JPH0571358B2 - - Google Patents

Description

[Detailed description of the invention]

Industrial Application Field The present invention provides an Al plate, an Al alloy plate, an Ag plate, an Ag brazing plate, a This is a new clad plate in which the adhesive material of a brass brazing plate or a solder plate is cold-pressed on the entire surface or in required places with high efficiency, and the adhesive material is press-fitted with good quality and continuity. This invention relates to a clad plate for electronic parts made of a clad plate. Conventional technology Fe-Ni sealing material (40-55% Ni-Fe)-Al plate (substrate-adherent material, hereinafter the same) is used as a cladding material for electronic components used in lead frames for ICs and transistors, etc. Sequence) Fe-Ni sealing material (40-55% Ni-Fe) - Ag brazing plate, Fe-Ni sealing material (40-55% Ni-Fe) - Ag
Plate, Kovar alloy plate (25~50%Ni−10~20%Co−
Fe)-Ag solder plate, two-layer striped clad plate consisting of copper-based sealing alloy plate-Ag plate, or
Fe-Ni sealing material (40-55% Ni-Fe)-Al plate,
Kovar alloy plate (25~50%Ni−10~20%Co−)
Fully clad plates made of Fe)-Ag solder plates, etc. are used. For example, to produce Al striped cladding materials for electronic components, a metal substrate strip of 42% Ni-Fe alloy is annealed in a reducing atmosphere, the substrate surface is cleaned, and then cold pressure welded. Wire brushing is applied to the surface area to be cleaned, and one or multiple Al strips in the desired pattern are superimposed on this substrate and cold welded using rolling rolls. After the welding, or at least one cold After rolling, diffusion annealing is performed at 600° or less to completely bond the Al strip to the metal substrate, and at least one cold annealing process is performed to adjust the dimensions and shape of the cladding material. After rolling, heat treatment is performed at 550°C or lower to remove uneven internal stress strain remaining in the width direction of the substrate due to striped cladding or residual strain at the edge after punching. Generally, a manufacturing method is adopted in which the clad strip is heated to apply tension to the clad strip to add elongation and straighten it. However, in the case of a so-called striped clad board in which one or more stripes of adherend material are provided on the substrate surface,
In mechanical polishing such as wire brushing, the surface of the substrate other than the surface scheduled for pressure welding, for example, the entire surface, is polished, and as a result of polishing, cracks occur, scale-like metal powder is generated, adhesion, and foreign matter remain on the polished surface. There is a risk that metal powder, foreign matter, or gas may be drawn into the pressure contact surface during pressure welding of adherends, resulting in a problem of blistering on the surface of the adherend. Furthermore, in addition to problems such as deterioration of the quality of the surface of the clad plate, conventional manufacturing methods require a large number of steps and heat treatments, increasing manufacturing costs, and causing defects in the adhered materials during diffusion annealing. The problem was a decrease in surface quality. Furthermore, in the production of clad plates, a method has been proposed in which a laser beam is irradiated onto the welding surface before cold welding (Japanese Unexamined Patent Publications Nos. 52-60256 and 1982-114590). Problem to be Solved by the Invention In the method disclosed in the former publication, at least one of the moving metal plates is directed toward the other, a V-shaped part is formed, and light is focused on the contact part (the part to be welded) of the V-shaped part. Since welding is performed by irradiating a laser beam, it is extremely troublesome to focus the laser beam on the V-shaped contact area, and since the moving metal plate is transported while vibrating, the laser It is not easy to always keep the focus of the beam stable at the welding position. In addition, the latter published method does not connect the end point to the welding part of the two metal plates to be welded (not in a focused state)
Since an energy beam is used, it is effectively used to directly heat the opposing surfaces of two metal plates, and there is no dissipation due to reflection, making it an extremely efficient welding method. However, in both of the above methods, an energy beam (laser beam) is used as a heat source for heating and welding the objects to be welded, so the formation of an alloy layer due to melting is unavoidable. Due to the presence of metal, it is difficult to manufacture clad plates for electronic components by heat welding, where the formation of an alloy layer is a problem.Also, with heat welding, the thickness of the molten alloy layer increases because the two metals come into contact in a molten state. The thickness is approximately 100 μm, and it cannot be applied to the production of clad plates for electronic components that use adherend materials or substrates with a thickness of 100 μm or less. This invention solves the problems caused by cleaning the surface of the metal plate, prevents the surface of the adherend from blistering,
The object of the present invention is to provide a cladding plate for electronic components that has high adhesion, has excellent surface quality, and can be manufactured with high efficiency by cold pressure welding. Means for Solving the Problems The applicant has previously proposed a manufacturing method that solves the problems of the above-mentioned method for manufacturing cladding plates for electronic components. proposed a method of cold-pressure welding the adherend material to the surface of the irradiated layer by irradiating it with a laser beam or by irradiating it with a laser beam after preheating (patent application filed in 1983).
-130191, patent application No. 1983-230666), and further,
With the aim of creating a clad plate with high adhesion and excellent surface quality, we conducted various studies and completed this invention. This invention is directed to forming a substrate material and/or an adhering material by irradiating a laser beam on the entire surface or a predetermined portion of one or both main surfaces of a substrate made of a single plate or a laminate made of a metal or an alloy. A cladding for electronic components, characterized in that a continuous adherend material is press-fitted by cold pressure welding into micro-cracks formed in a molten solidified hardened layer of a specific thickness provided in a selected intermediate layer material. It is a board. This invention is based on Fe-Ni sealing material, Kovar alloy plate or Cu
Continuous Al plate, Al alloy, etc. are formed in the micro cracks formed in the molten solidified hardened layer with a layer thickness of 2 μm or less provided on at least one main surface or at required locations of the substrate surface consisting of a single plate or a laminated plate of alloy plate. Board, Ag
This invention is a clad plate for electronic components, characterized in that it is formed by press-fitting a bonding material such as a plate, an Ag brazing plate, a brass brazing plate, or a solder plate. Kovar alloy plate or Cu
Cu or Cu press-fitted into micro-cracks formed in a molten solidified hardened layer with a layer thickness of 2 μm or less provided on the entire surface of at least one main surface of a substrate made of a single plate or a laminate of alloy plates or at required locations. The layer thickness provided on the surface of the Ni intermediate layer material.
Continuous Al plate, Al alloy plate, Ag plate, Ag
A clad plate for electronic components characterized by being formed by press-fitting a soldering material such as a brazing plate, a brass brazing plate, or a soldering plate. or Cu
Layer thickness provided on the entire surface of one main surface of a substrate made of a single alloy plate or a laminated plate or at required locations
Continuous Al plate, Al alloy plate, Ag plate, Ag
It is made by press-fitting a soldering plate, brass brazing plate, or solder plate, and is applied to the micro cracks formed in the molten solidified hardened layer with a layer thickness of 2 μm or less provided on the entire surface of the other main surface or at required locations. Press-fitted Cu
Or layer thickness 2μ provided on the surface of Ni intermediate layer material
Continuous Al plate, Al alloy plate, Ag
This is a clad board for electronic components, characterized in that it is formed by press-fitting a bonding material of a plate, an Ag brazing plate, a brass brazing plate, or a solder plate. To be more specific, the clad plate according to the present invention preheats the surface of the substrate to be coated while the substrate is running, either as it is or in a non-oxidizing atmosphere, using a heating device. When a surface is irradiated with a linear, zigzag, meandering, or uniform laser beam continuously or intermittently, foreign matter, oil, and moisture attached to the surface absorb the laser beam, gasify, and are removed. In addition, it is possible to obtain a clean surface by melting and solidifying the extreme surface layer of 2 μm or less, preferably submicron order, which is absorbed not only by foreign substances but also by the substrate. During cold pressure welding of the adherend, fine microcracks are formed on the surface of the hardened layer on the substrate surface due to sliding deformation, etc., and as the new surface is exposed, the adherend material is press-fitted into the microcracks and adhered to the substrate. It is possible to significantly improve the adhesion strength to the material, and it is also possible to prevent cracks on the surface, generation and adhesion of metal powder and residual foreign matter caused by conventional mechanical polishing, and the surface of the clad material can be improved without entrainment of gas. It has the advantage of eliminating swelling. Disclosure based on drawings of the invention FIGS. 1A and 1B are perspective explanatory views of a substrate showing a clad plate for electronic components according to the present invention, and FIGS.
E is a longitudinal cross-sectional view of the clad plate for electronic components according to the present invention. The cladding plate for electronic components according to the present invention has a first
As shown in Figures A and C, for example, a layer of substrate material with a thickness of 2 μm or less is formed on the entire surface of a substrate 1 made of Fe-Ni sealing material (40 to 55% Ni-Fe) by laser beam irradiation. In the melt solidification hardened layer 2 of
In addition to the structure in which the adherend material 3 such as a plate is continuously press-fitted by cold pressure welding, as shown in FIG. It has a so-called striped structure in which an adherend material 3 is continuously press-fitted by cold pressure welding onto a molten solidified hardened layer 2 of a substrate material having a layer thickness of 2 μm or less. Incidentally, in order to apply the adherend material 3 in a striped form, a groove portion having the width of the adherend material 3 may be formed in the substrate 1, and the adherend material 3 may be applied to the groove portion through the welded solidified and hardened layer 2. Furthermore, clad plates with intermediate layer materials interposed therebetween are known depending on the combination of the adhering material 3 of a required material and the substrate 1, but the clad plates according to the present invention are
As shown in Figure D, for example, a melted layer of substrate material with a thickness of 2 μm or less is formed by laser beam irradiation on the required main surface of the substrate 1 made of Fe-Ni sealing material (40 to 55% Ni-Fe). An intermediate layer material 4 such as Ni is continuously press-fitted onto the solidified and hardened layer 2 by cold welding, and the surface of this intermediate layer material 4 is melted to a layer thickness of 2 μm or less by laser beam irradiation. It consists of a structure in which an adherend material 3 such as an Ag brazing filler metal is continuously press-fitted onto a solidified and hardened layer 5 by cold pressure welding. In FIGS. 1C and 1D, the substrate 1 is made of a single plate and the clad plate has an adhesive material on one main surface, but the same or different types of adhesive materials are provided on both sides of the substrate 1. The same applies to the case. In addition, the clad plate shown in FIG.
For the substrate material 1a of the system sealing material, an intermediate layer material 4 of Ni is continuously press-fitted by cold pressure welding onto a molten solidified hardened layer 2 of the substrate material with a layer thickness of 2 μm or less formed by laser beam irradiation. Further, on the surface of this intermediate layer material 4, an adherent material 3a of Ag brazing material is continuously press-fitted by cold pressure welding into a molten solidified hardened layer 5 of the intermediate layer material having a layer thickness of 2 μm or less by laser beam irradiation. In addition, a Cu alloy substrate material 1b
consists of a molten solidified and hardened layer 2 of a substrate material formed by irradiation with a laser beam and a layer thickness of 2 μm or less, and an Ag brazing plate adhesion material 3b continuously press-fitted by cold pressure welding. . There are various configurations of the clad plate according to the present invention depending on the combination of the substrate and the adherend material, but in any case, the adherend material and/or the intermediate layer material are formed by laser beam irradiation. Since the molten solidified hardened layer of a specific layer thickness is press-fitted and adhered by cold pressure welding into the micro cracks formed during pressure welding, the substrate, adherend material and/or It is also possible to significantly improve the adhesion strength with the intermediate layer material, prevent cracks on the surface, generation of metal powder, and residual foreign matter, and adhesion caused by conventional mechanical polishing. The swelling on the surface disappears,
The quality is excellent. Further, the substrate made of a laminate may be a substrate in which required substrate materials are laminated by a conventional method, or may be a substrate in which the required substrate materials are laminated via a melted solidified hardened layer formed by irradiation with a laser beam. Preferred embodiments of the invention In this invention, the substrate made of a single plate or a laminate of metal or alloy is Fe-Ni based adhesive material (40-55% Ni-Fe) Kovar alloy plate (25-50% Ni-10-20 %Co−
Fe), Cu alloy plate (Be1.1% or less, Ti1.0% or less, Cr1.6
% or less, Fe6.0% or less, Ni15.0% or less, Zn45% or less, B0.5% or less, Si6.0% or less, Pb0.08% or less,
P0.5 or less, Te0.6% or less, Mg0.6% or less, Zr0.7%
Below, Mn 7% or less, Co2% or less, Ag 1.5% or less,
Contains at least one of 1.3% or less Cd, 12% or less Al, and 12% or less Sn, with the remainder being Cu. However, if two or more types of additive elements are included, the total amount will be 45% or less). Also, Cu, Ni, etc. are preferable for the intermediate layer material. In addition, Al, Al alloy plate, Ag
Preferred are plate, Ag brazed plate, brass brazed plate or solder plate. The clad plate for electronic components according to the present invention has a thickness of 0.005 to 5.0 mm in the case of a fully clad plate.
In the case of a striped clad plate, the plate thickness is preferably 0.05 to 1.0 mm, and the plate thickness may be appropriately selected depending on the intended use. In this invention, preheating before laser beam irradiation is performed in a non-oxidizing atmosphere such as Ar or N ₂ gas or in a reducing atmosphere such as H ₂ gas, for example, using a light beam, YAG laser, CO ₂ laser, high frequency or 200℃～1000℃ using a heating device such as low frequency
It is preferable to preheat to . In this invention, when irradiating a laser beam to form a molten solidified hardened layer, the laser wavelength is such that it is easily absorbed by deposits, oils and moisture on the surface.
It is desirable to use a wavelength of 5 µm or less, preferably 2 µm or less, which causes absorption and hardening into the substrate. Furthermore, any method may be used as long as it is possible to melt and solidify the outermost surface layer, which is preferably 2 µm or less. The laser beam can be focused in a shape and irradiated in a direction perpendicular to the substrate surface, the substrate and the laser beam can be moved in the same or opposite direction along the length of the substrate, or the laser beam can be oscillated in the width direction of the substrate. It is possible to adopt methods such as moving the beam in the longitudinal direction of the substrate, irradiating the entire surface of the target surface uniformly, or moving the beam in a zigzag pattern, meandering, or partially irradiating the target surface in a striped pattern. . As the irradiation conditions for the laser beam applied to the substrate of the clad plate of this invention, the power density of the beam is as follows:
The range is preferably 100kW/mm ² to 1500kW/mm ² , more preferably 300kW/mm ² to 900kW/mm ² . Examples Example 1 The metal substrate is 42% Ni- with a thickness of 0.5 mm and a width of 33 mm.
Fe alloy plate, adherend material: plate thickness 0.08mm, plate width 10
mm, an Al plate with a purity of 99.7% was used. The atmosphere in the irradiation box was Ar gas, and the substrate movement speed was 10 m/min. The YAG laser irradiation device has a wavelength of 1 μm and an output of
Using a 100W 10kHzQ switch laser and a lens focal length of 100mm, the center of the board width was
A uniform irradiated surface with a laser beam was formed continuously in the longitudinal direction of the substrate with a width of 10 mm, and the Al plate was cold-welded to the irradiated surface using a pressure roll at a rolling rate of 32.5%. After that, it is cold rolled once and has a thickness of 0.25.
