JP5690513B2 - Method for manufacturing contactless data receiving / transmitting body - Google Patents

Description

The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). of relates to a manufacturing method, in particular, even when superimposed, without having to contact each other, a method of manufacturing easy to handle non-contact type data reception and transmission body.

  An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, a sheet-like IC tag is known in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated ( For example, see Patent Document 1).

When such a sheet-like IC tag is superposed on another sheet-like IC tag of the same type, they are in close contact with each other and are difficult to peel off and are difficult to handle.
Therefore, in order to prevent the sheet-like IC tags from being in close contact with each other, it is sufficient that these IC tags have shapes that do not overlap each other. Thus, as a sheet-like IC tag having a shape that does not overlap each other, for example, an IC tag having a slight twist with the longitudinal direction as a rotation axis is known (for example, Patent Documents). 2).

JP 2005-056362 A JP-A-8-315264

  However, the IC tag known in Patent Document 2 is used by being inserted into a gap in a package that wraps a fixed-shaped object. It was restrained from being caught inside the package and falling out of the gap. That is, the twist applied to the IC tag is not permanent, and when an external force is applied, the IC tag may easily return to a flat state. When the IC tag returns to a flat state as described above, it may be in close contact with other IC tags.

  The present invention has been made in view of the above circumstances, and provides a non-contact type data receiving / transmitting body that is easy to handle without being in close contact with another sheet-like IC tag even when superimposed on another sheet-like IC tag. For the purpose.

The method of manufacturing the non-contact type data reception and transmission body of the present invention, the inlet and, Ri Na and and a coating material covering a surface of at least the IC chip is provided in the inlet, the outer edge portion, partially plurality a bent portion and / or a non-contact type data reception and transmission body manufacturing method of the undulating portion is provided, on the release layer constituting one surface of the release substrate, a two-component curing type urethane-based adhesive Overlaying the surface provided with the IC chip in the inlet sheet on one surface of the release substrate via the adhesive applied to the release substrate and the step A for applying the adhesive By pressing the inlet sheet against the peeling substrate, the adhesive B is developed between the peeling substrate and the inlet sheet, and after the adhesive is cured, the peeling substrate The adhesive And a step D of peeling the release substrate from the laminate including at least the inlet sheet, and a step G of exposing the release substrate to a high temperature and high humidity environment for a predetermined time after peeling the release substrate from the laminate. It is characterized by having .

Between the step B and the step G, a step E of applying an adhesive composed of a two-component curable urethane-based adhesive to a surface opposite to the surface on which the IC chip is provided in the inlet sheet; Through the adhesive applied to the inlet sheet, a release substrate is placed on the surface of the inlet sheet opposite to the surface on which the IC chip is provided, so that the release layer forming one surface faces the surface. By overlapping and pressing the release substrate against the inlet sheet, the adhesive is provided between the surface of the inlet sheet opposite to the surface on which the IC chip is provided and the release substrate. It is preferable to have the process F which expand | deploys .

 According to the non-contact type data transmitting / receiving body of the present invention, an inlet and a covering material that covers both surfaces of the inlet are provided, and a plurality of bent portions and / or undulating portions are partially provided on the outer edge portion. Since it is provided, even if it is overlapped with another sheet-like IC tag, it does not adhere to each other, so that it is easy to handle.

It is the schematic which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a perspective view, (b) is sectional drawing which follows the AA line of (a). It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the BB line of FIG. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is the schematic which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a perspective view, (b) is sectional drawing which follows the CC line of (a). It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, it is a schematic sectional drawing which shows the process B and follows the DD line | wire of FIG. It is a schematic perspective view which shows the process E and the process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process F is shown and it is a schematic sectional drawing in alignment with the EE line of FIG. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

An embodiment of the non-contact type data receiving / transmitting body of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
1A and 1B are schematic views showing a first embodiment of a non-contact type data receiving / transmitting body of the present invention, wherein FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view taken along line AA of FIG. It is. In FIG. 1B, a bent portion and a undulating portion, which will be described later, are omitted for ease of explanation.
The non-contact type data receiving / transmitting body 10 of this embodiment includes an inlet 11 having a substantially rectangular shape in plan view, a covering material 12 covering one surface 11a of the inlet 11, and an outer edge portion along the longitudinal direction of the inlet 11. The plurality of bent portions 20 and 21 and the undulating portions 22, 23, 24, and 25 are partially provided.

