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JPH0257475B2 - - Google Patents
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JPH0257475B2 - - Google Patents

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Publication number
JPH0257475B2
JPH0257475B2 JP61107175A JP10717586A JPH0257475B2 JP H0257475 B2 JPH0257475 B2 JP H0257475B2 JP 61107175 A JP61107175 A JP 61107175A JP 10717586 A JP10717586 A JP 10717586A JP H0257475 B2 JPH0257475 B2 JP H0257475B2
Authority
JP
Japan
Prior art keywords
substrate
laser beam
irradiated
plate
irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61107175A
Other languages
Japanese (ja)
Other versions
JPS62263879A (en
Inventor
Makoto Kawakami
Toshiaki Fujita
Yasuyuki Nakamura
Akio Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Special Metals Co Ltd filed Critical Sumitomo Special Metals Co Ltd
Priority to JP61107175A priority Critical patent/JPS62263879A/en
Priority to US06/873,350 priority patent/US4826736A/en
Priority to DE8686108119T priority patent/DE3677065D1/en
Priority to EP19860108119 priority patent/EP0205183B1/en
Priority to CN86105621A priority patent/CN1008900B/en
Publication of JPS62263879A publication Critical patent/JPS62263879A/en
Priority to US07/271,503 priority patent/US4923100A/en
Publication of JPH0257475B2 publication Critical patent/JPH0257475B2/ja
Granted legal-status Critical Current

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  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