A striped clad board according to the invention was obtained having dimensions of 30 mm and a board thickness of 30 mm. In addition, the total rolling ratio is 50
It was %. For comparison, using the same type of metal substrate and adhering material, the substrate surface was subjected to conventional mechanical polishing using a 0.1 mmφ wire rotating brush and a wire buff polishing condition at a moving speed of 22 m/s. The plates were cold welded to obtain striped clad plates of the same size. The dimensions, appearance, and mechanical properties of the two types of clad plates obtained were examined, and the results are shown in Table 1. As is clear from Table 1, according to the method of the present invention, a soft product can be obtained, and a clad plate with excellent appearance and properties and extremely high quality can be obtained.

[Table] Example 2 42% of the metal substrate has a plate thickness of 0.35 mm and a plate width of 33 mm.
Using a Ni-Fe alloy plate, a 5.5 mm wide portion was preheated to 400° C. at the center of one main surface of the metal substrate. Furthermore, using a Q-switched pulsed YAG laser with a wavelength of 1 μm and an output of 100 W, under the same laser beam irradiation conditions as in Example 1, as shown in FIG.
A laser beam is irradiated onto the metal substrate in a zigzag pattern to form an irradiated part a and a non-irradiated part b, and after cold welding of the adherend material Al, one cold rolling is performed. A striped clad plate according to the present invention was obtained having a thickness of 0.25 mm and a width of 33 mm. Note that the total rolling reduction was 29%. Furthermore, we measured the hardness from the surface layer to the inside of the substrate after laser beam irradiation in the present invention before pressure contact, and the hardness condition from the surface layer to the inside after wire brushing in the comparative example.
The results are shown in the figure. As is clear from Figure 3, the surface layer after wire brushing has a thickness of about 10 μm and is hardened, and the molten solidified hardened layer has a lower deformability than the inside, so cracks may occur due to deformation during pressure welding. , the adherend adheres well to the new surface that appears in the crack. This can be understood from the fact that when heat treatment is performed as an adhesion test after pressure bonding, this crack becomes a starting point for diffusion. Example 3 The metal substrate 10 has a thickness of 0.45 mm and a width of 130 mm.
Using a 42% Ni-Fe alloy plate, on one main surface of this substrate,
Using a Q-switch pulsed YAG laser with a wavelength of 1 μm and an output of 100 W, the laser beam irradiation device 11 capable of forming four laser beam irradiation surfaces with a width of 5.5 mm at 25 mm intervals was used under the same laser beam irradiation conditions as in Example 1. As shown in FIG. 4, four irradiation surfaces are formed, and the Al plate 12, which is the adherend material, is
After applying cold pressure welding to each of the irradiated surfaces of the four strips at the same time using a pressure welding roll 13, cold rolling was performed three times to obtain a multi-shaped striped board according to the present invention having dimensions of 0.25 mm in thickness and 130 mm in thickness. A tube plate 14 was obtained. Thereafter, in a slitter 15, a one-shaped striped clad plate 16 according to the present invention having a thickness of 0.25 mm and a width of 25 mm was obtained. In addition, the total rolling ratio is 44
It was %. For comparison, using the same type of metal substrate and adhering material, the substrate surface was subjected to conventional mechanical polishing using a 0.1 mmφ wire rotating brush at a moving speed of 22 m/s. Al plates were cold-welded to obtain a striped clad plate with the same dimensions. The dimensions, external appearance, and mechanical properties of the two types of clad plates obtained were examined, and the results are shown in Table 2. As is clear from Table 2, according to the method of the present invention, a soft product can be obtained, and a clad plate with excellent appearance and quality can be obtained.

