JPH0328987B2 - - Google Patents

Description

[Detailed description of the invention]

Field of Application This invention relates to a so-called island-like cladding for electronic components, which is formed by pressing an adherend material onto a metal or alloy substrate discontinuously in the longitudinal direction, for example, in the form of islands or stripes at regular intervals. A method for manufacturing an island-shaped clad plate for electronic components, which does not require diffusion annealing after cold welding, has good quality and adhesion, and clads adherend materials with high efficiency. Regarding. Background technology As a clad material for electronic components, Fe-Ni sealing material (40~55% Ni-Fe)-Al plate, (substrate-adherent material, hereinafter the same arrangement) Fe-Ni sealing material (40~55% Ni-Fe) is used as a cladding material for electronic components. 55%Ni−Fe)−Au
plate, Fe-Ni sealing material (40-55% Ni-Fe) - Cu plate, Fe-Ni sealing material (40-55% Ni-Fe) - Cu alloy plate, Fe-Ni sealing material (40~55%Ni-Fe)-Ag brazing plate, Fe-Ni sealing material (40~55%Ni-Fe)-Ag
Plate, Kovar alloy plate (25~50%Ni−10~20%Co−
Fe)-Ag brazing plate, etc. (see Figure 1a), or Fe-Ni sealing material (40-55% Ni-Fe)
−Al plate, Kovar alloy plate (25~50% Ni−10~20
%Co-Fe)-Ag brazing plate, etc. (see Figure 1b), or a multilayer clad plate in which a material is similarly crimped, plated, or vapor-deposited on a laminated substrate. has been done. For example, in the production of Al island-like cladding materials, a metal substrate strip of 42% Ni-Fe alloy is annealed in a reducing atmosphere, the substrate surface is cleaned, and then the surface to be cold-welded is coated. After buffing and cleaning the area to be adhered, the Al plates are stacked at the desired length in the longitudinal direction including the area to be adhered, and cold pressure welded. The aluminum strip is removed using a chemical removal method using alkali or the like, cold rolled at least once, and then diffusion annealed at 600℃ or less to bond the Al strip and the metal substrate. complete,
Furthermore, in order to adjust the dimensions and shape of the cladding material, cold rolling is performed at least once, and then, in order to remove the internal stress strain that remains unevenly inside the substrate due to the cladding in an island shape, a 550mm Manufacturing methods include heat treatment at temperatures below 30°F, or heating below 550°C to apply tension to the clad strips to add elongation and straightening, or cleaning the substrate surface using chemical methods such as alkaline degreasing or electrolytic degreasing. After coating, mask off the necessary parts using vacuum evaporation method and layer Al in spots, or after printing the resist, degrease and polish the substrate surface by chemical method, then Au, Ag wet method. A method such as plating is generally employed. However, with mechanical polishing such as Waima buff polishing,
Because it is difficult to polish only the required areas, the substrate surface other than the required pressure-welding surface, for example, the entire surface, may be polished, resulting in the occurrence of cracks on the polished surface or the generation and adhesion of scaly metal powder. There is also a risk that foreign matter may remain, and when the adherends are pressure welded, metal powder, foreign matter, or gas may be drawn into the pressure contact surface, causing a problem that the surface of the adherend material may swell. In addition, the cracks generate metal fine powder during cold welding or subsequent cold rolling, causing the metal fine powder to adhere to the clad plate, causing problems such as deterioration of the surface quality of the clad plate. The manufacturing method of
Problems were problems such as scratches on the Al alloy surface and deterioration of surface quality. In addition, when the vacuum evaporation method is the electroplating method, the productivity is lower than that of the cold pressure welding method, the cost increases due to the use of vacuum equipment, a dense Al surface cannot be obtained, and the processing of the electroplating solution, etc. There was a problem. Purpose of the Invention The present invention solves the problems caused by cleaning the surface of a metal substrate in the conventional manufacturing method of island-shaped cladding plates for electronic components, and also solves the problem of cleaning only the part to be adhered, which was difficult in the past. In addition to preventing blistering on the surface of the adherend and achieving excellent clad plate surface quality, it is also possible to omit the conventionally indispensable diffusion annealing process after cold welding. The purpose is to provide a manufacturing method for eyelint-like cladding plates for electronic components that can be completely bonded in just one process. Structure and Effects of the Invention The present invention was developed as a result of various studies aimed at cleaning the substrate surface of an island-shaped cladding material for electronic parts, improving the quality of the surface of the adherend of the cladding plate, and increasing the adhesion strength. The laser beam is irradiated only on the desired surface of the substrate surface to be coated.
