JPH0616538B2 - Integrated circuit element cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention provides a cooling device for an integrated circuit device, wherein a heat transfer plate extends toward a flexible elastic structure to improve reliability of the integrated circuit device, By providing a predetermined space between the bottom end of the elastic structure and the bottom surface of the heat transfer plate, the effective heat transfer area and heat transfer coefficient between the heat transfer plate and the refrigerant are increased, and the cooling capacity is improved.

[Industrial application field]

The present invention relates to a cooling device for integrated circuit devices, and more particularly to a cooling device for integrated circuit devices mounted on a large-scale computer.

[Conventional technology]

FIG. 4 is a diagram showing the configuration of a conventional cooling device for integrated circuit elements.

In FIG. 4, 41 is a cooling body, 42 is a refrigerant passage, 43
Is a nozzle, 44 is a flexible elastic structure, 45 is an integrated circuit element, 46 is a disk-shaped heat transfer plate, and 47 is a substrate.

In the conventional integrated circuit element cooling device, the nozzle 43 protruding from the refrigerant passage 42 directly injects a refrigerant, such as water, to the heat transfer plate 46 attached to the bottom end of the flexible elastic structure 44. Further, when the heat transfer plate 46 and the integrated circuit element 45 are pressed against each other, a heat conduction action is performed and the integrated circuit element 45 is cooled.

[Problems to be solved by the invention]

However, in the conventional integrated circuit element cooling device, since the disk-shaped heat transfer plate is used, the joining form of the heat transfer plate and the flexible elastic structure is limited, and as a result, the heat transfer surface and In the case where the heat transfer area between the refrigerants was limited by the size of the flexible elastic structure, the heat generation amount of the integrated circuit element further increased due to the high density mounting of the integrated circuit element,
There is a possibility that the sufficient cooling capacity cannot be obtained and the reliability of the integrated circuit element is lowered. In addition, since the heat transfer plate is flat, the shape of the joint with the flexible elastic structure cannot be a shape that allows the refrigerant to flow smoothly, and the refrigerant stagnates, causing some poor flow and reducing cooling efficiency. Was there.

An object of the present invention is to provide an integrated circuit element cooling device that can realize a sufficient cooling efficiency even when the amount of heat generated by the integrated circuit element is increased.

[Means for solving problems]

FIG. 1 is a principle diagram of an integrated circuit element cooling device of the present invention.

In the figure, 2 is a refrigerant passage through which a refrigerant flows, 3 is a nozzle that projects from the refrigerant passage 2, 4 is a flexible elastic structure for providing stable contact with the integrated circuit element 6, and 5 is a flexible elastic structure. A heat transfer plate, which is formed by plating the flexible elastic structure 4 or another member having excellent heat conduction, may be connected to the flexible elastic structure 4, 6 is an integrated circuit element , 7
Is a substrate on which the integrated circuit element 6 is mounted.

The heat transfer plate 5 extends in the direction of the flexible elastic structure 4 to form a concave portion, and a predetermined space is provided between the bottom of the flexible elastic structure 4 and the bottom surface of the heat transfer plate 5. It is configured to be provided.

[Action]

The present invention is configured as described above, and the concave portion of the cross section is formed by extending and extending the end portion of the heat transfer plate 5 toward the cooling body, and the inner surface of the concave portion of the cross section on the nozzle side is a flat surface. Therefore, a larger heat transfer plate can be provided without being limited by the size of the flexible elastic structure 4. Further, heat can be transferred to the refrigerant from both side surfaces of the heat transfer plate 5 by the heat conduction effect in the heat transfer plate 5, and the effect of both of them significantly increases the effective heat transfer area. Here, if the thermal resistance between the heat transfer plate 5 and the refrigerant is R (deg / w), the thermal resistance R can be expressed by the following equation.

In the above equation, A is the above-mentioned effective heat transfer area (m ² ),
h is the average heat transfer coefficient (W / m ² · d on the surface of the effective heat transfer area)
eg).

By the way, in the present invention, as described above, the effective heat transfer area A
Is significantly increased, the thermal resistance R decreases according to the equation (1). Further, since the bottom corner portion of the predetermined space provided between the bottom end of the flexible elastic structure 4 and the bottom surface of the heat transfer plate 5 has a curved shape, the refrigerant constantly flowing in the predetermined space. Is smoothed, and the average heat transfer coefficient h is also improved at the same time. This effect also greatly contributes to the reduction of the thermal resistance R.

As described above, in the present invention, the heat transfer plate is extended in the direction of the flexible elastic structure to form the concave portion, and the predetermined interval is provided between the bottom end of the flexible elastic structure and the bottom surface of the heat transfer plate. By providing, the heat transfer area A between the heat transfer surface and the refrigerant and the heat transfer coefficient h increase, and the thermal resistance R between the heat transfer surface and the refrigerant decreases.

〔Example〕

An embodiment of the present invention will be described below in detail with reference to FIG.

FIG. 2 is a diagram showing an embodiment of the present invention.

Note that, in FIG. 2, the same reference numerals as those in FIG. 1 denote the same objects.

In FIG. 2, 2 is a refrigerant passage, 3 is a nozzle, 4 is a flexible elastic structure, 5 is a heat transfer plate, 6 is an integrated circuit element, 7 is a substrate, and 21 is a guide.

When a coolant such as water flows in the coolant passage 2, the nozzle 3 protruding from the coolant passage 2 sprays the coolant such as water onto the heat transfer plate 5 attached to the bottom end of the flexible elastic structure 4. It The heat transfer plate 5 and the integrated circuit element 6 are pressed directly or indirectly, and the heat generated from the integrated circuit element 6 mounted on the substrate 7 is extended and extended toward the cooling body 1 and its nozzle The heat is transferred to the bottom surface portion and both side surface portions of the heat transfer plate 5 in which the inner side surface is a flat concave portion, and the refrigerant absorbs the heat to cool the integrated circuit element 6. At this time, if the guide 21 is joined to the cooling body 1, the positional accuracy of the heat transfer plate 5 in the horizontal direction with respect to the integrated circuit element 6 can be improved, and at the same time the horizontal vibration or movement of the heat transfer plate 5 can be prevented. It becomes possible.

The guide mounting structure may be any structure as shown in FIG. 3 as long as the guide 21 is mounted on the cooling body 1 to achieve the effect of preventing the horizontal movement of the heat transfer plate 5 and improving the accuracy of the pressure contact position. .

3 (a), (b), (c), and (d) are plan views showing an example of a guide mounting structure, and FIGS. 3 (a) and (b) show a case where the number of guides is three. .

FIG. 7C shows the case where the number of guides is four.

FIG. 3D shows a case of a common guide for a plurality of heat transfer plates 5, in which all the outer sides of the cooling body 1 except the portion connecting the cooling bodies 1 to each other are used as the guides 21.

As shown in FIG. 2, the small electronic component 22 is cooled at the same time as the integrated circuit element 6 by pressing the guide 21 made of a material having a high thermal conductivity such as copper based on the small electronic component 22. Is possible. At this time, a compound having good thermal conductivity may be sandwiched between the guide 21 and the small electronic component 22 for cooling.

〔The invention's effect〕

As described above, according to the present invention, the heat transfer plate that transfers the heat of the integrated circuit device to the coolant is extended in the direction of the flexible elastic structure to form the concave portion, and the bottom end of the flexible elastic structure is formed. And a predetermined space is provided between the transmission plate and the bottom surface of the transmission plate.

Therefore, even if the heat generation amount of the integrated circuit element increases due to the high density mounting of the integrated circuit element, the heat transfer area and the heat transfer coefficient between the heat transfer surface and the refrigerant increase, so that the heat transfer between the heat transfer surface and the refrigerant increases. The resistance is reduced and the cooling capacity is greatly improved.

[Brief description of drawings]

FIG. 1 is a diagram showing the principle of the present invention, FIG. 2 is a diagram showing an embodiment of the present invention, FIG. 3 is a plan view showing a guide mounting structure, and FIG. It is a figure which shows the structure of the integrated circuit element cooling device of FIG. In the figure, 1 ... Cooling body, 2 ... Refrigerant passage, 3 ... Nozzle, 4 ... Flexible elastic structure, 5 ... Heat transfer plate, 6 ... Integrated circuit element, 7 ... Substrate, 21 …… Guide, 22 …… Small electronic parts.

Claims (1)

[Claims] 1. A heat transfer plate (5) is provided at the bottom end of a flexible elastic structure (4) whose upper end is attached to the cooling body (1), and the cooling body (1) is provided.
From the nozzle (3) provided inside to the heat transfer plate (5),
Integrated circuit element mounted on the board (7) with refrigerant sprayed
In an integrated circuit element cooling device for cooling the integrated circuit element (6) by pressing the heat transfer plate (5) against (6), an end portion of the heat transfer plate (5) is connected to the cooling body ( 1) An integrated circuit element cooling device, which is formed by extending and extending in the direction 1) and has a concave portion having a flat cross section at least on the nozzle-side inner surface.