JP5474631B2 - Non-contact type data receiving / transmitting body and manufacturing method thereof - Google Patents

Description

 The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). In particular, the present invention relates to a non-contact type data transmitter / receiver that is easy to handle without being in close contact with each other even if they are overlapped, and a method for manufacturing the same.

 An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, a sheet-like IC tag is disclosed in which a thin sheet-like circuit portion is sandwiched between surface substrates made of urethane resin coated with a silicone film via an adhesive, and these are integrated ( For example, see Patent Document 1).

When such a sheet-like IC tag is superposed on another sheet-like IC tag of the same type, they are in close contact with each other and are difficult to peel off and are difficult to handle.
Therefore, in order to prevent the sheet-like IC tag from coming into close contact with other sheet-like IC tags, the IC tags need only have shapes that do not overlap each other. As described above, as a sheet-like IC tag having a shape that does not overlap each other, for example, an IC tag having a slight twist with respect to the longitudinal direction is disclosed (for example, Patent Documents). 2).

JP 2005-056362 A JP-A-8-315264

 However, the IC tag disclosed in Patent Document 2 is used by being inserted into a gap in a package that wraps a fixed-shaped object, and when inserted into the gap, the twist naturally returns, so that the corner portion is It was restrained from being caught inside the package and falling out of the gap. That is, the twist applied to the IC tag is not permanent, and when an external force is applied, the IC tag may easily return to a flat state. When the IC tag returns to a flat state as described above, there is a possibility that the IC tag is in close contact with other IC tags.

 The present invention has been made in view of the above circumstances, and provides a non-contact type data receiving / transmitting body that is easy to handle without being in close contact with another sheet-like IC tag even when superimposed on another sheet-like IC tag. For the purpose.

The non-contact type data receiving / transmitting body of the present invention is a non-contact type data receiving / transmitting body comprising an inlet and a covering material covering both sides of the inlet, the covering material being a two-component mixed urethane resin from it, the coating material is a layer bubble surface side in contact with the inlet is not formed, the surface in contact with the inlet and a layer bubble surface and its vicinity of the opposite side has been formed , and wherein the Tona Rukoto.

The manufacturing method of the non-contact type data transmitting / receiving body of the present invention includes an inlet and a coating material that covers both surfaces of the inlet, the coating material is made of a two-component mixed urethane resin , a layer bubble surface side in contact with the inlet is not formed, a layer bubble surface and its vicinity of the opposite side is formed to the surface in contact with the inlet, a non-contact type data Ru Tona It is a manufacturing method of a transmitting / receiving body, Comprising: The process A which apply | coats water to at least one part of the surface of the peeling layer which makes one side of a 1st peeling base material, and the water of said 1st peeling base material Applying the first adhesive made of a two-component mixed urethane resin to the applied surface, and the first peeling through the first adhesive applied to the first peeling substrate. Overlay the inlet on one side of the base material to the first release base material On the other hand, by pressing the inlet, a step C of developing the first adhesive between one surface of the first release substrate and the inlet, and one of the second release substrates A process D for applying water to at least a part of the surface of the release layer forming the surface, and a surface of the inlet opposite to the surface in contact with the first adhesive from a two-component mixed urethane resin The second peeling base material is opposed to the surface on which the water is applied on the inlet via the second adhesive applied to the inlet and the second adhesive applied to the inlet. The second adhesive is spread between one surface of the second release substrate and the inlet by overlapping and pressing the second release substrate against the inlet. And after the step F, the product is further included. A process G for cutting the layered body in accordance with the shape of the inlet; and a process H for peeling the first release substrate and the second release substrate. The process G and the process H Are performed in random order.

 According to the non-contact type data receiving / transmitting body of the present invention, the covering material is made of a two-component mixed urethane resin, and at least a part of the surface opposite to the surface in contact with the inlet of the covering material and the vicinity thereof. Since it has a region in which a large number of bubbles are formed, it is easy to handle because it does not adhere to each other even if it is overlapped with other sheet-like IC tags.

 According to the method for manufacturing a non-contact type data receiving / transmitting body of the present invention, a laminated body composed of a first peeling substrate, a first adhesive, an inlet, a second adhesive, and a second peeling substrate is heated. By doing so, the first adhesive and the second adhesive are rapidly cured, and at the same time, the first adhesive is foamed with water applied to one surface of the first release substrate, and the second adhesive Since the adhesive is foamed by water applied to one surface of the second release substrate, a large number of minute bubbles can be formed on at least a part of one surface of the first covering material and the vicinity thereof. At the same time, a large number of minute bubbles can be formed on at least a part of one surface of the second covering material and the vicinity thereof.

It is a schematic sectional drawing which shows one Embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process A and the process D in one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process B in one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process C in one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process C is shown and it is a schematic sectional drawing in alignment with the AA of FIG. It is a schematic perspective view which shows the process E, the process F, and the process I in one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process F is shown and it is a schematic sectional drawing in alignment with the BB line of FIG. It is a schematic sectional drawing which shows process G in one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process G in one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process H in one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body and a manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

"Non-contact type data receiver / transmitter"
FIG. 1 is a schematic cross-sectional view showing an embodiment of a non-contact type data transmitting / receiving body of the present invention.
The contactless data receiving / transmitting body 10 of this embodiment includes an inlet 11, a first covering material 13 that covers one surface 11a of the inlet 11, and a second covering that covers the other surface 11b of the inlet 11. The material 14 is schematically configured.
Further, the surface of the first covering material 13 opposite to the surface in contact with the inlet 11 (hereinafter referred to as “one surface”) 13a and the vicinity thereof are numerous over the entire area of the one surface 13a. It has a region 13e in which minute bubbles 13d are formed, and a surface (hereinafter referred to as “one surface”) 14a opposite to the surface in contact with the inlet 11 of the second covering material 14 and its vicinity. Has a region 14e in which a large number of minute bubbles 14d are formed over the entire area of one surface 14a.

 Here, the vicinity of one surface 13a of the first covering material 13 is, for example, an inlet from one surface 13a of the first covering material 13 when the thickness of the first covering material 13 is 0.5 mm. It refers to a portion of about 0.1 mm on the 11 side. Similarly, the vicinity of one surface 14a of the second covering material 14 is, for example, an inlet from one surface 14a of the second covering material 14 when the thickness of the second covering material 14 is 0.5 mm. It refers to a portion of about 0.1 mm on the 11 side.

The bubbles 13d of the first covering material 13 are generated by foaming of the first adhesive forming the first covering material 13 in the process of forming the first covering material 13.
In the first covering material 13, air bubbles may be generated in portions other than the one surface 13 a and the vicinity thereof. In particular, the first covering material 13 is formed in the one surface 13 a and the vicinity thereof. The ratio (volume ratio) of the occupied bubbles 13d is high.

Similarly, the bubbles 14d of the second covering material 14 are generated by foaming of the second adhesive forming the second covering material 14 in the process of forming the second covering material 14.
In the second covering material 14, air bubbles may also be generated in portions other than the one surface 14 a and the vicinity thereof. In particular, in the one surface 14 a and the vicinity thereof, the second covering material 14 The ratio (volume ratio) of the occupied bubbles 14d is high.

The size of the bubble 13d (the diameter of the largest portion of each bubble) is not particularly limited, but the size of the bubble 13d formed in the process of forming the first covering material 13 is usually 100 μm to 5 mm.
The size of the bubbles 14d (the diameter of the largest portion of each bubble) is not particularly limited, but the size of the bubbles 14d formed in the process of forming the second coating material 14 is usually 100 μm to 5 mm. .

The first covering material 13 and the second covering material 14 may be collectively referred to as the covering material 12.
In the non-contact type data receiving / transmitting body 10, both surfaces (one surface 11a and the other surface 11b) of the inlet 11 are directly covered with the covering material 12, and the first covering material 13, the inlet 11, The two coating | covering materials 14 have comprised the structure laminated | stacked in this order in the thickness direction. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in a plan view, for example.

The inlet 11 is generally configured by a base material 15 and an IC chip 16 and an antenna 17 which are provided on one surface 15a of the base material 15 and are electrically connected to each other.
The antenna 17 is a dipole antenna composed of a pair of planar radiating elements 18 and 19 made of various conductors, facing each other and having feed points (portions connected to the IC chip 16) on the facing sides. is there.
The length in the longitudinal direction of the antenna 17 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 18 and 19 is a length corresponding to a quarter wavelength.

One surface 11 a of the inlet 11 corresponds to one surface 15 a of the base material 15, and the other surface 11 b of the inlet 11 corresponds to the other surface 15 b of the base material 15.
Therefore, the IC chip 16 and the antenna 17 are covered with the first covering member 13 on the one surface 11 a of the inlet 11.

 Then, the end surface of the first covering material 13, the end surface of the base material 15, and the end surface of the second covering material 14 form the same surface on the four side surfaces of the non-contact type data receiving / transmitting body 10. . More specifically, for example, on the side surface 10a of the non-contact type data transmitting / receiving body 10, the end surface 13b of the first covering material 13, the end surface 15c of the base material 15, and the end surface 14b of the second covering material 14 Are on the same plane. Similarly, on the side surface 10b of the non-contact type data receiving / transmitting body 10, the end surface 13c of the first covering material 13, the end surface 15d of the base material 15, and the end surface 14c of the second covering material 14 are flush with each other. There is no.

The thickness of the first covering material 13 is not particularly limited, but at least unevenness caused by the IC chip 16 and the antenna 17 of the inlet 11 does not appear on one surface (outer surface) 10 c of the non-contact type data receiving / transmitting body 10. And the inlet 11 is not damaged by an external impact, for example, within a range of 10 μm to 2000 mm.
The thickness of the second covering material 14 is not particularly limited, but is such that the inlet 11 is not damaged by an external impact, and is, for example, in the range of 10 μm to 2000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 10 is made sufficiently flexible (flexible) and the non-contact type data receiving / transmitting body 10 is bent, the first covering material 13 is formed with respect to the inlet 11. It is preferable that the thickness of the first covering material 13 and the thickness of the second covering material 14 are equal in order to prevent the stress caused by the difference in thickness between the first covering material 14 and the second covering material 14.

 Further, as described above, the bubbles 13d are mainly formed on one surface 13a of the first covering material 13 and the vicinity thereof, and the bubbles 14d are mainly formed on the one surface 14a of the second covering material 14 and the vicinity thereof. Since they are formed, the presence of these bubbles 13d and 14d does not cause the antenna 17 to bend, so that the communication characteristics such as the resonance frequency of the antenna 17 do not deteriorate.

The covering material 12 (the first covering material 13 and the second covering material 14) is in a liquid state before use, and without adding external conditions such as heating, ultraviolet irradiation, and electron beam irradiation, the main agent and the curing agent. It consists of a two-component mixed urethane resin that cures by the reaction of
Since this two-component mixed urethane resin has tackiness (property that can be temporarily fixed) after curing, one surface 13a of the first covering material 13, that is, the non-contact type data transmitter / receiver 10 One surface 10c and one surface 14a of the second covering material 14, that is, the other surface 10d of the non-contact type data receiving / transmitting body 10 have tackiness.

 The peel strength after curing of the two-component mixed urethane resin, that is, the peel strength of the coating material 12 (the first coating material 13 and the second coating material 14) with respect to the inlet 11 is 1.0 N / mm or more. It is preferable.

As a two-component mixed urethane resin, a silane coupling agent having an epoxy group was further added to a mixed solution containing an isocyanate as a first liquid and a polyol having a hydroxyl group as a second hydroxyl group as a second liquid. Things are used.
In this two-component mixed urethane resin, the isocyanate and the polyol are mixed at a blending ratio of the isocyanate group of the isocyanate and the hydroxyl group of the polyol (-NCO / -OH) of 0.8 or more and 1.1 or less. ing. In the two-component mixed urethane resin, the amount of the silane coupling agent having an epoxy group is 0.1% by mass or more and 2.0% by mass or less.

In addition, as the two-component mixed urethane resin, an aspect ratio of 10 or more and 100 or less is further added to a mixed solution containing an isocyanate as a first solution and a polyol whose hydroxyl group is a primary hydroxyl group as a second solution. What added the inorganic fine particle is used.
In this two-component mixed urethane resin, the isocyanate and the polyol are mixed at a blending ratio of the isocyanate group of the isocyanate and the hydroxyl group of the polyol (-NCO / -OH) of 0.8 or more and 1.1 or less. ing. In this two-component mixed urethane resin, the blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component mixed urethane resin include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

 As the base material 15, a base material made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 16 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 17, and a non-contact type IC tag, a non-contact type IC label, or a non-contact type IC card. Anything can be used as long as it is applicable to RFID media.

 The antenna 17 is formed on one surface 15a of the base material 15 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 17 at 200 ° C. or less, for example, about 100 to 150 ° C. A path through which electricity of the coating film forming the antenna 17 flows is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photo-curing polymer type conductive ink include, for example, a thermoplastic resin alone, or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 fine conductive particles. More than 10% by mass and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combination type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinkable type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 17 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 17 include copper plating, silver plating, gold plating, and platinum plating.

In the non-contact type data receiving / transmitting body 10, a region 13e in which a large number of minute bubbles 13d are formed over the entire area of the one surface 13a is provided on one surface 13a of the first covering material 13 and its vicinity. The area 14e in which a large number of minute bubbles 14d are formed over the entire area of the one surface 14a is provided on one surface 14a of the second covering material 14 and its vicinity. Even if they are superposed on the tag, they are not in close contact with each other, and are easy to handle. Therefore, even if a large number of contactless data receiving / transmitting bodies 10 are grouped, they are not in close contact with each other and are easy to handle.
In particular, the non-contact type data receiving / transmitting body 10 has one surface 10c and the other surface 10d having tackiness (property that can be temporarily fixed) by the covering material 12 made of a two-component mixed urethane resin. Therefore, due to the presence of the bubbles 13d and 14d, even if they are overlapped with the same type of IC tag, they do not adhere to each other.

 In addition, since one surface 11a and the other surface 11b of the inlet 11 are directly covered with the covering material 12 made of a two-component mixed urethane resin, the covering material 12 forms an IC chip 16 or an antenna constituting the inlet 11. 17 is formed so as to follow the concavo-convex shape caused by 17, so that the adhesion between the inlet 11 and the covering material 12 is excellent, and peeling at the interface between the inlet 11 and the covering material 12 can be prevented. 11 is thin and excellent in flexibility while imparting heat resistance and weather resistance.

 Furthermore, since the non-contact type data receiving / transmitting body 10 has a simple configuration in which the one surface 11a and the other surface 11b of the inlet 11 are directly covered with the covering material 12, the non-contact type data receiving / transmitting body 10 can be easily manufactured. it can.

 In this embodiment, a region 13e in which a large number of minute bubbles 13d are formed over the entire area of the one surface 13a is provided on one surface 13a of the first covering material 13 and its vicinity, and the second covering Although the case where the region 14e in which a large number of minute bubbles 14d are formed over the entire area of the one surface 14a is provided on one surface 14a of the material 14 and the vicinity thereof, the present invention is not limited to this. In the present invention, a region in which a large number of bubbles are formed is provided on at least a part of the surface (one surface) opposite to the surface in contact with the inlet of the coating material and the vicinity thereof. Good.

 Moreover, in this embodiment, although the case where the bubbles 13d and 14d were provided in the both surfaces (one surface 10c and the other surface 10d) side of the non-contact-type data transmission / reception body 10 was illustrated, this invention is not limited to this. It is not limited. In the present invention, it is sufficient that bubbles are provided on either one side or the other side of the non-contact type data transmitting / receiving body.

 Moreover, in this embodiment, although the case where the non-contact type data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.

 Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 17 which consists of a dipole antenna comprised from a pair of planar radiation elements 18 and 19 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, or a monopole antenna.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 1-10, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 4, a long base material 15 </ b> A and an RFID antenna 17 and a large number of IC chips 16 that communicate with the antenna 17 are provided on one surface 15 a at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is continuously manufactured using the inlet sheet 22 will be exemplified.

 First, as shown in FIG. 2, the first release substrate 21 is formed on the entire surface of the release layer that forms one surface 21 a of the long first release substrate 21 that is conveyed in the direction of the arrow in the drawing. Water is applied by the water application means 31 along the transport direction (step A).

As the first release substrate 21, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 21a of the first release substrate 21 is composed of a release layer made of silicon.
Specific examples of such a release film include Tosero separator SP-PET-01-BU (trade name) manufactured by Tosero Co., Ltd.

As the release paper, a sealing agent is applied to one side and / or the other side of a 30 μm to 160 μm-thick substrate made of glassine paper or high-quality paper, and a silicon layer is formed on the layer made of the sealing agent. A material having a release layer having a thickness of 1 μm to 50 μm is used. That is, one surface 21a of the first release substrate 21 is composed of a release layer made of silicon.
Specific examples of such release paper include, for example, L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the first peeling substrate 21 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the first release substrate 21, the release layer (not shown) forming one surface 21a of the first release substrate 21 is used. Apply water to the surface.

 As the water application means 31, a sponge containing water, a spray nozzle capable of spraying water in a mist form, or the like is used.

 Next, as shown in FIG. 3, the first portion of the long release substrate 21 conveyed in the direction of the arrow in the drawing is coated with the first portion of the surface (one surface) 21 a on the first portion. The first adhesive 13A discharged from the nozzle 32 of the adhesive application device is applied linearly along the conveying direction of the release substrate 21 (step B).

As 1st adhesive agent 13A, the thing similar to the adhesive agent which forms said coating | covering material 12 is used.
Moreover, the width | variety which apply | coats the 1st adhesive agent 13A to the one surface 21a of the 1st peeling base material 21, ie, the application quantity of the 1st adhesive agent 13A with respect to the one surface 21a of the 1st peeling base material 21 Although there is no particular limitation, the size and number of IC chips 16 and antennas 17 provided on the inlet sheet 22 covered with the first adhesive 13A, and the first adhesive 13A are cured. According to the thickness etc. which are required for the 1st coating material 13 to be adjusted, it adjusts suitably.

 Next, as shown in FIG. 4, the inlet sheet 22 conveyed in the direction of the arrow in the figure is the first release group at the opposing portion of the pair of rollers 33 and 34 that rotate in the direction of the arrow in the figure. The first adhesive 21A applied to one surface 21a of the material 21 is superposed on the one surface 21a of the first peeling substrate 21 being conveyed in the direction of the arrow in the drawing, and the first By sandwiching the release substrate 21 and the inlet sheet 22 between the rollers 33 and 34, the first release substrate is formed over almost the entire area between the first release substrate 21 and the inlet sheet 22, as shown in FIG. The first adhesive 13A applied to the one surface 21a of 21 is developed (step C).

 In this process C, the one surface 21a of the first peeling substrate 21 is formed on one surface 15a of the substrate 15A, that is, the surface of the inlet sheet 22 on which the IC chip 16 and the antenna 17 are provided (hereinafter referred to as “one side”). The inlet sheet 22 is superimposed on one surface 21a of the first release substrate 21 so that the surfaces 22a face each other.

In Step C, as described above, the first adhesive 13A made of a two-component mixed urethane resin that cures by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 13 </ b> A has fluidity until it is developed between the first release substrate 21 and the inlet sheet 22, but gradually becomes fluid as the reaction proceeds. At the same time as it is cured, it is foamed by water applied to one surface 21a of the first peeling substrate 21 to form bubbles 13d.
Accordingly, the one surface 22a of the inlet sheet 22 and the IC chip 16 and the antenna 17 provided on the one surface 22a are covered with the first adhesive 13A, and the first peeling substrate 21 An inlet sheet 22 is temporarily fixed on one surface 21a. The first adhesive 13A becomes the first covering material 13 when cured.

 In Step C, the thickness of the first adhesive 13 </ b> A after being developed between the first release substrate 21 and the inlet sheet 22 is at least uneven by the IC chip 16 and the antenna 17 of the inlet sheet 22. However, the IC chip 16 and the antenna 17 are not damaged due to external impact, such as not appearing on the surface 13d opposite to the surface of the first adhesive 13A in contact with the inlet sheet 22, The range is 10 μm to 2000 mm.

Moreover, in the process C, the force which pinches | interposes the 1st peeling base material 21 and the inlet sheet 22 with a pair of rollers 33 and 34, ie, the force which presses the inlet sheet 22 with respect to the 1st peeling base material 21 in the thickness direction. (Pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 21 and the inlet sheet 22, the coating amount of the first adhesive 13A, and the like, but 1 kg / cm is preferably ^{2 ~20kg} / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this process C, the IC chip 16 and the antenna 17 are completely covered by the first adhesive 13A, and the first adhesive 13A is almost completely spaced between the first peeling substrate 21 and the inlet sheet 22. Filled.

 Next, as shown in FIG. 2, the second release substrate 23 is formed on the entire surface of the release layer that forms one surface 23 a of the long second release substrate 23 that is conveyed in the direction of the arrow in the drawing. Water is applied by the water applying means 31A along the transport direction (step D).

As the 2nd peeling base material 23, the thing similar to the 1st peeling base material 21 is used.
As the water application unit 31A, the same one as the water application unit 31 is used.

 Next, as shown in FIG. 6, while conveying the laminated body α composed of the first peeling base material 21 and the inlet sheet 22 in the direction of the arrow in the figure, the side opposite to the one surface 22 a of the inlet sheet 22 is provided. A surface (hereinafter referred to as “the other surface”) 22b, that is, a central portion of the other surface 15b of the base material 15A is discharged from the nozzle 35 of the adhesive application device along the transport direction of the laminate α. The second adhesive 14A is applied linearly (step E).

As the 2nd adhesive agent 14A, the thing similar to the adhesive agent which forms said coating | covering material 12 is used.
Further, the width of applying the second adhesive 14A to the other surface 22b of the inlet sheet 22, that is, the amount of the second adhesive 14A applied to the other surface 15b of the base material 15A is not particularly limited. It adjusts suitably according to the thickness etc. which are required for the 2nd coating | covering material 14 formed by hardening | curing the 2nd adhesive agent 14A.

 Next, as shown in FIG. 6, the second peeling base material 23 conveyed in the direction of the arrow in the drawing is placed at the opposing portion of the pair of rollers 36 and 37 that rotate in the direction of the arrow in the drawing. The second adhesive 14A applied to the other surface 22b of the sheet 22 is overlaid on the other surface 22b of the inlet sheet 22 constituting the laminate α conveyed in the direction of the arrow in the figure, By sandwiching the laminate α and the second release substrate 23 with the rollers 36 and 37, as shown in FIG. 7, the inlet sheet 22 is formed over almost the entire area between the laminate α and the second release substrate 23. The second adhesive 14A applied to the other surface 22b is developed (step F), and the first adhesive 13A and the inlet are disposed between the first release substrate 21 and the second release substrate 23. Sheet 22 and second adhesive 14 DOO forms the order stacked, integrated laminate beta.

 As the 2nd peeling base material 23, the thing similar to said 1st peeling base material 21 is used. That is, one surface 23a of the second release substrate 23 is formed of a release layer made of silicon.

 In this step F, since the above-described release film or release paper is used as the second release substrate 23, one surface 23a of the second release substrate 23 is attached to the other surface 22b of the inlet sheet 22. The second release substrate 23 is overlaid on the other surface 22b of the inlet sheet 22 so that the formed release layers (not shown) face each other.

Further, in the step F, as described above, the second adhesive 14A made of a two-component mixed urethane resin that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 14A has fluidity until it is developed between the laminate α and the second release substrate 23. However, as the reaction proceeds, the fluidity gradually increases. At the same time as it is cured, it is foamed by water applied to one surface 23a of the second peeling substrate 23 to form bubbles 14d.
As a result, the other surface 22b of the inlet sheet 22 is covered with the second adhesive 14A, and the second release substrate 23 is temporarily fixed on the laminate α. When the second adhesive 14A is cured, the second covering material 14 is obtained.

 In Step F, the thickness of the second adhesive 14A after being developed between the laminate α and the second release substrate 23 is set to the thickness of the first release substrate 21 and the inlet in Step C described above. The thickness is approximately the same as the thickness of the first adhesive 13 </ b> A after being spread between the sheets 22, for example, within a range of 10 μm to 1000 mm.

Moreover, in the process F, the force which pinches | interposes the laminated body (alpha) and the 2nd peeling base material 23 with a pair of rollers 36 and 37, ie, the force which presses the 2nd peeling base material 23 with respect to the inlet sheet 22 in the thickness direction. (Pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the laminate α and the second release substrate 23, the coating amount of the second adhesive 14A, and the like, but 1 kg / cm is preferably ^{2 ~20kg} / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this process F, the second adhesive 14 </ b> A is filled between the laminate α and the second release substrate 23 with almost no gap.

 Next, as shown in FIG. 8, the first peeling substrate 21, the first covering material 13, the inlet sheet 22, the second covering material 14, and the second peeling are performed by a cutting blade (not shown) of the cutting device. The laminate γ made of the base material 23 is cut in the thickness direction (along the alternate long and short dash line in FIG. 8) in accordance with the shape (size) of the inlet 11, and as shown in FIG. γ is separated into pieces (step H).

Next, after the first adhesive 13A is completely cured to become the first covering material 13 and the second adhesive 14A is completely cured to become the second covering material 14, FIG. As shown, the first release substrate 21 and the second release substrate 23 are peeled off from the laminate γ (step H), and the first covering material 13, the inlet sheet 22 (inlet 11), and the second The non-contact type data receiving / transmitting body 10 shown in FIG.

 By the way, as described above, the first adhesive 13 </ b> A is foamed by water applied to one surface 21 a of the first release substrate 21 at the same time as the main agent and the curing agent react and cure with time. Thus, bubbles 13d are formed. Similarly, the second adhesive 14A is cured by the reaction of the main agent and the curing agent with the passage of time, and at the same time, the second adhesive 14A is foamed by water applied to one surface 23a of the second release substrate 23, and the bubbles 14d. Form.

When it is desired to form relatively large bubbles 13d and 14d, as shown in FIG. 6, the first peeling substrate 21, the first adhesive 13A, the inlet sheet being conveyed in the direction of the arrow in the figure. 22, the laminated body β composed of the second adhesive 14 </ b> A and the second release substrate 23 is heated to a predetermined temperature by a heating device 40 including a pair of heaters 38 and 39 disposed so as to sandwich the laminated body β. (Step I).
The heating step includes the first heating step of heating the stacked body α after forming the stacked body α and the second heating of the stacked body β after forming the stacked body β. It is preferable to divide into the heating step.

In this step I, the stacked body β is heated to 60 to 70 ° C. by the heating device 40.
By this step I, the first adhesive 13 </ b> A and the second adhesive 14 </ b> A are rapidly cured, and at the same time, the first adhesive 13 </ b> A is foamed by water applied to one surface 21 a of the first release substrate 21. Thus, a relatively large bubble 13d is formed, and the second adhesive 14A is foamed by water applied to one surface 23a of the second peeling substrate 23 to form a relatively large bubble 14d.

 As a result, the first adhesive 13A is cured to form the first covering material 13, and there are many over the entire area of the one surface 13a on the one surface 13a of the first covering material 13 and in the vicinity thereof. The minute bubbles 13d are formed. In addition, the second adhesive 14A is cured to form the second covering material 14, and a large number of the entire area of the one surface 14a is formed on one surface 14a of the second covering material 14 and its vicinity. A minute bubble 14d is formed.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the first peeling substrate 21, the first adhesive 13A, the inlet sheet 22, the second adhesive 14A, and the second peeling substrate. 23, the first adhesive 13A and the second adhesive 14A are rapidly cured, and at the same time, the first adhesive 13A is applied to one surface of the first release substrate 21. Since the second adhesive 14A is foamed by water applied to one surface 23a of the second release substrate 23, the one surface 13a of the first covering material 13 and the second adhesive 14A are foamed by water applied to the 21a. A number of minute bubbles 13d can be formed in the vicinity thereof, and a number of minute bubbles 14d can be formed in one surface 14a of the second covering material 14 and in the vicinity thereof.

 In this embodiment, the above-described non-contact type data receiving / transmitting body 10 is continuously manufactured by using the long first peeling base material 21, the inlet sheet 22, and the second peeling base material 23. Although the case is illustrated, the present invention is not limited to this. In this invention, you may manufacture a non-contact-type data transmission / reception body separately using the 1st peeling base material, inlet, and 2nd peeling base material which were separated into pieces previously.

 In this embodiment, in step A, water is applied to the entire surface of one surface 21a of the first release substrate 21, and in step D, water is applied to the entire surface of one surface 23a of the second release substrate 23. Although the case where it apply | coats was illustrated, this invention is not limited to this. In the present invention, in the finally obtained non-contact type data receiving / transmitting body, the surface of the release layer that forms one surface of the first release substrate so as to correspond to the position where the coating material is to be foamed Water may be applied to a part of the surface of the release layer that forms one part of the second release substrate or one side of the second release substrate.

 Moreover, in this embodiment, after the process F, the laminated body γ composed of the first peeling base material 21, the first coating material 13, the inlet sheet 22, the second coating material 14, and the second peeling base material 23. When the step G is cut in accordance with the shape of the inlet 11 and the step H of peeling the first release substrate 21 and the second release substrate 23 from the cut laminate γ is performed in this order. However, the present invention is not limited to this. In the present invention, if the process G and the process H are further provided after the process F, the process G and the process H may be performed in random order. That is, in the present invention, in step H, the first release substrate, the first coating material, the inlet, the second coating material, and the laminate composed of the second release substrate, After peeling the release substrate and the second release substrate, in Step G, the laminate composed of the first coating material, the inlet, and the second coating material is cut according to the final shape of the inlet. May be.

DESCRIPTION OF SYMBOLS 10 ... Non-contact-type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 13 ... 1st coating | covering material, 13A ... 1st adhesive agent, 14 ... 1st Two coating materials, 14A ... second adhesive, 15, 15A ... base material, 16 ... IC chip, 17 ... antenna, 18, 19 ... radiating element, 21 ... 1st peeling base material, 22 ... Inlet sheet, 23 ... 2nd peeling base material, 31, 31A ... Water application means, 32 ... Nozzle, 33, 34 ... Roller, 35 ... Nozzle, 36, 37 ... Roller, 38, 39 ... Heater, 40 ... Heating device.

Claims (2)

A non-contact type data receiving / transmitting body comprising an inlet and a covering material covering both sides of the inlet,
The covering material is made of a two-component mixed urethane resin, and the covering material includes a layer in which bubbles on the surface side in contact with the inlet are not formed, a surface opposite to the surface in contact with the inlet, and contactless data reception and transmission body that a layer the bubbles in the vicinity are formed, characterized in Tona Rukoto. An inlet and a covering material that covers both sides of the inlet, the covering material is made of a two-component mixed urethane resin, and the covering material has no air bubbles on the surface side in contact with the inlet and the layer, to the surface in contact with the inlet and a layer bubble surface and its vicinity of the opposite side is formed, a manufacturing method of a non-contact type data reception and transmission body Ru Tona,
Step A for applying water to at least part of the surface of the release layer forming one surface of the first release substrate;
A step B of applying a first adhesive made of a two-component mixed urethane resin to the surface of the first release substrate on which water is applied;
Via the first adhesive applied to the first release substrate, an inlet is overlapped on one surface of the first release substrate, and the inlet to the first release substrate. Step C for developing the first adhesive between one surface of the first release substrate and the inlet by pressing
A step D of applying water to at least a part of the surface of the release layer forming one surface of the second release substrate;
Applying a second adhesive made of a two-component mixed urethane resin to a surface of the inlet opposite to the surface in contact with the first adhesive; and
Via the second adhesive applied to the inlet, the second release substrate is superposed on the inlet with its water-applied surface facing the second adhesive, and the second adhesive is applied to the inlet. Step F for developing the second adhesive between one surface of the second release substrate and the inlet by pressing the release substrate of
After the step F, the method further includes a step G of cutting the laminated body in accordance with the shape of the inlet, and a step H of peeling the first release substrate and the second release substrate. And the manufacturing method of the non-contact-type data receiving / transmitting body characterized by performing the said process G and the said process H in random order.

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