Stop the laser beam irradiation on areas other than the intended surface.
Alternatively, by shielding the light and not irradiating it, irradiating a laser beam with a wavelength that is easily absorbed by foreign matter, oil, fat, and moisture that causes bonding defects, removes foreign matter, oil, and fat attached to the surface of the desired adhering area. Moisture absorbs laser light, gasifies, and is removed, resulting in a clean surface. When an adherend material is pressed against the surface, interatomic bonds easily occur because the surface is clean, and in practical use, Sufficient adhesion strength is obtained, and since the surface of the area not irradiated with the laser beam is not cleaned, interatomic bonds do not occur and it can be easily peeled off, making it easy to maintain quality and properties. It has been found that an island-shaped clad plate for electronic parts with excellent properties can be obtained. Furthermore, by using a laser beam with a wavelength that is easily absorbed not only by foreign objects but also by the substrate, that is, a wavelength of 5 μm or less, the extreme surface layer of 2 μm or less, preferably on the submicron order, can be melted and solidified to form a hardened layer. During cold pressure welding of adherends, internal sliding deformation of the hardened layer on the substrate surface causes minute cracks on the surface, exposing the new internal surface and establishing close contact between the substrate and the adherend. It can significantly improve the strength, prevent cracks on the surface, the generation and adhesion of metal powder and residual foreign matter caused by conventional mechanical polishing, eliminate gas entrainment, eliminate blistering on the surface of the clad material, and especially , the adherend material is
In the case of Al, the above-mentioned diffusion annealing process is not necessary, and the adherend material can be simply cold-welded or cold-rolled after cold welding, and the parts other than the areas to be adhered can be brushed etc. Since it is possible to remove
The present invention was completed based on the discovery that an island-shaped clad plate for electronic components that is discontinuous in the longitudinal direction can be easily obtained. This invention involves irradiating at least one laser beam only on discontinuous areas to be deposited on at least one main surface of a metal or alloy substrate, and then applying a desired laser beam continuous in the longitudinal direction of the substrate including the irradiated surface. A clad plate for electronic components, characterized in that an island-shaped clad plate is obtained by cold welding an adherend material to the entire surface of the part at a rolling reduction rate of 25% to 70%, and then removing the adherend material other than the intended part. This is a manufacturing method. More specifically, at least one layer of varnish is applied only to a portion of at least one principal surface of a metal or alloy substrate, for example, a 42% Ni-Fe alloy or a Kovar alloy.
Laser beams of stripes are intermittently irradiated in various irradiation formats, and parts other than the surface to be adhered are treated as non-irradiated surfaces that are not irradiated with laser beams, and the required distance in the longitudinal direction of the substrate including the irradiated surfaces is On the entire surface of the striations,
When Al or Al alloy strip materials are cold welded at a reduction rate of 25% to 70%, the molten solidified hardened layer on the surface due to laser beam irradiation cracks on the irradiated surface, which is the intended surface to be adhered to. occurs, and the Al or Al alloy strip is pushed into this crack during cold pressure welding, completing the pressure welding. On the other hand, such a molten solidified and hardened layer is not formed on surfaces other than the intended surface to be adhered, and the bond between the adherend material and the substrate is weak and can be easily peeled off. Therefore, after pressure bonding of the adherend material, for example, the adherend material other than the surface to be adhered to is peeled off by vacuum suction, or
Polishing with a brush, applying ultrasonic waves to make it float, vacuum suction, or brushing, or inserting adhesive tape and winding it into a coil, and then unwinding the tape. By means such as peeling off, the adhered material other than the surface to be adhered to which the laser beam was irradiated can be easily removed, and an island-like clad plate for electronic components having a desired pattern can be obtained. Regarding the glass sealing in the lead frame obtained from the island-shaped clad plate for electronic components according to the present invention, the surface after removing the material deposited on areas other than the intended deposition surface is uniformly rough, indicating that the glass sealing property is good. There is a certain effect. In addition, in order to obtain an island-like clad plate with a desired pattern, it is difficult to conduct wire buffing using the conventional method only on the surface to be coated and discontinuously in the longitudinal direction of the substrate, but the laser polishing according to the present invention In the case of using a beam, since it is light, it