JP5558271B2 - Non-contact type data receiving / transmitting body and manufacturing method thereof - Google Patents

Description

 The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). And the manufacturing method thereof.

 An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, a sheet-like IC tag is known in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated ( For example, see Patent Document 1).

When such a sheet-like IC tag is superposed on another sheet-like IC tag of the same type, they are in close contact with each other and are difficult to peel off and are difficult to handle.
Therefore, in order to prevent the sheet-like IC tags from being in close contact with each other, it is sufficient that these IC tags have shapes that do not overlap each other. As described above, as a sheet-like IC tag having a shape that does not overlap each other, for example, a sheet with a slight twist with the longitudinal direction as a rotation axis is known (for example, Patent Document 2). reference).

JP 2005-056362 A JP-A-8-315264

 However, the IC tag known in Patent Document 2 is used by being inserted into a gap in a package that wraps a fixed-shaped object. It was restrained from being caught inside the package and falling out of the gap. That is, the twist applied to the IC tag is not permanent, and when an external force is applied, the IC tag may easily return to a flat state. When the IC tag returns to a flat state as described above, it may be in close contact with other IC tags.

 The present invention has been made in view of the above circumstances, and provides a non-contact type data receiver / transmitter that is easy to handle without being in close contact with each other even when superimposed on other similar sheet-like materials. For the purpose.

The non-contact type data receiving / transmitting body of the present invention is a non-contact type data receiving / transmitting body comprising an inlet and a covering material that covers at least a surface of the inlet where the IC chip is provided. The material is made of a two-component curable urethane-based adhesive, and the coating material includes a non-adhesive powder or particle-free layer on the surface in contact with the inlet, and a surface in contact with the inlet. Comprises the opposite surface and the layer containing the powder or the particles in the vicinity thereof.

 The non-contact type data transmitting / receiving body manufacturing method of the present invention includes an inlet and a covering material that covers at least a surface of the inlet where the IC chip is provided, and the covering material is a two-component curable urethane-based adhesive. A method of manufacturing a non-contact type data receiving / transmitting body comprising a non-adhesive powder or granule disposed on at least the surface of the covering material opposite to the surface in contact with the IC chip, wherein A non-tacky powder or granules are dispersed on the release layer forming one surface of the substrate, and the two-component curable urethane-based adhesion is applied to the release layer via the powder or granules. Step A for applying an adhesive composed of an agent, and a surface provided with an IC chip in an inlet on one surface of the release substrate through the adhesive applied to the release substrate, The inlet to the release substrate By applying, between the said release substrate inlet, a step B of deploying the adhesive, characterized by and a step C of removing the release substrate.

 Between the step B and the step C, further, a step D of applying an adhesive made of a two-component curable urethane-based adhesive on the surface of the inlet opposite to the surface on which the IC chip is provided; Through the adhesive applied to the inlet, the release substrate is overlaid on the surface of the inlet opposite to the surface on which the IC chip is provided, so that the release layer forming one surface is opposed, Step E for expanding the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. It is preferable to have.

 In the step E, after the non-adhesive powder or particles are dispersed on the release layer of the release substrate, the release substrate is disposed on the side opposite to the surface on which the IC chip is provided in the inlet. It is preferable to superimpose on the surface.

 According to the non-contact type data receiving / transmitting body of the present invention, since the non-adhesive powder or granule is disposed at least on the surface of the covering material opposite to the surface in contact with the IC chip, Since the outermost surface of the granule is exposed on the outer surface of the coating material, or the outer surface of the coating material forms an uneven surface due to the powder or granule, other similar sheet-like materials (IC tags, etc.) ), They are not in close contact with each other and are easy to handle. Therefore, even if a large number of non-contact type data receiving / transmitting bodies are collected, they are not in close contact with each other and are easy to handle.

 According to the method for producing a non-contact type data receiving / transmitting body of the present invention, after the non-adhesive powder or particles are sprayed on the release layer forming one surface of the release substrate, the two-component curing type Adhesives and inlets made of urethane adhesive are laminated and formed into an integrated laminate, and after the adhesive is cured, the release substrate is peeled off. A non-contact type data receiving / transmitting body in which a large number of bodies or granules are arranged can be obtained.

