JP5558274B2 - Method for manufacturing contactless data receiving / transmitting body - Google Patents

Description

The present invention, as the information recording medium of the RFID (Radio Frequency IDentification) application, an electromagnetic wave or radio wave receiving information from outside as medium, non-contact type data reception and transmission body in which to send information to the outside It relates to the manufacturing method.

 An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, a sheet-like IC tag is known in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated ( For example, see Patent Document 1).

When such a sheet-like IC tag is superposed on another sheet-like IC tag of the same type, they are in close contact with each other and are difficult to peel off and are difficult to handle.
Therefore, in order to prevent the sheet-like IC tags from being in close contact with each other, it is sufficient that these IC tags have shapes that do not overlap each other. As described above, as a sheet-like IC tag having a shape that does not overlap each other, for example, a sheet with a slight twist with the longitudinal direction as a rotation axis is known (for example, Patent Document 2). reference).

JP 2005-056362 A JP-A-8-315264

 However, the IC tag known in Patent Document 2 is used by being inserted into a gap in a package that wraps a fixed-shaped object. It was restrained from being caught inside the package and falling out of the gap. That is, the twist applied to the IC tag is not permanent, and when an external force is applied, the IC tag may easily return to a flat state. When the IC tag returns to a flat state as described above, it may be in close contact with other IC tags.

 The present invention has been made in view of the above circumstances, and provides a non-contact type data receiver / transmitter that is easy to handle without being in close contact with each other even when superimposed on other similar sheet-like materials. For the purpose.

The non-contact type data transmitting / receiving body manufacturing method of the present invention includes an inlet and a covering material that covers at least a surface of the inlet where the IC chip is provided, and the covering material is a two-component curable urethane-based adhesive. It consists agent, a method of making at least the the said IC chip in contact with the surface of the dressing surface opposite that not make uneven surface contactless data reception and transmission body, at one surface of the release substrate Yes, one of the release substrates through the step A of applying an adhesive composed of a two-component curable urethane adhesive on the release layer having an uneven surface and the adhesive applied to the release substrate The adhesive is spread between the release substrate and the inlet by superimposing the surface of the inlet on which the IC chip is provided and pressing the inlet against the release substrate. Craft Wherein and B, the step C of removing the release substrate, the Rukoto to have a.

Between the step B and the step C, further, a step D of applying an adhesive made of a two-component curable urethane-based adhesive on the surface of the inlet opposite to the surface on which the IC chip is provided; Through the adhesive applied to the inlet, the release substrate is overlaid on the surface of the inlet opposite to the surface on which the IC chip is provided, so that the release layer forming one surface is opposed, Step E for expanding the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. It is preferable to have .

Wherein in step E, the release layer of the release substrate is preferably Rukoto not make uneven surface.

 According to the non-contact type data receiving / transmitting body of the present invention, since at least the surface of the covering material opposite to the surface in contact with the IC chip is an uneven surface, other sheet-like objects of the same type (such as IC tags) Even if they are overlapped, they are not in close contact with each other and are easy to handle. Therefore, even if a large number of non-contact type data receiving / transmitting bodies are collected, they are not in close contact with each other and are easy to handle.

 According to the method for producing a non-contact type data transmitting / receiving body of the present invention, an adhesive is applied on a release layer which is one surface of a release substrate and forms an uneven surface, and two liquids are applied on the release substrate. Adhesives and inlets made of a curable urethane adhesive are laminated and formed into an integrated laminate, and after the adhesive is cured, the release substrate is peeled off. The non-contact type data receiving / transmitting body 10 to which the uneven surface is transferred can be obtained.

It is a schematic sectional drawing which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the AA of FIG. It is a schematic sectional drawing which shows process F in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process F in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, process B is shown and it is schematic sectional drawing in alignment with the BB line of FIG. It is a schematic perspective view which shows the process D and the process E in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process E is shown and it is a schematic sectional drawing in alignment with CC line of FIG. It is a schematic sectional drawing which shows process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body and a manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 1 is a schematic cross-sectional view showing a first embodiment of the non-contact type data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 10 of this embodiment is generally configured by an inlet 11 having a substantially rectangular shape in plan view and a covering material 12 that covers one surface 11a of the inlet 11.
That is, the non-contact type data receiving / transmitting body 10 has a structure in which one surface 11a of the inlet 11 is directly covered with the covering material 12, and the covering material 12 and the inlet 11 are laminated in the thickness direction. ing. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

In addition, a large number of dot-like convex portions 13 are formed on a surface (hereinafter referred to as “one surface”) 12 a opposite to the surface in contact with the IC chip 15 constituting the inlet 11 of the covering material 12. The one surface 12a of the covering material 12 is an uneven surface.
The convex portion 13 forms part of the covering material 12 and is made of an adhesive that forms the covering material 12.

The dot-like convex portions 13 are regularly or irregularly formed on one surface 12 a of the covering material 12.
The point-like convex portions 13 are regularly formed on the one surface 12a of the covering material 12 such that a large number of the convex portions 13 have substantially the same size and are equally spaced (periodically). Say that it is formed.
On the other hand, the point-shaped convex portions 13 being irregularly formed means that a large number of convex portions 13 are formed in irregular sizes and intervals on one surface 12a of the covering material 12.
Moreover, the magnitude | size and space | interval of the convex part 13 are not specifically limited, According to the adhesiveness etc. of the adhesive agent which forms the coating | covering material 12, it adjusts suitably.

The inlet 11 is generally configured by a base material 14 and an IC chip 15 and an antenna 16 which are provided on one surface 14a of the base material 14 and are electrically connected to each other.
The antenna 16 is a dipole antenna composed of a pair of planar radiating elements 17, 18 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 15) on the facing sides. is there.
The length in the longitudinal direction of the antenna 16 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 17 and 18 is a length corresponding to a quarter wavelength.

The one surface 11 a of the inlet 11 corresponds to the one surface 14 a of the base material 14.
Therefore, on one surface 11 a of the inlet 11, the IC chip 15 and the antenna 16 are covered with the covering material 12.

 And the end surface of the coating | covering material 12 and the base material 14 have comprised the same surface in the four side surfaces of the non-contact-type data transmission / reception body 10. FIG. More specifically, for example, the end surface 12a of the covering material 12 and the end surface 14c of the base material 14 are the same surface on the side surface 10a of the non-contact type data transmitting / receiving body 10. Similarly, the end surface 12b of the covering material 12 and the end surface 14d of the base material 14 are the same surface on the side surface 10b of the non-contact type data transmitting / receiving body 10.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 15 and the antenna 16 of the inlet 11 does not appear on one surface (outer surface) 10c of the non-contact type data transmitting / receiving body 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 micrometers.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

 As the substrate 14, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, and polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 15 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 16, and a non-contact type IC tag, a non-contact type IC label, or a non-contact type IC card. Anything can be used as long as it is applicable to RFID media.

 The antenna 16 is formed on one surface 14a of the base material 14 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 16 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric path of the coating film forming the antenna 16 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 16 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 16 include copper plating, silver plating, gold plating, and platinum plating.

This non-contact type data receiving / transmitting body 10 has a large number of dot-like convex portions 13 formed on one surface 12a of the covering material 12, and the one surface 12a of the covering material 12 forms an uneven surface. Even if they are stacked with the same kind of sheet-like material (IC tag or the like), they are not in close contact with each other and are easy to handle. Therefore, even if a large number of contactless data receiving / transmitting bodies 10 are grouped, they are not in close contact with each other and are easy to handle.
In particular, the non-contact type data receiving / transmitting body 10 has one surface 10c having a tack property (property that can be temporarily fixed) by the covering material 12 made of a two-component mixed urethane resin. Since one of the surfaces 12a is an uneven surface, it does not adhere to each other even if it is overlapped with other similar sheet-like materials.

 Furthermore, since the non-contact type data receiving / transmitting body 10 has a simple configuration in which the one surface 11a of the inlet 11 is directly covered with the covering material 12, it can be easily manufactured.

 In this embodiment, the case where the convex portion 13 is formed over almost the entire surface of the one surface 12a of the covering material 12 is illustrated, but the present invention is not limited to this. In the present invention, the convex portion may be partially formed on one surface of the covering material, and the abundance ratio of the convex portion (area ratio with respect to one surface of the covering material) forms the covering material. It adjusts suitably according to the adhesiveness etc. of the adhesive to perform.

Moreover, in this embodiment, although the case where the non-contact type data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 16 which consists of a dipole antenna comprised from a pair of planar radiation elements 17 and 18 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 2-7, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 3, a long inlet in which a large number of RFID antennas 16 and IC chips 15 communicating through the antenna 16 are provided at equal intervals on one surface 14a of the base material 14A. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is manufactured continuously using the sheet 22 is illustrated.

 First, as shown in FIG. 2, the adhesive is applied to the central portion of one surface 21 a of the long release substrate 21 being conveyed in the direction of the arrow in the drawing along the conveyance direction of the release substrate 21. The adhesive 12A discharged from the nozzle 31 of the apparatus is applied linearly (step A).

As adhesive 12A, the thing similar to the adhesive which forms said coating | covering material 12 is used.
Further, the width for applying the adhesive 12A to the one surface 21a of the release substrate 21, that is, the amount of the adhesive 12A applied to the one surface 21a of the release substrate 21 is not particularly limited. Adjust appropriately according to the size and number of IC chips 15 and antennas 16 provided on the inlet sheet 22 to be coated, the thickness required for the covering material 12 formed by curing the adhesive 12A, etc. Is done.

As the peeling base material 21, one surface 21 a is made of a peeling layer, and the surface of the peeling layer is processed into an uneven surface by embossing or the like is used.
That is, on one surface 21a of the peeling substrate 21, a large number of dot-like convex portions 21A are formed, and the one surface 21a of the peeling substrate 21 forms an uneven surface.
Further, the dot-shaped convex portions 21 </ b> A are regularly or irregularly formed on the one surface 21 a of the peeling substrate 21.
The point-shaped convex portions 21A are regularly formed on the one surface 21a of the peeling substrate 21 in which a large number of convex portions 21A have substantially the same size and are substantially equally spaced (periodically). ) Say that it is formed.
On the other hand, the point-shaped convex portions 21 </ b> A being irregularly formed means that a large number of convex portions 21 </ b> A are formed with irregular sizes and intervals on one surface 21 a of the peeling substrate 21. .
Moreover, the magnitude | size and space | interval of the convex part 21A are not specifically limited, According to the adhesiveness of the adhesive agent 12A, etc., it adjusts suitably.

As the release substrate 21, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero separator SP-PET-01-BU (trade name) manufactured by Tosero Co., Ltd.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such release paper include, for example, L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 21 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 21, the adhesive is formed on the release layer (not shown) forming one surface 21a of the release substrate 21. Apply 12A.

 Next, as shown in FIG. 3, the inlet sheet 22 conveyed in the direction of the arrow in the figure is the portion of the peeling substrate 21 that is opposed to the pair of rollers 32 and 33 that rotate in the direction of the arrow in the figure. While superposing on the one surface 21a of the peeling base material 21 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 21a, the peeling base material 21 and the inlet sheet 22 are placed on the roller 32. , 33, as shown in FIG. 4, the adhesive 12A applied to one surface 21a of the peeling substrate 21 is spread over almost the entire area between the peeling substrate 21 and the inlet sheet 22 (step B). ).

 In this process B, one surface 14a of the base material 14A, that is, the surface on which the IC chip 15 and the antenna 16 in the inlet sheet 22 are provided (hereinafter referred to as “one surface”) The inlet sheet 22 is overlaid on the one surface 21a of the peeling substrate 21 so that 22a faces each other.

 In Step B, as described above, the adhesive 12A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is spread between the release substrate 21 and the inlet sheet 22, but gradually loses fluidity as the reaction proceeds, and finally Harden. As a result, the one surface 22a of the inlet sheet 22 and the IC chip 15 and the antenna 16 provided on the one surface 22a are covered with the adhesive 12A, and on the one surface 21a of the release substrate 21. The inlet sheet 22 is temporarily fixed. When the adhesive 12A is cured, the coating material 12 is obtained.

 In Step B, the thickness of the adhesive 12A after being developed between the peeling substrate 21 and the inlet sheet 22 is at least uneven by the IC chip 15 and the antenna 16 of the inlet sheet 22. The IC chip 15 and the antenna 16 are not damaged on the surface 12a opposite to the surface in contact with the inlet sheet 22 and are not damaged by an external impact, for example, within a range of 10 μm to 2000 μm. .

In Step B, the force for sandwiching the release substrate 21 and the inlet sheet 22 between the pair of rollers 32 and 33, that is, the force (pressure) for pressing the inlet sheet 22 in the thickness direction against the release substrate 21 is is not particularly limited, the thickness or size of the release substrate 21 and the inlet sheet 22, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

By this step B, the IC chip 15 and the antenna 16 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 21 and the inlet sheet 22 with almost no gap.
Moreover, the uneven | corrugated shape of one surface 21a of the peeling base material 21 is transcribe | transferred to the surface which contact | connects the one surface 21a of the peeling base material 21 in adhesive agent 12A.

Next, as shown in FIG. 5, the laminated body composed of the peeling base material 21, the adhesive 12 </ b> A and the inlet sheet 22 is formed in the thickness direction thereof (in the dotted line of FIG. Along with this, the laminate is cut according to the shape of the antenna 16, and the laminate is separated into pieces as shown in FIG. 6 (step F).
Here, cutting the laminated body according to the shape of the antenna 16 means cutting the laminated body according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 16.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 7, the release substrate 21 is peeled from the above laminate (step C), and the non-shown in FIG. The contact type data receiving / transmitting body 10 is obtained.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the adhesive 12A is applied on the release layer that forms an uneven surface on one surface 21a of the release substrate 21, After the adhesive 12A and the inlet sheet 22 are laminated and integrated to form a laminated body, and the adhesive 12A is cured, the release substrate 21 is peeled off. The non-contact type data receiving / transmitting body 10 to which the uneven surface of the substrate 21 is transferred can be obtained.

 Also, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 10 can be easily manufactured. Further, since a member other than the adhesive 12A is not required to cover one surface of the inlet sheet 22, the contactless data receiving / transmitting body 10 having a very thin thickness can be manufactured. The manufacturing cost of the contact-type data receiving / transmitting body 10 can be reduced.

 In this embodiment, the case where the convex portion 21A is formed over almost the entire surface of the one surface 21a of the peeling substrate 21 is illustrated, but the present invention is not limited to this. In this invention, the convex part may be partially formed in one surface of the peeling base material, and the abundance ratio of the convex part (area ratio with respect to one surface of the peeling base material) is an adhesive. It adjusts suitably according to the adhesiveness of this.

 Moreover, in this embodiment, although the case where the above-mentioned non-contact-type data receiving / transmitting body 10 was manufactured continuously using the elongate peeling base material 21 and the inlet sheet 22, this invention is shown to this. It is not limited. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process F was performed after the process B was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process C is performed after the process B, and the process F may not be performed.

 Further, in this embodiment, after step B, the laminate composed of the peeling substrate 21, the adhesive 12A and the inlet sheet 22 is cut according to the shape of the antenna 16, and the cut laminate, Although the case where the process C which peels the peeling base material 21 was performed in this order was illustrated, this invention is not limited to this. In the present invention, after step B, step F and step C may be performed in any order. That is, in this invention, after peeling a peeling base material from the laminated body which consists of a peeling base material, an adhesive agent, and an inlet sheet in process C, the laminated body which consists of an adhesive agent and an inlet sheet in process F May be cut according to the shape of the antenna.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 8 is a schematic cross-sectional view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 50 of this embodiment includes an inlet 51 having a substantially rectangular shape in plan view, a first covering member 53 that covers one surface 51a of the inlet 51, and the other surface 51b of the inlet 51. A second covering material 54 to be covered is schematically configured.
The first covering material 53 and the second covering material 54 may be collectively referred to as a covering material 52.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51a and the other surface 51b) of the inlet 51 are directly covered with the covering material 52, and the first covering material 53, the inlet 51, and the The two coating | covering materials 54 have comprised the structure laminated | stacked in this order in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

In addition, on the surface 53a opposite to the surface in contact with the inlet 51 of the first covering material 53 (hereinafter referred to as “one surface”) 53a, a large number of dot-like convex portions 55 are formed. One surface 53a of the covering material 53 is an uneven surface.
The convex portion 55 forms part of the first covering material 53 and is made of an adhesive that forms the first covering material 53.

The dot-like convex portions 55 are regularly or irregularly formed on one surface 53 a of the first covering material 53.
The point-like convex portions 55 are regularly formed on the one surface 53a of the first covering material 53. The large number of convex portions 55 are substantially the same in size and at almost equal intervals (periods). In fact) that is formed.
On the other hand, the point-shaped convex portions 55 are formed irregularly on the one surface 53a of the first covering material 53 that a large number of convex portions 55 are formed with irregular sizes and intervals. Say.
Further, the size and interval of the convex portions 55 are not particularly limited, and are appropriately adjusted according to the adhesiveness of the adhesive forming the first covering material 53.

In addition, on the surface 54 a opposite to the surface in contact with the inlet 51 of the second covering material 54 (hereinafter referred to as “one surface”) 54 a, a large number of dot-like convex portions 56 are formed, One surface 54a of the covering material 54 is an uneven surface.
The convex portion 56 forms part of the second covering material 54 and is made of an adhesive that forms the second covering material 54.

The dot-like convex portions 56 are regularly or irregularly formed on one surface 54 a of the second covering material 54.
The point-shaped convex portions 56 are regularly formed on the one surface 54a of the second covering material 54. The large number of convex portions 56 are substantially the same in size and at regular intervals (periods). In fact) that is formed.
On the other hand, the point-shaped convex portions 56 are irregularly formed means that a large number of convex portions 56 are formed in irregular sizes and intervals on one surface 54a of the second covering material 54. Say.
Moreover, the magnitude | size and space | interval of the convex part 56 are not specifically limited, According to the adhesiveness etc. of the adhesive agent which forms the 2nd coating | covering material 54, it adjusts suitably.

The inlet 51 is generally configured by a base material 57 and an IC chip 58 and an antenna 59 which are provided on one surface 57a of the base material 57 and are electrically connected to each other.
The antenna 59 is a dipole antenna composed of a pair of planar radiating elements 60 and 61 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 58) on the facing sides. is there.
The length in the longitudinal direction of the antenna 59 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 60 and 61 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 57 a of the base material 57, and the other surface 51 b of the inlet 51 corresponds to the other surface 57 b of the base material 57.
Therefore, on one surface 51 a of the inlet 51, the IC chip 58 and the antenna 59 are covered with the first covering material 53.

 Then, on the four side surfaces of the non-contact type data transmitting / receiving body 50, the end surface of the first covering material 53, the end surface of the base material 57, and the end surface of the second covering material 54 are the same surface. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 53b of the first covering material 53, the end surface 57c of the base material 57, and the end surface 54b of the second covering material 54 are provided. They are on the same plane. Similarly, the end surface 53c of the first covering material 53, the end surface 57d of the base material 57, and the end surface 54c of the second covering material 54 are the same surface on the side surface 50b of the non-contact type data transmitting / receiving body 50. ing.

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 58 and the antenna 59 of the inlet 51 appears on one surface (outer surface) 50c of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 μm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, and is, for example, in the range of 10 μm to 2000 μm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

In the non-contact type data receiving / transmitting body 50, a large number of convex portions 55 are formed on one surface 53a of the first covering material 53, and the one surface 53a of the first covering material 53 forms an uneven surface. Therefore, even if they are overlapped with other similar sheet-like materials (IC tags or the like), they do not adhere to each other and are easy to handle. Moreover, since many convex parts 56 are formed in one surface 54a of the 2nd coating | covering material 54, and one surface 54a of the 2nd coating | covering material 54 has comprised the uneven | corrugated surface, it is another sheet-like thing of the same kind. Even if they are overlapped with an IC tag or the like, they do not adhere to each other and are easy to handle. Therefore, even if a large number of non-contact type data receiving / transmitting bodies 50 are grouped, they are not in close contact with each other and are easy to handle.
In particular, the non-contact type data transmitting / receiving body 50 has one surface 50c and the other surface 50d having tack property (property that can be temporarily fixed) by the covering material 52 made of a two-component mixed urethane resin. However, since one surface 53a of the first covering material 53 forms an uneven surface, and one surface 54a of the second covering material 54 forms an uneven surface, it overlaps with other similar sheet-like materials. However, they do not adhere to each other.

 Furthermore, the non-contact type data receiving / transmitting body 50 can be easily manufactured because the one surface 51a and the other surface 51b of the inlet 51 are directly covered with the covering material 52. it can.

 In this embodiment, a convex portion 55 is formed over substantially the entire surface of one surface 53a of the first covering material 53, and a convex portion 56 is formed over the substantially entire surface of one surface 54a of the second covering material 54. Although the case where it formed was illustrated, this invention is not limited to this. In the present invention, the convex portion may be partially formed on one surface of the covering material, and the abundance ratio of the convex portion (area ratio with respect to one surface of the covering material) forms the covering material. It adjusts suitably according to the adhesiveness of the adhesive to do.

 Moreover, in this embodiment, although the one surface 53a of the 1st coating | covering material 53 comprised an uneven surface, and illustrated the case where the one surface 54a of the 2nd coating | covering material 54 made an uneven surface, this invention Is not limited to this. In the present invention, only one surface of the first covering material may form an uneven surface.

Moreover, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 59 which consists of a dipole antenna comprised from a pair of planar radiation elements 60 and 61 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 9-16, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 10, a long inlet in which a large number of RFID antennas 59 and IC chips 58 communicating through the antenna 59 are provided at equal intervals on one surface 57a of the base material 57A. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the sheet 72 is illustrated.

 First, as shown in FIG. 9, along the conveyance direction of the first peeling substrate 71, the central portion of one surface 71 a of the long peeling substrate 71 being conveyed in the direction of the arrow in the drawing, The first adhesive 53A discharged from the nozzle 81 of the adhesive application device is applied linearly (step A).

As the first adhesive 53A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the first adhesive 53A to the one surface 71a of the first release substrate 71, that is, the application amount of the first adhesive 53A to the one surface 71a of the first release substrate 71. Although there is no particular limitation, the size and number of IC chips 58 and antennas 59 provided on the inlet sheet 72 and the first adhesive 53A, which are covered with the first adhesive 53A, are cured. According to the thickness etc. which are required for the first covering material 53 to be adjusted, it is appropriately adjusted.

As the first release substrate 71, one having one surface 71a made of a release layer and the surface of the release layer processed into an uneven surface by embossing or the like is used.
That is, on one surface 71a of the first peeling substrate 71, a large number of dot-like convex portions 71A are formed, and the one surface 71a of the first peeling substrate 71 is an uneven surface.
In addition, the dot-like convex portions 71 </ b> A are regularly or irregularly formed on one surface 71 a of the first peeling base material 71.
The point-like convex portions 71A are regularly formed on the one surface 71a of the first peeling substrate 71, with a large number of the convex portions 71A having substantially the same size and at substantially equal intervals ( Say that it is formed (periodically).
On the other hand, the point-shaped convex portions 71A are irregularly formed. On one surface 71a of the first peeling base 71, a large number of convex portions 71A are formed with irregular sizes and intervals. Say that.
Further, the size and interval of the convex portions 71A are not particularly limited, and are appropriately adjusted according to the tackiness of the first adhesive 53A.

As the 1st peeling base material 71, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 71 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the first release substrate 71, a release layer (not shown) forming one surface 71a of the first release substrate 71 is used. The first adhesive 53A is applied on the top.

 Next, as shown in FIG. 10, the inlet sheet 72 conveyed in the direction of the arrow in the drawing is moved to the first peeling group at the opposing portion of the pair of rollers 82 and 83 that rotate in the direction of the arrow in the drawing. The first adhesive 71A applied to one surface 71a of the material 71 is overlaid on the one surface 71a of the first peeling substrate 71 being conveyed in the direction of the arrow in the drawing, and the first As shown in FIG. 11, the first release substrate 71 and the inlet sheet 72 are sandwiched between the first release substrate 71 and the inlet sheet 72 as shown in FIG. The first adhesive 53A applied to one surface 71a of 71 is developed (step B).

 In this process B, one surface 57a of the base material 57A, that is, the surface of the inlet sheet 72 on which the IC chip 58 and the antenna 59 are provided (hereinafter referred to as “one side”) The inlet sheet 72 is overlaid on one surface 71a of the first release substrate 71 so that the surfaces 72a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 71 and the inlet sheet 72. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. Thus, the one surface 72a of the inlet sheet 72, and the IC chip 58 and the antenna 59 provided on the one surface 72a are covered with the first adhesive 53A, and the first peeling substrate 71 An inlet sheet 72 is temporarily fixed on one surface 71a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first peeling substrate 71 and the inlet sheet 72 is caused by at least the IC chip 58 and the antenna 59 of the inlet sheet 72. The degree of unevenness does not appear on the surface 53a opposite to the surface in contact with the inlet sheet 72 of the first adhesive 53A, and the IC chip 58 and the antenna 59 are not damaged by an external impact. The range is 10 μm to 2000 μm.

Further, in step B, a force for sandwiching the first release substrate 71 and the inlet sheet 72 between the pair of rollers 82 and 83, that is, pressing the inlet sheet 72 in the thickness direction against the first release substrate 71. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 71 and the inlet sheet 72, the coating amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

By this step B, the IC chip 58 and the antenna 59 are completely covered with the first adhesive 53A, and the first adhesive 53A is almost completely spaced between the first peeling substrate 71 and the inlet sheet 72. Filled.
Moreover, the uneven | corrugated shape of the one surface 71a of the 1st peeling base material 71 is transcribe | transferred to the surface which contact | connects the one surface 71a of the 1st peeling base material 71 in the 1st adhesive agent 53A.

 Next, as shown in FIG. 12, while transporting the laminated body α composed of the first peeling base material 71 and the inlet sheet 72 in the direction of the arrow in the figure, the side opposite to the one surface 72 a of the inlet sheet 72. A surface (hereinafter referred to as “the other surface”) 72b, that is, the central portion of the other surface 57b of the base material 57A is discharged from the nozzle 84 of the adhesive application device along the transport direction of the laminate α. The second adhesive 54A is applied linearly (step D).

As the second adhesive 54A, the same adhesive as that used to form the covering material 52 is used.
Further, the width of applying the second adhesive 54A to the other surface 72b of the inlet sheet 72, that is, the application amount of the second adhesive 54A to the other surface 57b of the base material 57A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 12, a pair of rollers 85 that rotate in the direction of the arrow in the figure, the second peeling base material 73 on the peeling layer that is conveyed in the direction of the arrow in the figure and forms one surface 73 a, 86, the other side of the inlet sheet 72 constituting the laminated body α being conveyed in the direction of the arrow in the drawing via the second adhesive 54A applied to the other surface 72b of the inlet sheet 72. 13 and between the laminate α and the second release substrate 73 as shown in FIG. 13 by sandwiching the laminate α and the second release substrate 73 with rollers 85 and 86. The second adhesive 54A applied to the other surface 72b of the inlet sheet 72 is developed over almost the entire area (step E), and between the first release substrate 71 and the second release substrate 73, First adhesive 53A, inlet DOO 72 and second adhesive 54A is laminated in this order, to form a laminate β which is integrated.

As the 2nd peeling base material 73, the thing similar to said 1st peeling base material 71 is used. That is, as the second release substrate 73, one having one surface 73a made of a release layer and the surface of the release layer processed into an uneven surface by embossing or the like is used.
That is, on one surface 73a of the second peeling substrate 73, a large number of dot-like convex portions 73A are formed, and the one surface 73a of the second peeling substrate 73 forms an uneven surface.
Further, the dot-shaped convex portions 73 </ b> A are regularly or irregularly formed on one surface 73 a of the second peeling base material 73.
The point-shaped protrusions 73A are regularly formed on the one surface 73a of the second peeling substrate 73, in which a large number of the protrusions 73A have substantially the same size and are substantially equally spaced ( Say that it is formed (periodically).
On the other hand, the point-shaped convex portions 73A are irregularly formed. On one surface 73a of the second peeling substrate 73, a large number of convex portions 73A are formed with irregular sizes and intervals. Say that.
Further, the size and interval of the convex portions 73A are not particularly limited, and are appropriately adjusted according to the adhesiveness of the second adhesive 54A.

 In this step E, since the above-described release film or release paper is used as the second release substrate 73, one surface 73a of the second release substrate 73 is formed on the other surface 72b of the inlet sheet 72. The second release substrate 73 is overlaid on the other surface 72b of the inlet sheet 72 so that the formed release layers (not shown) face each other.

 In Step E, as described above, the second adhesive 54A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 54A has fluidity until it is developed between the laminate α and the second release substrate 73. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. Thereby, the other surface 72b of the inlet sheet 72 is covered with the second adhesive 54A, and the second peeling base material 73 is temporarily fixed on the laminate α. When the second adhesive 54A is cured, the second covering material 54 is obtained.

 In Step E, the thickness of the second adhesive 54 </ b> A after being developed between the laminate α and the second release substrate 73 is the same as that of the first release substrate 71 in Step B described above. The thickness is the same as the thickness of the first adhesive 53 </ b> A after being spread between the inlet sheets 72, for example, in the range of 10 μm to 1000 μm.

Moreover, in the process E, the force which pinches | interposes the laminated body (alpha) and the 2nd peeling base material 73 with a pair of rollers 85 and 86, ie, presses the 2nd peeling base material 73 to the thickness direction with respect to the inlet sheet 72. The force (pressure) is not particularly limited and is appropriately adjusted according to the thickness and size of the laminate α and the second release substrate 73, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

By this step E, the second adhesive 54 </ b> A is filled between the laminate α and the second release substrate 73 with almost no gap.
Moreover, the uneven | corrugated shape of one surface 73a of the 2nd peeling base material 73 is transcribe | transferred to the surface which contact | connects the one surface 73a of the 2nd peeling base material 73 in the 2nd adhesive agent 54A.

Next, as shown in FIG. 14, the first peeling substrate 71, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second peeling are performed by a cutting blade (not shown) of the cutting device. The laminated body γ made of the base material 73 is cut in the thickness direction (along the alternate long and short dash line in FIG. 14) according to the shape of the antenna 59, and the laminated body γ is singulated as shown in FIG. (Step F).
Here, cutting the laminated body γ according to the shape of the antenna 59 means cutting the antenna 59 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 59.

 Next, after the first adhesive 53A is completely cured to become the first covering material 53, and the second adhesive 54A is completely cured to become the second covering material 54, FIG. As shown, the first peeling base material 71 and the second peeling base material 73 are peeled from the laminate γ (step C) to obtain the non-contact type data receiving / transmitting body 50 shown in FIG.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the first adhesive 53A and the inlet sheet 72 are laminated on the release layer forming the uneven surface of the first release substrate 71, and After the second adhesive 54A is applied on the inlet sheet 72, the release layer forming the uneven surface of the second release substrate 73 is superimposed on the inlet sheet 72 via the second adhesive 54A. Then, the laminate γ composed of the first release substrate 71, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second release substrate 73 is integrated, and the first adhesive 53A After the second adhesive 54A is cured, the first release base 71 and the second release base 73 are peeled off, so that the first release group is formed on one surface 53a of the first covering material 53. The uneven surface of the material 71 is transferred, and the second covering material 5 On one surface 54a of the can uneven surface of the second release substrate 73 to obtain a contactless data reception and transmission body 50 it has been transferred.

 Also, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 50 can be easily manufactured. Further, since no member other than the first adhesive 53A and the second adhesive 54A is required to cover both surfaces of the inlet sheet 72, the non-contact type data receiving / transmitting body 50 having a very thin thickness is manufactured. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body 50 can be reduced.

 In this embodiment, the convex portion 71A is formed over substantially the entire surface of one surface 71a of the first release substrate 71, and over the entire surface of one surface 73a of the second release substrate 73, Although the case where convex part 73A was formed was illustrated, this invention is not limited to this. In this invention, the convex part may be partially formed in one surface of the peeling base material, and the abundance ratio of the convex part (area ratio with respect to one surface of the peeling base material) is an adhesive. It adjusts suitably according to adhesiveness.

 Moreover, in this embodiment, although the case where the surface where the surface of a peeling layer makes an uneven surface was used as the 2nd peeling base material 73 in the process E was illustrated, this invention is not limited to this. In the present invention, in step E, a release substrate whose surface of the release layer does not form an uneven surface may be used.

 Moreover, in this embodiment, the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the long first peeling base material 71, the inlet sheet 72, and the second peeling base material 73. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process F was performed after the process E was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process C is performed after the process E, and the process F may not be performed.

 In this embodiment, after step E, a laminate γ composed of the first release substrate 71, the first adhesive 53 </ b> A, the inlet sheet 72, the second adhesive 54 </ b> A, and the second release substrate 73 is used. When the step F is cut in accordance with the shape of the antenna 59 and the step C of peeling the first peeling substrate 71 and the second peeling substrate 73 from the cut laminate γ is performed in this order. However, the present invention is not limited to this. In the present invention, after step E, step F and step C may be performed in random order. That is, in the present invention, in step C, the first release substrate, the first adhesive, the inlet sheet, the second adhesive, and the laminate composed of the second release substrate, In Step F, the laminate made of the first adhesive, the inlet sheet, and the second adhesive is cut according to the shape of the antenna. Also good.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13 ... Convex part, 14, 14A ... Base material, 15. ..IC chip, 16 ... antenna, 17,18 ... radiation element, 21 ... peeling substrate, 21A ... convex part, 22 ... inlet sheet, 31 ... nozzle, 32, 33 ... Roller, 50 ... Non-contact type data transmitting / receiving body, 51 ... Inlet, 52 ... Coating material, 53 ... First coating material, 53A ... First adhesive 54 ... second coating material, 54A ... second adhesive, 55,56 ... convex, 57,57A ... base material, 58 ... IC chip, 59 ... Antenna, 60, 61 ... Radiation element, 71 ... First peeling substrate, 71A ... Projection, 72 ... Inlet DOO, 73 ... second release substrate, 73A ... projecting portion, 81 and 84 ... nozzle, 82,83,85,86 ... roller.

Claims (3)

An inlet and a coating material that covers at least a surface of the inlet on which the IC chip is provided. The coating material is made of a two-component curable urethane adhesive, and at least the surface of the coating material that contacts the IC chip. A method of manufacturing a non-contact type data receiving / transmitting body in which a surface opposite to the surface is an uneven surface,
Step A for applying an adhesive composed of a two-component curable urethane adhesive on the release layer that is one surface of the release substrate and forms an uneven surface;
Via the adhesive applied to the release substrate, the surface on which the IC chip in the inlet is provided is superimposed on one surface of the release substrate, and the inlet is pressed against the release substrate. Step B for developing the adhesive between the release substrate and the inlet,
And a step C of peeling the peeling substrate. A method for producing a non-contact type data transmitting / receiving body. Between Step B and Step C,
Further, a step D of applying an adhesive made of a two-component curable urethane-based adhesive to the surface of the inlet opposite to the surface on which the IC chip is provided,
Through the adhesive applied to the inlet, the release substrate is overlaid on the surface of the inlet opposite to the surface on which the IC chip is provided, so that the release layer forming one surface is opposed, Step E for expanding the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. The method of manufacturing a non-contact type data receiving / transmitting body according to claim 1 , wherein: The method for producing a non-contact type data transmitter / receiver according to claim 2 , wherein in the step E, the release layer of the release substrate has an uneven surface.

Images