JPH079963B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an EPROM-embedded microcomputer-mounted hybrid integrated circuit device in which a chip-type EPROM-embedded microcomputer is mounted on an integrated circuit substrate.

(B) Conventional technology EPRO with a UV irradiation window that can erase and rewrite memory information that has already been written by UV irradiation.
Microcomputer devices with a built-in M are preferably used in various electronic devices. Most of the EPROM built-in microcomputer is currently mounted on a printed wiring board together with a control or driving integrated circuit. For various electronic devices, which are required to be small and light,
A semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called board, and after the required wiring is made, the IC chip including this wiring part is covered with synthetic resin, which is extremely small and lightweight. Has been achieved.

A mounting structure of such a conventional microcomputer with built-in EPROM will be described with reference to FIG. 13. FIG. 13 is a perspective view showing a partial cross section of the conventional microcomputer with built-in EPROM, in which a conductive wiring pattern ( Microcomputer (44) with built-in EPROM embedded in a sardip type package in a through hole (43) of an insulating substrate (42) made of glass epoxy resin etc.
Is installed. The EPROM built-in microcomputer (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) by an external lead (48) or a low melting point glass material. There is.
Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed in glass is adhered onto the low melting point glass material or the ceramic base material (47). An EPROM built-in microcomputer chip (51) is mounted on the element mounting portion (50), and the electrodes of the chip (51) and the external lead-outs (48) are connected by a thin metal wire (52). This Cap (46)
EP placed in header (45) by low melting glass
The ROM built-in microcomputer chip (51) is sealed. In this way, a microcomputer chip (4) with a built-in EPROM in which the microcomputer chip (51) with a built-in EPROM is sealed
The external lead (48) is inserted into the through hole (43) of the insulating substrate (42) and is fixed by soldering. This through hole (43) has a conductive wiring pattern (4
By 1), required wiring is routed, and the male connector terminal portion (55) provided at the end of the insulating substrate is connected to a female connector (not shown).

Now, in the conventional mounting structure of the microcomputer element with built-in EPROM, the package outer shape is much larger than that of the microcomputer chip (51) with built-in EPROM, and the plane occupation ratio is also three-dimensional, that is, the height of the chip is small. It is several times, which is extremely disadvantageous for thinning. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM-embedded microcomputer device is once assembled in a package prior to mounting on an insulating substrate.

Although the cerdip package type microcomputer device with a built-in EPROM has been described here, the above-mentioned problems also occur in the resin-sealed package.

The mounting structure shown in FIG. 14 has already been used to solve such a problem.

The EPROM built-in microcomputer mounting structure shown in FIG. 14 will be described below.

On the insulating substrate (60) such as a glass / epoxy resin plate with the conductive wiring pattern (60b) formed on the main surface (60a), the chip mounting area () for mounting the EPROM built-in microcomputer chip (61) 60c), and the wiring pattern (60b) is routed from the vicinity of this area on the main surface (60a) and connected to a male connector terminal portion (not shown). A microcomputer chip (61) with a built-in EPROM is mounted in the area (60c), and the surface electrode of the chip (61) and the wiring pattern (60b) are formed by a thin metal wire (6).
Connected by 2). Of course, one of the thin metal wires (62) is connected to the substrate of the chip (61),
The chip (61) is wired with the wiring pattern (60b) mounted thereon.

It is already known as a well-known technique to mount the EPROM-embedded microcomputer chip directly on the substrate as described above.

(C) Problems to be Solved by the Invention Needless to say, in the structure for mounting the microcomputer with built-in EPROM shown in FIG. 14, the chip of the microcomputer with built-in EPROM is die-bonded on the printed circuit board, resulting in miniaturization. Absent. However, the miniaturization referred to here is only miniaturization of the EPROM built-in microcomputer itself. That is, although it is not clear from FIG. 14, since the peripheral circuit elements fixed to the periphery of the EPROM built-in microcomputer are composed of electronic components such as discretes, a printout mounted with the EPROM built-in microcomputer is provided. When looking at the entire system as an integrated circuit for a board, there is a problem that the size is not reduced at all and the printed circuit board is increased in size as in the past, that is, the size of the entire system is increased.