It is a schematic sectional drawing which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the AA of FIG. It is a schematic sectional drawing which shows process F in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process F in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, process B is shown and it is schematic sectional drawing in alignment with the BB line of FIG. It is a schematic perspective view which shows the process D and the process E in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process E is shown and it is a schematic sectional drawing in alignment with CC line of FIG. It is a schematic sectional drawing which shows process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body and a manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 1 is a schematic cross-sectional view showing a first embodiment of the non-contact type data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 10 of this embodiment is generally configured by an inlet 11 having a substantially rectangular shape in plan view and a covering material 12 that covers one surface 11a of the inlet 11.
That is, the non-contact type data receiving / transmitting body 10 has a structure in which one surface 11a of the inlet 11 is directly covered with the covering material 12, and the covering material 12 and the inlet 11 are laminated in the thickness direction. ing. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

Further, a non-adhesive powder or granule on the surface 12a side opposite to the surface in contact with the IC chip 15 constituting the inlet 11 of the covering material 12 (hereinafter referred to as “one surface (outer surface)”). (Hereinafter, these are collectively referred to as “powder bodies”.) 13 are arranged in large numbers.
Here, the powder 13 is disposed on the one surface 12a side of the covering material 12 so that the outermost surface 13a is flush with the one surface 12a of the covering material 12. It means that the body 13 is arranged, or the granular material 13 is arranged so that a part of the body 13 is buried in the covering material 12 and the other part protrudes from one surface 12 a of the covering material 12.
When the powder 13 is arranged such that the outermost surface 13a is flush with the one surface 12a of the coating material 12, the outermost surface 13a of the powder 13 is represented on one surface 12a of the coating material 12. I'm out.
When the powder body 13 is arranged so as to protrude from the one surface 12 a of the covering material 12, the one surface 12 a of the covering material 12 forms an uneven surface due to the powder body 13.

Moreover, the granular material 13 is regularly or irregularly arranged on the one surface 12 a side of the covering material 12.
The phrase that the powder particles 13 are regularly arranged means that the powder particles 13 are arranged in substantially the same direction and at substantially equal intervals on the one surface 12a side of the covering material 12. .
On the other hand, the phrase that the powder particles 13 are irregularly arranged means that the powder particles 13 are arranged in irregular directions and intervals on the one surface 12 a side of the covering material 12.

The inlet 11 is generally configured by a base material 14 and an IC chip 15 and an antenna 16 which are provided on one surface 14a of the base material 14 and are electrically connected to each other.
The antenna 16 is a dipole antenna composed of a pair of planar radiating elements 17, 18 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 15) on the facing sides. is there.
The length in the longitudinal direction of the antenna 16 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 17 and 18 is a length corresponding to a quarter wavelength.

The one surface 11 a of the inlet 11 corresponds to the one surface 14 a of the base material 14.
Therefore, on one surface 11 a of the inlet 11, the IC chip 15 and the antenna 16 are covered with the covering material 12.

 And the end surface of the coating | covering material 12 and the base material 14 have comprised the same surface in the four side surfaces of the non-contact-type data transmission / reception body 10. FIG. More specifically, for example, the end surface 12a of the covering material 12 and the end surface 14c of the base material 14 are the same surface on the side surface 10a of the non-contact type data transmitting / receiving body 10. Similarly, the end surface 12b of the covering material 12 and the end surface 14d of the base material 14 are the same surface on the side surface 10b of the non-contact type data transmitting / receiving body 10.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 15 and the antenna 16 of the inlet 11 does not appear on one surface (outer surface) 10c of the non-contact type data transmitting / receiving body 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 micrometers.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

The powder 13 is not particularly limited as long as it is a non-adhesive powder or granule, but is a scaly thing made of glass, graphite or the like, a bead-like powder made of a resin such as acrylic, or slipperiness such as wax. High waxy lump, sand and gravel are used.
Moreover, as the granular material 13, that whose length (thickness) of the longest part is about 100 micrometers-about 10 mm is preferable.
A metal foil such as an aluminum foil can also be used depending on the thickness of the covering material 12, required communication performance, information writing / reading environment, and the like.
Further, the color of the granular material 13 is appropriately adjusted according to the color of the covering material 12. Specifically, in order to make the granular material 13 inconspicuous, the color of the granular material 13 is made substantially the same as the color of the covering material 12.

 As the substrate 14, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, and polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 15 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 16, and a non-contact type IC tag, a non-contact type IC label, or a non-contact type IC card. Anything can be used as long as it is applicable to RFID media.

 The antenna 16 is formed on one surface 14a of the base material 14 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 16 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric path of the coating film forming the antenna 16 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 16 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 16 include copper plating, silver plating, gold plating, and platinum plating.

Since the non-contact type data receiving / transmitting body 10 has a large number of non-adhesive powder particles 13 arranged on one surface (outer surface) 12a side of the covering material 12, the outermost surface 13a of the powder material 13 is Since one surface 12a of the covering material 12 is exposed on the one surface 12a, or the one surface 12a of the covering material 12 has an uneven surface caused by the powder 13, other similar sheet-like material (IC Even if they are overlapped with a tag or the like, they are not in close contact with each other and are easy to handle. Therefore, even if a large number of contactless data receiving / transmitting bodies 10 are grouped, they are not in close contact with each other and are easy to handle.
In particular, the non-contact type data receiving / transmitting body 10 has one surface 10c having a tack property (property that can be temporarily fixed) by the covering material 12 made of a two-component mixed urethane resin. Due to the presence of 13, even if they are overlapped with other similar sheet-like materials, they do not adhere to each other.

 Furthermore, since the non-contact type data receiving / transmitting body 10 has a simple configuration in which the one surface 11a of the inlet 11 is directly covered with the covering material 12, it can be easily manufactured.

 In addition, in this embodiment, although the case where the granular material 13 was arrange | positioned over the substantially whole surface of the one surface 12a of the coating | covering material 12 was illustrated, this invention is not limited to this. In the present invention, the non-adhesive powder or particles may be partially disposed on one surface of the covering material, and the amount of the powder or particles disposed (one of the covering materials). The area ratio with respect to the surface is appropriately adjusted according to the tackiness of the adhesive forming the coating material.

Moreover, in this embodiment, although the case where the non-contact type data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 16 which consists of a dipole antenna comprised from a pair of planar radiation elements 17 and 18 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 2-7, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 3, a long inlet in which a large number of RFID antennas 16 and IC chips 15 communicating through the antenna 16 are provided at equal intervals on one surface 14a of the base material 14A. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is manufactured continuously using the sheet 22 is illustrated.

 First, as shown in FIG. 2, non-adhesive powder particles 13 are sprayed on one surface 21 a of a long release substrate 21 that is conveyed in the direction of the arrow in the drawing. The adhesive 12 </ b> A discharged from the nozzle 31 of the adhesive application device is linearly applied to the central portion of the one surface 21 a of the release substrate 21 along the conveying direction of the release substrate 21 ( Step A).

As adhesive 12A, the thing similar to the adhesive which forms said coating | covering material 12 is used.
Further, the width for applying the adhesive 12A to the one surface 21a of the release substrate 21, that is, the amount of the adhesive 12A applied to the one surface 21a of the release substrate 21 is not particularly limited. Adjust appropriately according to the size and number of IC chips 15 and antennas 16 provided on the inlet sheet 22 to be coated, the thickness required for the covering material 12 formed by curing the adhesive 12A, etc. Is done.

 The amount of the powder 13 applied to the one surface 21a of the release substrate 21 is not particularly limited, but is finally obtained in consideration of the adhesiveness of the covering 12 formed by curing the adhesive 12A. Further, the non-contact type data receiving / transmitting body 10 is appropriately adjusted to such an extent that the non-contact type data receiving / transmitting body 10 can be prevented from sticking to each other due to the adhesiveness of the covering material 12.

As the release substrate 21, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero separator SP-PET-01-BU (trade name) manufactured by Tosero Co., Ltd.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such release paper include, for example, L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 21 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 21, the adhesive is formed on the release layer (not shown) forming one surface 21a of the release substrate 21. Apply 12A.

 Next, as shown in FIG. 3, the inlet sheet 22 conveyed in the direction of the arrow in the figure is the portion of the peeling substrate 21 that is opposed to the pair of rollers 32 and 33 that rotate in the direction of the arrow in the figure. While superposing on the one surface 21a of the peeling base material 21 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 21a, the peeling base material 21 and the inlet sheet 22 are placed on the roller 32. , 33, as shown in FIG. 4, the adhesive 12A applied to one surface 21a of the peeling substrate 21 is spread over almost the entire area between the peeling substrate 21 and the inlet sheet 22 (step B). ).

 In this process B, one surface 14a of the base material 14A, that is, the surface on which the IC chip 15 and the antenna 16 in the inlet sheet 22 are provided (hereinafter referred to as “one surface”) The inlet sheet 22 is overlaid on the one surface 21a of the peeling substrate 21 so that 22a faces each other.

 In Step B, as described above, the adhesive 12A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is spread between the release substrate 21 and the inlet sheet 22, but gradually loses fluidity as the reaction proceeds, and finally Harden. As a result, the one surface 22a of the inlet sheet 22 and the IC chip 15 and the antenna 16 provided on the one surface 22a are covered with the adhesive 12A, and on the one surface 21a of the release substrate 21. The inlet sheet 22 is temporarily fixed. When the adhesive 12A is cured, the coating material 12 is obtained.

 In Step B, the thickness of the adhesive 12A after being developed between the peeling substrate 21 and the inlet sheet 22 is at least uneven by the IC chip 15 and the antenna 16 of the inlet sheet 22. The IC chip 15 and the antenna 16 are not damaged on the surface 12a opposite to the surface in contact with the inlet sheet 22 and are not damaged by an external impact, for example, within a range of 10 μm to 2000 μm. .

