JPH0770808B2 - How to cut end through-hole board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention prints a circuit on a plurality of small boards in which through holes are formed on an end face of an outer shape portion on one large board,
Cut the outline of the small board along the through hole on the end face,
The present invention relates to a cutting method for forming a plurality of end face through hole substrates.

[Prior art]

For example, when manufacturing a large number of small boards of 20 × 30 mm, for example, a circuit of a small board of 20 × 30 mm is 5 m on a large board of 400 × 400 mm.
It is general that, for example, 150 pieces are printed at m intervals and cut along the outer shape of a small board of 20 × 30 mm to manufacture 150 small boards.

This will be described in detail in the case of manufacturing a small substrate having end face through holes. First, on a large substrate formed of an insulating material, end face through holes are formed at desired positions along the outer shape of the small substrate, and at other positions. A through hole is drilled at the position.

When this end face through hole is very small, a drill with a diameter corresponding to this diameter is used to drill it.
It may be a long hole formed by sides.

Next, electroless plating is performed on this large substrate to metallize the vertical surfaces in the end surface through holes and other through holes, and then the metal film is thickened by the electrodeposition method as much as necessary for wiring.

Then, the metal film is removed by a chemical method such as etching, except for a portion to be a wiring pattern,
This large substrate is cut to the size of a small substrate by a press, a router, or a combination of these to form a small substrate having end face through holes.

[Problems to be Solved by the Invention]

In the cutting method for manufacturing such an end face through hole substrate, the end face through hole portion is subjected to a strong stress during pressing or router processing.

Therefore, the metal film formed in the vertical surface of the end face through hole is separated from the insulating material that is the substrate material and falls off, or the separated metal film rises from the insulating material and becomes a burr. Therefore, defective products or post-processing are required.

As a means to solve the problems associated with peeling of such a metal film, a small board is first punched out to a size slightly larger than the outer shape of the small board, and then this is pressed to the outer dimensions of the small board. It may be punched twice.

Further, as another means, there is a method of using a shaving die in which punching teeth of a press called shaving cut are provided in several stages.

By this method, high-precision press working is performed with only the sheared surface without leaving a fractured surface on the cut surface.

The former of such means requires two die as a punching die, and the latter has a drawback that the die cost is high because of the high die cost.

Furthermore, when the manufacturing quantity is small, it is common to cut the outer mold of the small substrate with a cutting tool without using a press punching die, so the processing cost for cutting is high. There is a drawback that becomes.

The present invention solves the above-mentioned problems in the cutting process when a small substrate having a plurality of end face through holes is cut by cutting a large substrate, and two punching processes using two dies,
An object of the present invention is to provide a cutting method capable of cutting a small substrate without peeling a metal film in a vertical plane of an end face through hole without incurring an expensive die cost such as a shaving process.

[Means for Solving the Problems]

The present invention relates to a method of cutting an end face through hole substrate for achieving the above-mentioned object, of a substrate having an end face through hole having a metal film formed on an inner surface along an outline line for cutting a small substrate from a large substrate, In the method of obtaining a plurality of small substrates by cutting along the contour line, two points of the end face through hole, which the contour line crosses, are drilled toward each other from inside the end face through hole toward a metal film on the small substrate side. The small substrate is obtained by punching in a rotating direction and then cutting along the outline with a cutting means such as a press or a router.

[Work]

In the method for cutting an end face through hole substrate of the present invention, at the left end of the long hole which becomes the end face through hole with respect to the small substrate, a hole rotating in a counterclockwise direction is used to expand the hole along the parallel surface of the long hole. Since the metal film at the left end is not subjected to a force in the direction of peeling from the substrate material and is cut so as to be pressed in reverse, the metal film at the left end is cut off without peeling from the substrate material. .

Similarly, even at the right end, the metal film is cut off without peeling.

In this way, since the portions where the metal films on both the left and right ends of the end face through hole are cut are punched by a press or the like, the stress is not applied to the metal film on the vertical plane parallel to the long hole of the end face through hole, and the cutting is performed. It is possible.

Example of Invention

 Next, an example of implementation of the present invention will be described with reference to the drawings.

FIG. 1 is an end face through hole 4 provided along the outline 3 of the small substrate 2 in the large substrate 1. The circuit pattern of the small substrate 2 adjacent to the end face through hole 4 is formed by the same process as the conventional one. The metal film 6 is also formed on the hole surface (vertical surface) of the end face through hole 4 while being connected to the metal film 5.

On the left side of the end face through hole 4 with respect to the small board 2,
As shown in FIG. 2, the hole is expanded by a drill A rotating counterclockwise.

Then, the metal film 6 at this location is cut by the blade edge of the drill A while being pressed against the substrate material by the blade edge, so that the metal film 6 on the left end arc surface does not peel off from the substrate material. To be resected.

Similarly, at the right end of the end face through hole 4, the metal film 6 is cut off by the drill A that rotates clockwise.

In this way, at both ends of the end face through hole 4, the metal film 6 is cut off by the drills A that rotate in opposite directions, but the cutting edge of the drill A is adapted only to rotation in one direction, or any one of them is used. When it is possible to rotate only in the direction, the purpose is achieved by processing from the back side of the large substrate 1 at either one end.

In this way, the metal films 6 on both ends of the end face through hole 4 are formed.
After the removal, the cutting is performed along the outline 3 of the small substrate 2 by pressing or the like, and the stress due to the cutting is not applied to the metal films 5 and 6 of the end face through holes 4.

Therefore, by such a cutting method, it is possible to prevent the end surface through-hole 4 from coming off due to the peeling of the metal film 6 and the occurrence of burr.

〔The invention's effect〕

As described above, the present invention, as described above, punches at two positions where the cutting outline of the end face through hole intersects with each other in a direction of rotating toward each other from the inside of the end face through hole toward the metal film on the small substrate side, and thereafter Since a small board is obtained by cutting along a contour line with a cutting device such as a press or a router, the metal film formed in the end surface through hole on the small board side does not cause peeling, falling, or burrs. It can be cut, and therefore, the die cost can be reduced and the cost can be reduced as compared with the conventional method, which is particularly effective for small-quantity production.

[Brief description of drawings]

FIG. 1 is a plan view of an essential part of a large substrate having end face through holes, and FIG. 2 is a plan view of an embodiment of drilling according to the present invention. A ... drill, 1 ... large substrate, 2 ... small substrate, 3 ... outline, 4 ... end face through hole, 5,6 ... metal film.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hidekazu Sunaga Hidekazu Sunaga 6-7-9 Tsunashima-higashi, Kohoku-ku, Yokohama-shi, Kanagawa Eight Industry Co., Ltd. (56) Reference JP-A-61-159789 (JP, A) Kaihei 2-213196 (JP, A)

Claims (1)

[Claims] 1. A method of obtaining a plurality of small substrates by cutting along a contour line of a substrate having an end face through hole having a metal film formed on an inner surface along a contour line for cutting a small substrate from a large substrate. In, in two places where the outline of the end face through hole crosses,
A small board is obtained by making holes in a direction in which they rotate from inside the end face through holes toward the metal film on the side of the small board with a drill, and then cutting along the outline with a cutting means such as a press or a router. A method for cutting an end face through-hole substrate, which is characterized by the above.