JPH0762270B2 - Partial plating method - Google Patents
Partial plating methodInfo
- Publication number
- JPH0762270B2 JPH0762270B2 JP60129830A JP12983085A JPH0762270B2 JP H0762270 B2 JPH0762270 B2 JP H0762270B2 JP 60129830 A JP60129830 A JP 60129830A JP 12983085 A JP12983085 A JP 12983085A JP H0762270 B2 JPH0762270 B2 JP H0762270B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- circuit board
- plated
- printed circuit
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は部分めっき方法に係り、特にめっき不用部分を
被覆することなく部分的にめっきを行なう方法に関す
る。Description: FIELD OF THE INVENTION The present invention relates to a partial plating method, and more particularly to a method of performing partial plating without coating an unnecessary portion of plating.
従来、プリント配線板の接栓部に金めっきを行なうに
は、以下（ａ），（ｂ）の工程で行なっていた。Conventionally, gold plating is applied to the plug portion of a printed wiring board in the following steps (a) and (b).
（ａ）プリント配線板を対向する弾性ベルト間に圧接保
持して境界線によってめっき液と接触する接栓部と、め
っき液と接触しない配線部とを分離し、 （ｂ）境界線の下方からめっき液を接栓部に吹きつけ
る。（特開昭55−16499） しかし、上記の方法ではベルトとプリント配線板間にめ
っき液が毛細管現象で浸み込み、めっき不要部分にも金
めっき皮膜が形成されることがあった。(A) A printed wiring board is pressed and held between opposing elastic belts to separate a contact portion that comes into contact with the plating solution at a boundary line from a wiring portion that does not come into contact with the plating solution, and (b) from below the boundary line. Spray the plating solution on the plug. (Japanese Patent Laid-Open No. 55-16499) However, in the above method, the plating solution may penetrate between the belt and the printed wiring board due to a capillary phenomenon, and a gold plating film may be formed even on a portion not to be plated.
本発明の目的は上記した従来技術の欠点をなくし、めっ
き不用部分をマスクすることなく、めっきすべき部分に
のみめっき皮膜形成出来る部分めっき方法を提供するに
ある。An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to provide a partial plating method capable of forming a plating film only on a portion to be plated without masking an unnecessary portion of the plating.
本発明では、パターンが形成されたプリント回路板を垂
直に保持し、該プリント回路板のパターン上のめっきす
べき部分に向かいめっき液を吹き付けて、めっきを施す
部分めっき方法において、予め、先端部が下方に向かっ
て傾斜すると共に、先端に至るに従って先細形状となる
先端先細傾斜部を有するしゃへい板を形成し、該しゃへ
い板の傾斜先端部を、プリント回路板のパターン上のめ
っきすべき部分とめっき不要部分との境界部に対し、プ
リント回路板と直交する線上と傾斜先端部との間の噴出
角がある角度をもって配置させ、めっき液をしゃへい板
に沿いプリント回路板の境界部分から下方のめっきすべ
き部分に向かい吹き付け、かつ電解めっき処理すること
により、めっきすべき部分にのみめっきを施し、これに
よって上記目的を達成したものである。In the present invention, a printed circuit board on which a pattern is formed is held vertically, a plating solution is sprayed toward a portion to be plated on the pattern of the printed circuit board, and plating is performed in advance in a partial plating method. Forming a shield plate having a tip tapered slope portion that is tapered downward as it reaches the tip, and the sloped tip portion of the shield plate serves as a portion to be plated on the pattern of the printed circuit board. With respect to the boundary with the non-plating unnecessary part, arrange it at an angle with a jetting angle between a line orthogonal to the printed circuit board and the inclined tip, and place the plating solution along the shield plate downward from the boundary part of the printed circuit board. By spraying toward the part to be plated and electrolytically plating, only the part to be plated is plated. Are those that form.