利用産業分野 この発明は、金属または合金基板上に、被着材
料を冷間圧接法にて、全面あるいは所要箇所に局
部的に、圧着する電子部品用クラツド板の製造方
法に係り、冷間圧接後の拡散焼なまし処理及び歪
取り焼鈍を必要とせず、クラツド材料幅方向の内
部歪が均一で、エツチング、打抜後の変形が防止
され、品質および密着性良好に、1層または多層
の被着材料を高能率にクラツドできる製造方法に
関する。 背景技術 電子部品用クラツド材料として、 Fe−Ni系封着材料(40〜55%Ni−Fe)−Al板、 (基板−被着材料、以下同配列) Fe−Ni系封着材料(40〜55%Ni−Fe)−Agろ
う板、 Fe−Ni系封着材料(40〜55%Ni−Fe)−Ag
板、 コバール合金板(25〜50%Ni−10〜20%Co−
Fe)−Agろう板、 等からなる2層ストライプクラツド板、または
Fe−Ni系封着材料(40〜55%Ni−Fe)−Al板、
コバール合金板(25〜50%Ni−10〜20%Co−
Fe)−Agろう板、等からなる全面クラツド板が
利用されている。 例えば、Alストライプ状電子部品クラツド材
料の製造には、42%Ni−Fe合金の金属基板帯を
還元雰囲気中で焼鈍し、基板表面の清浄化処理を
施した後、さらに冷間圧接すべき表面部分にワイ
ヤーブラツシングを施して清浄化し、1条あるい
は所要パターンの複数条のAl条をこの基板上に
重ね合せて圧延ロールにより冷間圧接し、圧接後
あるいは少なくとも1回の冷間圧延を行なつた
後、600℃以下で拡散焼なまし処理して、Al条と
金属基板との接合を完全にし、さらにクラツド材
料の寸法、形状を調整するため、少なくとも1回
の冷間圧延を行ない、さらに、ストライプ状にク
ラツドすることによる基板幅方向に不均一に残留
した内部応力歪あるいは打抜き加工後のエツジ部
の残留歪を除去するため、550℃以下で熱処理し
たり、550℃以下で加熱してクラツド条に張力を
付与し、伸びを付加して矯正する製造方法が、一
般に採用されている。 しかし、基板表面に1条または複数条の被着材
を設ける所謂ストライプ状クラツド板の場合は、
ワイヤーブラツシング等の機械的研摩では、所要
圧接予定表面以外の基板表面、例えば全表面まで
研摩され、研摩によつて研摩表面に割れの発生や
鱗片状金属粉の発生付着及び異物が残存する恐れ
があり、被着材の圧接の際に圧接面に金属粉、該
異物あるいは気体の巻き込みが起り、被着材表面
の膨れを生じる問題がある。 また、クラツド板表面の品質を劣化させる等の
問題を有するほか、従来の製造方法では、多大の
工程や熱処理を要し、製造コストの上昇、並びに
拡散焼なまし時の被着材料等の疵や表面品質の低
下が問題となつていた。 また、クラツド板の製造において、冷間圧接前
に圧接面にレーザービームを照射する方法が提案
(特開昭52−60256号公報、特開昭56−114590号公
報)されている。 前者公報方法は、移動中の金属板の少なくとも
一方を他方に向けて、V形部を形成して、該V形
部の接触部分(溶接される部分)に集光するよう
に、レーザービームを照射して溶接するため、レ
ーザービームのV形接触部分に集光させるための
調整が極めて面倒であり、また、移動する金属板
は振動しながら移送されるため、レーザービーム
の焦点を常に溶接位置に安定されることは容易で
ない。 また、後者公報方法は、溶接すべき2枚の金属
板の溶接部に焦点を結ばない(集束状態にない)
エネルギービームを用いるため、2枚の金属板の
対向面の直接加熱に有効に利用され、反射による
散逸などがないため、極めて効率的な溶接法では
ある。 しかし、前記両方法はいずれもエネルギービー
ム(レーザービーム)を溶接対象物の加熱溶着の
ための熱源として使用されるため、溶融による合
金層の形成は避けられず、合金層の形成が問題と
なる電子部品用クラツド板では加熱溶着による方
法では製造困難であり、また加熱溶着法では溶融
合金層厚が100μm程度であるため、板厚が100μm
以下の被着材料や基板を使用する電子部品用クラ
ツド板の製造には適用できない。 発明の目的 この発明は、従来のクラツド法において、金属
板表面の清浄化に起因する問題点を解消し、被着
材表面の膨れ防止とすぐれたクラツド板表面品質
が得られるとともに、従来、不可欠であつた冷間
圧接後の拡散焼なまし処理工程を省略でき、冷間
圧接工程のみで完全な接合が可能で、さらに、機
械特性調整のため、軟化焼鈍を必要により施して
もよいが、歪取り焼鈍することなく、金属基板幅
方向の内部応力を均一にでき、打抜き加工後の変
形を防止できる電子部品用クラツド板の製造方法
を目的としている。 発明の構成と効果 この発明は、電子部品用クラツド材料の製造方
法において、冷間圧接後の拡散焼なまし処理工程
を省略できる製造方法を目的に種々検討し、かつ
基板表面の清浄化とクラツド板の被着材表面の品
質改善並びに被着強度の向上を目的に種々検討し
た結果、走行中の基板表面の被着予定表面を非酸
化性雰囲気中で、加熱装置にて予備加熱した後、
基板表面の被着予定表面に、全面均一なレーザー
ビームの照射を行ない、接合不良となる異物、油
脂、水分に吸収され易い波長のレーザービームを
照射することにより、表面に付着している異物、
油脂、水分がレーザー光を吸収してガス化し、除
去されるため、清浄な表面が得られ、前記表面に
被着材料を圧接すると表面が清浄なために容易に
原子間結合が起り、実用上、差支えない範囲の充
分な接着強度が得られることを知見した。 さらに、異物等だけでなく、基板にも吸収され
易い波長、すなわち波長5μm以下のレーザービー
ムを用いれば、2μm以下、望ましくはサブミクロ
ンオーダーの極表面層を、溶融凝固させて硬化層
を形成し、被着材の冷間圧接時に、基板表面の硬
化層表面にすべり変形等により微細なマイクロク
ラツクを形成し、新生面の露出により、基板と被
着材料との密着強度を著しく向上させることがで
き、従来の機械的研摩にともなう表面の割れ、金
属粉、残留異物の発生、付着を防止でき、気体の
巻き込みが発生せずにクラツド材表面の膨れがな
くなり、従来の拡散焼なまし処理が不要になるこ
とを知見した。 さらに、この圧接方法を製品形状、寸法精度等
の厳しいリードフレーム用のクラツド材への適用
を種々検討した結果、金属基板の一主面に凹部溝
を形成し、凹部溝を含んであるいは凹部溝形成主
面とは反対側他主面の凹部溝位置を含む金属基板
表面に、レーザービームを照射し、該照射により
形成した基板の照射層表面に、被着材料を冷間圧
接すると、基板幅方向の内部応力が均一化され、
特に、被着材料がAlの場合、前記の拡散焼なま
し処理工程及び残留歪取り焼鈍工程が不要とな
り、冷間圧接のまま、あるいは冷間圧接後の冷間
圧延のみで、打抜き後の変形がない電子部品用ク
ラツド板が得られることを知見し、この発明を完
成したものである。 すなわち、この発明は、 金属または合金の基板表面の1主面に、少なく
とも1状の凹部溝を形成し、そのままもしくは基
板を非酸化性または還元性雰囲気中で焼鈍後、前
記凹部溝を含んであるいは凹部溝形成主面とは反
対側他主面の凹部溝位置を含む基板表面に、必要
に応じて、予備加熱した後、レーザービームを照
射し、該照射により形成した基板の照射層表面
に、被着材料を冷間圧接することを特徴とする電
子部品用クラツド板の製造方法である。 さらに詳述すれば、この発明は、 平滑な2主面を有する金属基板、例えば、42%
Ni−Fe合金やコバール合金の1主面に、所要パ
ターンにクラツドするAlあるいはAl合金条の断
面積に等しい凹部溝を同様配置パターンで、冷間
圧延により形成し、 この凹部溝形成による内部の残留歪を除去する
ため、非酸化性もしくは還元性雰囲気にて、 850℃〜1050℃にて焼鈍したのち、 前記凹部溝を含んであるいは凹部溝形成のない
側の反対主面の凹部溝位置を含む基板表面に、レ
ーザービームを照射し、該照射面に溶融凝固硬化
層を生成させ、 かかる表面硬化層上に、Al、Al合金条を 25%〜70%の圧下率で冷間圧接すると、該硬化
層に亀裂を生じ、この亀裂内にAl、Al合金条が、
冷間圧接時に押込まれた状態となり、圧接が完全
となり、 従来不可欠とされていた接合を安定化させるた
めの拡散焼なまし処理は不要となり、クラツド材
料内部の歪が均一化され、後続での打抜きやエツ
チング加工での製品に変形や歪が発生せず、歪取
り焼鈍処理の必要がなくなる。 また、この発明において、溝形成し、非酸化性
もしくは還元性雰囲気にて焼鈍した金属または合
金基板の凹部溝を含んであるいは凹部溝形成主面
とは反対側多面の凹部溝相当位置を含む基板表面
に、レーザービームを照射するが、照射前に予備
加熱することにより、クラツド板を高能率で製造
することができる。 また、凹部溝を多条形成し、前記の照射処理を
行ない、多条の被着材料を圧接後、所要幅にスリ
ツトして製造するのもよい。 発明の好ましい実施態様 この発明において、予備加熱は、Ar、N2ガス
等の非酸化性雰囲気中もしくはH2ガス等の還元
性雰囲気中で、例えば、光ビーム、YAGレーザ
ー、CO2レーザー、高周波等の加熱装置にて、
200℃〜1000℃に予備加熱するのが好ましい。 加熱温度が200℃未満では、表面の清浄化の点
で好ましくなく、また、1000℃を越えると、極表
面酸化や基板の変形の点で好ましくなく、予備加
熱温度は200℃〜1000℃が好ましい。 この発明において、レーザービームの照射方法
は、被着材料の被着予定表面にスポツト状のビー
ムをミラーを用いて2次元的に走行、あるいはミ
ラー、レンズを用いて、ビームを拡げて板幅方向
に一括照射を行ない、被着予定表面の全面に均一
に照射するか、あるいは被着予定表面上にビーム
をジグザグ走行、蛇行させたり、縞状に部分照射
するものである。 また、この発明において、レーザービームを部
分的に照射した被着材料の表面状態は、前記の如
く、照射表面の清浄化と極表面層の溶融凝固によ
る硬化層を形成し、非照射部分も周囲の照射部分
の熱影響により、表面が清浄化されている。この
ため、レーザービームの照射部分に被着材料を冷
間圧接すると、前述の如く、照射部分において、
被着材料と基板材料が強固に接着し、非照射部分
も表面が清浄化されるため、被着材料と基板材料
との密着性が向上して充分な接着強度が得られ
る。 この発明において、基板及び被着材料の種類や
組み合せは、任意でクラツドできる組み合せであ
ればよく、また、レーザービームの照射は、表面
の付着物、油脂、水分の除去ができればよく、好
ましくは2μm以下の極表面層の溶融凝固が可能で
あれば、いかなる方法でもよく、例えば、スポツ
ト状にビームを集光させて基板表面の直交方向に
照射し、基板とレーザービームとを基板の長手方
向に同方向あるいは逆方向に移動させたり、さら
には、レーザービームを基板幅方向に振幅させな
がら基板長手方向に移動させるなどの方法が採用
できる。 また、レーザービームは、レーザ発振器から発
振されて、コリメータ、レンズにより集光し、光
フアイバーにて所要位置に導いて照射する方法も
採用できる。 この発明において、レーザービームの照射条件
として、ビームのパワー密度は、100kW/mm2
1500kW/mm2の範囲が好ましく、さらに好ましく
は、300kW/mm2〜900kW/mm2である。 レーザービームのパワー密度が100kW/mm2
満では、圧接に対する表面清浄化効果がなく、ま
た、1500kW/mm2を越えると、表面の凹凸が激し
くなり、パワー密度の上昇に伴ない基板に孔が生
成し好ましくない。 また、レーザー波長は、5μm以下であれば有効
であるが、2μmを越えると基板への吸収効果が低
下するため、2μm以下の波長を用いることが望ま
しい。 この発明における金属または合金基板は、Fe
−Ni系封着材料(40〜55%Ni−Fe)、コバール
合金板(25〜50%Ni−10〜20%Co−Fe)、Cu合
金板(Be1.1%以下、Ti1.0%以下、Cr1.6%以下、
Fe6.0%以下、Ni15.0%以下、Zn43%以下、B0.5
%以下、Si6.0%以下、Pb0.08%以下、P0.5以下、
Te0.6%以下、Mg0.6%以下、Zr0.7%以下、Mn7
%以下、Co2%以下、Ag1.5%以下、Cd1.3%以
下、Al12%以下、Sn12%以下の少なくとも1種
を含有し、但し、添加元素を2種以上含有する場
合、その総量は45%以下、残部Cuからなる)が
好ましい。 また、被着材料として、Al、Al合金板、Ag
板、Agろう板、黄銅ろう板、はんだ板が好まし
い。 また、この発明による電子部品用クラツド板と
して、全面クラツド板の場合、その板厚は、0.05
〜1.0mmが好ましく、ストライプ状クラツド板の
場合、その板厚は、0.05〜1.0mmが好ましく、目
的用途に応じて板厚を適宜選定するとよい。 発明の図面に基づく開示 第1図はこの発明によるクラツド法を示す基板
の斜視説明図である。ここでは、42%Ni−Fe合
金板の幅方向中央にAgろう板を1条、ストライ
ブ状に冷間圧接する例を説明する。 42%NiFe合金板1コイルは、アンコイリング
され、続いて凹部溝成形ロール9にて、下面に凹
部溝を形成し、さらに、H2雰囲気の焼鈍炉10
にて焼鈍した後、冷間圧接ロール2へ進行する。 圧接ロール2後方には、通過する合金板1の上
面にレーザービームを照射するための照射ボツク
ス3が配置され、照射ボツクス3は合金板1全体
を包囲し、内部にArガスを通気してあり、Arガ
ス雰囲気中でレーザービームを照射できる構成で
ある。 レーザービームは、例えば、YAGレーザ−の
レーザー発振器4から発振されてコリメーター
5、ガルバニツクミラー6を介して、fθレンズ7
により集光し焦点を結んだのち、焦点より所要距
離、離間した位置で、合金板1の幅方向中央位置
の所要幅部分を照射できるよう、fθレンズ7位置
が調整される。 なお、この発明に使用されるレーザービーム発
生装置は、ガルバニツクミラー6に代えて、多面
体ミラーもしくはセグメントミラーを用いること
