JPH0611833B2 - Transparent and heat resistant thermoplastic resin composition - Google Patents
Transparent and heat resistant thermoplastic resin compositionInfo
- Publication number
- JPH0611833B2 JPH0611833B2 JP60144583A JP14458385A JPH0611833B2 JP H0611833 B2 JPH0611833 B2 JP H0611833B2 JP 60144583 A JP60144583 A JP 60144583A JP 14458385 A JP14458385 A JP 14458385A JP H0611833 B2 JPH0611833 B2 JP H0611833B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- component
- unsaturated dicarboxylic
- vinyl monomer
- dicarboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は透明でかつ耐熱性にすぐれた熱可塑性樹脂組成
物に関するものであり、本発明組成物は自動車関係、家
電関係及び精密機器関係等の機器又はその部品の材料と
して使用することができる。TECHNICAL FIELD The present invention relates to a thermoplastic resin composition which is transparent and has excellent heat resistance, and the composition of the present invention relates to automobiles, home appliances, precision instruments and the like. Can be used as a material for the equipment or parts thereof.
(従来の技術) 従来から芳香族ビニル単量体及び不飽和ジカルボン酸無
水物からなる共重合体とポリカーボネート樹脂からなる
組成物が知られている(特公昭57−27133)。又
衝撃強度を改良する目的でゴム変性された芳香族ビニル
単量体及び不飽和ジカルボン酸無水物からなる共重合体
とポリカーボネート樹脂からなる組成物も提案されてい
る(特開昭56−92950)。(Prior Art) A composition comprising a copolymer of an aromatic vinyl monomer and an unsaturated dicarboxylic acid anhydride and a polycarbonate resin has been known (Japanese Patent Publication No. 57-27133). A composition comprising a copolymer of a rubber-modified aromatic vinyl monomer and an unsaturated dicarboxylic acid anhydride and a polycarbonate resin has also been proposed for the purpose of improving impact strength (JP-A-56-92950). .
しかしこれら不飽和ジカルボン酸無水物を共重合した共
重合体とポリカーボネート樹脂との組成物は共重合体連
鎖中に不飽和ジカルボン酸無水物に起因する酸無水物基
が存在するために、高温時の水に対しては勿論のこ、熱
に対しても化学変化を起こし分解しやすく、射出又は押
出加工する際に著しい制約を受け、又加工品を水又は水
蒸気に接触させたり高温下にさらしたりする場合、機械
的物性の低下を引き起こす欠点があつた。又ポリカーボ
ネート樹脂は機械的及び熱的特性にすぐれているが溶融
粘度が高く成形加工性に劣ることや耐油性及び耐熱水性
が悪いことなどが欠点として指摘されており、例えば射
出成形により成形品を製造する場合高い射出圧力や高い
成形温度を必要とし成形歪や熱劣化の原因となる。また
成形品をガソリン、ブレーキオイルなどの油や沸騰水中
に浸漬した場合、クラツクが発生し著しく強度の低下を
きたす。However, the composition of the copolymer obtained by copolymerizing these unsaturated dicarboxylic acid anhydrides and the polycarbonate resin has an acid anhydride group derived from the unsaturated dicarboxylic acid anhydride in the copolymer chain, and therefore, at a high temperature. Of course, it easily decomposes due to chemical changes not only with water but also with heat, and is subject to significant restrictions during injection or extrusion processing. Also, the processed product is exposed to water or steam or exposed to high temperatures. However, there is a drawback that the mechanical properties are deteriorated. Polycarbonate resin has excellent mechanical and thermal properties, but it has been pointed out that it has a high melt viscosity, poor moldability and poor oil resistance and hot water resistance. When manufacturing, high injection pressure and high molding temperature are required, which causes molding distortion and thermal deterioration. When the molded product is immersed in oil such as gasoline or brake oil or boiling water, cracking occurs and the strength is remarkably reduced.
(発明が解決しようとする問題点及びその解決手段) 本発明はかかる欠点を解決すべく研究を重ねた結果、不
飽和ジカルボン酸イミド誘導体とエポキシ樹脂及びポリ
カーボネート樹脂を混合することにより耐熱性と透明性
にすぐれた組成物が得られ、しかもイミド化共重合体中
に存在する不飽和ジカルボン酸無水分単量体残基1−2
0重量%とエポキシ樹脂とが反応することにより著しく
衝撃性を改良することができた。さらにポリカーボネー
ト樹脂の耐油性、耐熱水性及び成形性が悪いという欠点
を改良することに成功した。(Problems to be Solved by the Invention and Means for Solving the Problems) As a result of repeated studies to solve the above-mentioned drawbacks, the present invention shows that heat resistance and transparency are improved by mixing an unsaturated dicarboxylic acid imide derivative with an epoxy resin and a polycarbonate resin. A composition having excellent properties is obtained, and the unsaturated dicarboxylic acid anhydride monomer residue 1-2 present in the imidized copolymer is obtained.
By reacting 0% by weight with the epoxy resin, the impact resistance could be improved significantly. Furthermore, they have succeeded in improving the drawbacks of the polycarbonate resin, such as poor oil resistance, hot water resistance and moldability.
即ち本発明は、 A成分:芳香族ビニル単量体残基30〜90重量%、不
飽和ジカルボン酸イミド誘導体残基3〜70重量%、不
飽和ジカルボン酸無水物単量体残基1〜20重量%及び
前記の基以外のビニル単量体残基0〜40重量%からな
るイミド化共重合体5〜70重量%と、 B成分:エポキシ樹脂0.1〜20重量%と、 C成分:ポリカーボネート樹脂94.9〜15重量%
と、 からなる透明でかつ耐熱性を有する熱可塑性樹脂組成物
である。That is, the present invention comprises: Component A: aromatic vinyl monomer residue 30 to 90% by weight, unsaturated dicarboxylic acid imide derivative residue 3 to 70% by weight, unsaturated dicarboxylic acid anhydride monomer residue 1 to 20. 5 to 70% by weight of an imidized copolymer composed of 0 to 40% by weight of vinyl monomer residues other than the above groups, B component: 0.1 to 20% by weight of epoxy resin, and C component: Polycarbonate resin 94.9-15% by weight
And a transparent thermoplastic resin composition having heat resistance.
ますA成分のイミド化共重合体およびその製法を説明す
る。The imidized copolymer of the component A and its manufacturing method will be described.
A成分共重合体の製法としては、第1の製法として芳香
族ビニル単量体、不飽和ジカルボン酸イミド誘導体、不
飽和ジカルボン酸無水物単量体、及びこれらと共重合可
能なビニル単量体混合物を共重合させる方法、第2の製
法として芳香族ビニル単量体、不飽和ジカルボン酸無水
物及びこれらと共重合可能なビニル単量体混合物を共重
合させた重合体に該重合体中の酸無水中物基に対し0.
8〜0.99モル当量のアンモニア及び/又は第1級ア
ミンを反応させて酸無水物基をイミド基に変換させる方
法が挙げられ、いずれの方法によつても イミド化重合体を得ることができる。As the method for producing the component A copolymer, the first production method is an aromatic vinyl monomer, an unsaturated dicarboxylic acid imide derivative, an unsaturated dicarboxylic acid anhydride monomer, and a vinyl monomer copolymerizable therewith. A method of copolymerizing the mixture, and as a second production method, an aromatic vinyl monomer, an unsaturated dicarboxylic acid anhydride, and a polymer obtained by copolymerizing a vinyl monomer mixture copolymerizable therewith 0.
Examples thereof include a method of reacting 8 to 0.99 molar equivalents of ammonia and / or a primary amine to convert an acid anhydride group into an imide group, and any method can give an imidized polymer. it can.
A成分共重合体第1の製法に使用される芳香族ビニル単
量体としてはスチレン、α−メチルスチレン、ビニルト
ルエン、t−ブチルスチレン、クロロスチレン等のスチ
レン単量体およびその置換単量体であり、これらの中で
スチレンが特に好ましい。As the aromatic vinyl monomer used in the first production method of the component A copolymer, styrene monomers such as styrene, α-methylstyrene, vinyltoluene, t-butylstyrene and chlorostyrene, and substituted monomers thereof Among these, styrene is particularly preferable.