【table】

[Table] Effects of the invention The embodiments shown in the examples that occur in conventional wire brushing are effective as a surface treatment before pressure welding, but on the other hand, they reduce deposits, oil, and moisture, which are necessary for pressure welding. If the polishing process is continued until a clean surface is obtained, the polished surface will become extremely rough, and there is a risk that scale-like metal powder will be generated and adhered to the surface and gas will be drawn into the pressure contact surface. It is difficult to apply the coating only to the thin striped area where the coating is to be applied. On the other hand, in the laser beam irradiation of the present invention, as in the embodiment, it is possible to irradiate the desired part in a stripe shape, and by selecting the irradiation conditions,
Deposits, oils and moisture are removed without creating a rough surface, and the thickness of the melt-solidified hardened layer can be controlled. In addition, due to the generation of microcracks during pressure welding, the newly formed surface of this molten solidified layer is more uniform and densely distributed than in the case of the comparative example, so the reason why the adherend material is well welded is that heat treatment reduces diffusion. This was also confirmed by the fact that the process progressed uniformly. That is, the Fe-Ni based sealing material according to the present invention,
Al plate, Al alloy plate, Ag
A clad board is made by cold-bonding a plate, an Ag brazing plate, a brass brazing plate, or a solder plate to the entire surface or locally at required points, so that the surface to which the substrate is to be bonded is irradiated with a laser beam. The adherend material is press-fitted into the micro-cracks of the cleaned, melted, solidified, and hardened layer with a layer thickness of 2 μm or less, significantly improving the adhesion strength, preventing the adhesion of foreign objects, and preventing the entrainment of gas. The material is press-fitted with the above-mentioned adhered material, which eliminates blistering on the surface of the clad material and has good quality and adhesion.
It is the best material for cladding plates for electronic components.

[Brief explanation of the drawing]

1A and 1B are perspective explanatory views of a substrate showing a clad plate for electronic components according to the present invention, and FIGS.
E is a longitudinal cross-sectional view of the clad plate for electronic components according to the present invention. FIG. 2 is a top view of the substrate showing the laser beam irradiation method in the embodiment. FIG. 3 is a graph showing the relationship between substrate depth and Vickers hardness of the clad plate for electronic components according to the present invention. 4A and 4B are perspective explanatory views of a manufacturing apparatus for manufacturing a clad plate for electronic components according to the present invention. 1...Substrate, 1a, 1b...Substrate material, 2, 5...
...Melting solidification and hardening layer, 3, 3a, 3b...Adhesive material, 4...Intermediate layer material, 10...Substrate, 11...Laser beam irradiation device, 12...Al plate, 13...
... Pressure roll, 14... Multi-striped clad board, 15... Slitter, 16... Al-like striped clad board, a... Irradiated area, b... Non-irradiated area.

Claims (1)

[Claims] 1 Fe-Ni sealing material, Kovar alloy plate or
An Al plate that is continuous with micro-cracks formed in a molten solidified hardened layer with a layer thickness of 2 μm or less provided on the entire surface of at least one main surface or at a required location on the surface of a substrate made of a single plate or a laminate of Cu alloy plates, A clad plate for electronic components, characterized by being formed by press-fitting an Al alloy plate, Ag plate, Ag brazing plate, brass brazing plate, or solder plate as an adhesive material. 2 Fe-Ni sealing material, Kovar alloy plate or
Cu is press-fitted into micro-cracks formed in a molten solidified hardened layer with a layer thickness of 2 μm or less provided on the entire surface of at least one main surface of a substrate made of a single plate or a laminate of Cu alloy plates or at required locations. or
On the surface of the Ni intermediate layer material, continuous Al plates, Al alloy plates, Ag plates,
A clad plate for electronic components, characterized by being formed by press-fitting an adhesive material such as an Ag brazing plate, a brass brazing plate, or a solder plate. 3 Fe-Ni sealing material, Kovar alloy plate or
Continuous Al plate, Al Alloy plate, Ag plate,
Micro cracks formed in a molten solidified hardened layer with a layer thickness of 2 μm or less, which is formed by press-fitting an adhesive material such as an Ag brazing plate, a brass brazing plate, or a solder plate, and is provided on the entire surface of the other main surface or at a required location. press-fitted into
Layer thickness provided on the surface of Cu or Ni intermediate layer material
Continuous Al plate, Al alloy plate,
A clad plate for electronic components, characterized by being formed by press-fitting an adhesive material of Ag plate, Ag brazing plate, brass brazing plate, or solder plate.