JPH028835B2 - - Google Patents

Description

[Detailed description of the invention]

TECHNICAL FIELD The present invention relates to a method of manufacturing a clad plate for electronic components, and more particularly, to a method of manufacturing a clad plate for electronic components, which allows one or more layers of adhesive material to be clad on the entire surface of a substrate or at required locations with good quality and adhesion. Background technology 42% Ni-Fe as a cladding material for electronic components
Alloy plate (substrate) - Al plate (adhered material) (same arrangement below), 46% Ni-Fe alloy plate - Al plate, Kovar alloy plate - Ag brazing plate, Cu plate - Ag plate, stainless steel plate -
A two-layer clad plate consisting of a substrate material such as a Cu plate and an adherend material, or a multilayer clad plate in which a plurality of adherend materials are laminated is used. In general, the above-mentioned manufacturing method for cladding boards for electronic components involves unwinding the substrate coil, cleaning the surface to be pressure-bonded using a mechanical polishing method such as a wire buff, and applying the material to be applied onto the substrate surface by cold rolling using a rolling roll. Pressure contact. However, in the case of a so-called striped clad board in which one or more stripes of adherend material are provided on the surface of the substrate,
In mechanical polishing, the surface of the substrate other than the surface to be welded with the required pressure, for example, the entire surface, is polished, and the polishing may cause microcracks, scaly metal powder, adhesion, and residual foreign matter on the polished surface. There is a problem in that during pressure welding of adherends, metal powder, foreign matter, or gas may be entrapped in the pressure contact surface, resulting in swelling of the surface of the adherend. Further, there were other problems such as deterioration of the quality of the surface of the clad plate. Furthermore, in the production of clad plates, a method has been proposed in which the welding surface is irradiated with a laser beam before cold welding (Japanese Unexamined Patent Publication No. 1983-60256,
- Publication No. 11459). In the former method, at least one of the moving metal plates is directed toward the other to form a V-shaped part, and the light is focused on the contact part (the part to be welded) of the V-shaped part.
Since welding is performed by irradiating a laser beam, it is extremely troublesome to adjust the laser beam to focus it on the V-shaped contact area, and since the moving metal plate is transported while vibrating, it is difficult to focus the laser beam. It is not easy to always remain stable in the welding position. In addition, the latter method uses an energy beam that is not focused (not in a focused state) on the welding part of the two metal plates to be welded, so it is effectively used to directly heat the opposing surfaces of the two metal plates. This is an extremely efficient welding method as there is no dissipation due to reflection. However, since both of the above methods use an energy beam (laser beam) as a heat source for heating and welding the welding object, the formation of an alloy layer due to melting cannot be avoided, and the formation of an alloy layer becomes a problem. It is difficult to manufacture clad plates for electronic components using heat welding, and the thickness of the molten alloy layer in heat welding is approximately 100μm.
It cannot be applied to the manufacture of cladding plates for electronic components that use adherent materials or substrates of less than m. Purpose of the Invention The present invention provides a clad plate for electronic components that solves the problems caused by cleaning the metal plate surface in the conventional cladding method, prevents blistering on the surface of the adherend, and provides excellent clad plate surface quality. Relating to a manufacturing method. Structure and Effects of the Invention The present invention includes cold-pressure welding an adherend material at least once to the surface of an irradiated layer of a pressure-welded material formed by laser beam irradiation, and This is a method for producing a clad board for electronic components, characterized in that it is characterized by cladding a layer or multiple layers of adhered material. More specifically, by moving the metal or alloy substrate and the laser beam of the laser irradiation device relatively, one or more stripes of the desired size are applied to the surface to be adhered to the substrate, that is, the entire surface of the substrate surface or at a desired position. A method for producing a clad plate for electronic components, which comprises forming an irradiation layer using a laser beam on a local surface of the clad plate, and then cold-pressing a metal or alloy adhering material to the surface of the irradiation layer, further comprising: By relatively moving the metal or alloy substrate and the laser beam of the laser irradiation device,