In Step B, the force for sandwiching the release substrate 21 and the inlet sheet 22 between the pair of rollers 32 and 33, that is, the force (pressure) for pressing the inlet sheet 22 in the thickness direction against the release substrate 21 is is not particularly limited, the thickness or size of the release substrate 21 and the inlet sheet 22, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

By this step B, the IC chip 15 and the antenna 16 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 21 and the inlet sheet 22 with almost no gap.
Moreover, the granular material 13 is arrange | positioned in the surface side which contact | connects one surface 21a of the peeling base material 21 in adhesive agent 12A.

Next, as shown in FIG. 5, the laminated body composed of the peeling base material 21, the granular material 13, the adhesive 12 </ b> A, and the inlet sheet 22 is formed in the thickness direction (see FIG. 5), and cuts according to the shape of the antenna 16, and separates the laminate as shown in FIG. 6 (step F).
Here, cutting the laminated body according to the shape of the antenna 16 means cutting the laminated body according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 16.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 7, the release substrate 21 is peeled from the above laminate (step C), and the non-shown in FIG. The contact type data receiving / transmitting body 10 is obtained.

According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, after the non-adhesive powder 13 is dispersed on the peeling base material 21 having the peeling layer, the adhesive 12A and the inlet sheet 22 are After the laminated body and the laminated body are formed and the adhesive 12A is cured, the release base material 21 is peeled off, so that the non-adhesive powder on the one surface (outer surface) 12a side of the covering material 12 The non-contact type data receiving / transmitting body 10 in which a large number of 13 are arranged can be obtained.
Also, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 10 can be easily manufactured. Further, since a member other than the adhesive 12A is not required to cover one surface of the inlet sheet 22, the contactless data receiving / transmitting body 10 having a very thin thickness can be manufactured. The manufacturing cost of the contact-type data receiving / transmitting body 10 can be reduced.

 In addition, in this embodiment, although the case where the above-mentioned non-contact type | mold data receiving / transmitting body 10 is manufactured continuously using the elongate peeling base material 21 and the inlet sheet 22, this invention is shown to this. It is not limited. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process F was performed after the process B was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process C is performed after the process B, and the process F may not be performed.

 Moreover, in this embodiment, after the process B, the process F which cuts the laminated body which consists of the peeling base material 21, the adhesive agent 12A, the granular material 13, and the inlet sheet 22 according to the shape of the antenna 16, and this cutting Although the case where the process C which peels the peeling base material 21 from this laminated body is performed in this order was illustrated, this invention is not limited to this. In the present invention, after step B, step F and step C may be performed in any order. That is, in this invention, after peeling a peeling base material from the laminated body which consists of a peeling base material, an adhesive agent, a granular material, and an inlet sheet in process C, in step F, an adhesive agent, granular material The laminate composed of the body and the inlet sheet may be cut according to the shape of the antenna.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 8 is a schematic cross-sectional view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 50 of this embodiment includes an inlet 51 having a substantially rectangular shape in plan view, a first covering member 53 that covers one surface 51a of the inlet 51, and the other surface 51b of the inlet 51. A second covering material 54 to be covered is schematically configured.
The first covering material 53 and the second covering material 54 may be collectively referred to as a covering material 52.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51a and the other surface 51b) of the inlet 51 are directly covered with the covering material 52, and the first covering material 53, the inlet 51, and the The two coating | covering materials 54 have comprised the structure laminated | stacked in this order in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

A large number of non-adhesive particles 55 are arranged on the side of the first covering material 53 opposite to the surface in contact with the inlet 51 (hereinafter referred to as “one surface (outer surface)”) 53a. .
Here, when the powder body 55 is disposed on the one surface 53 a side of the first covering material 53, the outermost surface 55 a is the same surface as the one surface 53 a of the first covering material 53. As it is, the powder particles 55 are arranged, or part of the powder is buried in the first covering material 53 and the other part protrudes from the one surface 53 a of the first covering material 53. This means that the granules 55 are arranged.
When the powder body 55 is arranged so that the outermost surface 55 a is flush with the one surface 53 a of the first covering material 53, the powder body 55 is placed on the one surface 53 a of the first covering material 53. The outermost surface 55a is exposed.
When the powder body 55 is arranged so as to protrude from the one surface 53a of the first covering material 53, the one surface 53a of the first covering material 53 is an uneven surface caused by the powder body 55. I am doing.

The powder particles 55 are regularly or irregularly arranged on the one surface 53 a side of the first covering material 53.
The powder particles 55 are regularly arranged on the one surface 53a side of the first covering material 53. The powder particles 55 are arranged in substantially the same direction and at almost equal intervals. Say that.
On the other hand, that the powder particles 55 are irregularly arranged means that the powder particles 55 are arranged in irregular directions and intervals on the one surface 53 a side of the first covering material 53. Say.

In addition, a large number of non-adhesive powder particles 56 are arranged on the surface 54 a side opposite to the surface in contact with the inlet 51 of the second covering material 54 (hereinafter referred to as “one surface (outer surface)”). ing.
Here, the powder body 56 is disposed on the one surface 54 a side of the second covering material 54, so that the outermost surface 56 a is flush with the one surface 54 a of the second covering material 54. As it is, the powder particles 56 are disposed, or part of the powder 56 is buried in the second covering material 54 and the other part protrudes from one surface 54 a of the second covering material 54. This means that the particles 56 are arranged.
When the powder body 56 is arranged such that the outermost surface 56a is flush with the one surface 54a of the second covering material 54, the granular material is placed on the one surface 54a of the second covering material 54. The outermost surface 56a of 56 is exposed.
When the powder particles 56 are arranged so as to protrude from the one surface 54 a of the second covering material 54, the one surface 54 a of the second covering material 54 is an uneven surface caused by the powder particles 56. I am doing.

The powder particles 56 are regularly or irregularly arranged on the one surface 54 a side of the second covering material 54.
The fact that the powder particles 56 are regularly arranged means that the powder particles 56 are arranged in substantially the same direction and at substantially equal intervals on the one surface 54 a side of the second covering material 54. Say that.
On the other hand, that the powder particles 56 are irregularly arranged means that the powder particles 56 are arranged in irregular directions and intervals on the one surface 54 a side of the second covering material 54. Say.

The inlet 51 is generally configured by a base material 57 and an IC chip 58 and an antenna 59 which are provided on one surface 57a of the base material 57 and are electrically connected to each other.
The antenna 59 is a dipole antenna composed of a pair of planar radiating elements 60 and 61 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 58) on the facing sides. is there.
The length in the longitudinal direction of the antenna 59 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 60 and 61 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 57 a of the base material 57, and the other surface 51 b of the inlet 51 corresponds to the other surface 57 b of the base material 57.
Therefore, on one surface 51 a of the inlet 51, the IC chip 58 and the antenna 59 are covered with the first covering material 53.

 Then, on the four side surfaces of the non-contact type data transmitting / receiving body 50, the end surface of the first covering material 53, the end surface of the base material 57, and the end surface of the second covering material 54 are the same surface. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 53b of the first covering material 53, the end surface 57c of the base material 57, and the end surface 54b of the second covering material 54 are provided. They are on the same plane. Similarly, the end surface 53c of the first covering material 53, the end surface 57d of the base material 57, and the end surface 54c of the second covering material 54 are the same surface on the side surface 50b of the non-contact type data transmitting / receiving body 50. ing.

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 58 and the antenna 59 of the inlet 51 appears on one surface (outer surface) 50c of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 μm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, and is, for example, in the range of 10 μm to 2000 μm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

 As the powder bodies 55 and 56, the base material 57, the IC chip 58, and the antenna 59, the same ones as those in the first embodiment are used.

In this non-contact type data receiving / transmitting body 50, a large number of non-adhesive powder particles 55 are arranged on one surface (outer surface) 53 a side of the first covering material 53. Since the surface 55a is exposed on the one surface 53a of the first covering material 53, or the one surface 53a of the first covering material 53 is an uneven surface caused by the granular material 55, Even if they are superposed on other similar sheet-like materials (IC tags or the like), they do not adhere to each other and are easy to handle. In addition, since a large number of non-adhesive powder particles 56 are arranged on one surface (outer surface) 54 a side of the second coating material 54, the outermost surface 56 a of the powder particles 56 is the second coating material 54. Or the other surface 54a of the second covering material 54 has an uneven surface caused by the granular material 56, so that other similar sheet-like material (IC Even if they are overlapped with a tag or the like, they are not in close contact with each other and are easy to handle. Therefore, even if a large number of non-contact type data receiving / transmitting bodies 50 are grouped, they are not in close contact with each other and are easy to handle.
In particular, the non-contact type data transmitting / receiving body 50 has one surface 50c and the other surface 50d having tack property (property that can be temporarily fixed) by the covering material 52 made of a two-component mixed urethane resin. However, due to the presence of the powder particles 55 and 56, they do not adhere to each other even if they are overlapped with other similar sheet-like materials.

 Furthermore, the non-contact type data receiving / transmitting body 50 can be easily manufactured because the one surface 51a and the other surface 51b of the inlet 51 are directly covered with the covering material 52. it can.

 In this embodiment, the granular material 55 is disposed on the one surface 53a side of the first covering material 53, and the granular material 56 is disposed on the one surface 54a side of the second covering material 54. However, the present invention is not limited to this. In the present invention, the granular material may be arranged only on one surface side of the first covering material.

 Moreover, in this embodiment, the granular material 55 is arrange | positioned over the substantially whole surface of the one surface 53a of the 1st coating | covering material 53, and the powder over the substantially whole surface of the one surface 54a of the 2nd coating | covering material 54. Although the case where the granular material 56 was arrange | positioned was illustrated, this invention is not limited to this. In the present invention, the non-adhesive powder or particles may be partially disposed on one surface of the covering material, and the amount of the powder or particles disposed (one of the covering materials). The area ratio with respect to the surface is appropriately adjusted according to the tackiness of the adhesive forming the coating material.

Moreover, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 59 which consists of a dipole antenna comprised from a pair of planar radiation elements 60 and 61 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 9-16, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 10, a long inlet in which a large number of RFID antennas 59 and IC chips 58 communicating through the antenna 59 are provided at equal intervals on one surface 57a of the base material 57A. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the sheet 72 is illustrated.

 First, as shown in FIG. 9, non-adhesive powder particles 55 are sprayed on one surface 71 a of a long release substrate 71 conveyed in the direction of the arrow in the drawing, and the powder particles 55. The first adhesion discharged from the nozzle 81 of the adhesive applicator along the conveying direction of the first release substrate 71 to the center of the one surface 71a of the first release substrate 71 via The agent 53A is applied linearly (step A).

As the first adhesive 53A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the first adhesive 53A to the one surface 71a of the first release substrate 71, that is, the application amount of the first adhesive 53A to the one surface 71a of the first release substrate 71. Although there is no particular limitation, the size and number of IC chips 58 and antennas 59 provided on the inlet sheet 72 and the first adhesive 53A, which are covered with the first adhesive 53A, are cured. According to the thickness etc. which are required for the first covering material 53 to be adjusted, it is appropriately adjusted.

 The amount of the powder particles 55 sprayed onto the one surface 71a of the first peeling substrate 71 is not particularly limited, but the first coating material 53 formed by curing the first adhesive 53A has a stickiness. In consideration, the non-contact type data receiving / transmitting body 50 finally obtained is appropriately adjusted to such an extent that it can be prevented from sticking to each other due to the adhesiveness of the first covering material 53.

As the 1st peeling base material 71, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 71 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the first release substrate 71, a release layer (not shown) forming one surface 71a of the first release substrate 71 is used. The first adhesive 53A is applied on the top.

 Next, as shown in FIG. 10, the inlet sheet 72 conveyed in the direction of the arrow in the drawing is moved to the first peeling group at the opposing portion of the pair of rollers 82 and 83 that rotate in the direction of the arrow in the drawing. The first adhesive 71A applied to one surface 71a of the material 71 is overlaid on the one surface 71a of the first peeling substrate 71 being conveyed in the direction of the arrow in the drawing, and the first As shown in FIG. 11, the first release substrate 71 and the inlet sheet 72 are sandwiched between the first release substrate 71 and the inlet sheet 72 as shown in FIG. The first adhesive 53A applied to one surface 71a of 71 is developed (step B).

 In this process B, one surface 57a of the base material 57A, that is, the surface of the inlet sheet 72 on which the IC chip 58 and the antenna 59 are provided (hereinafter referred to as “one side”) The inlet sheet 72 is overlaid on one surface 71a of the first release substrate 71 so that the surfaces 72a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 71 and the inlet sheet 72. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. Thus, the one surface 72a of the inlet sheet 72, and the IC chip 58 and the antenna 59 provided on the one surface 72a are covered with the first adhesive 53A, and the first peeling substrate 71 An inlet sheet 72 is temporarily fixed on one surface 71a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first peeling substrate 71 and the inlet sheet 72 is caused by at least the IC chip 58 and the antenna 59 of the inlet sheet 72. The degree of unevenness does not appear on the surface 53a opposite to the surface in contact with the inlet sheet 72 of the first adhesive 53A, and the IC chip 58 and the antenna 59 are not damaged by an external impact. The range is 10 μm to 2000 μm.

Further, in step B, a force for sandwiching the first release substrate 71 and the inlet sheet 72 between the pair of rollers 82 and 83, that is, pressing the inlet sheet 72 in the thickness direction against the first release substrate 71. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 71 and the inlet sheet 72, the coating amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

By this step B, the IC chip 58 and the antenna 59 are completely covered with the first adhesive 53A, and the first adhesive 53A is almost completely spaced between the first peeling substrate 71 and the inlet sheet 72. Filled.
Moreover, the granular material 55 is arrange | positioned in the surface side which contact | connects the one surface 71a of the 1st peeling base material 71 in the 1st adhesive agent 53A.

 Next, as shown in FIG. 12, while transporting the laminated body α composed of the first peeling base material 71 and the inlet sheet 72 in the direction of the arrow in the figure, the side opposite to the one surface 72 a of the inlet sheet 72. A surface (hereinafter referred to as “the other surface”) 72b, that is, the central portion of the other surface 57b of the base material 57A is discharged from the nozzle 84 of the adhesive application device along the transport direction of the laminate α. The second adhesive 54A is applied linearly (step D).

As the second adhesive 54A, the same adhesive as that used to form the covering material 52 is used.
Further, the width of applying the second adhesive 54A to the other surface 72b of the inlet sheet 72, that is, the application amount of the second adhesive 54A to the other surface 57b of the base material 57A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 12, the second release substrate 73 is conveyed in the direction of the arrow in the drawing, and the non-adhesive granular material 56 is dispersed on the release layer forming one surface 73 a. It is conveyed in the direction of the arrow in the figure through the second adhesive 54A applied to the other surface 72b of the inlet sheet 72 at the opposing portion of the pair of rollers 85, 86 rotating in the direction of the arrow. 13 is stacked on the other surface 72b of the inlet sheet 72 constituting the laminated body α and sandwiched between the laminated body α and the second release substrate 73 with rollers 85 and 86, as shown in FIG. The second adhesive 54A applied to the other surface 72b of the inlet sheet 72 is developed over almost the entire area between the body α and the second release substrate 73 (step E), and the first release substrate 71 is thus developed. And the second release substrate 73, Granules 55, the first adhesive 53A, inlet sheet 72, the second adhesive 54A and granular material 56, laminated in this order, to form a laminate β which is integrated.

 As the 2nd peeling base material 73, the thing similar to said 1st peeling base material 71 is used. That is, one surface 73a of the second release substrate 73 is composed of a release layer made of silicon.

 In this step E, since the above-described release film or release paper is used as the second release substrate 73, one surface 73a of the second release substrate 73 is formed on the other surface 72b of the inlet sheet 72. The second release substrate 73 is overlaid on the other surface 72b of the inlet sheet 72 so that the formed release layers (not shown) face each other.

 In Step E, as described above, the second adhesive 54A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 54A has fluidity until it is developed between the laminate α and the second release substrate 73. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. Thereby, the other surface 72b of the inlet sheet 72 is covered with the second adhesive 54A, and the second peeling base material 73 is temporarily fixed on the laminate α. When the second adhesive 54A is cured, the second covering material 54 is obtained.

 In Step E, the thickness of the second adhesive 54 </ b> A after being developed between the laminate α and the second release substrate 73 is the same as that of the first release substrate 71 in Step B described above. The thickness is the same as the thickness of the first adhesive 53 </ b> A after being spread between the inlet sheets 72, for example, in the range of 10 μm to 1000 mm.

Moreover, in the process E, the force which pinches | interposes the laminated body (alpha) and the 2nd peeling base material 73 with a pair of rollers 85 and 86, ie, presses the 2nd peeling base material 73 to the thickness direction with respect to the inlet sheet 72. The force (pressure) is not particularly limited and is appropriately adjusted according to the thickness and size of the laminate α and the second release substrate 73, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 Furthermore, in this process E, as a method of spraying the non-adhesive granular material 56 on the peeling layer which forms one surface 73a of the second peeling base material 73, one of the second peeling base materials 73 is used. The surface of the surface 73a is charged and the particles 56 are adsorbed by the electric charge (static electricity), and the surface of the second release substrate 73 is adhered to the surface of the second surface 73a by using an adhesive with weak adhesion. For example, a method of adhering the adhesive is used.

By this step E, the second adhesive 54 </ b> A is filled between the laminate α and the second release substrate 73 with almost no gap.
Moreover, the granular material 56 is arrange | positioned in the surface side which contact | connects one surface 73a of the 2nd peeling base material 73 in 2nd adhesive agent 54A.

Next, as shown in FIG. 14, the first peeling substrate 71, the granular material 55, the first adhesive 53 </ b> A, the inlet sheet 72, and the second adhesive 54 </ b> A are cut by a cutting blade (not shown) of the cutting device. 15 is cut in the thickness direction (along the one-dot chain line in FIG. 14) in accordance with the shape of the antenna 59, and shown in FIG. As described above, the laminate γ is separated into pieces (step F).
Here, cutting the laminated body γ according to the shape of the antenna 59 means cutting the antenna 59 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 59.

 Next, after the first adhesive 53A is completely cured to become the first covering material 53, and the second adhesive 54A is completely cured to become the second covering material 54, FIG. As shown, the first peeling base material 71 and the second peeling base material 73 are peeled from the laminate γ (step C) to obtain the non-contact type data receiving / transmitting body 50 shown in FIG.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, after the non-sticky granular material 55 is sprayed on the first release substrate 71 having the release layer, the first adhesive 53A and the inlet sheet 72 are further laminated, and after the second adhesive 54A is applied on the inlet sheet 72, the second peeling substrate 73 in which the powder 56 is dispersed on the peeling layer is laminated, After these are integrated and the first adhesive 53A and the second adhesive 54A are cured, the first peeling base 71 and the second peeling base 73 are peeled off. A large number of non-adhesive powder particles 55 are arranged on one surface 53a side, and a large number of non-adhesive powder particles 56 are arranged on one surface 54a side of the second covering material 54. The contact-type data receiving / transmitting body 50 can be obtained.

 Also, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 50 can be easily manufactured. Further, since no member other than the first adhesive 53A and the second adhesive 54A is required to cover both surfaces of the inlet sheet 72, the non-contact type data receiving / transmitting body 50 having a very thin thickness is manufactured. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body 50 can be reduced.

 In this embodiment, in Step E, after spraying the granular material 56 on the release layer that forms one surface 73a of the second release substrate 73, the second release substrate 73 is used as the inlet sheet 72. Although the case where it piled up on the other surface 72b of this was illustrated, this invention is not limited to this. In the present invention, in the step E, the surface of the release substrate opposite to the surface on which the IC chip is provided is disposed on the release layer of the release substrate without spraying powder particles. It may be superimposed on top.

 Moreover, in this embodiment, the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the long first peeling base material 71, the inlet sheet 72, and the second peeling base material 73. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process F was performed after the process E was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process C is performed after the process E, and the process F may not be performed.

 Moreover, in this embodiment, after the process E, the 1st peeling base material 71, the granular material 55, the 1st adhesive agent 53A, the inlet sheet 72, the 2nd adhesive agent 54A, the granular material 56, and the 2nd The step F for cutting the laminate γ composed of the peeling substrate 73 in accordance with the shape of the antenna 59 and the first peeling substrate 71 and the second peeling substrate 73 are peeled from the cut laminate γ. However, the present invention is not limited to this. In the present invention, after step E, step F and step C may be performed in random order. That is, in the present invention, in Step C, a laminate comprising the first release substrate, the powder, the first adhesive, the inlet sheet, the second adhesive, and the second release substrate. Then, after peeling the first peeling substrate and the second peeling substrate, in Step F, the laminate composed of the powder, the first adhesive, the inlet sheet, and the second adhesive is used as the antenna. You may cut | judge according to a shape.

DESCRIPTION OF SYMBOLS 10 ... Non-contact-type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13 ... Granules, 14, 14A ... Base material, 15 ... IC chip, 16 ... antenna, 17,18 ... radiating element, 21 ... peeling substrate, 22 ... inlet sheet, 31 ... nozzle, 32,33 ... roller, 50 ... Non-contact type data transmitting / receiving body, 51 ... Inlet, 52 ... Covering material, 53 ... First covering material, 53A ... First adhesive, 54 ... First Second coating material, 54A, second adhesive, 55, 56, powder, 57, 57A, base material, 58, IC chip, 59, antenna, 60, 61 ... Radiation element, 71 ... First release substrate, 72 ... Inlet sheet, 73 ... Second release substrate, 1,84 ... nozzle, 82,83,85,86 ... roller.

Claims (4)

A non-contact type data receiving / transmitting body comprising: an inlet; and a covering material that covers at least a surface of the inlet on which the IC chip is provided.
The coating material is made of a two-component curable urethane-based adhesive, and the coating material is in contact with the inlet and a non-adhesive powder or granule-free layer in contact with the inlet. A non-contact type data transmitting / receiving body comprising a surface opposite to the surface and a layer containing the powder or the granular material in the vicinity thereof . An inlet and a coating material that covers at least a surface of the inlet on which the IC chip is provided. The coating material is made of a two-component curable urethane adhesive, and at least the surface of the coating material that contacts the IC chip. A method for producing a non-contact type data receiving / transmitting body in which non-adhesive powder or particles are arranged on the opposite surface side,
A non-adhesive powder or granule is sprayed on the release layer forming one surface of the release substrate, and the two-part curable urethane system is applied to the release layer via the powder or granule. Step A for applying an adhesive composed of an adhesive;
Via the adhesive applied to the release substrate, the surface on which the IC chip in the inlet is provided is superimposed on one surface of the release substrate, and the inlet is pressed against the release substrate. Step B for developing the adhesive between the release substrate and the inlet,
And a step C of peeling the peeling substrate. A method for producing a non-contact type data transmitting / receiving body. Between Step B and Step C,
Furthermore, a step D of applying an adhesive made of a two-component curable urethane-based adhesive on the surface of the inlet opposite to the surface on which the IC chip is provided;
Through the adhesive applied to the inlet, the release substrate is overlaid on the surface of the inlet opposite to the surface on which the IC chip is provided, so that the release layer forming one surface is opposed, Step E for expanding the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. The method for manufacturing a non-contact type data receiving / transmitting body according to claim 2, wherein:   In the step E, after the non-adhesive powder or particles are dispersed on the release layer of the release substrate, the release substrate is disposed on the side opposite to the surface on which the IC chip is provided in the inlet. The method for manufacturing a non-contact type data receiving / transmitting body according to claim 3, wherein the method is superposed on a surface.

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