不飽和ジカルボン酸イミド誘導体としてはマレイミド、
N−メチルマレイミド、N−ブチルマレイミド、N−フ
エニルマレイミド、N−メチルフエニルマレイミド、N
−ヒドロキシフエニルマレイミド、N−メトキシフエニ
ルマレイミド、N−クロロフエニルマレイミド、N−カ
ルボキシフエニルマレイミド、N−ニトロフエニルマレ
イミド、N−シクロヘキシルマレイミド、N−イソプロ
ピルマレイミド等のマレイミド誘導体、N−メチルイタ
コン酸イミド、N−フエニルイタコン酸イミド等のイタ
コン酸イミド誘導体等が挙げられ、これらの中でN−フ
エニルマレイミドが特に好ましい。Maleimide as the unsaturated dicarboxylic acid imide derivative,
N-methylmaleimide, N-butylmaleimide, N-phenylmaleimide, N-methylphenylmaleimide, N
-Hydroxyphenyl maleimide, N-methoxyphenyl maleimide, N-chlorophenyl maleimide, N-carboxyphenyl maleimide, N-nitrophenyl maleimide, N-cyclohexyl maleimide, N-methyl imide and other maleimide derivatives, N-methyl Examples thereof include itaconic acid imide derivatives such as itaconic acid imide and N-phenylitaconic acid imide, and among these, N-phenylmaleimide is particularly preferable.
不飽和ジカルボ酸無水物としては、マレイン酸、イタコ
ン酸、シトラコン酸、アコニツト酸等の無水物があり、
マレイン酸無水物が特に好ましい。Examples of unsaturated dicarboic acid anhydrides include anhydrides such as maleic acid, itaconic acid, citraconic acid, and aconitic acid.
Maleic anhydride is especially preferred.
またこれらと共重合可能なビニル単量体としては、アク
リロニトリル、メタクリロニトリル、α−クロロアクリ
ロニトリル等のシアン化ビニル単量体、メチルアクリル
酸エステル、エチルアクリル酸エステル等のアクリル酸
エステル単量体エステル等のアクリル酸エステル単量
体、メチルメタクリル酸エステル、エチルメタクリル酸
エステル等のメタクリル酸エステル単量体、アクリル
酸、メタクリル酸等のビニルカルボン酸単量体、アクリ
ル酸アミド、メタクリル酸アミド等があつてこれらの中
でアクリルロニトリル、メタクリル酸エステル、アクリ
ル酸、メタクリル酸などの単量体が好ましい。As vinyl monomers copolymerizable with these, vinyl cyanide monomers such as acrylonitrile, methacrylonitrile and α-chloroacrylonitrile, and acrylic acid ester monomers such as methyl acrylic acid ester and ethyl acrylic acid ester. Acrylic acid ester monomers such as ester, methacrylic acid ester monomers such as methyl methacrylic acid ester, ethyl methacrylic acid ester, vinyl carboxylic acid monomers such as acrylic acid and methacrylic acid, acrylic acid amide, methacrylic acid amide, etc. Therefore, of these, monomers such as acrylonitrile, methacrylic acid ester, acrylic acid and methacrylic acid are preferable.
また第2の製法に使用される芳香族ビニル単量体、不飽
和ジカルボン酸無水物及びこれらと共重合可能なビニル
単量体は前記の第1の製法に使用されるものが使用でき
る。As the aromatic vinyl monomer, unsaturated dicarboxylic acid anhydride and vinyl monomer copolymerizable with these used in the second production method, those used in the first production method can be used.
また、イミド化反応に用いるアンモニアや第1級アミン
は無水又は水溶液のいずれの状態であつてもよく、また
第1級アミンの例としてメチルアミン、エチルアミン、
ブチルアミン、シクロヘキシルアミン等のアルキルアミ
ン、およびこれらのクロル又はブロム置換アルキルアミ
ン、アニリン、トリルアミン、ナフチルアミン等の芳香
族アミンおよびクロル又はブロム置換アニリン等のアロ
ゲン置換芳香族アミンがあげられる。Further, the ammonia and the primary amine used in the imidization reaction may be in either anhydrous or aqueous solution, and examples of the primary amine include methylamine, ethylamine,
Examples thereof include alkylamines such as butylamine and cyclohexylamine, and aromatic amines such as chloro- or bromine-substituted alkylamines, aniline, tolylamine, naphthylamine, and allogen-substituted aromatic amines such as chloro- or bromo-substituted aniline.
さらに、イミド化反応を溶液状態又は懸濁状態で行なう
場合は、通常の反応容器、例えばオートクレーブなどを
用いるのが好ましく、塊状溶融状態で行なう歩合は脱揮
装置の付いた押出機を用いてもよい。またイミド化する
際に触媒を存在させてもよく、例えば第3級アミン等が
好ましく用いられる。Furthermore, when the imidization reaction is carried out in a solution state or a suspension state, it is preferable to use an ordinary reaction vessel, for example, an autoclave, and the rate of carrying out in a bulk molten state can be obtained by using an extruder equipped with a devolatilization device. Good. A catalyst may be present during imidization, and for example, a tertiary amine or the like is preferably used.