After forming an irradiation layer using a laser beam on the surface of the substrate to be adhered, a metal or alloy adhesion material is cold-pressed onto the surface of the irradiation layer, and then the adhesion material is applied to the surface of the irradiation layer formed by the laser beam. This method of manufacturing a clad plate for electronic components is characterized in that the above-described method of cold-pressure welding is repeated, and one or more layers of other adherend materials are provided on the surface of the adherend material to form a multilayer structure. As a result of various studies aimed at cleaning the substrate surface, improving the quality of the adherend surface of the clad plate, and increasing the adhesion strength, the inventor of the present invention irradiated the surface of the substrate to be adhered with a laser beam. In addition to removing deposits, oil, and moisture from the surface, the very surface layer of 2 μm or less, preferably on the submicron order, is melted and solidified to form a hardened layer, and when the adherend is cold pressure welded, the surface of the substrate is Fine microcracks are formed on the surface of the hardened layer due to sliding deformation, etc., and the exposure of the newly formed surface can significantly improve the adhesion strength between the substrate and the adherend material. They discovered that it is possible to prevent the generation and adhesion of metal powder and residual foreign matter, and that the bulges on the surface of the clad plate are eliminated without entrainment of gas. By the manufacturing method of the present invention, the substrate surface can be highly cleaned, the quality of the adherend surface of the clad plate can be improved, and the adhesion strength can be improved. This has the advantage that it is possible to obtain a cladding plate for use in other applications. In this invention, the types and combinations of substrates and materials to be adhered may be any combination that can be used for cladding, and the laser beam irradiation is used to remove deposits, oil, and water on the surface, and to remove the extreme surface layer of 2 μm or less. Any method may be used as long as melting and solidification is possible.For example, the beam is focused in a spot shape and irradiated in a direction perpendicular to the substrate surface, and the substrate and laser beam are moved in the same direction or in opposite directions in the longitudinal direction of the substrate. Alternatively, a method may be adopted in which the laser beam is moved in the longitudinal direction of the substrate while being oscillated in the width direction of the substrate. In addition, in the case of a fully clad plate for electronic components according to the present invention, the thickness of the plate is 0.05 mm.
The thickness is preferably 1.0 mm to 1.0 mm, and in the case of a striped clad plate, the thickness is preferably 0.1 to 1.0 mm, and the thickness may be appropriately selected depending on the intended use. Disclosure of the Invention Based on Drawings FIG. 1 is a perspective explanatory view of a substrate showing the cladding method according to the invention. Here, we will explain an example in which a single Al plate is cold-welded in a stripe shape at the widthwise center of a 42% Ni--Fe alloy plate. The 42% Ni--Fe alloy plate 1 coil is uncoiled and advances to the cold welding roll 2. An irradiation box 3 for irradiating the upper surface of the passing alloy plate 1 with a laser beam is arranged behind the pressure roll 2, and the irradiation box 3 surrounds the entire alloy plate 1.
Ar gas is vented inside, and the laser beam can be irradiated in an Ar gas atmosphere. The laser beam is oscillated by a laser oscillator 4, passes through a collimator 5 and a galvanic mirror 6, and is condensed and focused by an fθ lens 7. The laser beam is then focused on the alloy plate 1 at a required distance from the focal point. The position of the fθ lens 7 is adjusted so that the required width portion at the center position in the width direction can be irradiated. The alloy plate 1 is irradiated with a laser beam at the required width at the center position in the width direction, and the extreme surface layer is melted and solidified.
A new surface is created from which deposits, oil, and moisture have been removed. On the other hand, after the Al plate 8 is uncoiled,
The alloy plate 1 is fed from above to the pressure roll 2, and is pressed onto the surface irradiated with the laser beam. At this time, microcracks occur on the surface of the molten solidified layer on the irradiated surface due to sliding deformation due to pressure welding.