Further, in the mounting structure shown in FIG. 13 as well as in FIG.
Since circuit elements such as SI and IC are composed of electronic components such as discretes, the printed circuit board becomes large, that is, the entire system becomes large, and the light, thin, short, and small EP required by users.
There is a big problem that it is not possible to provide an integrated circuit equipped with a microcomputer with built-in ROM.

Furthermore, in the EPROM-embedded microcomputer mounting structure shown in FIGS. 13 and 14, as described above, the entire system becomes larger and the conductive patterns that connect the EPROM-embedded microcomputer and its peripheral circuit elements to each other are exposed. Therefore, there is a problem that reliability is lowered.

Further, in the EPROM built-in microcomputer mounting structure shown in FIG. 13 and FIG. 14, the EPROM built-in microcomputer and the peripheral circuit elements such as IC and LSI are exposed, so that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle. There is a problem of reduced workability.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and includes a chip-type EPROM built-in microcomputer on a substrate,
The most related circuit elements are mounted, and all other circuit elements are mounted on the board, and the circuit board is mounted on the board so that only the EPROM built-in microcomputer chip is exposed through the holes provided at the predetermined positions of the case material. , And a structure in which all the circuit elements other than the EPROM built-in microcomputer chip are sealed in a sealing space formed by the substrate and the case material.

Therefore, it is possible to realize a hybrid integrated circuit having a microcomputer chip with a built-in EPROM in a very small size, and to provide a hybrid integrated circuit mounting with a microcomputer chip having a built-in EPROM for high density mounting.

(E) Action As described above, according to the present invention, a hole is provided at a predetermined position of the case material fixed to the substrate, and the EPROM-embedded microcomputer chip is mounted adjacent to the conductive path on the substrate exposed by the hole. Since it is connected to the conductive path, the placement position of the EPROM built-in microcomputer chip can be set arbitrarily, so that it is most efficient and most relevant to the EPROM built-in microcomputer chip in consideration of the electrical connection with the most related circuit element. A circuit element can be connected to the circuit element, and a signal line, that is, a wiring line of a conductive path can be eliminated.

Further, in the present invention, all circuit elements other than the microcomputer chip with built-in EPROM are mounted on the substrate by the chip and are housed in the sealed space formed by the substrate and the case material, so that the size can be reduced and the high-density mounting can be achieved. Thus, it is possible to provide a hybrid integrated circuit device having excellent handleability.

(F) Embodiment A hybrid integrated circuit device according to the present invention will be described in detail below with reference to an embodiment shown in FIGS. 1 to 12.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in the field of a wide range of inverter motors such as an inverter air conditioner.

As shown in FIGS. 1 and 2, the hybrid integrated circuit device (1) includes an integrated circuit board (2), an integrated circuit board (2), a hole (4) provided at a predetermined position, and an integrated circuit board. (2) Conductive path (5) having a desired shape formed on the conductive path (5)
It is composed of a microcomputer chip (6) with built-in EPROM (hereinafter referred to as an EP microcomputer chip) connected thereto, a peripheral circuit element (8), and a case member (7) integrated with the substrate (2).

As the integrated circuit board (2), a hard substrate made of ceramics, glass epoxy or metal is used, and in this embodiment, a metal substrate excellent in heat dissipation and mechanical strength is used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9) is formed on the surface of the substrate (2) by known anodic oxidation.
(Alumite layer) is formed, 10-70μ on one main surface side
Insulating resin layer such as thick epoxy or polyimide (10)
Is attached. Furthermore, a copper foil (11) having a thickness of 10 to 70 μm is adhered to the insulating resin layer (10) at the same time as the insulating resin layer (10) by means such as a roller or a hot press. By the way, the substrate (2) is in a state of being connected to the insulating resin layer (10) having flexibility at a predetermined distance. In this embodiment, the films are used to connect the respective substrates (2), but it is also possible to make the respective substrates (2) independent without using the film and later connect them with the metal leads.