イミド化反応の温度は、約80〜350℃であり、好ま
しくは100〜300℃である。The temperature of the imidization reaction is about 80 to 350 ° C, preferably 100 to 300 ° C.
80℃未満の場合には反応速度が遅く、反応に長時間を
要し実用的でない。一方350℃を越える場合には重合
体の熱分解による物性低下をきたす。When the temperature is lower than 80 ° C, the reaction rate is slow and the reaction requires a long time, which is not practical. On the other hand, when the temperature exceeds 350 ° C, the physical properties are deteriorated due to thermal decomposition of the polymer.
溶液状態でイミド化する場合の溶剤としては、アセト
ン、メチルエチルケトン、メチルイソブチルケトン、ア
セトフエノン、テトラヒドロフラン、ジメチルホルムア
ミド等がありこれらの中でメチルエチルケトン、メチル
イソブチルケトンが好ましい。非水性媒体中での置換状
態でイミド化する特に非水性媒体にはヘブタン、ヘキサ
ン、ペンタン、オクタン、2−メチルペンタン、シクロ
ペンタン、シクロヘキサン等の脂肪族炭化水素がある。As the solvent for imidization in a solution state, there are acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, tetrahydrofuran, dimethylformamide and the like. Among these, methyl ethyl ketone and methyl isobutyl ketone are preferable. Particularly, the non-aqueous medium which is imidized in the non-aqueous medium in a substituted state includes aliphatic hydrocarbons such as hebutane, hexane, pentane, octane, 2-methylpentane, cyclopentane and cyclohexane.
A成分共重合体は、芳香族ビニル単量体残基30〜90
重量%好ましくは40〜70重量%、不飽和ジカルボン
酸イミド誘導体残基3〜70重量%好ましくは10〜6
0重量%、不飽和ジカルボン酸無水物単量体残基1〜2
0重量%好ましくは2〜15重量%および前記の基以外
のビニル単量体残基0〜40重量%好ましくは0〜30
重量%からなるイミド化共重合体である。芳香族ビニル
単量体残基の量が30重量%未満であると成形性及び寸
法安定性が損われ、90重量%を超えると、衝撃強度及
び耐熱性が損われる。不飽和ジカルボン酸イミド誘導体
残基の量が3重量%未満の場合は耐熱性改良の効果が十
分でなく、一方70重量%を越えると樹脂組成がもろく
なり成形性も著しく悪くなる。これらの基以外のビニル
単量体残基の量が40重量%を超えると、寸法安定性及
び耐熱性が損われる。The component A copolymer has an aromatic vinyl monomer residue of 30 to 90.
% By weight, preferably 40-70% by weight, unsaturated dicarboxylic acid imide derivative residue 3-70% by weight, preferably 10-6
0% by weight, unsaturated dicarboxylic acid anhydride monomer residues 1-2
0% by weight, preferably 2-15% by weight and vinyl monomer residues other than the above groups, 0-40% by weight, preferably 0-30
It is an imidized copolymer composed of wt%. When the amount of the aromatic vinyl monomer residue is less than 30% by weight, moldability and dimensional stability are impaired, and when it exceeds 90% by weight, impact strength and heat resistance are impaired. When the amount of the unsaturated dicarboxylic acid imide derivative residue is less than 3% by weight, the effect of improving the heat resistance is not sufficient, while when it exceeds 70% by weight, the resin composition becomes brittle and the moldability is remarkably deteriorated. If the amount of vinyl monomer residues other than these groups exceeds 40% by weight, dimensional stability and heat resistance are impaired.