can be blocked arbitrarily, and it can be irradiated only to the intended areas to be adhered in a desired pattern in the longitudinal direction of the substrate, which has the advantage that island-like clad plates of various shapes can be manufactured. The present invention makes it possible to highly clean the substrate surface, improve the quality of the adherend surface of the clad plate, and improve the adhesion strength, so that an island-shaped clad plate for electronic components can be obtained with high efficiency. Preferred Embodiments of the Invention The island-like clad plate for electronic components according to the present invention is formed by applying an adhesive material discontinuously in the longitudinal direction to at least one main surface of a substrate, as shown in FIG. 1a. As shown in the figure, in addition to the clad plate in which the square-shaped adhesive material 2 is adhered to the widthwise center of the substrate 1 at predetermined intervals in the longitudinal direction, as shown in figure b, the rectangular-shaped material 2 covering the entire width of the substrate 1 is Adhesive material 2
It is also possible to use cladding plates attached at regular intervals in the longitudinal direction of the substrate 1.Furthermore, as shown in FIG. 1c, the pattern shown in FIG. It is also possible to obtain an island-like clad plate for electronic components in which the adhesive material 2 is applied at three locations in the width direction of the substrate 1, and the adhesive material is discontinuously crimped onto portions corresponding to three strips in the longitudinal direction. The shape, dimensions, longitudinal spacing, etc. of the adhered material can be arbitrarily selected depending on the application, etc., and any desired discontinuous pattern can be adopted depending on the application, etc.
A deposition pattern in which deposited materials of the same shape are arranged at equal intervals is preferable from the viewpoint of manufacturability, but the shape of the pattern may be arbitrary, the same shape does not have to be repeated, and the pattern spacing is not constant. It's okay. It is also possible to apply the material to a relatively wide substrate in the patterns shown in Figures b and c, and then use a slitter to produce an island-like clad plate for electronic components of a desired width. In this invention, the method of irradiating the laser beam is to use a mirror to run a spot-shaped beam two-dimensionally on the surface of the material to be adhered, or to spread the beam in the width direction of the plate using a lens or mirror. Either the entire surface to be coated is irradiated uniformly, or at least one laser beam is irradiated onto the surface to be coated in various irradiation forms such as all over the surface, zigzag, meandering, or striped. irradiate. In addition, surfaces other than the surface to be adhered are treated as non-irradiated surfaces that are not irradiated with the laser beam. In addition, when a laser beam is irradiated onto the surface of the substrate to be adhered, for example, in a zigzag pattern, the surface condition of the irradiated surface of the substrate is changed by cleaning the irradiated surface and melting, solidifying and hardening the extreme surface layer, as described above. The non-irradiated portion of the surface to be deposited is not irradiated with the above-mentioned laser beam, that is, it is completely different from the non-irradiated surface other than the surface to be deposited, and there is no thermal effect due to zigzag laser beam irradiation. The surface is cleaned. For this reason, when the adherend material is cold pressure welded to the irradiated part of the zigzag laser beam, which is not the entire surface irradiation, as mentioned above, the adherend material and the substrate material will be firmly bonded in the irradiated part, and the non-irradiated part will also be bonded. Since the surface is cleaned, the adhesion between the adherend material and the substrate material is improved and sufficient adhesive strength can be obtained. In this invention, the type and combination of the substrate and the adherend material may be any combination that can be used for cladding, and the laser beam irradiation may be used as long as it can remove deposits, oils, and moisture from the surface, preferably with a thickness of 2 μm. Any method may be used as long as it is possible to melt and solidify the extreme surface layer described below.For example, the beam is focused in a spot shape and irradiated in a direction perpendicular to the substrate surface, and the substrate and the laser beam are aligned in the longitudinal direction of the substrate. By moving the laser beam in the same direction or in the opposite direction, or by moving the laser beam in the longitudinal direction of the substrate while vibrating it in the width direction of the substrate, the laser beam is intermittently oscillated and stopped, and the island-shaped irradiation surface of the desired pattern is Alternatively, methods such as blocking light from areas other than the surface to be deposited, or directing the laser beam to the outside of the substrate at areas other than the surface to be deposited can be adopted. In addition, the laser beam is oscillated from a laser oscillator, focused by a collimator and a lens,
It is also possible to use an optical fiber to guide the light to the desired position and irradiate it. In this invention, the laser beam irradiation conditions are such that the beam power density is 100kW/mm ² ~
The range is preferably 1500kW/mm ² , more preferably 300kW/mm ² to 900kW/mm ² . If the power density of the laser beam is less than 100kW/mm ² , there is no surface cleaning effect for pressure welding, and if it exceeds 1500kW/mm ² , the surface becomes more uneven and holes are formed in the substrate as the power density increases. It generates and is undesirable. Further, it is effective if the laser wavelength is 5 μm or less, but if it exceeds 2 μm, the absorption effect on the substrate is poor, so it is desirable to use a wavelength of 2 μm or less. The metal or alloy substrate in this invention includes Fe-Ni sealing material (40-55% Ni-Fe), Kovar alloy plate (25-50% Ni-10-20% Co-
Fe), Cu alloy plate (Be1.1% or less, Ti1.0% or less, Cr1.6
% or less, Fe6.0% or less, Ni15.0% or less, Zn43% or less, B0.5% or less, Si6.0% or less, Pb0.08% or less,
P0.5 or less, Te0.6% or less, Mg0.6% or less, Zr0.7%
Below, Mn 7% or less, Co2% or less, Ag 1.5% or less,
It contains at least one of Cd of 1.3% or less, Al of 12% or less, and Sn of 12% or less; however, if two or more types of additive elements are contained, the total amount is preferably 45% or less, with the balance being Cu. In this invention, the metal or alloy substrate is
A single plate may be used, or a laminate of the Cu alloy and 42% Ni-Fe alloy, or the Cu alloy and Kovar alloy, for example, may be used to improve conductivity, corrosion resistance, and strength. Note that the laminated substrate may be pressure-bonded after surface cleaning using a laser beam, or may be pressure-bonded after surface cleaning by conventional wire brushing. Further, as the material to be adhered, Au plate, Al plate, Al alloy plate, Cu plate, Cu alloy plate, Ag plate, Ag brazing plate, brass brazing plate, and solder plate are preferable. Further, the thickness of the island-shaped clad plate for electronic components according to the present invention is preferably 0.05 to 1.0 mm.
The plate thickness may be appropriately selected depending on the intended use. Disclosure of the Invention Based on Drawings FIGS. 2 and 3 are perspective explanatory views of a substrate showing a method of manufacturing an island-shaped clad plate for electronic components according to the present invention, respectively. Here, 42%Ni−
An example will be described in which a rectangular Al plate is cold-welded in the widthwise center of an Fe alloy plate in the form of islands at regular intervals in a portion corresponding to one strip. As shown in FIGS. 2 and 3a, the 42% Ni--Fe alloy plate 10 coil is uncoiled and transferred to a cold welding roll 11. An irradiation box 12 for irradiating a laser beam onto the upper surface of the alloy plate 10 passing through is arranged behind the pressure roll 11.
The irradiation box 12 surrounds the entire alloy plate 10, has Ar gas vented therein, and is configured to be able to irradiate the laser beam in an Ar gas atmosphere. The laser beam is oscillated by a laser oscillator 13 of, for example, a YAG laser, passes through a collimator 14 and a galvanic mirror 15, and is condensed and focused by an fθ lens 16. The position of the fθ lens 16 is adjusted so that a required width of the alloy plate 10 at the central position in the width direction can be irradiated. The laser beam is connected to a galvanic mirror 15.
By opening and closing the shutter 18 disposed between the fθ lenses 16, the substrate can be irradiated intermittently, and irradiated portions can be formed discontinuously in the longitudinal direction of the substrate. In the case of FIG. 3a, the irradiated surface and the alloy plate 10 are connected by intermittent oscillation of the laser beam.
can be provided discontinuously in the longitudinal direction. Note that the laser beam generator used in the present invention can increase the laser scanning speed by using a polyhedral mirror or a segment mirror instead of the galvanic mirror 15, and by using a cylindrical lens, By irradiating the sheet width direction all at once, it is possible to improve the processing speed. The rewound alloy plate 10 is irradiated with a laser beam in a zigzag or striped manner on the surface to be adhered at regular intervals in the center position in the width direction, so that the extreme surface layer is melted and solidified, and deposits on the surface are removed. It becomes a new surface from which oil, fat, and moisture have been removed. In addition, on surfaces other than those to be deposited, the shutter 18 is closed, the galvanic mirror 15 is given an offset to guide the laser beam to the outside of the alloy plate 10, or the oscillation of the laser beam is stopped and irradiation is not performed. On the other hand, after being rewound, the Al plate 17 is fed to the pressure roll 11 from above the alloy plate 10 and is pressed onto the surface irradiated with the laser beam. At this time, on the surface to be adhered by rolling, the molten solidified layer on the irradiated surface causes minute cracks on the surface due to the influence of internal sliding deformation, and the new internal surface is exposed.
Since the Al plate 17 is pressure-welded, the cleanliness is superior compared to conventional mechanically polished surfaces, and the alloy plate 10 and
The Al plate 17 is more firmly attached. However, since areas other than the surface to be adhered are not irradiated with the laser beam, the adherend material is not in close contact with the substrate, and after pressure bonding, for example, the second
As shown in the figure, by brushing with a brush roll 19, it can be easily removed and an island-shaped clad plate with the Al plate 17 adhered only to the intended surface can be obtained with high efficiency. Further, as shown in FIG. 3a, when the Al plate 17 is pressed by the pressure roll 11 and wound around the coil 20, the adhesive surface 22 of the adhesive tape 21 adheres to the Al.
Roll it up so that it is pasted on the board. Thereafter, when unwinding the coil 20, as shown in FIG.
As shown in FIG. 2, by peeling off the adhesive tape 21, the adherend material can be easily peeled off because areas other than the intended surface to be adhered to are not irradiated with the laser beam. Al
An island-shaped clad plate having the plate 17 attached thereon can be obtained with high efficiency. Regarding the island-like pattern, Fig. 1 describes an example in which the adhered material is cold-welded on the alloy plate in a rectangular shape at regular intervals, but it can be applied in multiple patterns in the width direction of the substrate or unequal in the longitudinal direction. Even if they are provided at intervals, they can be manufactured in the same way, and excellent adhesion strength and product properties can be obtained. Moreover, a double-sided clad plate having pressure contact not only with one main surface but also with the other main surface can be manufactured in the same manner. Therefore, the oscillation method of the laser beam, the irradiation output, the distance between the focal point of the FE lens and the irradiation surface, the moving speed of the irradiated side, etc., depend on the material and dimensions of the substrate material, as well as the material dimensions of the adhered material. It is necessary to select it appropriately. Examples Example 1 The metal substrate is a 42% Ni-Fe alloy plate with a thickness of 0.38 mm and a width of 27 mm. The adhesion material is an Al plate with a thickness of 0.02 mm and a width of 10 mm and a purity of 99.7%. did. The atmospheric gas in the irradiation box was Ar gas, and the substrate movement speed was 10 m/min. The laser irradiation device has 100W output and 10kHzQ.
Using a switch YAG laser and using the method shown in Figure 2 above, under the conditions of a lens focal length of 100 mm, a wavelength of 1.00 μm, and a laser power density of 500 kW/mm ² , a laser beam of 10.5 mm in the width direction of the substrate and in the longitudinal direction of the substrate was used. A laser beam is intermittently irradiated onto a 7 mm rectangular spot-like portion to form discontinuous irradiated surfaces at intervals of 40 mm in the longitudinal direction of the substrate, and the irradiated surfaces and A non-irradiated surface was formed, and the Al plate was cold-pressed at a rolling rate of 30% using a pressure roll to a portion corresponding to one strip in the longitudinal direction including the same irradiated surface. After that, unnecessary Al plate was removed by brushing using a 0.15mmφ nylon brush, and
After one cold rolling, the plate thickness is 0.25mm and the plate width is 27mm.
An island-like clad plate of the following dimensions was obtained. Note that the total rolling reduction was 34.2%. At this time, the shape of the adherend material part was approximately square with dimensions of 10.3 mm x 10.7 mm, and the interval between the parts was 60 mm in the longitudinal direction. The dimensions, external appearance, and mechanical properties of the obtained island-shaped clad plate for electronic components according to the present invention were examined, and the results are shown in Table 1. Example 2 A 42% Ni-Fe alloy plate with a thickness of 0.45 mm and a width of 35 mm was used as the metal substrate, and an Al plate with a purity of 99.7% and a thickness of 0.02 mm and a width of 30 mm was used as the adherend material. The atmospheric gas inside the irradiation box was Ar gas, and the substrate movement speed was 5 m/min. The laser irradiation device has 100W output and 10kHzQ.
Using a Switch YAG laser and using the method shown in Figure 3 above, the distance between the lens focal points is 100 mm, the wavelength is 1.06 μm, and the laser power density is 500 kW/ ^mm2. The oscillator is operated intermittently to irradiate a rectangular spot-like portion with dimensions of mm to form a discontinuous irradiation surface at intervals of 20 mm in the longitudinal direction of the substrate, in the pattern shown in Figure 1a. An irradiated surface and a non-irradiated surface were formed, and the Al plate was cold-pressed at a rolling rate of 44% using a pressure roll to a portion corresponding to one strip in the longitudinal direction including the irradiated surface. Thereafter, as shown in FIG. 3A, after the Al plate 17 is pressed by the pressure roll 11, when it is wound around the coil 20, the adhesive surface 22 of the adhesive tape 21 adheres to it.
The coil 20 is wound so as to be pasted onto the Al plate, and when the coil 20 is unwound, the adhesive tape 21 is peeled off and the unnecessary Al plate is removed, as shown in FIG. 3b.
Furthermore, continuous stress relief annealing is applied to achieve a plate thickness of 0.25.
An island-shaped clad plate according to the present invention having dimensions of 35 mm and a plate width of 35 mm was obtained. Note that the total rolling reduction was 47%. At this time, the shape of the adherend material part was approximately square with dimensions of 7.1 mm x 7.0 mm, and the interval between the parts was 36 mm in the longitudinal direction. The dimensions, external appearance, and mechanical properties of the obtained island-shaped clad plate according to the present invention were examined, and the results are shown in Table 1. As is clear from Table 1, by the manufacturing method of the present invention, it is possible to easily obtain island-shaped cladding plates for electronic components, which were difficult to manufacture in the past. It can be seen that an island-like clad plate for parts can be obtained.

【table】

[Table] Furthermore, we measured the hardness from the surface layer to the inside of the substrate before pressure bonding after laser beam irradiation in the present invention, and the hardness condition from the surface layer to the inside of the substrate after wire buffing in the comparative example. Figure 4 shows the results. As is clear from Figure 4, the surface layer after wire buffing has a thickness of about 10 μm and is hardened, and since the hardened layer has a lower deformability than the inside, it cracks due to deformation during pressure welding. The adherend adheres well to the newly formed surface. This can be understood from the fact that when heat treatment is performed as an adhesion test after pressure bonding, this crack becomes a starting point for diffusion. The above-mentioned aspect caused by wire buffing is effective as a surface treatment before pressure welding, but on the other hand, if such treatment is performed until deposits, oil, and moisture are reduced and a clean surface necessary for pressure welding is obtained, polishing The surface becomes extremely rough, and there is a risk of scaly metal powder forming and adhering to the surface and causing problems such as gas entrainment to the pressure welding surface.
Further, it is difficult to apply such polishing to a limited area on the island-shaped portion of the substrate where the material is to be deposited. On the other hand, in the laser beam irradiation according to the present invention, since the beam can be irradiated intermittently, it is possible to apply it only to the required island-shaped parts as in the embodiment, and depending on the selection of the irradiation conditions, a rough surface may occur. It is possible to remove deposits, oils, fats, and moisture without any problems, and to provide a melted, solidified, and hardened layer of a required thickness, allowing selective adhesion of adherend materials. In addition, due to the generation of micro-cracks during pressure welding, this molten solidified layer has a new surface that is more uniformly and densely distributed than in the comparative example. This was also confirmed by the fact that the process progressed uniformly.

[Brief explanation of drawings]

FIG. 1 is a top view of a substrate showing the deposition pattern of the deposition material in the island-shaped clad plate for electronic components according to the present invention. FIGS. 2 and 3 are perspective explanatory views of an apparatus showing a method of manufacturing an island-shaped clad plate for electronic components according to the present invention. FIG. 4 is a graph showing the relationship between substrate depth and Vickers hardness of the island-shaped clad plate for electronic components of the present invention. 10... Alloy plate, 11... Pressure roll, 12...
...Irradiation box, 13...Laser oscillator, 14
... Collimator, 15 ... Galvanic mirror,
16...fθ lens, 17...Al plate, 18...shutter, 19...brush roll, 20...coil, 21...adhesive tape, 22...adhesive surface.

Claims (1)

[Claims] 1. After irradiating at least one laser beam only on the discontinuous areas to be adhered on at least one main surface of a metal or alloy substrate, apply the laser beam to the entire surface of the desired area continuous in the longitudinal direction of the substrate, including the irradiated surface. A method for producing a clad plate for electronic components, which comprises cold welding the adherend material at a rolling reduction rate of 25% to 70%, and then removing the adherend material other than the area to be adhered to obtain an island-shaped clad plate. .