On the surface of the copper foil (11) provided on one main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a noble metal (gold, silver, platinum) plating layer is formed. The surface of the copper foil (11) is plated. After that, the resist is removed and the copper foil (11) is etched using the noble metal plating layer as a mask to form a desired conductive path (5). Here, the fineness of the conductive path (5) by screen printing is 0.5 mm.
Therefore, when a very fine wiring pattern is required, it is possible to form a very fine conductive path (5) of up to about 2 μ by the well-known photo-etching technique.

Although the conductive path (5) formed on the substrate (2) is not shown, a thick conductive path for a large signal power system and a thin conductive path for a small signal are formed.

An EP microcomputer chip (6) and a plurality of circuit elements (8) supplied with data from the EP microcomputer chip (6) are mounted on the conductive path (5) on the substrate (2). Further, a conductive path (5) extends on the same side or opposite side edges of the substrate (2) to form a plurality of pads for fixing the external lead terminals (12) and (13). External lead terminals (12) and (13) are fixed to the external solder terminal by soldering.

As is well known, the EP microcomputer chip (6) is mainly composed of a program processor (CPU), a program memory such as RAM, EPROM,
It is an element that combines a peripheral device with an input / output interface. Since the EP microcomputer chip (6) is commercially available, the description of the EP microcomputer chip (6) is omitted here.

The EP microcomputer chip (6) is Ag-based on the substrate (2) exposed by the hole (4) of the case material (7),
It is fixedly mounted by brazing material such as solder, and EP is installed around it.
A plurality of conductive paths (5) connected to the microcomputer chip (6)
One end of is extended. The conductive path (5) and the EP microcomputer chip (6) are ultrasonically bonded by an Al wire line.

The circuit element (8) around the EP microcomputer chip (6), which is selected and supplied with predetermined program data, is a chip component and is soldered on a desired conductive path (5) or by a brazing material such as Ag based. Attached and nearby conductive paths (5)
Connected by ultrasonic bonding. Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

More specifically, the circuit element (8) most related to the EP microcomputer chip (6) is connected near the substrate (2) exposed by the hole (4), and all other circuit elements (8) are connected to the substrate ( It is selectively attached on the conductive path (5) at a predetermined position in 2).

On the other hand, the case member (7) is made of a thermoplastic resin as an insulating member, and is formed in a box shape so that a space is formed when it is fixed to the substrate (2). The peripheral edge of the box-shaped case material (7) is arranged substantially at the peripheral edge of the substrate (2) and firmly fixed to the substrate (2) by an adhesive sealing material (J sheet: product name). Be integrated. As a result, a predetermined sealed space (21 ') is provided between the substrate (2) and the case member (7).
Will be formed. Further, a hole (4) is provided at a predetermined position of the case material (7) of this embodiment. The hole (4) is formed in such a size as to expose the EP microcomputer chip (6) and the bonding wire line connecting the EP microcomputer chip (6) and the conductive path (5). That is,
It will be formed larger than the EP microcomputer chip (6).

On the substrate (2) exposed in the hole (4) of the case material (7), one end of a plurality of conductive paths (5) connected to the EP microcomputer chip (6) is formed as described above, and the conductive path is formed. (5)
The EP microcomputer chip (6) is fixed to the tip of the. The other end of the conductive path (5) to which the EP microcomputer chip (6) is fixed is efficiently routed to the vicinity of the related circuit element (8) and connected by a bonding wire.

Here, the positional relationship between the EP microcomputer chip (6) and the circuit element (8) most closely related to the chip (6) will be described. As shown in FIG. 1, since the EP microcomputer chip (6) and the circuit element (8) most closely related to each other are connected through a large number of conductive paths (5), the routing of the conductive paths (5) is prevented. For the purpose of shortening, the circuit elements (8) most closely related to the EP microcomputer chip (6) are arranged so as to be adjacent to each other or as close to each other as possible. Therefore
The routing of the conductive path (5) between the EP microcomputer chip (6) and the circuit element (8) most related to it can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. The EP microcomputer chip (6) and the most related circuit element (8) arranged near or adjacent to the EP microcomputer chip (6) are conductive paths (5) extending near the circuit element (8) as shown in FIG.
It is ultrasonically bonded to the tip end of Al by an Al wire wire and electrically connected to the EP microcomputer chip (6).

As is apparent from FIGS. 1 and 2, the EP microcomputer chip (6) is mounted on the substrate (2) exposed in the hole (4) of the case material (7), and the wall body forming the hole (4) is formed. The structure is surrounded by (4a). More specifically, what is surrounded by the wall body (4a) is the EP microcomputer chip (6), the EP microcomputer chip (6), and the wire line for bonding connection with the conductive path (5) in the vicinity.

Further, the space (19a) surrounded by the wall (4a) is filled with one or more layers of resin, and the EP microcomputer chip (6) and the wire wire are completely covered with the resin layer. The first layer resin directly coated on the EP microcomputer chip (6) needs to transmit ultraviolet rays when erasing the data of the EP microcomputer chip (6).
a) is used. The ultraviolet-transparent resin (21a) is not limited as long as it is a non-aromatic resin, and for example, methyl silicon rubber or silicon gel is used.

In this embodiment, the second resin layer (21b) is filled on the first resin layer (21a). Unlike the first layer, the second resin layer is made of a UV impermeable resin (21b) that blocks UV rays in order to prevent erroneous erasing of the EP microcomputer chip (6). The resin (21b) is not limited as long as it is a resin containing an aromatic ring (benzene ring), and for example, an epoxy-based or polyimide-based resin is used, and the resin (21b) is filled until it substantially coincides with the upper surface of the substrate (2).

Therefore, only the EP microcomputer chip (6) is surrounded by the wall body (4a) and covered with two layers of resin, and the other circuit elements (8) are formed by the substrate (2) and the case material (7). It will be arranged in the stop space (21 ').

As described above, the circuit elements (8) connected to the EP microcomputer chip (6) are arranged in the sealed space (21 ') formed by the substrate (2) and the case material (7). It is set. That is, all the elements such as chip-shaped electronic components and resistance elements such as printing resistors and plating resistors are sealed space (2
It is installed in 1 ').

By the way, in this embodiment, the space (19) surrounded by the wall (4a) is
a) UV transparent resin (21a) and non-transparent resin (21a)
Impermeable resin (21b) consisting of a two-layer resin structure of b)
Instead of, as shown in Fig. 5, light-shielding sealing material (22 ')
Even if it is adhered onto the hole (4) of the case material (7), it is possible to completely block the ultraviolet rays like the impermeable resin (21b).

In this embodiment, when erasing the data of the EP microcomputer chip (6), the UV impermeable resin (21b) or the sealing material (2
When peeling off 2 ') and irradiating with ultraviolet light to rewrite, the ultraviolet transparent resin (21) on the EP microcomputer chip (6)
A) is also peeled off, and a terminal such as a probe is brought into contact with the conductive path (5) in the vicinity where the bonding is performed, and data is written by the writing device. At this time, when the ultraviolet-transparent resin (21a) is peeled off, since the resin (21a) does not have a strong adhesive force, the wire line is not cut.

A specific example of a hybrid integrated circuit device for an inverter for driving a motor according to the present invention will be shown below.

An inverter for driving a motor generally makes an arbitrary AC power supply from a DC power supply and arbitrarily controls the rotation speed of a three-phase motor, for example. That is, a DC power supply obtained by rectifying a commercial AC power supply using a rectifier circuit is used as a power supply. The input DC power supply is called an inverter main circuit, and chopping is performed under a predetermined control signal using a switching element having a three-phase bridge structure to output a pseudo AC to a load. By changing the control signal, the output AC voltage and frequency can be made variable, and the rotation speed and torque of the motor can be adjusted variably.

The motor driving inverter will be briefly described based on the block diagram shown in FIG.

FIG. 6 is a block diagram when a motor driving inverter is mounted on the integrated circuit board (2).

The motor drive inverter chops the rectifier circuit (21) that inputs AC power and converts it to DC, and the DC power output from the rectifier circuit (21) at specified intervals to supply pseudo AC to the load (motor). Inverter main circuit (22)
And an EPROM built-in microcomputer (6) for supplying an output signal for chopping the inverter main circuit (22) at predetermined intervals and an output signal for operating the other device.
(Hereinafter referred to as an EP microcomputer chip), a buffer (23) for amplifying an output signal output from the EP microcomputer chip (6) as desired, and a base amplifier (25) having a different potential for the signal amplified by the buffer (23). ) To the first interface (24) and the first interface (2
4) A base amplifier (25) that amplifies and supplies the signal transmitted from the inverter to the inverter main circuit (22), and a rectifier circuit (21)
The current supplied from the inverter to the inverter main circuit (22) is detected, and the heat generation of the inverter main circuit (22) is detected.
Circuit (26) that protects the inverter main circuit (22) and peripheral circuits by feeding back a specified signal to the EP microcomputer chip (6) through the interface (24)
A second interface (27) for inputting and outputting signals having different potentials to the microcomputer (6), and an output buffer (28) for amplifying the output signal output from the EP microcomputer chip (6) to supply it to an external device. ) And is composed of. The respective configurations described above will be briefly described below.

First, the rectifier circuit is composed of a well-known diode bridge circuit, and is for converting commercial alternating current into direct current. In this embodiment, the rectifier circuit is composed of chip parts on the substrate, but when the rectifier circuit is externally attached, it may occur depending on the purpose of use, but the present invention does not cause any problems.

Next, in the inverter main circuit (22), as shown in FIG. 7, two switching elements (22a) (transistor, MOSFET, IGBT, etc.) connected in series are connected in parallel (bridge connection). In this embodiment, a transistor element will be used for description. The explanation is continued below.
A flywheel diode is connected between the collector and emitter of each transistor of the inverter main circuit (22), and output terminals (U, V, W) is provided. Further, (22b) is an input terminal for input.

Next, as the EP microcomputer chip (6), for example, an IC chip of LM8051P (manufactured by Sanyo) is used.

FIG. 8 is a block diagram showing the basic configuration of the microcomputer,
A CPU that fetches and executes instructions and a predetermined program
It is composed of a memory section (4b) in which data is stored and an I / O boat section (4c) for inputting / outputting data to / from an external device. Since the EP microcomputer chip (6) itself has nothing new, it will not be described in detail here. The EP microcomputer chip (6) controls the inverter main circuit (22) and desired external devices.

Next, as the buffer (23), an IC chip such as LC4049B (manufactured by Sanyo) is used. The buffer (23) amplifies an output signal from the EP microcomputer chip (6) in a predetermined manner.

Next, the first interface (24) is composed of multiple photocouplers, for example, an IC such as PC817 (made by Sharp).
It is composed of chips. As described above, the first interface (24) optically transmits the output signal output from the buffer (23) to the base amplifier (25).

Then, as shown in FIG. 8, the base amplifier (25) receives a signal input terminal (25a) to which the signal output from the first interface (24) is input and a signal input from the input terminal (25a). First and third transistors (Tr ₁ ) (Tr ₃ ) that are supplied and turned on and off, and a third transistor (Tr ₃ )
The first transistor (Tr ₁ ) to which the collector and the base of the are connected, and the second transistor (Tr ₂ ) connected between the minus line, the resistor and the diode connected between the power supply lines, and the diode in parallel. It consists of a capacitor connected to. Also, the first and second
An output terminal (25b) is provided for connecting the transistors and the base and emitter of each transistor of the inverter main circuit. For example, when an ON signal is input to the signal input terminal (25a) of the base amplifier (25), the first transistor (Tr ₁ ) and the third transistor (Tr ₃ ) are turned on, and the second transistor (Tr ₂₎ ) Turns off. Then, a desired current is supplied from the power supply V _D to the base of the inverter main circuit (22) via the first transistor (Tr ₁ ) and the control resistor R ₁ .
Further, when the signal is OFF, the first transistor (Tr ₁ ) and the third transistor (Tr ₃ ) are OFF, and the second transistor (Tr ₂ ) is ON. Then, the power supply made up of the diode and capacitor accelerates the turning off of the inverter main circuit (22).

Next, as shown in FIG. 10, the protection circuit (26) is provided in the vicinity of the inverter main circuit (22) and is composed of a diode or the like for detecting a temperature rise due to heat generation of the inverter main circuit (22) ( 26a), a current detection section (26b) composed of a resistor for detecting a current supplied from the rectification circuit (21) to the inverter main circuit (22), and a reference voltage section (26c) forming an internal reference voltage. , The respective detectors (26a) (26
a voltage comparison unit (26d) that compares the output signal from b) with the signal output from the reference voltage unit (26c);
It is composed of a control signal output section (26e) for feeding back the signal from d) to the EP microcomputer chip (6).

Next, the second interface (27) is composed of a plurality of photocouplers like the first interface (24), and is a signal input / output from the EP microcomputer chip (6) and the input / output terminals S ₀ and S _1. Is transmitted to the EP microcomputer chip (6).

Finally the output buffer (28) is LC as well as the buffer (23).
An IC chip such as 4049B (manufactured by Sanyo) is used, which amplifies the signal from the EP microcomputer chip (6) and outputs the signal to the output terminals PO _{0 to} PO ₉ .

The operation of the motor drive inverter will be briefly described below.

When commercial AC is input from the terminal (21X), it is converted to DC by the rectifier circuit (21) as described above. The converted direct current is supplied to the inverter main circuit (22). The output terminals (U, V, W) of the inverter main circuit (22) are connected to a load (motor) and supply a desired current to the load.

When a predetermined control or command signal is input from the input / output terminals S ₀ and S ₁ , the digital input terminals D _{0 to} D ₅ , and the analog input terminals A _{0 to} A ₈ , the EP microcomputer chip (6) will It operates based on the input signal. That is, a control signal for executing a predetermined process based on the program data in the memory stored in the EP microcomputer chip (6) is output based on the input signal. The control signal is amplified by the buffer (23) and supplied to the base amplifier (25) via the first interface (24).

The signal supplied to the base amplifier (25) is supplied to the base of each transistor element of the inverter main circuit (22), and each transistor element of the inverter main circuit (22) is turned on and off to chop the direct current to generate a pseudo alternating current. Is formed and AC is supplied to the load through the output terminals (U, V, W) to rotate the load at a predetermined rotation speed.

That is, a predetermined program in the EP microcomputer chip (6)
Based on the data, the inverter main circuit (22) chops the direct current and converts it to alternating current. Further, another power supply is constantly applied to the base amplifier (25) via the V _{D1 to} V _D4 terminals.

If the program data in the EP microcomputer chip (6) described above is converted, that is, if it is converted to another microcomputer, the EP
The rotation can be controlled according to the program data stored in the microcomputer chip.

The signals output from the output terminals PO _{0 to} PO ₉ are output based on the result of the predetermined signal processing performed by the EP microcomputer chip (6) based on the input command input to the EP microcomputer chip (6). . The output signals output from the output terminals PO _{0 to} PO ₉ control external equipment or devices. For example, in the case of an inverter air conditioner, an electromagnetic relay, a valve for adjusting the refrigerant, etc. are controlled in a predetermined manner in response to a temperature change in the room.

When the above-mentioned inverter operation is performed, the inverter system, that is, the temperature on the board (2) is designed to be below the rated maximum temperature, but the system itself is not operated in an abnormal environment (high temperature, high humidity). If used in the lower) or if heat is not radiated normally, the temperature of the inverter main circuit (22) and its surroundings may rise abnormally, which may damage the system or set. The temperature detector (26a) of (26) detects an abnormal temperature and stops the operation of the inverter to suppress heat generation of the inverter and protect the set or system. Also, a load is connected to the inverter main circuit (22), but a short circuit due to an abnormality in the wiring inside the load, a short circuit in the output terminals (U, V, W),
Or, the EP microcomputer chip (6) malfunctions due to external noise and the serially connected elements of the inverter main circuit (22) simultaneously
If it is turned on, an abnormally large current will be generated.
Even in this case, even in this case, the current detection unit (26b) in the protection circuit (26) detects the large current and immediately stops the operation for protection.