B成分に用いられるエポキシ樹脂としては一般式 〔式中のRは水素原子又はメチル基を表わし、nは0〜
100,000なる有理数である。〕 で示されるビスフエノール型エポキシ樹脂及び一般式 〔式中のRは水素原子又はメチル基を、R′はC1〜R
9なるアルキル基を表わし、mは0〜100なる有理数
である。〕 で示されるノボラツク型エポキシ樹脂などがあり、具体
例としてはビスフエノールA型エポキシ樹脂、ビスフエ
ノールF型エポキシ樹脂、フエノールノボラツク型エポ
キシ樹脂、クレゾールノボラツク型エポキシ樹脂、脂環
式エポキシ樹脂、トリグリシジルイソシアネートやヒダ
ントインエポキシ樹脂のような含複素環エポキシ樹脂、
水添ビスフエノールA型エポキシ樹脂、芳香族や脂肪族
あるいは脂環式カルビン酸とエピクロリヒドリンとの反
応で得られるエポキシ樹脂、スピロ環含有エポキシ樹
脂、オルソーアリル−フエノールノボラツク化合物とエ
ピクロルヒドリンとの反応生成物であるグリシジルエー
テル型エポキシ樹脂、オルソ位にアリル基を有するジア
リルビスフエノール化合物とエピクロルヒドリンとの反
応生成物であるグリシジルエーテル型エポキシ樹脂及び
これらのハロゲン誘導体が挙げられ、それぞれ単独又は
複合系で用いられる。The epoxy resin used for component B has the general formula [In the formula, R represents a hydrogen atom or a methyl group, and n is 0 to
It is a rational number of 100,000. ] Bisphenol type epoxy resin represented by [Wherein R represents a hydrogen atom or a methyl group, and R ′ represents C 1 -R
9 represents an alkyl group, and m is a rational number of 0 to 100. ] There is a novolak type epoxy resin represented by the following, and specific examples are bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, alicyclic epoxy resin, Heterocyclic epoxy resins, such as triglycidyl isocyanate and hydantoin epoxy resins,
Of hydrogenated bisphenol A type epoxy resin, epoxy resin obtained by reaction of aromatic or aliphatic or alicyclic carbamic acid with epichlorohydrin, spiro ring-containing epoxy resin, orthoallyl-phenol novolak compound and epichlorohydrin A glycidyl ether type epoxy resin which is a reaction product, a glycidyl ether type epoxy resin which is a reaction product of a diallyl bisphenol compound having an allyl group at an ortho position and epichlorohydrin and a halogen derivative thereof, each of which may be used alone or in a complex system. Used in.
C成分に用いられるポリカーボネート樹脂としては、一
般に式 なる繰返し単位を有するものであり、例えばホスゲン法
又はエステル交換法によつて得られる。ポリカーボネー
ト樹脂として好ましいものはビス(ヒドロキシアリー
ル)アルカン系ポリカーボネート樹脂であり、例えばビ
ス(4−ヒドロキシフエニル)メタン、ビス(4−ヒド
ロキシフエニル)エタン、2,2−ビス(4−ヒドロキシ
フエニル)プロパン、2,2−ビス(4−ヒドロキシ−
3,5−ジクロロフエニルプロパンもしくはビス(4−ヒ
ドロキシフエニル)フエニルメタン等のビス(ヒドロキ
シアリール)アルカンとホスゲンあるいはジアリールカ
ーボネートとより得られるものであり、これは単独ある
いは混合して使用される。The polycarbonate resin used for the C component is generally represented by the formula And has a repeating unit of, for example, a phosgene method or a transesterification method. Preferred as the polycarbonate resin are bis (hydroxyaryl) alkane-based polycarbonate resins such as bis (4-hydroxyphenyl) methane, bis (4-hydroxyphenyl) ethane, and 2,2-bis (4-hydroxyphenyl). ) Propane, 2,2-bis (4-hydroxy-)
It is obtained from bis (hydroxyaryl) alkane such as 3,5-dichlorophenylpropane or bis (4-hydroxyphenyl) phenylmethane and phosgene or diaryl carbonate, which may be used alone or in a mixture.
また本発明においてA成分、B成分及びC成分の割合は A成分 5〜70重量%、好ましくは10〜60重量
%; B成分 0.1〜20重量%、好ましくは0.5〜15
重量%; C成分 94.9〜15重量%、好ましくは89.5〜
20重量%である。In the present invention, the proportions of the A component, B component and C component are: A component 5 to 70% by weight, preferably 10 to 60% by weight; B component 0.1 to 20% by weight, preferably 0.5 to 15%
% By weight; C component 94.9-15% by weight, preferably 89.5-
It is 20% by weight.
A成分の割合が5重量%未満であると耐熱性、耐油性及
び耐熱水性の改良効果が十分でなく、70重量%をこえ
ると衝撃強度が低下し成形性も悪くなる。If the proportion of the component A is less than 5% by weight, the effect of improving heat resistance, oil resistance and hot water resistance is not sufficient, and if it exceeds 70% by weight, impact strength is lowered and moldability is deteriorated.
B成分の割合が0.1重量%未満では衝撃強度の改良が
十分でなく、20重量をこえると耐熱性が低下する。If the proportion of the component B is less than 0.1% by weight, the impact strength is not sufficiently improved, and if it exceeds 20% by weight, the heat resistance is lowered.
C成分の割合が15重量%未満では衝撃強度が劣り、9
4.9重量%をこえると成形性、耐油性及び耐熱水性が
悪くなる。When the proportion of C component is less than 15% by weight, the impact strength is inferior.
If it exceeds 4.9% by weight, moldability, oil resistance and hot water resistance are deteriorated.
本発明でA成分、B成分及びC成分の混合方法は特に制
限がなく、公知の手段を使用することができる。その手
段として例えばバンバリーミキサー、タンブラーミキサ
ー、混合ロール、1軸又は2時押出機等があげられる。
混合形態としては通常の溶融混合、マスターペレツト等
を用いる多段階溶融混練、溶液中でのブレンド等による
組成物を得る方法がある。In the present invention, the mixing method of the components A, B and C is not particularly limited, and known means can be used. Examples of such means include a Banbury mixer, a tumbler mixer, a mixing roll, a single-screw or two-hour extruder.
As a mixing form, there are a usual melt mixing method, a multi-step melt kneading method using a master pellet, and a method of obtaining a composition by blending in a solution.
(実施例) 実施例中の部、%はいずれも重量基準で表わした。(Example) All parts and% in the examples are expressed on a weight basis.
実験例(1) 芳香族ビニル単量体と不飽和ジカルボン酸
無水物を重合させた共重合体をイミド化した重合体の製
造 撹拌機を備えたオートクレーブ中にスチレン100部、
及びメチルイソブチルケトン50部を仕込み、納を窒素
ガスで置換した。温度を83℃に昇温後、無水マレイン
酸67部とベンゾイルパーオキサイド0.2部をメチルイ
ソブチルケトン400部に溶解した溶液を8時間で添加
した。粘調な反応液の一部をサンプリングしてガスクロ
マトグラフイーにより未反応単量体の定量を行なつた結
果重合率はスチレン99%、無水マレイン酸99%であ
つた。ここで得られた共重合体溶液に無水マレイン酸に
対して0.9モル当量のアニリン57.2部、トリエチ
ルアミン1部を加え140℃で7時間反応させた。脱気
処理し得られたイミド化重合体を重合体A−1とする。Experimental Example (1) Production of a polymer obtained by imidizing a copolymer obtained by polymerizing an aromatic vinyl monomer and an unsaturated dicarboxylic acid anhydride 100 parts of styrene in an autoclave equipped with a stirrer,
And 50 parts of methyl isobutyl ketone were charged and the contents were replaced with nitrogen gas. After the temperature was raised to 83 ° C., a solution prepared by dissolving 67 parts of maleic anhydride and 0.2 part of benzoyl peroxide in 400 parts of methyl isobutyl ketone was added over 8 hours. A part of the viscous reaction liquid was sampled and the amount of unreacted monomer was quantified by gas chromatography. As a result, the polymerization rate was 99% for styrene and 99% for maleic anhydride. To the copolymer solution obtained here, 57.2 parts of aniline and 1 part of triethylamine, which are 0.9 molar equivalents to maleic anhydride, were added and reacted at 140 ° C. for 7 hours. The imidized polymer obtained by the degassing treatment is referred to as polymer A-1.
実験例(2) 芳香族ビニル、不飽和ジカルボン酸、及び
これらと共重合可能なビニル単量体を重合させた共重合
体をイミド化した重合体の製造 実験(1)のスチレン100部の代わりにスチレン100
部とアクリロニトリル17部を用い、無水マレイン酸6
7部を50部にし、アニリン57.2部を42.7部に代え
た以外は実験例(1)と全く同じ操作を行ないイミド化重
合体を得た。これを重合体A−2とする。なおこの重合
体の重合率はスチレン98%、無水マレイン酸98%で
あつた。Experimental Example (2) Production of a polymer obtained by imidizing a copolymer obtained by polymerizing an aromatic vinyl, an unsaturated dicarboxylic acid, and a vinyl monomer copolymerizable therewith, instead of 100 parts of styrene in Experiment (1) Styrene 100
And 17 parts of acrylonitrile, maleic anhydride 6
The same operation as in Experimental Example (1) was carried out except that 7 parts was changed to 50 parts and 57.2 parts of aniline was changed to 42.7 parts to obtain an imidized polymer. This is designated as Polymer A-2. The polymerization rate of this polymer was 98% styrene and 98% maleic anhydride.
実験例(3) 芳香族ビニル単量体及びN−置換マレイミ
ドよりなる重合体の製造 撹拌機を備えたオートクレーブ中にスチレン100部、
メチルイソブチルケトン50部を仕込み系内を窒素置換
後温度を83℃に昇温しN−フエニルマレイミド85
部、無水マレイン酸15部、ベンゾイルパーオキサイド
0.2部をメチルイソブチルケトン400部に溶解した
溶液を8時間で添加した以外は実験例(1)と同じ操作を
行ない共重合体を得た。重合率はスチレン96%、N−
フエニルマレイミド95%であつた。これを重合体A−
3とする。Experimental Example (3) Production of polymer composed of aromatic vinyl monomer and N-substituted maleimide 100 parts of styrene in an autoclave equipped with a stirrer,
After charging 50 parts of methyl isobutyl ketone and replacing the inside of the system with nitrogen, the temperature was raised to 83 ° C. and N-phenylmaleimide 85 was added.
Parts, 15 parts of maleic anhydride and 0.2 parts of benzoyl peroxide were dissolved in 400 parts of methyl isobutyl ketone in 8 hours, and the same operation as in Experimental Example (1) was performed to obtain a copolymer. Polymerization rate is 96% styrene, N-
It was 95% phenylmaleimide. This is polymer A-
Set to 3.
実施例1 実験例(1)で得られた重合体A−135部、エポキシ樹
脂(シエル化学社製 エピコート1001)5部 ポリカーボネート樹脂(帝人化成製パンライト K−1
300W)60部をブレンドし、このブレンド物を30
mmφ脱揮装置付スクリユー押出機により押出しペレツト
化した。Example 1 135 parts of the polymer A obtained in Experimental Example (1), 5 parts of epoxy resin (Epicoat 1001 manufactured by Ciel Chemical Co., Ltd.) Polycarbonate resin (Panlite K-1 manufactured by Teijin Chemicals)
300 W) 60 parts were blended, and this blended product was blended with 30 parts.
It was extruded into pellets by a screen extruder equipped with a mmφ devolatilizer.
実施例2〜3 実施例1において重合体A−1、エポキシ樹脂及びポリ
カーボネート樹脂とのブレンド比を変えた以外は実施例
1と同様に行なつた。Examples 2 to 3 Example 1 was repeated except that the blend ratio of the polymer A-1, the epoxy resin and the polycarbonate resin was changed.
実施例4〜5 実施例1において重合体A−1に代え実験例(2)の重合
体A−2及び実験例(3)の重合体A−3を用いた以外は
実施例1と同様に行なつた。Examples 4 to 5 In the same manner as in Example 1 except that the polymer A-1 in Example 1 was replaced with the polymer A-2 in Experimental Example (2) and the polymer A-3 in Experimental Example (3). Done.
比較例1 実施例1において重合体A−1を用いずポリカーボネー
ト樹脂のみを成形した。Comparative Example 1 In Example 1, only the polycarbonate resin was molded without using the polymer A-1.
比較例2 実験例(1)で得られたスチレン−無水マレイン酸共重合
体をイミド化せずに用いた以外は実施例1と同様に行な
つた。Comparative Example 2 The procedure of Example 1 was repeated except that the styrene-maleic anhydride copolymer obtained in Experimental Example (1) was used without imidization.
比較例3 実施例1において重合体A−1のみを用いて成形した。Comparative Example 3 In Example 1, molding was performed using only the polymer A-1.
比較例4 実施例1においてエポキシ樹脂を用いなかつた以外は実
施例1と同様に行なつた。Comparative Example 4 Example 1 was repeated except that no epoxy resin was used.
上記実施例及び比較例で得れた組成物の物性を第1表に
示した。The physical properties of the compositions obtained in the above Examples and Comparative Examples are shown in Table 1.
なお物性の測定は下記の方法によつた。 The physical properties were measured by the following methods.
(1) ビカツト軟化温度:5Kg過重でASTM D−1
525に準じた。(1) Bicat softening temperature: ASTM D-1 with 5 kg excess
According to 525.
(2) アイゾツト衝撃強度:ノツチ付、1/4インチ、
ASTM D−256に準じた。(2) Izod impact strength: with notch, 1/4 inch,
According to ASTM D-256.
(3) 成形加工性:射出成形機による精鋭加工を行な
い、ポイカーボネート樹脂と同等あるいはそれ以上の成
形温度及び/又は射出圧力を必要とするものを「×」、
ポリカーボネート樹脂より低い成形温度及び射出圧力で
成形可能なものを「○」で示した。(3) Molding processability: “X” indicates that a molding temperature and / or injection pressure equal to or higher than that of the polycarbonate resin is required by performing the sharpening process with an injection molding machine.
Those that can be molded at a molding temperature and injection pressure lower than those of the polycarbonate resin are indicated by “◯”.
(4) 耐油性:試験片を室温のガソリンに24時間浸漬
させ、クラツク発生のあるものを「×」、クラツク発生
のないものを「○」で示した。(4) Oil resistance: The test pieces were immersed in gasoline at room temperature for 24 hours, and those with cracking were indicated by "x", and those without cracking were indicated by "○".
(5) 耐熱水性:試験片を沸騰水中に24時間浸漬させ
てクラツク発生のあるものを「×」、クラツク発生のな
いものを「○」で示した。(5) Hot water resistance: Test pieces were immersed in boiling water for 24 hours, and those with crack generation were indicated by "x", and those without crack generation were indicated by "○".
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08L 69:00) 9363−4J (C08L 69/00 35:06 7921−4J 63:00) 8830−4J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display area C08L 69:00) 9363-4J (C08L 69/00 35:06 7921-4J 63:00) 8830- 4J
Claims (1)
0重量%、不飽和ジカルボン酸イミド誘導体残基3〜7
0重量%、不飽和ジカルボン酸無水物単量体残基1〜2
0重量%及び前記の基以外のビニル単量体残基0〜40
重量%からなるイミド化共重合体5〜70重量%と、 B成分:エポキシ樹脂0.1〜20重量%と、 C成分:ポリカーボネート樹脂94.9〜15重量%
と、 からなる透明でかつ耐熱性を有する熱可塑性樹脂組成
物。1. Component A: aromatic vinyl monomer residue 30 to 9
0% by weight, unsaturated dicarboxylic acid imide derivative residues 3 to 7
0% by weight, unsaturated dicarboxylic acid anhydride monomer residues 1-2
0% by weight and 0 to 40 vinyl monomer residues other than the above groups
5 to 70% by weight of imidized copolymer consisting of 10% by weight, B component: 0.1 to 20% by weight of epoxy resin, C component: 94.9 to 15% by weight of polycarbonate resin
A transparent and heat-resistant thermoplastic resin composition comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60144583A JPH0611833B2 (en) | 1985-07-03 | 1985-07-03 | Transparent and heat resistant thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60144583A JPH0611833B2 (en) | 1985-07-03 | 1985-07-03 | Transparent and heat resistant thermoplastic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS627758A JPS627758A (en) | 1987-01-14 |
| JPH0611833B2 true JPH0611833B2 (en) | 1994-02-16 |
Family
ID=15365494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60144583A Expired - Lifetime JPH0611833B2 (en) | 1985-07-03 | 1985-07-03 | Transparent and heat resistant thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611833B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2556376B2 (en) * | 1989-03-31 | 1996-11-20 | 日本ジーイープラスチックス株式会社 | Polycarbonate and polystyrene composition |
| JP2556379B2 (en) * | 1989-03-31 | 1996-11-20 | 日本ジーイープラスチックス株式会社 | Polycarbonate resin composition |
| JP6699546B2 (en) | 2014-10-28 | 2020-05-27 | 東洋紡株式会社 | Polycarbonate imide resin paste and electronic component having solder resist layer, surface protection layer, interlayer insulating layer or adhesive layer obtained by curing the paste |
| KR102233604B1 (en) | 2015-10-19 | 2021-03-30 | 도요보 가부시키가이샤 | Polycarbonate imide resin and paste using the same |
| EP3960814B1 (en) | 2019-04-26 | 2023-10-11 | Denka Company Limited | Thermoplastic resin composition and molded article thereof |
-
1985
- 1985-07-03 JP JP60144583A patent/JPH0611833B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS627758A (en) | 1987-01-14 |
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