により、レーザー走査速度を速くすることがで
き、また、シリンドリカルレンズを用いて、板幅
方向を一括して照射することにより、加工速度の
向上を図ることができる。 合金板1は幅方向中央位置の所要幅部分、ここ
では、凹部溝とは反対側の上面の凹部溝相当位置
を、ジグザグ状あるいは縞状に、レーザービーム
照射されて、極表面層が溶融凝固し、表面の付着
物、油脂、水分が除去された新生面となる。 一方、Agろう板8はアンコイリングされたの
ち、合金板1上方より圧接ロール2へ送給され、
前記のレーザービーム照射による照射面上に圧接
される。 この際、圧接により照射面の溶融凝固層表面に
すべり変形等によりマイクロクラツクが発生し、
内部の新生面が露出してAgろう板8が圧接され
るため、従来の機械的研摩表面に比較して、清浄
度がすぐれ、合金板1とAgろう板8との密着強
度が向上し、従来法より圧延率を小さくでき、軟
質製品を高効率で得ることができる。 例えば、リードフレーム材料の場合、クラツド
後の工程で、打抜き加工及び折曲げ加工が容易に
なり、材料のリード強度、品質の向上に極めて有
利である。 第1図では、合金板上に1条の被着材料を冷間
圧接した例を説明したが、合金板全面であつて
も、また、複数条であつても同様に製造でき、す
ぐれた密着強度と製品性状を得ることができる。 また、一主面みならず、他主面に圧接した両面
クラツド板についても同様に製造できる。 従つて、基板となる材料の材質や寸法、さらに
被着材料の材質寸法等により、レーザービームの
発振方法や照射出力、fθレンズによる焦点と照射
表面までの距離、被照射側の移動速度などを適宜
選定する必要がある。 実施例 実施例 1 金属基板には、板厚1mm、板幅25mmの42Ni−
Fe合金板、被着材料には、板厚0.03mm、板幅3.0
mm、85Ag−Cu系ろう板を使用した。 該金属基板の一方主面の中央部に、0.3mm深さ
×3.0mm幅の1条の溝を、冷間圧延により成形し
た。ついで、該金属基板帯を水素中にて1000℃、
30秒の条件で焼鈍した。 その後、前記凹部溝形成主面の凹部溝に、レー
ザービームを照射した。その時の照射条件は以下
のとおりである。 照射ボツクス内雰囲気ガス、Arガス、基板移
動速度10m/minであつた。 レーザー照射装置には、波長1μm、出力100W
の10kHzQスイツチYAGレーザーを用い、レン
ズ焦点間距離100mmの条件で、上述した第1図の
この発明による方法で、表面の溝底部に、幅3.0
mmで、ビーム照射幅3mm、ピツチ幅0.5mmで、基
板長手方向に連続して、レーザービームによるジ
グザグ状の照射面を形成し、第2図に示す如く、
照射部分aと非照射部分bとを形成し、同照射面
に、前記Agろう板を圧接ロールにて、圧延率60
%で冷間圧接した。 その後、1回の冷間圧延を施して、板厚0.25
mm、板幅25mm寸法からなるこの発明によるストラ
イプ状クラツド板を得た。なお、全圧延率は75%
であつた。 また、比較のため、同種の金属基板と被着材料
を用い、基板表面に、0.1mmφワイヤー回転ブラ
シ、移動速度22m/sのワイヤーブラツシング条
件で、従来の機械的研摩を施したのち、Agろう
板を冷間圧接し、同一寸法のストライプ状クラツ
ド板を得た。 得られた2種のクラツド板の寸法、外観性状及
び機械的性質を調べ、その結果を第1表に示す。 第1表から明らかなように、本発明方法による
と、軟質製品を得ることができ、かつ外観性状が
すぐれ、すこぶる品質のよいクラツド板が得られ
ることが分る。
Field of Application This invention relates to a method for manufacturing a cladding plate for electronic components, in which an adherend material is crimped on the entire surface or locally at required points on a metal or alloy substrate by cold welding. There is no need for subsequent diffusion annealing or strain relief annealing, the internal strain in the width direction of the cladding material is uniform, deformation after etching and punching is prevented, and quality and adhesion are good. This invention relates to a manufacturing method that enables highly efficient cladding of adherend materials. Background technology Fe-Ni sealing material (40~55% Ni-Fe)-Al plate, (substrate-adherent material, hereinafter the same arrangement) Fe-Ni sealing material (40~55% Ni-Fe) as a cladding material for electronic components. 55%Ni-Fe)-Ag brazing plate, Fe-Ni sealing material (40-55%Ni-Fe)-Ag
Plate, Kovar alloy plate (25~50%Ni−10~20%Co−
Fe)-Ag brazed plate, two-layer striped clad plate, etc.
Fe-Ni sealing material (40-55% Ni-Fe)-Al plate,
Kovar alloy plate (25~50%Ni−10~20%Co−)
Fully clad plates made of Fe)-Ag solder plates, etc. are used. For example, in the production of Al striped electronic component cladding materials, a metal substrate strip of 42% Ni-Fe alloy is annealed in a reducing atmosphere, the substrate surface is cleaned, and then the surface to be cold-welded is The part is cleaned by wire brushing, and one or multiple Al strips in a desired pattern are superimposed on this substrate and cold welded using rolling rolls, and after welding, or at least one cold rolling process. After this, diffusion annealing is performed at 600°C or less to completely bond the Al strip to the metal substrate, and cold rolling is performed at least once to adjust the dimensions and shape of the cladding material. Furthermore, in order to remove the internal stress strain that remains unevenly in the width direction of the substrate due to the striped cladding or the residual strain at the edge after punching, heat treatment is performed at a temperature of 550°C or lower, or heat treatment is performed at a temperature of 550°C or lower. Generally, a manufacturing method is adopted in which tension is applied to the cladding strip to add elongation and correction. However, in the case of a so-called striped clad board in which one or more stripes of adherend material are provided on the surface of the substrate,
In mechanical polishing such as wire brushing, the surface of the substrate other than the surface scheduled for pressure welding, for example, the entire surface, is polished, and as a result of polishing, cracks occur, scale-like metal powder is generated, adhesion, and foreign matter remain on the polished surface. There is a risk that metal powder, foreign matter, or gas may be drawn into the pressure contact surface during pressure welding of adherends, resulting in a problem that the surface of the adherend may swell. Furthermore, in addition to problems such as deterioration of the quality of the surface of the clad plate, conventional manufacturing methods require a large number of steps and heat treatments, increasing manufacturing costs, and causing defects in the adhered materials during diffusion annealing. and deterioration of surface quality had become a problem. Furthermore, in the production of cladding plates, a method has been proposed in which a laser beam is irradiated onto the pressure-welding surface before cold pressure welding (Japanese Patent Application Laid-open No. 52-60256 and Japanese Patent Application Laid-open No. 114590-1983). In the method disclosed in the former publication, at least one of the moving metal plates is directed toward the other to form a V-shaped section, and a laser beam is focused on the contact part (the part to be welded) of the V-shaped part. Since welding is performed by irradiating the laser beam, it is extremely troublesome to adjust the laser beam to focus it on the V-shaped contact area.Also, the moving metal plate is transported while vibrating, so the focus of the laser beam is always adjusted to the welding position. It is not easy to be stabilized. In addition, the latter method does not focus on the welding part of the two metal plates to be welded (not in a focused state).
Since an energy beam is used, it is effectively used to directly heat the opposing surfaces of two metal plates, and there is no dissipation due to reflection, making it an extremely efficient welding method. However, since both of the above methods use an energy beam (laser beam) as a heat source for heating and welding the welding object, the formation of an alloy layer due to melting cannot be avoided, and the formation of an alloy layer becomes a problem. It is difficult to manufacture clad plates for electronic components using heat welding, and the thickness of the molten alloy layer is approximately 100 μm, so the thickness of the plate is approximately 100 μm.
It cannot be applied to the production of clad plates for electronic components using the following adherend materials and substrates. Purpose of the Invention The present invention solves the problems caused by cleaning the surface of a metal plate in the conventional cladding method, prevents blistering on the surface of the adherend and provides excellent cladding plate surface quality, which is indispensable in the past. The diffusion annealing process after cold pressure welding, which was previously required, can be omitted, and complete bonding can be achieved with only the cold pressure welding process.Furthermore, softening annealing may be performed if necessary to adjust the mechanical properties. The object of the present invention is to provide a method for manufacturing a clad plate for electronic components that can uniformize internal stress in the width direction of a metal substrate without strain relief annealing, and can prevent deformation after punching. Structure and Effects of the Invention The present invention has been made with the aim of creating a manufacturing method that can omit the diffusion annealing process after cold pressure welding in a manufacturing method for cladding materials for electronic components, and has also been developed to improve cleaning of substrate surfaces and cladding materials. As a result of various studies aimed at improving the quality of the adherend surface of the board and increasing the adhesion strength, we found that after preheating the surface of the substrate to be adhered to during running using a heating device in a non-oxidizing atmosphere,
By irradiating the surface of the substrate to be adhered with a laser beam uniformly over the entire surface, and by irradiating the laser beam with a wavelength that is easily absorbed by foreign matter, oil, fat, and moisture that cause bonding defects, foreign matter adhering to the surface can be removed.
Oils, fats, and water absorb laser light, gasify, and remove, resulting in a clean surface. When an adherend material is pressed onto the surface, interatomic bonds easily occur because the surface is clean, making it difficult to use in practical applications. It has been found that sufficient adhesion strength can be obtained without causing any problems. Furthermore, by using a laser beam with a wavelength that is easily absorbed not only by foreign objects but also by the substrate, that is, a wavelength of 5 μm or less, the extreme surface layer of 2 μm or less, preferably on the submicron order, can be melted and solidified to form a hardened layer. During cold pressure welding of adherends, fine microcracks are formed on the surface of the hardened layer on the substrate surface due to sliding deformation, etc., and the exposure of the new surface significantly improves the adhesion strength between the substrate and the adherend. It is possible to prevent cracks on the surface, generation and adhesion of metal powder and residual foreign matter caused by conventional mechanical polishing, and there is no gas entrainment, eliminating swelling on the surface of the clad material, and eliminating the need for conventional diffusion annealing. I realized that it was no longer necessary. Furthermore, as a result of various studies on the application of this pressure welding method to cladding materials for lead frames with strict product shape and dimensional accuracy, we found that we formed concave grooves on one main surface of the metal substrate, A laser beam is irradiated onto the surface of the metal substrate including the concave groove positions on the other main surface opposite to the main surface to be formed, and when an adherend material is cold-pressed onto the surface of the irradiated layer of the substrate formed by the irradiation, the substrate width is The internal stress in the direction is equalized,
In particular, when the adherend material is Al, the above-mentioned diffusion annealing process and residual strain relief annealing process are unnecessary, and deformation after punching can be achieved by simply cold welding or cold rolling after cold welding. This invention was completed based on the discovery that a cladding plate for electronic parts without any cladding can be obtained. That is, the present invention forms at least one concave groove on one main surface of a metal or alloy substrate surface, and includes the concave groove as it is or after annealing the substrate in a non-oxidizing or reducing atmosphere. Alternatively, the substrate surface including the concave groove position on the other main surface opposite to the concave groove forming main surface is preheated as necessary and then irradiated with a laser beam, and the surface of the irradiated layer of the substrate formed by the irradiation is , a method for manufacturing a clad plate for electronic components, characterized by cold pressure welding of adherend materials. More specifically, the present invention provides a metal substrate having two smooth main surfaces, e.g.
Concave grooves equal to the cross-sectional area of the Al or Al alloy strips clad in the desired pattern are formed on one main surface of the Ni-Fe alloy or Kovar alloy by cold rolling in the same arrangement pattern. In order to remove residual strain, annealing is performed at 850°C to 1050°C in a non-oxidizing or reducing atmosphere, and then the recessed groove position on the opposite main surface including the recessed groove or on the side where no recessed groove is formed is A laser beam is irradiated onto the surface of the substrate containing the aluminum to form a molten solidified hardened layer on the irradiated surface, and Al and Al alloy strips are cold-pressed onto the surface hardened layer at a reduction rate of 25% to 70%. A crack is generated in the hardened layer, and within this crack, Al and Al alloy strips are formed.
During cold pressure welding, the material is pushed in and the pressure welding is complete, eliminating the need for diffusion annealing to stabilize the bond, which was previously considered indispensable.The internal strain of the clad material is evened out, making subsequent welding easier. No deformation or distortion occurs in the product during punching or etching, eliminating the need for distortion-relief annealing. Further, in the present invention, a substrate including grooves formed in a metal or alloy substrate formed with grooves and annealed in a non-oxidizing or reducing atmosphere, or including positions corresponding to the grooves on multiple sides on the opposite side from the main surface on which the grooves are formed. The surface is irradiated with a laser beam, but by preheating the surface before irradiation, a clad plate can be manufactured with high efficiency. Alternatively, it is also possible to manufacture the recessed groove by forming multiple grooves, performing the irradiation treatment described above, press-contacting multiple layers of the adherend material, and then slitting it to a desired width. Preferred Embodiment of the Invention In this invention, preheating is performed in a non-oxidizing atmosphere such as Ar or N 2 gas or in a reducing atmosphere such as H 2 gas, for example, using a light beam, YAG laser, CO 2 laser, high frequency With a heating device such as
Preferably, it is preheated to 200°C to 1000°C. If the heating temperature is less than 200°C, it is unfavorable in terms of cleaning the surface, and if it exceeds 1000°C, it is unfavorable in terms of extreme surface oxidation or deformation of the substrate, so the preheating temperature is preferably 200°C to 1000°C. . In this invention, the laser beam irradiation method is to use a mirror to run a spot-shaped beam two-dimensionally on the surface to be adhered to the material to be adhered, or to spread the beam in the width direction of the plate using a mirror or lens. Either the beam is irradiated all at once and the entire surface to be coated is irradiated uniformly, or the beam is irradiated in a zigzag pattern, meandering, or partially in a striped manner over the surface to be coated. In addition, in this invention, the surface state of the adherend material partially irradiated with the laser beam is such that a hardened layer is formed by cleaning the irradiated surface and melting and solidifying the extreme surface layer, and the non-irradiated portion also forms a hardened layer as described above. The surface is cleaned by the thermal influence of the irradiated area. Therefore, when the adherend material is cold-welded to the laser beam irradiation area, as mentioned above, in the irradiation area,
Since the adherend material and the substrate material are firmly bonded and the surface of non-irradiated areas is also cleaned, the adhesion between the adherend material and the substrate material is improved and sufficient adhesive strength can be obtained. In this invention, the type and combination of the substrate and the adherend material may be any combination that can be used for cladding, and the laser beam irradiation may be applied as long as it can remove deposits, oils, and moisture from the surface, preferably 2 μm. Any method may be used as long as it is possible to melt and solidify the extreme surface layer described below.For example, the beam is focused in a spot shape and irradiated in a direction perpendicular to the substrate surface, and the substrate and the laser beam are aligned in the longitudinal direction of the substrate. It is possible to adopt methods such as moving the laser beam in the same direction or in the opposite direction, or moving the laser beam in the longitudinal direction of the substrate while vibrating the laser beam in the width direction of the substrate. Alternatively, a method may be adopted in which the laser beam is oscillated by a laser oscillator, focused by a collimator and a lens, and guided to a desired position by an optical fiber for irradiation. In this invention, the laser beam irradiation conditions are such that the beam power density is 100kW/mm 2 ~
The range is preferably 1500kW/mm 2 , more preferably 300kW/mm 2 to 900kW/mm 2 . If the power density of the laser beam is less than 100kW/mm 2 , there is no surface cleaning effect for pressure welding, and if it exceeds 1500kW/mm 2 , the surface becomes more uneven and holes are formed in the substrate as the power density increases. It generates and is undesirable. Further, it is effective if the laser wavelength is 5 μm or less, but if it exceeds 2 μm, the absorption effect on the substrate decreases, so it is desirable to use a wavelength of 2 μm or less. The metal or alloy substrate in this invention is Fe
-Ni-based sealing material (40-55% Ni-Fe), Kovar alloy plate (25-50% Ni-10-20% Co-Fe), Cu alloy plate (Be less than 1.1%, Ti less than 1.0%) , Cr1.6% or less,
Fe6.0% or less, Ni15.0% or less, Zn43% or less, B0.5
% or less, Si6.0% or less, Pb0.08% or less, P0.5 or less,
Te 0.6% or less, Mg 0.6% or less, Zr 0.7% or less, Mn7
% or less, Co2% or less, Ag1.5% or less, Cd1.3% or less, Al12% or less, Sn12% or less.However, if two or more types of additive elements are contained, the total amount is 45% or less. % or less, the balance consisting of Cu) is preferred. In addition, Al, Al alloy plate, Ag
Preferred are plates, Ag brazed plates, brass brazed plates, and soldered plates. Furthermore, in the case of a fully clad plate for electronic components according to the present invention, the thickness of the plate is 0.05 mm.
The thickness is preferably 1.0 mm to 1.0 mm, and in the case of a striped clad plate, the thickness is preferably 0.05 to 1.0 mm, and the thickness may be appropriately selected depending on the intended use. Disclosure of the Invention Based on Drawings FIG. 1 is a perspective explanatory view of a substrate showing the cladding method according to the invention. Here, an example will be described in which a single strip of Ag solder plate is cold-welded in the widthwise center of a 42% Ni-Fe alloy plate in the form of a stripe. The 42% NiFe alloy plate 1 coil is uncoiled, and then a concave groove forming roll 9 is used to form concave grooves on the lower surface.
After being annealed in the cold welding roll 2, the material is annealed. An irradiation box 3 is arranged behind the pressure roll 2 to irradiate the upper surface of the alloy plate 1 passing with a laser beam.The irradiation box 3 surrounds the entire alloy plate 1 and has Ar gas vented inside. , the configuration allows laser beam irradiation in an Ar gas atmosphere. A laser beam is emitted from a laser oscillator 4 such as a YAG laser, passes through a collimator 5 and a galvanic mirror 6, and then passes through an fθ lens 7.
After the light is condensed and focused, the position of the fθ lens 7 is adjusted so that a required width of the alloy plate 1 at the center in the width direction can be irradiated at a position separated by a required distance from the focal point. Note that the laser beam generator used in the present invention can increase the laser scanning speed by using a polyhedral mirror or a segment mirror instead of the galvanic mirror 6, and can increase the laser scanning speed by using a cylindrical lens. By irradiating the sheet width direction all at once, it is possible to improve the processing speed. The alloy plate 1 is irradiated with a laser beam in a zigzag or striped manner to melt and solidify the extreme surface layer at a required width at the center in the width direction, here, at a position corresponding to the recess grooves on the upper surface opposite to the recess grooves. This creates a new surface from which deposits, oil, and moisture have been removed. On the other hand, after being uncoiled, the Ag brazing plate 8 is fed from above the alloy plate 1 to the pressure welding roll 2.
It is pressed onto the surface irradiated by the laser beam irradiation. At this time, microcracks occur on the surface of the molten solidified layer on the irradiated surface due to sliding deformation due to pressure welding.
Since the internal newly formed surface is exposed and the Ag solder plate 8 is pressed against the surface, the cleanliness is superior compared to conventional mechanically polished surfaces, and the adhesion strength between the alloy plate 1 and the Ag solder plate 8 is improved. The rolling ratio can be lower than that of the conventional method, and soft products can be obtained with high efficiency. For example, in the case of lead frame materials, punching and bending are facilitated in the post-cladding process, which is extremely advantageous in improving the lead strength and quality of the material. In Fig. 1, we explained an example in which a single strip of adherend material was cold-welded on an alloy plate, but it can be manufactured in the same way whether it is the entire surface of the alloy plate or multiple strips, and excellent adhesion can be achieved. Strength and product properties can be obtained. Moreover, not only one main surface but also a double-sided clad plate in pressure contact with the other main surface can be manufactured in the same manner. Therefore, the oscillation method of the laser beam, the irradiation output, the distance between the focal point of the fθ lens and the irradiation surface, the moving speed of the irradiated side, etc., depend on the material and dimensions of the substrate material, as well as the material dimensions of the adhered material. It is necessary to select it appropriately. Examples Example 1 The metal substrate was made of 42Ni with a thickness of 1 mm and a width of 25 mm.
Fe alloy plate, adherend material: plate thickness 0.03mm, plate width 3.0mm
mm, 85Ag-Cu brazing plate was used. A single groove having a depth of 0.3 mm and a width of 3.0 mm was formed in the center of one main surface of the metal substrate by cold rolling. Then, the metal substrate strip was heated in hydrogen at 1000°C.
Annealed for 30 seconds. Thereafter, a laser beam was irradiated onto the concave grooves on the main surface where the concave grooves were formed. The irradiation conditions at that time were as follows. The atmospheric gas in the irradiation box was Ar gas, and the substrate movement speed was 10 m/min. The laser irradiation device has a wavelength of 1μm and an output of 100W.
Using a 10 kHz Q-switch YAG laser with a lens focal length of 100 mm, the method according to the invention shown in FIG.
A zigzag-shaped irradiation surface is formed by the laser beam continuously in the longitudinal direction of the substrate with a beam irradiation width of 3 mm and a pitch width of 0.5 mm, as shown in Fig. 2.
An irradiated part a and a non-irradiated part b are formed, and the Ag brazing plate is placed on the same irradiated surface using a pressure roll at a rolling rate of 60.
% cold pressure welding. After that, it is cold rolled once and has a thickness of 0.25.
A striped clad plate according to the present invention having dimensions of 25 mm and a plate width of 25 mm was obtained. The total rolling ratio is 75%.
It was hot. For comparison, using the same type of metal substrate and adhering material, the substrate surface was subjected to conventional mechanical polishing using a 0.1 mmφ wire rotating brush at a moving speed of 22 m/s. Ag brazing plates were cold-welded to obtain striped clad plates of the same size. The dimensions, appearance, and mechanical properties of the two types of clad plates obtained were examined, and the results are shown in Table 1. As is clear from Table 1, it can be seen that according to the method of the present invention, a soft product can be obtained, and a clad board with excellent appearance properties and extremely high quality can be obtained.

【表】【table】

【表】 実施例 2 金属基板に、板厚0.5mm、板幅23mmの42%Ni−
Fe合金板を用い、該金属基板の1主面の中央部
に、幅5.5mm、深さ0.1mmの1状の溝を成形し、
1000℃、30秒の焼鈍後、前記凹部溝成形主面とは
反対側主面の該溝相当位置を、N2ガス雰囲気中
で光ビームにて400℃に予備加熱した。 さらに、波長1μm、出力100WのQスイツチパ
ルスレーザーを用いて、実施例1と同一のレーザ
ービーム照射条件で、第2図に示す如く、金属基
板上にレーザービームをジグザグ状に照射し、照
射部分aと非照射部分bとを形成し、被着材料で
あるAlの冷間圧接を施したのち、1回の冷間圧
延を施して、板厚0.25mm、板幅23mm寸法からなる
この発明によるストライプ状クラツド板を得た。
なお、全圧延率は50%であつた。 さらに、本発明におけるレーザービーム照射後
の基板の圧接前表層から内部にかけての硬さの状
況及び比較例のワイヤーブラツシング後の基板表
層から内部にかけての硬さの状況を測定し、第3
図にその結果を示す。 第3図から明らかなように、ワイヤーブラツシ
ング後の表層は約10μmの厚さにわたり、硬化し
ており、硬化層は内部より変形能力が劣るため、
圧接時の変形により割れを生じ、その割れに現わ
れる新生面に被着材がよく密着する。このこと
は、圧接後の密着性試験として加熱処理を施す
と、この亀裂が拡散の起点となることから理解さ
れる。 ワイヤーブラツシングで生じる上記の態様は、
圧接前の表面処理として有効であるが、その反
面、付着物、油脂、水分を減少させ、圧接に必要
な清浄面を得るまでかかる処理を行なうと、研摩
面は著しく粗面となり、鱗片状金属粉の発生付着
及び圧接面への気体の巻き込む障害を残す恐れが
あり、また、かかる研摩を、基板上の細いストラ
イプ状の被着予定部分に、限定して施すことは困
難である。 これに対して、この発明によるレーザービーム
照射では、実施例の如く、ストライプ状の所要部
分に施すことが可能であり、照射条件の選定によ
り、粗面が生じることなく、付着物、油脂、水分
が除去され、溶融凝固層の厚さをコントロールで
きる。 また、この溶融凝固層は圧接時にマイクロクラ
ツクの発生により、比較例の場合より新生面が均
一且つ密に分布しているため、被着材がよく密着
することは加熱処理を施すと、拡散が均一に進行
することからも確認できた。
[Table] Example 2 42% Ni− with a thickness of 0.5 mm and a width of 23 mm on a metal substrate.
Using an Fe alloy plate, form a groove with a width of 5.5 mm and a depth of 0.1 mm in the center of one main surface of the metal substrate,
After annealing at 1000° C. for 30 seconds, the groove-corresponding position on the main surface opposite to the main surface forming the concave grooves was preheated to 400° C. with a light beam in an N 2 gas atmosphere. Furthermore, using a Q-switch pulse laser with a wavelength of 1 μm and an output of 100 W, the laser beam was irradiated onto the metal substrate in a zigzag pattern as shown in Figure 2 under the same laser beam irradiation conditions as in Example 1, and the irradiated area was A and a non-irradiated part b are formed, and after cold welding of Al as the adherend material, one cold rolling is performed to obtain a sheet according to the present invention having dimensions of 0.25 mm in thickness and 23 mm in width. A striped clad plate was obtained.
Note that the total rolling reduction was 50%. Furthermore, we measured the hardness from the surface layer to the inside of the substrate after laser beam irradiation in the present invention before pressure contact, and the hardness condition from the surface layer to the inside after wire brushing in the comparative example.
The results are shown in the figure. As is clear from Figure 3, the surface layer after wire brushing has a thickness of about 10 μm and is hardened, and the hardened layer has a lower deformability than the inside.
Cracks occur due to deformation during pressure welding, and the adherend adheres well to the new surface that appears in the cracks. This can be understood from the fact that when heat treatment is performed as an adhesion test after pressure bonding, this crack becomes a starting point for diffusion. The above aspects that occur during wire brushing are:
It is effective as a surface treatment before pressure welding, but on the other hand, if such treatment is performed until the clean surface necessary for pressure welding is obtained by reducing deposits, oil, and moisture, the polished surface will become extremely rough and flaky metal will be removed. There is a risk of dust generation and adhesion and gas entrainment on the pressure contact surface, and it is difficult to apply such polishing to a narrow striped area on the substrate where the polishing is to be applied. On the other hand, with the laser beam irradiation according to the present invention, it is possible to apply the laser beam to the desired striped area as in the embodiment, and by selecting the irradiation conditions, the laser beam irradiation does not cause a rough surface and removes deposits, oil, fat, moisture, etc. is removed, and the thickness of the melt-solidified layer can be controlled. In addition, due to the generation of microcracks during pressure welding, the new surface of this melted solidified layer is distributed more uniformly and densely than in the comparative example, so the fact that the adherend adheres well is due to heat treatment, which prevents diffusion. This was also confirmed by the fact that the process progressed uniformly.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明によるクラツド法を示す基板
及び装置の斜視説明図である。第2図は実施例に
おけるレーザービームの照射方法を示す基板の上
面図である。第3図はこの発明によるクラツド板
の基板深さとビツカース硬さとの関係を示すグラ
フである。 1…合金板、2…圧接ロール、3…照射ボツク
ス、4…レーザー発振器、5…コリメータ、6…
ガルバニツクミラー、7…fθレンズ、8…Agろ
う板、9…凹部溝成形ロール、10…焼鈍炉、a
…照射部分、b…非照射部分。
FIG. 1 is a perspective explanatory view of a substrate and an apparatus showing the cladding method according to the present invention. FIG. 2 is a top view of the substrate showing the laser beam irradiation method in the embodiment. FIG. 3 is a graph showing the relationship between substrate depth and Vickers hardness of a clad plate according to the present invention. DESCRIPTION OF SYMBOLS 1... Alloy plate, 2... Pressure roll, 3... Irradiation box, 4... Laser oscillator, 5... Collimator, 6...
Galvanic mirror, 7...fθ lens, 8...Ag brazing plate, 9...concave groove forming roll, 10...annealing furnace, a
...irradiated part, b... non-irradiated part.

Claims (1)

【特許請求の範囲】 1 金属または合金の基板表面の1主面に、少な
くとも1状の凹部溝を形成し、そのままもしくは
基板を非酸化性または還元性雰囲気中で焼鈍後、
前記凹部溝を含んであるいは凹部溝形成主面とは
反対側他主面の凹部溝位置を含む基板表面に、レ
ーザービームを照射し、該照射により形成した基
板の照射層表面に、被着材料を冷間圧接すること
を特徴とする電子部品用クラツド板の製造方法。 2 金属または合金の基板表面の1主面に、少な
くとも1状の凹部溝を形成し、そのままもしくは
基板を非酸化性または還元性雰囲気中で焼鈍後、
前記凹部溝を含んであるいは凹部溝形成主面とは
反対側他主面の凹部溝位置を含む基板表面を予備
加熱した後、該基板表面にレーザービームを照射
し、該照射により形成した基板の照射層表面に、
被着材料を冷間圧接することを特徴とする電子部
品用クラツド板の製造方法。
[Claims] 1. At least one concave groove is formed on one main surface of a metal or alloy substrate surface, and the substrate is annealed as it is or after annealing in a non-oxidizing or reducing atmosphere.
A laser beam is irradiated onto the substrate surface including the recessed grooves or the position of the recessed grooves on the other main surface opposite to the main surface where the recessed grooves are formed, and an adherend material is applied to the surface of the irradiated layer of the substrate formed by the irradiation. A method for manufacturing a cladding plate for electronic components, characterized by cold pressure welding. 2. Forming at least one concave groove on one main surface of a metal or alloy substrate surface, and then annealing the substrate as it is or in a non-oxidizing or reducing atmosphere,
After preheating the substrate surface including the recessed grooves or the position of the recessed grooves on the other main surface opposite to the main surface on which the recessed grooves are formed, the substrate surface is irradiated with a laser beam, and the substrate formed by the irradiation is heated. On the surface of the irradiated layer,
A method for manufacturing a clad plate for electronic components, which comprises cold pressure welding of adherend materials.
JP61107175A 1985-06-14 1986-05-10 Manufacture of clad plate Granted JPS62263879A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP61107175A JPS62263879A (en) 1986-05-10 1986-05-10 Manufacture of clad plate
US06/873,350 US4826736A (en) 1985-06-14 1986-06-12 Clad sheets
DE8686108119T DE3677065D1 (en) 1985-06-14 1986-06-13 PLATED SHEET AND METHOD AND DEVICE FOR PRODUCING IT.
EP19860108119 EP0205183B1 (en) 1985-06-14 1986-06-13 Clad sheet and process and apparatus for producing same
CN86105621A CN1008900B (en) 1985-06-14 1986-06-14 Process and apparatus for production of clad sheets
US07/271,503 US4923100A (en) 1985-06-14 1988-11-15 Process for producing clad sheets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61107175A JPS62263879A (en) 1986-05-10 1986-05-10 Manufacture of clad plate

Publications (2)

Publication Number Publication Date
JPS62263879A JPS62263879A (en) 1987-11-16
JPH0257475B2 true JPH0257475B2 (en) 1990-12-05

Family

ID=14452372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61107175A Granted JPS62263879A (en) 1985-06-14 1986-05-10 Manufacture of clad plate

Country Status (1)

Country Link
JP (1) JPS62263879A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0668579U (en) * 1993-03-15 1994-09-27 有限会社加古家 Passing prayer equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010205964A (en) * 2009-03-04 2010-09-16 Taiyosha Electric Co Ltd Chip resistor for detecting current, and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0668579U (en) * 1993-03-15 1994-09-27 有限会社加古家 Passing prayer equipment

Also Published As

Publication number Publication date
JPS62263879A (en) 1987-11-16

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