By performing the above-described operation, the operation of the motor drive inverter is performed, and the rotation control of the load (motor) and the operation of the external device are controlled in a predetermined manner to normally operate the control of the inverter air conditioner or the like.

FIG. 11 is a plan view showing a case where the motor driving inverter circuit shown in FIG. 6 is mounted on the substrate (2) of this embodiment, and the reference numerals of the respective circuit elements mounted are the blocks shown in FIG. It is the same as the reference numeral shown in the figure. Since the conductive path connecting the plurality of circuit elements is complicated, it is indicated by an arrow.

As shown in FIG. 11, a plurality of fixing pads (3a) to which the external lead terminals (12) are fixed are provided on the peripheral end of the substrate (2). A plurality of circuit elements and an EP microcomputer chip (6) are fixed at predetermined positions on a conductive path (5) extending from the fixing pad (3a). That is, the EP microcomputer chip (6) and the plurality of circuit elements (8) are provided on the substrate (2).
Are fixed, (21) is a rectifier circuit, (25) is a base amplifier, (23) is a buffer, (24) is a first interface, (27) is a second interface, and (28) is an output buffer. , (26) are protection circuits.

As is clear from FIG. 11, the EP microcomputer chip (6) is fixed at a position adjacent to the vicinity (here, a buffer and an output buffer) of the circuit element most closely related to the EP microcomputer chip (6).

By arranging the circuit element (8) most closely related to the EP microcomputer chip (6) in the vicinity of the EP microcomputer chip (6), the distance between the wiring lines of the conductive path (5) connecting the two is the shortest and the smallest. Can be arranged and formed, and as a result, other mounting patterns can be effectively used and high-density mounting can be performed. Further, the area surrounded by the one-dot chain line indicates that the case material (7) is fixed by the adhesive sheet.

FIG. 12 shows the case material (7) on the substrate (2) shown in FIG.
FIG. 9 is a plan view of a finished product of the hybrid integrated circuit device for the inverter when the IC is fixed, and shows the upper surface of the second resin layer (15b) coated on the EP microcomputer chip (6) from the upper surface of the substrate (2). Only the state is exposed. That is, all the elements other than the EP microcomputer chip (6) are sealed in the sealed space (21 ') formed by the case material (7) and the substrate (2).

That is, in this embodiment, as shown in FIGS. 11 and 12, only all peripheral circuits necessary for inverter control are formed on the substrate (2). That is, only the peripheral circuits necessary for inverter control are formed on the substrate (2), and the holes (4) provided in the case material (7) are formed.
Only the EP microcomputer chip (6) by the case material (7)
It will be more exposed. More specifically, the program data in the EP microcomputer chip (6) can be erased and written while the EP microcomputer chip (6) is still mounted, and the user can write the dedicated program data. it can.

According to the present invention, the hole (4) is provided at a desired position of the case material (7), and the EP microcomputer chip (6) is formed in the conductive path (5) on the substrate (2) exposed in the hole (4). ) Is connected to the adjacent conductive path (5) by a wire line, and another circuit element (8) is placed in the sealed space (21 ') formed by the substrate (2) and the case material (7). By fixedly arranging them, an integrated device of the hybrid integrated circuit and the EP microcomputer chip can be obtained.

(G) Effect of the Invention As described in detail above, according to the present invention, first, the hole (4) is provided at a desired position of the case material (7), and the substrate (2) exposed through the hole (4). Since the EP microcomputer chip (6) is connected to the upper conductive path (5), there is an advantage that the mounting position of the EP microcomputer chip (6) can be arbitrarily selected. As a result, the circuit element (8) most closely related to the EP microcomputer chip (6) can be arranged at a position adjacent to each other, and as a result, the data exchange between the EP microcomputer chip (6) and the most closely related circuit element (8) can be performed. The data lines to be performed can be realized with the shortest distance or the layout that is the easiest to design, and the loss of mounting density due to the routing of the data lines can be suppressed to the minimum.

Secondly, by placing the EP microcomputer chip (6) on the substrate (2) exposed by the hole (4) at the desired position of the case material (7) and mounting all the peripheral circuit elements in other areas, The required printed circuit board can be eliminated, and a hybrid integrated circuit device incorporating an extremely miniaturized EP microcomputer chip (6) can be realized.