Since the internal new surface is exposed and the Al plate 8 is pressed against the surface, the cleanliness is superior compared to the conventional mechanically polished surface, and the adhesion strength between the alloy plate 1 and the Al plate 8 is improved, which is better than the conventional method. The pressure welding ratio can be reduced and a softer product can be obtained. For example, in the case of lead frame materials, punching and bending are facilitated in the post-cladding process, which is extremely advantageous in improving the lead strength and quality of the material. In Fig. 1, an example was explained in which a single strip of adhered material was cold-welded on an alloy plate, but it is also possible to manufacture the entire surface of the alloy plate or multiple strips, and furthermore, By repeatedly applying the same method to the desired location, it is possible to clad another adherend material on top of the adherend material, resulting in excellent adhesion strength and product properties. Therefore, the oscillation method of the laser beam, the irradiation output, the distance between the focal point of the fθ lens and the irradiation surface, the moving speed of the irradiated side, etc., depend on the material and dimensions of the substrate material, as well as the material dimensions of the adhered material. It is necessary to select it appropriately. Example The metal substrate is a 42% Ni-Fe alloy plate with a thickness of 0.35 mm and a width of 25 mm.The adhering material is an Al plate with a thickness of 0.08 mm and a width of 5.5 mm.The atmospheric gas in the irradiation box is Ar. Gas, substrate moving speed 80m/s, laser irradiation device with continuous wave output of 500W
Using YAG laser or 50W output, 10KHz Q-switch YAG laser, lens focal length
Under the condition of 100 mm, a laser beam irradiation surface is formed at the center of the substrate in the width direction with a width of 5.5 mm continuously in the longitudinal direction of the substrate, using the method according to the invention shown in FIG. 1 described above, and on the same irradiation surface, The Al plates were cold-welded using a pressure roll at a pressure welding ratio of 24%. After that, one round of cold welding was performed, and the plate thickness was 0.25.
A striped clad plate according to the present invention having dimensions of 25 mm and a plate width of 25 mm was obtained. The total rolling rate is 29%.
It was hot. For comparison, using the same type of metal substrate and adhering material, the substrate surface was subjected to conventional mechanical polishing using a 0.3 mmφ wire rotating brush and a wire buff polishing condition at a moving speed of 17 m/s. The plates were cold welded to obtain striped clad plates of the same size. The dimensions, external appearance, and mechanical properties of the two types of clad plates obtained were examined, and the results are shown in Table 1. As is clear from Table 1, it can be seen that according to the method of the present invention, a softer product can be obtained than before, and a clad board with excellent appearance properties and extremely high quality can be obtained. Furthermore, we measured the hardness from the surface layer to the inside of the substrate after laser beam irradiation in the present invention before pressure bonding, and the hardness condition from the surface layer to the inside after wire buffing in the comparative example. The results are shown below. As is clear from Figure 2, the surface layer after wire buffing has a thickness of about 10 μm and is hardened, and since the hardened layer has a lower deformability than the inside, cracks occur due to deformation during pressure welding, and the gaps between them. The reason why the adherend adheres well to the newly formed surface is understood from the fact that when heat treatment is applied, this area becomes the starting point for diffusion. The above-mentioned aspect caused by wire buffing is effective as a surface treatment before pressure welding, but on the other hand, if such treatment is performed until deposits, oil, and moisture are reduced and a clean surface necessary for pressure welding is obtained, it will be significantly The surface becomes rough, causing problems such as the generation and adhesion of scale-like metal powder and the entrainment of gas to the pressure contact surface, and it is difficult to perform polishing only on the area on the substrate where stripes are to be arranged. On the other hand, the laser beam irradiation according to the present invention can be applied only to the required areas as in the embodiment, and by selecting the irradiation conditions, it can remove deposits, oil, fat, and water without creating a rough surface. is removed, and the thickness of the melt-solidified layer can be controlled. In addition, due to the generation of microcracks in this molten solidified layer during pressure welding, the newly formed surface is more uniform and densely distributed than in the comparative example. This was also confirmed by the fact that the process progressed uniformly.

【table】

【table】 [Brief explanation of drawings]

FIG. 1 is a perspective explanatory view of a substrate showing the cladding method according to the present invention. FIG. 2 is a graph showing the relationship between substrate depth and Vickers hardness. DESCRIPTION OF SYMBOLS 1... Alloy plate, 2... Pressure roll, 3... Irradiation box, 4... Laser transmitter, 5... Collimator, 6...
Galvanic mirror, 7...fθ lens, 8...Al plate.

Claims (1)

[Claims] 1. Cold pressure welding of the adherend material to the surface of the irradiated layer of the pressure welded material formed by laser beam irradiation is performed at least once, and one layer or multiple layers of the adherend material are applied to the surface of the metal or alloy substrate. A method for manufacturing a clad plate for electronic components, characterized by: