のセル1
a′によつて基板8上に長時間に亘つて充分実用的
な膜厚の均一性を確保できることが判明してい
る。 It is easy to agree that the larger the values of L and D2 are compared to D1, the more difficult it is for the composite pattern to change, but if you choose D1<L and D1<D2 as mentioned above, n will not be large. No change, cell 1 in Figure 4
It has been found that sufficient practical film thickness uniformity can be ensured on the substrate 8 over a long period of time by a'.
本発明のセルは第7図のようにD1、D2を互に
偏心させて実施することができ、第8図のよう
に、接続を鍔22,32を廃して、円錐面24の
スリ合せで行つてもよい。セルの素材をPBN以
外のものも(例えばカーボン等)にとれば、第9
図のように一体化構造にすることもできる。 The cell of the present invention can be implemented by making D1 and D2 eccentric to each other as shown in FIG. 7, and as shown in FIG. You may go. If the cell material is other than PBN (for example, carbon), the 9th
It is also possible to have an integrated structure as shown in the figure.
また、セルの開口形状は円形に限定されない。
第10図a,b,c,dのように卵形、隋円形、
四角、台形等々が必要に応じて選定できるもので
ある。なお、そのときのD1の値は、図のように
開口部の長を採用すべきである。 Further, the opening shape of the cell is not limited to a circular shape.
Oval shape, round shape, as shown in Figure 10 a, b, c, d.
Square, trapezoid, etc. can be selected as required. Note that the value of D1 at that time should be the length of the opening as shown in the figure.
本発明の分子ビームエピタキシヤル成長装置は
上述のとおりであるため、蒸気放射のパターンを
一定にし、再現性あるMBE膜、膜厚の均一性に
すぐれたMBE膜等を生成する上で著効がある。
本発明が高性能半導体装置の製造に寄与するとこ
ろ極めて大きく、工業上有為の発明ということが
できる。 Since the molecular beam epitaxial growth apparatus of the present invention is as described above, it is extremely effective in keeping the vapor radiation pattern constant and producing reproducible MBE films and MBE films with excellent film thickness uniformity. be.
The present invention greatly contributes to the production of high-performance semiconductor devices, and can be said to be an industrially useful invention.
第1,2,3図は従来の分子線源用セルの図。
第4図は膜厚分布の均一性の高いMBE膜を作る
方法を説明する図。第5図はそのセルの分子線放
射の図。第6図a,b及び第7,8,9図は本発
明のセルの実施例の図。第10図a,b,c,d
はセルの開口形状の例を示す図である。
10:セル、20:蒸気整流部、30:ソース
物質収納部。
Figures 1, 2, and 3 are diagrams of conventional molecular beam source cells.
Figure 4 is a diagram illustrating a method for producing an MBE film with highly uniform film thickness distribution. Figure 5 is a diagram of the molecular beam radiation of the cell. Figures 6a and 6b and Figures 7, 8 and 9 are illustrations of embodiments of the cell of the present invention. Figure 10 a, b, c, d
2 is a diagram showing an example of the opening shape of a cell. FIG. 10: Cell, 20: Steam rectification section, 30: Source material storage section.
Claims (1)
その表面に半導体結晶薄膜を成長させる分子ビー
ムエピタキシヤル成長装置において、 開口部の長径よりも大きい深さをもつ単一の筒
状蒸気整流部と、該整流部に接続されたそれより
大きい開口面積及びそれより大きい容積をもつソ
ース物質収納部を具え、且つ、該成長させようと
する薄膜の構成物質をソース物質として収納した
蒸発源セルを、 前記筒状蒸気整流部の軸が、該基板と、その回
転の中心を外れた位置と交わる如く配置されてい
ることを特徴とする分子ビームエピタキシヤル成
長装置。[Claims] 1. In a molecular beam epitaxial growth apparatus that grows a semiconductor crystal thin film on the surface of a substrate while rotating it around a predetermined rotation axis, comprising a cylindrical steam rectifying section and a source material storage section connected to the rectifying section and having an opening area larger than that and a larger volume, and storing a constituent material of the thin film to be grown as a source material. A molecular beam epitaxial growth apparatus characterized in that the evaporation source cell is arranged such that the axis of the cylindrical vapor rectifying section intersects with the substrate at a position off the center of rotation thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58222929A JPS60115218A (en) | 1983-11-26 | 1983-11-26 | Vaporization source cell of thin film forming apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58222929A JPS60115218A (en) | 1983-11-26 | 1983-11-26 | Vaporization source cell of thin film forming apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60115218A JPS60115218A (en) | 1985-06-21 |
| JPH0232781B2 true JPH0232781B2 (en) | 1990-07-23 |
Family
ID=16790072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58222929A Granted JPS60115218A (en) | 1983-11-26 | 1983-11-26 | Vaporization source cell of thin film forming apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60115218A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08117472A (en) * | 1994-10-21 | 1996-05-14 | Hirose Mfg Co Ltd | Outer rotary hook |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61236112A (en) * | 1985-04-12 | 1986-10-21 | Hitachi Ltd | Source of molecular beam |
| JPS61251116A (en) * | 1985-04-30 | 1986-11-08 | Fujitsu Ltd | Molecular beam source for molecular beam crystal growth apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812233A (en) * | 1981-06-15 | 1983-01-24 | 松下電工株式会社 | Latching relay drive circuit |
-
1983
- 1983-11-26 JP JP58222929A patent/JPS60115218A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08117472A (en) * | 1994-10-21 | 1996-05-14 | Hirose Mfg Co Ltd | Outer rotary hook |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60115218A (en) | 1985-06-21 |
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