Thirdly, by using a metal substrate as the integrated circuit board (2), the heat radiation effect thereof can be greatly improved compared with the printed circuit board, which can contribute to further improvement of the mounting density. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (5) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fourthly, the peripheral circuit element (8) connected to the EP microcomputer chip (6) is die-shaped or formed in the sealed space (21 ') formed by the case material (7) and the integrated circuit board (2). Since it is incorporated in the form of a chip, it has an advantage that the occupied area is extremely smaller than that of a conventional printed circuit board that is resin-molded, and the mounting density can be greatly improved.

Fifthly, by substantially matching the peripheral edges of the case material (7) and the integrated circuit board (2), substantially the entire surface of the case material (7) and the integrated circuit board (2) is sealed with a space (21). ′), And an extremely compact hybrid integrated circuit device can be realized in combination with an improvement in packaging density.

Sixth, since the light-shielding resin layer (21b) is provided on the EP microcomputer chip (6), the EP microcomputer chip (6) can be protected and the EP microcomputer chip (6) can be shielded from light. There is an advantage that it is possible to seal the gap between the EP microcomputer chip (6) and the case material (7).

Seventh, the external leads (12) and (13) can be led out from the same side of the integrated circuit board (2) or the opposite sides thereof, which has an advantage that an extremely multi-pin hybrid integrated circuit device can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a sectional view of a substrate used in this embodiment, FIG. 4 is a sectional view showing another embodiment, and FIG. 5 is a block diagram showing a motor drive inverter used in this embodiment. 6 is a circuit diagram showing a main circuit of the inverter shown in FIG. 5, FIG. 7 is a block diagram showing a microcomputer of the inverter shown in FIG. 5, and FIG. 8 is a base of the inverter shown in FIG. FIG. 9 is a circuit diagram showing an amplifier, FIG. 9 is a block diagram showing a protection circuit for the inverter shown in FIG. 5, and FIG. 10 is a plan view when the block diagram shown in FIG. 5 is mounted on a substrate. FIG. 12 is a plan view of a case member fixed to the substrate shown in FIG. 10, and FIGS. 12 and 13 are perspective views showing a conventional microcomputer mounting structure. (1) ... Hybrid integrated circuit device, (2) ... Integrated circuit substrate,
(5) ... Conductive path, (6) ... EP microcomputer chip, (8) ...
Circuit element, (4) ... Hole, (7) ... Case material, (21a) ...
Ultraviolet permeable resin, (21b) ... Ultraviolet opaque resin.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Osamu Nakamoto 2-18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Koji Nagahama 2-18-2 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno, 2-18-18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 41-1, Omama-machi, Yamada-gun, Gunma Prefecture Tokyo ICI Co., Ltd.

Claims (7)

[Claims] 1. An integrated circuit substrate, a conductive path having a desired pattern formed on the substrate, an EPROM built-in microcomputer chip connected to the conductive path and containing desired program data, and the EPROM built-in microcomputer. The chip includes a peripheral circuit element supplied with a predetermined control output signal of the chip and connected to a conductive path on the substrate, and a case member integrated with the substrate, and a hole is provided at a desired position of the case member. The microcomputer chip is fixed to the conductive path on the substrate exposed by the hole, and the electrode of the EPROM built-in microcomputer chip and the desired conductive path are connected by a bonding wire to form the substrate and the case. A hybrid integrated circuit device characterized in that the peripheral circuit element is arranged in a sealed space. 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 4. The hybrid integrated circuit device according to claim 1, wherein the EPROM built-in microcomputer chip is sealed with a sealing resin layer in which a resin that transmits ultraviolet rays is injected into the hole. 5. The hybrid integrated circuit device according to claim 4, wherein a sealing resin layer for blocking ultraviolet rays is provided on the sealing resin layer in the hole. 6. The upper surface of the sealing resin layer and the upper surface of the case member are substantially aligned with each other.
A hybrid integrated circuit device as described. 7. A chip resistor and a chip capacitor are used as the peripheral circuit element.
A hybrid integrated circuit device as described.