上記のある角度とは、後述する第１図のθを、指し、実
用上は10°〜65°であり、好ましくは30°〜45°であ
る。また、めっき液が噴出する部分は、被めっき物の移
動に支障ない位置にあれば良く、通常は被めっき物から
1mm〜4mm離すが、1mm〜2mm離れていると更に良い。The above-mentioned certain angle refers to θ in FIG. 1 described later, and is 10 ° to 65 ° in practice, and preferably 30 ° to 45 °. Further, the portion where the plating solution is ejected may be at a position where it does not hinder the movement of the object to be plated.
1mm ~ 4mm apart, but 1mm ~ 2mm apart is even better.
めっき液の噴射速度は、めっき液がめっきをすべき部分
とめっき不用部分の境界線付近に均一に噴射される速度
が良く、通常はめっき槽1m当り21.0l/min〜212l/min、
好ましくは35.7l/min〜71.4l/minである。The spraying speed of the plating solution is preferably such that the plating solution is uniformly sprayed near the boundary between the part to be plated and the part not to be plated, usually 21.0 l / min to 212 l / min per 1 m of the plating tank,
It is preferably 35.7 l / min to 71.4 l / min.
以下、本発明を実施例によって詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to examples.
第１図に示すように、プリント回路板１をめっき槽の上
部しゃへい板２−1,2−２の間に垂直に保持する。これ
ら上部しゃへい板２−1,2−２の先端部C,Dにはその先端
が下方に向かって傾斜すると共に、先端に至るに従って
先細形状となる先端先細傾斜部を有している。そして、
先端先細傾斜部の先端部C,Dは、プリント回路板１のパ
ターン上のめっきすべき部分となる接栓部と、該接栓部
の上部にあってめっき不要部となる部分との境界部に向
かって配置される。この場合、先端部C,Dの壁面と、プ
リント回路板１と直交する線上との間の噴射角（θ）を
もち、しかもプリント回路板より1mm離れている。As shown in FIG. 1, the printed circuit board 1 is vertically held between the upper shield plates 2-1 and 2-2 of the plating tank. The tip portions C and D of the upper shield plates 2-1 and 2-2 have tip portions which are inclined downward and have tapered tip inclined portions which are tapered toward the tip portions. And
The tip portions C and D of the tapered tip end portion are the boundary portions between the plugging portion that is the portion to be plated on the pattern of the printed circuit board 1 and the portion that is above the plugging portion and that does not require plating. Placed towards. In this case, it has an ejection angle (θ) between the wall surfaces of the tips C and D and the line orthogonal to the printed circuit board 1, and is 1 mm away from the printed circuit board.
めっき液槽５−1,5−２中のめっき液は、上部しゃへい
板２−1,2−２と下部しゃへい板４−1,4−２の間から流
出し、壁面A,Bにそって流れ、先端部C,Dからめっき槽1m
当り50l/minの割合でプリント回路板１の長さ50cmの境
界線に噴射させためっき液は、めっき液排出部６からめ
っき槽５−1,5−２に循環された。そして、プリント回
路板１を陰極とし、陽極３とプリント回路板１との間に
直流電圧（DC4〜20V,DA＝５〜20A/dm2）を印加し、めっ
き液に日本高純度化学製オーロブライトHS−５（金濃
度:5〜10g/l、比重:10〜16ボーメ度、pH:4.0±0.2、添
加剤：オーロブライトHS−５）を用いてプリント回路板
１の接栓部銅パターン上に金めっきを行なった。なお、
第２図は、第１図のめっき液噴射部の拡大図である。The plating solution in the plating solution tanks 5-1 and 5-2 flows out from between the upper shield plates 2-1 and 2-2 and the lower shield plates 4-1 and 4-2, and along the wall surfaces A and B. Flow, plating tank 1m from tip C, D
The plating solution sprayed onto the boundary line of the printed circuit board 1 having a length of 50 cm at a rate of 50 l / min was circulated from the plating solution discharge section 6 to the plating tanks 5-1 and 5-2. Then, using the printed circuit board 1 as a cathode, a direct current voltage (DC4 to 20V, DA = 5 to 20A / dm 2 ) is applied between the anode 3 and the printed circuit board 1, and the plating solution is manufactured by Nippon Kojundo Chemical Auro. Bright HS-5 (gold concentration: 5-10 g / l, specific gravity: 10-16 Baume degree, pH: 4.0 ± 0.2, additive: aurobrite HS-5) Copper pattern of plug part of printed circuit board 1 The top was gold plated. In addition,
FIG. 2 is an enlarged view of the plating solution jetting section of FIG.
接栓部への部分金めっき結果を、第３図に示した。第３
図の（ａ）は、噴射角（θ）が30°の場合である。部分
的、すなわち接点との接触部にのみ金めっきがされてい
た。このような状態は、噴射角30°〜45°の間でみられ
た。めっき液の噴射速度、めっき液の噴出する上部しゃ
へい板の先端（第１図中のC,D）とプリント回路板との
距離が前述した範囲で同様に起こることも確認された。The result of partial gold plating on the plugging portion is shown in FIG. Third
(A) of the figure shows the case where the injection angle (θ) is 30 °. Gold plating was performed only partially, that is, only at the contact portion with the contact. Such a condition was observed between the injection angles of 30 ° and 45 °. It was also confirmed that the spraying speed of the plating solution and the distance between the tip of the upper shielding plate (C and D in FIG. 1) from which the plating solution is sprayed and the printed circuit board similarly occur within the range described above.
第３図の（ｂ），（ｃ）は噴出角（θ）が60°,80°の
場合である。第３図（ｂ）のように接点との接触部近傍
の金めっき皮膜厚さが厚くなり、その他の部分は金めっ
き被膜厚さがうすくなるのは、噴射角10°〜30°未満、
45°より大〜65°以下の場合であった。このような状態
は、めっき液の噴出速度、めっき液の噴出する部分（第
１図中のC,D）とプリント回路板との距離が前述した範
囲で同様に起こることも確認された。第４図はその一例
であり、めっき液の噴出する上部しゃへい板の先端とプ
リント回路板との距離が4mmである以外は第３図（ｂ）
と同じ条件で部分金めっきを行なった場合であり、第３
図（ｂ）と同様の結果を得ている。FIGS. 3B and 3C show the case where the ejection angle (θ) is 60 ° and 80 °. As shown in FIG. 3 (b), the thickness of the gold plating film in the vicinity of the contact portion with the contact becomes thicker, and the thickness of the gold plating film becomes thinner in the other portions because the spray angle is 10 ° to less than 30 °.
It was more than 45 ° to less than 65 °. It was also confirmed that such a state occurs similarly in the range where the jetting speed of the plating solution, the distance between the jetting parts of the plating solution (C and D in FIG. 1) and the printed circuit board are within the above-mentioned range. FIG. 4 is an example of that, and FIG. 3 (b) except that the distance between the tip of the upper shield plate from which the plating solution is ejected and the printed circuit board is 4 mm.
When the partial gold plating is performed under the same conditions as
The result similar to that of FIG.
以上述べたように本発明によって部分めっきをすれば、 （ａ）必要とする部分にのみ厚くつくので経済的であ
る。As described above, partial plating according to the present invention is economical because (a) only the necessary portion is thickened.
（ｂ）めっき不要部分を弾性体で圧接する必要もないの
で、めっき設備が簡単になる。(B) Since it is not necessary to press the non-plating portion with the elastic body, the plating facility is simplified.
（ｃ）テープでめっき不用部分をかくす必要がないの
で、めっき工程が簡略になる。また、テープをはがした
後に残る粘着剤を取り除く工程も不要となる。(C) Since it is not necessary to cover the unnecessary portion of the plating with the tape, the plating process is simplified. Further, the step of removing the adhesive remaining after peeling the tape is also unnecessary.
また、本技術は、コネクタ、その他部分めっきをする場
合に適用できる。Further, the present technology can be applied to the case of performing connector or other partial plating.
第１図は本発明で用いるめっき槽の部分断面図、第２図
は第１図の部分拡大図、第３図、第４図は本発明の方法
で部分めっきした場合のめっき皮膜の出来工合を示す図
である。 １……プリント回路板 ２−1,2−２……上部しゃへい板 ３……陽極 ４−1,4−２……下部しゃへい板 ５−1,5−２……めっき液槽 ６……めっき液排出部 C,D……先端先細傾斜部としての先端部 θ……噴射角FIG. 1 is a partial cross-sectional view of a plating tank used in the present invention, FIG. 2 is a partially enlarged view of FIG. 1, and FIGS. 3 and 4 are finishes of plating films when partial plating is performed by the method of the present invention. FIG. 1 ... Printed circuit board 2-1, 2-2 ... Upper shield plate 3 ... Anode 4-1, 4-2 ... Lower shield plate 5-1, 5-2 ... Plating bath 6 ... Plating Liquid discharge part C, D ... Tip as a tapered tip angle θ ... Injection angle
───────────────────────────────────────────────────── フロントページの続き (72)発明者 縁本 和博 東京都豊島区南池袋２丁目26番７号 日本 高純度化学株式会社内 (72)発明者 川上 明仁 神奈川県横浜市戸塚区戸塚町216番地 株 式会社日立製作所戸塚工場内 (72)発明者 藤田 繁 神奈川県横浜市戸塚区戸塚町216番地 株 式会社日立製作所戸塚工場内 (56)参考文献 特開 昭55−28339（ＪＰ，Ａ) 特開 昭55−28340（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kazuhiro Enmoto 2-26-7 Minami-Ikebukuro, Toshima-ku, Tokyo Japan High-Purity Chemical Co., Ltd. (72) Akihito Kawakami 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Address Company, Hitachi Ltd., Totsuka Plant (72) Inventor Shigeru Fujita Address: 216 Totsuka, Totsuka-ku, Totsuka-ku, Yokohama, Kanagawa Prefecture, Ltd. Hitachi Ltd., Totsuka Plant (56) Reference JP-A-55-28339 (JP, A) JP-A-55-28340 (JP, A)
Claims (1)
直に保持し、該プリント回路板のパターン上のめっきす
べき部分に向かいめっき液を吹き付けて、めっきを施す
部分めっき方法において、予め、先端が下方に向かって
傾斜した傾斜先端部を有するしゃへい板を形成し、該し
ゃへい板の傾斜先端部を、プリント回路板のパターン上
のめっきすべき部分とめっき不要部分との境界部に対
し、プリント回路板と直交する線上と傾斜先端部との間
の噴出角が10〜65°の角度にして配置させ、めっき液を
しゃへい板に沿いプリント回路板の境界部分から下方の
めっきすべき部分に向かい吹き付け、かつ電解めっき処
理することにより、めっきすべき部分にめっきを施すこ
とを特徴とする部分めっき方法。1. A partial plating method in which a printed circuit board on which a pattern is formed is held vertically, and a plating solution is sprayed toward a portion to be plated on the pattern of the printed circuit board to perform plating. Form a shield plate having an inclined tip portion which is inclined downward, and the inclined tip portion of the shield plate is printed on a boundary portion between a portion to be plated and a non-plating portion on a pattern of a printed circuit board. Arrange the jet angle between the line perpendicular to the circuit board and the inclined tip with an angle of 10 to 65 °, and place the plating solution along the shield plate from the boundary part of the printed circuit board to the lower part to be plated. A partial plating method characterized in that a portion to be plated is plated by spraying and electrolytic plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60129830A JPH0762270B2 (en) | 1985-06-17 | 1985-06-17 | Partial plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60129830A JPH0762270B2 (en) | 1985-06-17 | 1985-06-17 | Partial plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61288092A JPS61288092A (en) | 1986-12-18 |
| JPH0762270B2 true JPH0762270B2 (en) | 1995-07-05 |
Family
ID=15019280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60129830A Expired - Fee Related JPH0762270B2 (en) | 1985-06-17 | 1985-06-17 | Partial plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0762270B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059997B2 (en) * | 1978-08-18 | 1985-12-27 | 日本エレクトロプレイテイング・エンジニヤ−ス株式会社 | plating device |
| JPS6059998B2 (en) * | 1978-08-18 | 1985-12-27 | 日本エレクトロプレイテイング・エンジニヤ−ス株式会社 | plating device |
-
1985
- 1985-06-17 JP JP60129830A patent/JPH0762270B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61288092A (en) | 1986-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |