JPH0719864B2 - Integrated circuit cooling structure - Google Patents

Description

TECHNICAL FIELD The present invention relates to a cooling structure for an integrated circuit, and more particularly to a water cooling type cooling structure using a cold plate.

[Prior Art] Conventionally, in this type of integrated circuit cooling structure, as shown in FIG. 3, for example, an LSI case 22 on which the integrated circuit 21 is mounted is mounted on a printed circuit board 23, and on the LSI case 22, A heat transfer plate 24, which has a larger area than the integrated circuit 21 and is in contact with the integrated circuit 21, is provided. A heat transfer body 26 made of copper or the like is fixed via the heat transfer body 25, and the heat transfer body 26 transfers the heat transferred to the heat transfer body 26 to the bellows 27.
It is structured such that it is cooled by the refrigerant 29 in the cooling header 28 attached via the air conditioner (JP-A-60-110149).

[Problems to be Solved by the Invention] The conventional cooling structure for an integrated circuit described above uses a flexible bellows 27 in order to eliminate variations such as variations in the outer shape of the LSI case 22 and floats and tilts of parts during assembly. Although the heat transfer surfaces of the plate 24 and the heat transfer body 25 are in close contact with each other, the bellows 27 itself is formed to be very thin in order to give the bellows 27 flexibility, so that the strength is weak and the refrigerant 29 Since there is a risk of leakage, it is necessary to handle it with care, and as a result, there is a drawback in that operability is poor.

[Means for Solving the Problems] The present invention has been made to solve the above-described conventional problems. As a means for solving the problems, a frame is provided on a printed circuit board on which a plurality of LSI cases are mounted. A cooling plate having a cooling pipe is provided on the frame at a position corresponding to the LSI case via a spring that biases the LSI case side to the LSI case.
Provided is a cooling structure for an integrated circuit, which is mounted in close contact with the surface of a case and cools the heat of the LSI case transmitted through the cooling plate by the refrigerant in the cooling pipe.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.

1 is a sectional view showing a cooling structure of an integrated circuit according to an embodiment of the present invention, and FIG. 2 is a partially cutaway side view showing the cooling structure of the integrated circuit of FIG.

The cooling structure of the integrated circuit is such that the integrated circuit 2 of the LSI case 1 is cooled by the cooling pipe 6 via the heat transfer plate 3 and the cooling plate 5.

The LSI case 1 mounting the integrated circuit 2 is a printed circuit board 4
It is implemented horizontally. In this LSI case 1, a heat transfer plate 3 having a larger area than the upper surface of the integrated circuit 2 is bonded and held on the upper surface of the integrated circuit 2. The heat transfer plate 3 is formed by finishing a material having high thermal conductivity into a flat plate shape on both sides.

The cooling plate 5 is located in contact with the upper surface of the heat transfer plate 3. The cooling plate 5 is formed by finishing a material having a high thermal conductivity into a plate shape having at least a flat lower surface. The cooling plate 5 is attached to the frame 9 via a spring 8. The spring 8 is formed of a substantially Z-shaped elastic member as shown in FIG. 2, and has a function of adhering the cooling plate 5 to the upper surface of the heat transfer plate 3 by its urging force. This causes variations in the outer shape of the LSI case 1 and the LSI case 1 that occurs during assembly.
The cooling plate 5 accurately adheres to the heat transfer plate 3 irrespective of variations in height and inclination. On the other hand, the frame 9 is supported on the printed circuit board 4 by the support 11.

The cooling pipe 6 is mounted and fixed on the upper surface of the cooling plate 5 with solder 7. This cooling pipe 6 is provided on each cooling plate 5, and is connected in series by a hose 10 as shown in FIG. Further, the cooling medium flows in the cooling pipe 6.

Next, the operation of the cooling structure for an integrated circuit according to this embodiment will be described.

The heat released from the integrated circuit 2 reaches the cooling plate 5 via the heat transfer plate 3. Since this cooling plate 5 is in close contact with the heat transfer plate 3 by the urging force of the spring 8, the heat from the heat transfer plate 3 is sufficiently absorbed and the absorbed heat is conducted to the cooling pipe 6. The heat conducted to the cooling pipe 6 is cooled by the refrigerant inside the cooling pipe 6.

[Effects of the Invention] As described above, in the cooling structure for an integrated circuit of the present invention, a frame is provided on a printed circuit board on which a plurality of LSI cases are mounted, and a cooling pipe is provided at a portion of the frame corresponding to the LSI case. Since the cooling plate having the is attached to the surface of the LSI case with a spring that biases the LSI case in close contact, the size of the LSI case and variations during assembly
The cooling plate can be closely attached to the LSI case regardless of the height difference and inclination of the case, and as a result, the thermal resistance is reduced and the cooling characteristics are improved. Further, since the structure is simple, it is inexpensive, easy to handle, and less likely to leak the refrigerant. Furthermore, since the cooling pipe is attached to the cooling plate, the cooling plate can be made thin and light in weight.

[Brief description of drawings]

FIG. 1 is a sectional view showing a cooling structure for an integrated circuit according to an embodiment of the present invention, FIG. 2 is a side view with partial cutaway showing a cooling structure for the integrated circuit of FIG. 1, and FIG. It is sectional drawing which shows the cooling structure of an integrated circuit. 1,12: LSI case 2,21: Integrated circuit 3,24: Heat transfer plate 4,23: Printed circuit board 5: Cooling plate, 6: Cooling pipe 7: Solder, 8: Spring 9: Frame, 10: Hose 11: Supports, 25: variable shaped heat conductors 26: heat conductors, 27: bellows 28: cooling header, 29: refrigerant

Claims (1)

[Claims] 1. A frame is provided on a printed circuit board on which a plurality of LSI cases are mounted, a cooling plate having a cooling pipe is provided at a portion of the frame corresponding to the LSI case, and a spring for urging the LSI case side. A cooling structure for an integrated circuit, characterized in that the heat of the LSI case transmitted through the cooling plate is cooled by a refrigerant in the cooling pipe.