JPH0744134B2 - Electronic component manufacturing method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an improvement in a method for manufacturing an electronic component having a structure in which terminals are joined to electrodes, such as a capacitor with leads, and particularly to an electrode forming step and The present invention relates to an improved terminal joining process.

[Conventional technology]

FIG. 2 is a perspective view for explaining a conventional method of manufacturing a capacitor with leads. In manufacturing this capacitor with leads, first, electrodes 2 are formed on both main surfaces of a disk-shaped sintered body 1 made of a dielectric ceramic. The electrode 2 is formed by applying and baking an electrode paste containing a conductive powder for forming an electrode such as Ag, Cu, Zn, Al or by plating a metal material such as Ag, Cu or Ni, and then the end surface of the sintered body 1 or the like. It is formed by polishing or etching away the plating metal attached to the unnecessary portion of the.

Next, the lead terminals 4 and 5 are joined to the electrode 2 by using solder or a conductive adhesive 3. After that, a resin with an outer cover (not shown) is applied to obtain a leaded capacitor.

[Descriptive problem to be solved by the invention]

As described above, in the conventional method for manufacturing the electronic component with leads, the step of forming the electrodes 2 on both main surfaces of the sintered body 1 and the terminal
Since the bonding steps of 4 and 5 are performed separately, the total number of steps is relatively large, and the electrode forming step and the terminal bonding step itself are considerably complicated.

In addition, heat treatment such as baking when forming the electrode 2 or residual electrolytic material during plating may deteriorate the quality of the electronic component.

An object of the present invention is to provide a method for manufacturing an electronic component, which can be manufactured by a relatively simple process and can effectively prevent the deterioration of quality due to the electrode forming process.

[Means for solving technical problems]

The present invention is a method of manufacturing an electronic component having a structure in which a terminal is joined to an electrode, which is characterized by including the following steps.

That is, an electronic component unit without electrodes is prepared, and the electronic component unit is held in a state of being sandwiched by a plurality of terminals. Next, the electronic component unit held by the terminal is immersed in molten solder in a state of being vibrated by ultrasonic waves, and the electronic component unit is pulled up from the molten solder,
Each step of solidifying the attached solder to form an electrode and bonding the electrode and the terminal is provided.

[Action]

The molten solder that is vibrated by ultrasonic waves has improved wettability due to the ultrasonic vibrations, and is therefore attached to the electronic component unit made of ceramic or the like with a considerable affinity. Therefore, the electrode is formed by solder on the outer surface of the electronic component unit by immersing it in molten solder that is vibrated by ultrasonic waves, and then pulling up and solidifying, and at the same time, the electrode is joined to the terminal. It is fulfilled by solder.

That is, the present invention is characterized by improving the wettability of the solder by vibrating the molten solder by ultrasonic waves, thereby performing both the electrode formation and the joining of the electrode and the terminal in one step. Is.

[Explanation of Examples]

Hereinafter, an embodiment applied to a method of manufacturing a capacitor having electrodes formed on both main surfaces will be described with reference to the drawings.

First, as shown in FIG. 3, a sintered body 11 made of a disk-shaped dielectric ceramic is prepared, and the sintered body 11 is connected to the terminal portion 1.
It is held by a U-shaped metal wire 14 having 2,13.

Next, the electronic component unit 11 held by the terminal portions 12 and 13 of the metal wire 14 is dipped in the molten solder 16 stored in the bath 15 as shown in FIG. An ultrasonic oscillator 18 connected to an ultrasonic generator 17 is immersed in the molten solder 16 in the bath 15, and the molten oscillator 16 is melted by the ultrasonic oscillator 18.
Is being vibrated.

Therefore, as shown in FIG. 1, the wettability of the molten solder 16 is improved in a state where the electronic component unit 11 is immersed, so that the molten solder 16 can be applied to the electronic component unit 11 and the terminal portion 12, It adheres to the portion of the molten solder 16 dipped in 13 with considerable affinity.

Next, pull up the electronic component unit 11 from the molten solder 16,
The attached solder is solidified.

As a result, a solder film is formed on the outer surface of the portion that was immersed in the molten solder 16. This solder film is
The electronic component unit 11 centering around the contact portions of the terminal portions 12 and 13
It is applied to almost the entire area of both main surfaces, and the leaded capacitor 20 shown in FIGS. 4 (a) and 4 (b) can be obtained.

In the lead-equipped capacitor 20, the molten solder 16 is solidified, so that the electrodes 21, 2 are formed on both main surfaces of the electronic component unit 11.
2 is formed, and the electrodes 21 and 22 and the terminal portions 12 and 13 are joined by the solder.

After that, a resin exterior is applied to the periphery of the electronic component unit 11 by a known method except for the tip side portions of the terminal portions 12 and 13. Further, by cutting the metal wire 14 at the portion along the alternate long and short dash line AA, the terminal portions 12 and 13 can form a pair of lead terminals. The cutting of this metal wire 14 is
You may go earlier.

In the manufacturing method of the above-described embodiment, the molten solder 16 in a state of being vibrated by the ultrasonic vibrator 18 is immersed in the electronic component unit 11 with the lead terminals in contact, and pulled up to solidify the molten solder. By the step of, it is possible to perform both the formation of the electrodes 21 and 22 and the joining of the electrodes 21 and 22 and the lead terminal. Therefore, it is understood that the electrode forming and terminal joining steps can be greatly simplified as compared with the conventional example.

Not only that, when the electrodes are formed, excessive heat treatment such as baking is not performed, and the electrolytic substance does not remain during plating, so that the quality of the electronic component unit 11 is not deteriorated.

Before dipping in the molten solder 16, masking may be performed in advance except for the portion where the electrode is to be formed, whereby the molten solder can be prevented from adhering to unnecessary portions.

FIG. 5 is a schematic perspective view for explaining another embodiment of the present invention. Here, the terminals 33, 34 are brought into contact with both end surfaces of the internal electrode 31 of the electronic component unit 32 made of dielectric ceramics arranged so that the plurality of internal electrodes 31 are overlapped in the thickness direction, and the terminals 33, 34 are brought into contact with each other. The electronic component unit 32 is held by being sandwiched by the terminals 33 and 34.

Further, ultrasonic shielding plates 35, 36 as shown in the drawing are provided around the electronic component unit 32. This ultrasonic shield 35,36
This prevents solder from adhering to unnecessary parts of the electronic component unit 32. That is, by immersing the molten solder in a state of being vibrated by the ultrasonic vibrator in the state shown in the figure, the molten solder is adhered only to the end faces of the electronic component unit 32 where the terminals 33 and 34 are in contact. .

Therefore, by pulling up from the molten solder and solidifying the adhered solder, external electrodes are formed by the solder film on both end surfaces of the electronic component unit 32 in the vertical direction in FIG. 5, and the external electrodes and the terminals 33, 34 are formed. Is joined.

As in the embodiment of FIG. 5, the present invention can be applied to the manufacture of a laminated capacitor with leads. Not only in the case of the capacitor but also in other ceramic electronic components such as a coil and a resonator, the present invention can be generally applied when formation of electrodes and joining of the electrodes and terminals are required.

Further, the electrodes formed by the molten solder are not limited to the capacitance extracting electrodes and the external electrodes as shown in the drawing, but may be wiring electrodes.

〔The invention's effect〕

As described above, according to the present invention, the formation of the electrode and the joining with the electrode terminal are performed in a single step of immersing in molten solder vibrated by ultrasonic waves, pulling up, and solidifying, It is possible to greatly simplify the manufacturing process of the component, and thus it is possible to effectively reduce the cost of the electronic component. Further, since the number of times the electronic component unit is handled is reduced, the possibility of chipping or cracking during handling is reduced. Not only that, when forming electrodes, there is no risk of heat treatment such as baking as in the conventional example or residual of electrolytic material during plating, etc. There is no fear that the quality of

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a step of immersing in molten solder in an embodiment of the present invention, FIG. 2 is an external perspective view for explaining a conventional method for manufacturing an electronic component, and FIG. FIG. 4A and FIG. 4B are perspective views showing a state where the electronic component unit is held by the terminal portion in the first embodiment of the invention.
FIG. 5 is a perspective view and a sectional view for explaining an electronic component obtained by an embodiment of the present invention, and FIG. 5 is a perspective view showing a state in which an electronic component unit is held by a terminal in another embodiment of the present invention. is there. In the figure, 11 is an electronic component unit, 12 and 13 are terminal portions for forming terminals, 16 is molten solder, 18 is an ultrasonic vibrator, 21 and 22 are electrodes, 32 is an electronic component unit, and 33 and 34 are Indicates a terminal.

Claims (1)

[Claims] 1. A method of manufacturing an electronic component having a structure in which a terminal is joined to an electrode, the process comprising preparing an electronic component unit in which an electrode is not formed, and sandwiching the electronic component unit with a plurality of terminals. A step of holding in a state, a step of immersing the electronic component unit held by the terminal in a molten solder in a state of being vibrated by ultrasonic waves, pulling up the electronic component unit from the molten solder, and solidifying the attached solder. And forming an electrode and performing the bonding between the electrode and the terminal.
Electronic component manufacturing method.