 That is, the non-contact type data receiving / transmitting body 10 has a structure in which one surface 11 a of the inlet 11 is directly covered with the covering material 12 and the covering material 12 and the inlet 11 are laminated. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

The inlet 11 is generally configured by a base material 13 and an IC chip 14 and an antenna 15 which are provided on one surface 13a of the base material 13 and are electrically connected to each other.
The antenna 15 is a dipole antenna composed of a pair of planar radiating elements 16 and 17 which are made of various conductors, face each other, and have feeding points (portions connected to the IC chip 14) on the opposite sides. is there.
The length in the longitudinal direction of the antenna 15 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 16 and 17 is a length corresponding to a quarter wavelength.

The one surface 11 a of the inlet 11 corresponds to the one surface 13 a of the base material 13.
Therefore, on one surface 11 a of the inlet 11, the IC chip 14 and the antenna 15 are covered with the covering material 12.

 And the end surface of the covering material 12 and the end surface of the base material 13 form the same surface on the four side surfaces of the non-contact type data transmitting / receiving body 10. More specifically, for example, the end surface 12 a of the covering material 12 and the end surface 13 c of the base material 13 are flush with each other on the side surface 10 a of the non-contact type data transmitting / receiving body 10. Similarly, the end surface 12b of the covering material 12 and the end surface 13d of the base material 13 are flush with each other on the side surface 10b of the non-contact type data transmitting / receiving body 10.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 14 and the antenna 15 of the inlet 11 does not appear on one surface (outer surface) 10c of the non-contact type data transmitter / receiver 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 mm.

Further, the bent portions 20 and 21 in the non-contact type data transmitting / receiving body 10 are relatively small in a laminated body composed of the covering material 12 and the inlet 11 (hereinafter, this laminated body is simply referred to as “laminated body A1”). The curvature is a portion that is curved along the longitudinal direction of the inlet 11, that is, the outer edge of the non-contact type data receiving / transmitting body 10.
In the bent portions 20 and 21, the hardness of the two-component mixed urethane resin forming the coating material 12 described later is based on the hardness of other portions (the portions other than the bent portion or the undulating portion in the non-contact type data receiving / transmitting body 10). Is also high. As will be described later, the bent portions 20 and 21 are formed by exposing the laminate A1 once formed in a sheet shape (planar) to a high temperature and high humidity environment for a predetermined time. In particular, while shrinking along the longitudinal direction, the curing reaction of the two-component mixed urethane resin forming the covering material 12 is further promoted in the contracted portion of the laminate A1, and the hardness is partially increased. Part. Here, the phenomenon that the curing reaction further accelerates is due to the reaction of a small amount of unreacted components of the two-component mixed urethane resin contained in the coating material 12. Therefore, even when an external force is applied, the bent portions 20 and 21 are not easily deformed and returned to a flat state, and the shape thereof is permanently maintained. Further, the bent portions 20 and 21 are prominently formed at the outer edge portion that is most susceptible to heat when the laminate A1 is exposed to a high temperature and high humidity environment.

 The curvature of the bent portions 20 and 21 is not particularly limited. For example, when the non-contact type data receiving / transmitting body 10 is viewed, a portion that is significantly curved is referred to as a bent portion.

On the other hand, the undulating portions 22, 23, 24, 25 in the non-contact type data receiving / transmitting body 10 are such that the laminate A 1 has a relatively large curvature and the longitudinal direction of the inlet 11, that is, the non-contact type data receiving / transmitting body 10. The outer edge portion is a portion curved along the longitudinal direction.
Even in the undulating portions 22, 23, 24, 25, the hardness of the two-component mixed urethane resin that forms the coating material 12 described later has other portions (the portions other than the bent portion or the undulating portion in the non-contact type data receiving / transmitting body 10). ) Is higher than the hardness. As will be described later, the undulating portions 22, 23, 24, and 25 are laminated by exposing the laminated body A1 once made into a sheet (planar) to a high temperature and high humidity environment for a predetermined time. The body A1 partially contracts along the longitudinal direction, and the curing reaction of the two-component mixed urethane resin forming the covering material 12 is further promoted in the contracted part of the laminate A1, and partially This is the part where the hardness is high. Here, the phenomenon that the curing reaction further accelerates is due to the reaction of a small amount of unreacted components of the two-component mixed urethane resin contained in the coating material 12. Therefore, even if external force is applied, the undulating portions 22, 23, 24, and 25 are not easily deformed to return to a flat state, and the shape thereof is permanently maintained. Further, the undulating portions 22, 23, 24, 25 are formed remarkably at the outer edge portion that is most susceptible to heat when the laminate A1 is exposed to a high temperature and high humidity environment.

 The curvature of the undulations 22, 23, 24, 25 is not particularly limited. For example, when the non-contact type data receiving / transmitting body 10 is visually observed, the curvature is slightly curved or hill-shaped. That part is called the undulating part.

 Further, as described above, the bent portions 20, 21 and the undulating portions 22, 23, 24, 25 are mainly formed at the outer edge portion of the non-contact type data receiving / transmitting body 10, so that the antenna 15 is provided. Since it is not extremely curved, communication characteristics such as the resonance frequency of the antenna 15 are not deteriorated.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

 As the substrate 13, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 14 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 15. A non-contact IC tag, a non-contact IC label, or a non-contact IC card can be used. Anything can be used as long as it is applicable to RFID media.

 The antenna 15 is formed on one surface 13a of the base material 13 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 15 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 15 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 15 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 15 include copper plating, silver plating, gold plating, and platinum plating.

Since the non-contact type data receiving / transmitting body 10 is provided with a plurality of bent portions 20 and 21 and undulating portions 22, 23, 24, and 25 partially along the longitudinal direction at the outer edge portion thereof. Even if they are superposed on other sheet-like IC tags, they do not adhere to each other, and are easy to handle. Therefore, even if a large number of contactless data receiving / transmitting bodies 10 are grouped, they are not in close contact with each other and are easy to handle.
In particular, the non-contact type data receiving / transmitting body 10 has one surface 10c having a tack property (property that can be temporarily fixed) by the covering material 12 made of a two-component mixed urethane resin. , 21 and the undulating portions 22, 23, 24, 25 are not adhered to each other even when they are overlapped with the same type of IC tag.

 In addition, since one surface 11a of the inlet 11 is directly covered with the coating material 12 made of a two-component mixed urethane resin, the coating material 12 is uneven due to the IC chip 14 and the antenna 15 constituting the inlet 11. Since it is formed following the shape, the adhesiveness between the inlet 11 and the covering material 12 is excellent, and peeling at the interface between the inlet 11 and the covering material 12 can be prevented. Therefore, the non-contact type data receiving / transmitting body 10 is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 11.

 Furthermore, since the non-contact type data receiving / transmitting body 10 has a simple configuration in which the one surface 11a of the inlet 11 is directly covered with the covering material 12, it can be easily manufactured.

 In this embodiment, the case where the bent portions 20, 21 and the undulating portions 22, 23, 24, 25 are distinguished by their curvatures is illustrated, but the present invention is not limited to this. In the present invention, the difference between the bent portion and the undulating portion is not strictly defined.

Further, in this embodiment, the non-contact type data receiving / transmitting body 10 provided with the bent portions 20, 21 and the undulating portions 22, 23, 24, 25 is illustrated, but the present invention is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, either one of the bent portion or the undulating portion, or both the bent portion and the undulating portion may be provided, and the number thereof is not limited. The number of bent portions and / or undulations provided in the non-contact type data receiving / transmitting body is appropriately adjusted according to the size of the non-contact type data receiving / transmitting body, the tackiness of the covering material, and the like.
Moreover, in this embodiment, the case where the bent parts 20 and 21 and the undulating parts 22, 23, 24, and 25 are provided in the outer edge part of the non-contact type data receiving / transmitting body 10 along the longitudinal direction. Although illustrated, this invention is not limited to this. In the non-contact type data receiving / transmitting body of the present invention, a bent portion and / or a undulating portion may be provided along the short direction at the outer edge of the non-contact type data receiving / transmitting body.

 Moreover, in this embodiment, although the case where the non-contact type data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.

 Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 15 which consists of a dipole antenna comprised from a pair of planar radiation elements 16 and 17 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 1-7, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 3, a long base material 13A and one surface 13a thereof are provided with a large number of RFID antennas 15 and IC chips 14 communicating through the antenna 15 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is continuously manufactured using the inlet sheet 32 will be exemplified.

 First, as shown in FIG. 2, an adhesive is applied to the central portion of one surface 31 a of the long release substrate 31 being conveyed in the direction of the arrow in the drawing along the conveyance direction of the release substrate 31. The adhesive 12A discharged from the nozzle 41 of the apparatus is applied in a line (step A).

As adhesive 12A, the thing similar to the adhesive which forms said coating | covering material 12 is used.
Further, the width of the adhesive 12A applied to the one surface 31a of the release substrate 31, that is, the amount of the adhesive 12A applied to the one surface 31a of the release substrate 31 is not particularly limited, but the adhesive 12A Appropriate adjustments are made according to the size and number of the IC chip 14 and antenna 15 provided on the inlet sheet 32 to be coated, the thickness required for the covering material 12 formed by curing the adhesive 12A, and the like. Is done.

As the release substrate 31, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 31a of the peeling substrate 31 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero separator SP-PET-01-BU (trade name) manufactured by Tosero Co., Ltd.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used. That is, one surface 31a of the peeling substrate 31 is composed of a peeling layer made of silicon.
Specific examples of such release paper include, for example, L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 31 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 31, the adhesive is formed on the release layer (not shown) forming one surface 31a of the release substrate 31. Apply 12A.

 Next, as shown in FIG. 3, the inlet sheet 32 conveyed in the direction of the arrow in the drawing is the portion of the peeling substrate 31 that is opposed to the pair of rollers 42 and 43 that rotate in the direction of the arrow in the drawing. While superposing on the one surface 31a of the peeling base material 31 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 31a, the peeling base material 31 and the inlet sheet 32 are placed on the roller 42. , 43, the adhesive 12A applied to one surface 31a of the release substrate 31 is spread over substantially the entire area between the release substrate 31 and the inlet sheet 32 (step B), as shown in FIG. ).

 In this step B, one surface 13a of the substrate 13A, that is, the surface of the inlet sheet 32 on which the IC chip 14 and the antenna 15 are provided (hereinafter referred to as “one surface”) The inlet sheet 32 is overlaid on the one surface 31a of the peeling substrate 31 so that the 32a faces.

 Further, in the process B, as described above, the adhesive 12A made of a two-component mixed urethane resin that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is developed between the release substrate 31 and the inlet sheet 32, but gradually loses fluidity as the reaction proceeds, and finally Harden. Thus, the one surface 32a of the inlet sheet 32, and the IC chip 14 and the antenna 15 provided on the one surface 32a are covered with the adhesive 12A, and on the one surface 31a of the peeling substrate 31. The inlet sheet 32 is temporarily secured. When the adhesive 12A is cured, the first covering material 12 is obtained.

 Further, in step B, the thickness of the adhesive 12A after being developed between the peeling base material 31 and the inlet sheet 32 is at least uneven by the IC chip 14 and the antenna 15 of the inlet sheet 32. The IC chip 14 and the antenna 15 are not damaged on the surface 12c opposite to the surface in contact with the inlet sheet 32, and are not damaged by an external impact, for example, within a range of 10 μm to 2000 mm. .

In Step B, the force for sandwiching the release substrate 31 and the inlet sheet 32 between the pair of rollers 42 and 43, that is, the force (pressure) for pressing the inlet sheet 32 in the thickness direction against the release substrate 31 is is not particularly limited, the thickness or size of the release substrate 31 and the inlet sheet 32, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 14 and the antenna 15 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 31 and the inlet sheet 32 with almost no gap.

Next, as shown in FIG. 5, the laminated body composed of the peeling base material 31, the adhesive 12 </ b> A and the inlet sheet 32 is formed in the thickness direction thereof (in the dashed line in FIG. 5) by a cutting blade (not shown) of the cutting device. Along) according to the shape of the antenna 15, and as shown in FIG. 6, the laminate is singulated (step C).
Here, cutting the laminated body according to the shape of the antenna 15 means cutting the laminated body according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 15.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 7, the peeling base material 31 is peeled from the above laminate (step D), and the covering material 12 and the inlet A laminate B1 made of the sheet 32 (inlet 11) is obtained.

 Next, the laminate B1 is exposed to an environment having a temperature of 80 to 90 ° C. and a humidity of 75 to 95% RH for 168 hours (24 hours × 7 days) or more, whereby the non-contact type data receiving / transmitting body shown in FIG. Get 10.

 That is, when the laminate B1 is exposed to an environment having a temperature of 80 to 90 ° C. and a humidity of 75 to 95% RH for 168 hours (24 hours × 7 days) or more, the laminate B1 is partially along the longitudinal direction. In the contracted portion of the laminate B1, the curing reaction of the adhesive 12A that forms the covering material 12 is further promoted, and the bent portions 20 and 21 and the undulating portions 22 that are partially hardened. The non-contact type data receiving / transmitting body 10 having 23, 24 and 25 is obtained.

 The conditions (temperature, humidity) of the high temperature and high humidity environment to which the laminate B1 is exposed are not particularly limited, and the bent portions 20 and 21 and the undulating portions 22 formed on the non-contact type data receiving / transmitting body 10 are not limited. According to the curvature of 23, 24, 25, the material of the adhesive 12A, the material of the inlet sheet 32, etc., it adjusts suitably.

 In addition, in this embodiment, although the case where the above-mentioned non-contact type | mold data receiving / transmitting body 10 is manufactured continuously using the elongate peeling base material 31 and the inlet sheet 32, this invention is shown to this. It is not limited. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process C was performed after the process B was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process D is performed after the process B, and the process C may not be performed.

 Further, in this embodiment, after step B, the laminate composed of the release substrate 31, the adhesive 12A and the inlet sheet 32 is cut according to the shape of the antenna 15 and the cut laminate. Although the case where the process D which peels the peeling base material 31 is performed in this order was illustrated, this invention is not limited to this. In the present invention, after step B, step C and step D may be performed in any order. That is, in the present invention, in Step D, after peeling the release substrate from the laminate comprising the release substrate, the adhesive and the inlet sheet, in Step C, the laminate comprising the adhesive and the inlet sheet. The body may be cut according to the shape of the antenna.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 8 is a schematic view showing a second embodiment of the non-contact type data receiving / transmitting body of the present invention, where (a) is a perspective view, and (b) is a cross-sectional view taken along the line CC of (a). It is. In FIG. 8B, a bent portion and a undulating portion to be described later are omitted in order to simplify the description.
The non-contact type data transmitting / receiving body 50 of this embodiment includes an inlet 51 having a substantially rectangular shape in plan view, a first covering member 53 that covers one surface 51a of the inlet 51, and the other surface 51b of the inlet 51. The second covering material 54 to be covered, and a plurality of bent portions 60 and 61 and undulating portions 62, 63, 64, and 65 partially provided along the longitudinal direction of the inlet 51 at the outer edge portion, are schematically illustrated. It is configured.

The first covering material 53 and the second covering material 54 may be collectively referred to as a covering material 52.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51a and the other surface 51b) of the inlet 51 are directly covered with the covering material 52, and the first covering material 53, the inlet 51, and the The two coating | covering materials 54 have comprised the structure laminated | stacked in this order in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

The inlet 51 is generally configured by a base 55 and an IC chip 56 and an antenna 57 which are provided on one surface 55a of the base 55 and are electrically connected to each other.
The antenna 57 is a dipole antenna composed of a pair of planar radiating elements 58 and 59 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 56) on the facing sides. is there.
The length in the longitudinal direction of the antenna 57 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 58 and 59 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 55 a of the base material 55, and the other surface 51 b of the inlet 51 corresponds to the other surface 55 b of the base material 55.
Therefore, the IC chip 56 and the antenna 57 are covered with the first covering member 53 on the one surface 51 a of the inlet 51.

 Then, on the four side surfaces of the non-contact type data transmitting / receiving body 50, the end surface of the first covering material 53, the end surface of the base material 55, and the end surface of the second covering material 54 form the same surface. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 53a of the first covering material 53, the end surface 55c of the base material 55, and the end surface 54a of the second covering material 54 are the same surface. I am doing. Similarly, on the side surface 50b of the non-contact type data transmitting / receiving body 50, the end surface 53b of the first covering material 53, the end surface 55d of the base material 55, and the end surface 54b of the second covering material 54 form the same surface. .

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 56 and the antenna 57 of the inlet 51 appears on one surface (outer surface) 50 c of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

Further, the bent portions 60 and 61 in the non-contact type data transmitting / receiving body 50 are a laminated body composed of the first covering material 53, the inlet 51 and the second covering material 54 (hereinafter, this laminated body is simply referred to as “laminated body”). A2 ”) is a portion having a relatively small curvature and curved along the longitudinal direction of the inlet 51, that is, the outer edge of the non-contact type data receiving / transmitting body 50.
In the bent portions 60 and 61, the hardness of the two-component mixed urethane resin forming the first covering material 53 and the second covering material 54 described later is the other portion (the bent portion in the non-contact type data receiving / transmitting body 50. Or it is higher than the hardness of the portion other than the undulating portion). As will be described later, the bent portions 60 and 61 are formed by exposing the laminate A2 once produced in a sheet shape (planar) to a high temperature and high humidity environment for a predetermined time. In particular, the curing reaction of the two-component mixed urethane resin which contracts along the longitudinal direction and forms the first coating material 53 and the second coating material 54 at the contracted portion of the laminate A2 is further performed. It is a part that is promoted and partially hardened. Here, the phenomenon that the curing reaction further accelerates is due to the reaction of a small amount of unreacted components of the two-component mixed urethane resin contained in the first coating material 53 and the second coating material 54. Therefore, even if an external force is applied, the bent portions 60 and 61 are not easily deformed to return to a flat state, and the shape is permanently maintained. Further, the bent portions 60 and 61 are prominently formed at the outer edge portion that is most susceptible to heat when the laminate A2 is exposed to a high temperature and high humidity environment.

 The curvature of the bent portions 60 and 61 is not particularly limited. For example, when the non-contact type data receiving / transmitting body 50 is viewed, a portion that is significantly curved is referred to as a bent portion.

On the other hand, the undulating portions 62, 63, 64, 65 in the non-contact type data receiving / transmitting body 50 have a relatively large curvature of the laminate A2, and the longitudinal direction of the inlet 51, that is, the non-contact type data receiving / transmitting body 50. The outer edge portion is a portion curved along the longitudinal direction.
Also in the undulating portions 62, 63, 64, 65, the hardness of the two-component mixed urethane resin forming the first covering material 53 and the second covering material 54 described later is the other portion (non-contact type data transmitting / receiving body). It is higher than the hardness of the bent portion or the undulating portion at 50). As will be described later, the undulating portions 62, 63, 64, 65 are laminated by exposing the laminated body A2 once made into a sheet (planar) to a high temperature and high humidity environment for a predetermined time. The body A2 partially contracts along the longitudinal direction thereof, and the two-component mixed urethane resin that forms the first coating material 53 and the second coating material 54 in the contracted portion of the laminate A2. This is a portion where the curing reaction is further accelerated and the hardness is partially increased. Here, the phenomenon that the curing reaction further accelerates is due to the reaction of a small amount of unreacted components of the two-component mixed urethane resin contained in the first coating material 53 and the second coating material 54. Therefore, the undulating portions 62, 63, 64, 65 are not easily deformed even when an external force is applied, and do not return to a flat state, and the shape thereof is permanently maintained. In addition, the undulating portions 62, 63, 64, and 65 are conspicuously formed at the outer edge portion that is most susceptible to heat when the laminate A2 is exposed to a high temperature and high humidity environment.

 The curvature of the undulating portions 62, 63, 64, 65 is not particularly limited. For example, when the non-contact type data receiving / transmitting body 50 is visually observed, the curvature is slightly curved or hill-shaped. That part is called the undulating part.

 In addition, as described above, the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65 are mainly formed at the outer edge portion of the non-contact type data receiving / transmitting body 50. Since it is not extremely curved, the communication characteristics such as the resonance frequency of the antenna 57 are not deteriorated.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

 As the base material 55, the IC chip 56, and the antenna 57, those similar to those in the first embodiment described above are used.

Since this non-contact type data receiving / transmitting body 50 is provided with a plurality of bent portions 60, 61 and undulating portions 62, 63, 64, 65 partially along the longitudinal direction at the outer edge portion thereof. Even if they are superposed on other sheet-like IC tags, they do not adhere to each other, and are easy to handle. Therefore, even if a large number of non-contact type data receiving / transmitting bodies 50 are grouped, they are not in close contact with each other and are easy to handle.
In particular, the non-contact type data transmitting / receiving body 50 has one surface 50c and the other surface 50d having tack property (property that can be temporarily fixed) by the covering material 52 made of a two-component mixed urethane resin. Therefore, due to the presence of the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65, they do not adhere to each other even if they are overlapped with the same type of IC tag.

 In addition, since one surface 51a and the other surface 51b of the inlet 51 are directly covered with a covering material 52 made of a two-component mixed urethane resin, the covering material 52 forms an IC chip 56 or an antenna constituting the inlet 51. Since it is formed following the uneven shape caused by 57, it is excellent in the adhesion between the inlet 51 and the covering material 52, and can be prevented from peeling at the interface between the inlet 51 and the covering material 52. Therefore, the non-contact type data receiving / transmitting body 50 is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 51.

 Furthermore, the non-contact type data receiving / transmitting body 50 can be easily manufactured because the one surface 51a and the other surface 51b of the inlet 51 are directly covered with the covering material 52. it can.

 In this embodiment, the case where the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65 are distinguished by their curvatures is illustrated, but the present invention is not limited to this. In the present invention, the difference between the bent portion and the undulating portion is not strictly defined.

Further, in this embodiment, the non-contact type data receiving / transmitting body 50 provided with the bent portions 60 and 61 and the undulating portions 62, 63, 64 and 65 is illustrated, but the present invention is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, either one of the bent portion or the undulating portion, or both the bent portion and the undulating portion may be provided, and the number thereof is not limited. The number of bent portions and / or undulations provided in the non-contact type data receiving / transmitting body is appropriately adjusted according to the size of the non-contact type data receiving / transmitting body, the tackiness of the covering material, and the like.
Moreover, in this embodiment, the case where the bending parts 60 and 61 and the undulation parts 62, 63, 64, and 65 are provided in the outer edge part of the non-contact-type data transmission / reception body 50 along the longitudinal direction. Although illustrated, this invention is not limited to this. In the non-contact type data receiving / transmitting body of the present invention, a bent portion and / or a undulating portion may be provided along the short direction at the outer edge of the non-contact type data receiving / transmitting body.

 Moreover, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.

 Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 57 which consists of a dipole antenna comprised from a pair of planar radiation elements 58 and 59 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 9-16, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 10, a long base plate 55A and a long surface 55a provided with a large number of RFID antennas 57 and IC chips 56 communicating through the antenna 57 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the inlet sheet 72 will be exemplified.

 First, as shown in FIG. 9, in the center of one surface 71 a of the long first release substrate 71 being conveyed in the direction of the arrow in the figure, in the conveyance direction of the first release substrate 71. The first adhesive 53A discharged from the nozzle 81 of the adhesive application device is applied linearly (step A).

As the first adhesive 53A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the first adhesive 53A to the one surface 71a of the first release substrate 71, that is, the application amount of the first adhesive 53A to the one surface 71a of the first release substrate 71. Although there is no particular limitation, the size and number of IC chips 56 and antennas 57 provided on the inlet sheet 72 and the first adhesive 53A, which are covered with the first adhesive 53A, are cured. According to the thickness etc. which are required for the first covering material 53 to be adjusted, it is appropriately adjusted.

As the 1st peeling base material 71, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 71 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the first release substrate 71, a release layer (not shown) forming one surface 71a of the first release substrate 71 is used. A first adhesive 73A is applied on the top.

 Next, as shown in FIG. 10, the inlet sheet 72 conveyed in the direction of the arrow in the drawing is moved to the first peeling group at the opposing portion of the pair of rollers 82 and 83 that rotate in the direction of the arrow in the drawing. The first adhesive 71A applied to one surface 71a of the material 71 is overlaid on the one surface 71a of the first peeling substrate 71 being conveyed in the direction of the arrow in the drawing, and the first As shown in FIG. 11, the first release substrate 71 and the inlet sheet 72 are sandwiched between the first release substrate 71 and the inlet sheet 72 as shown in FIG. The first adhesive 53A applied to one surface 71a of 71 is developed (step B).

 In this process B, the one surface 71a of the first peeling substrate 71 is provided on one surface 55a of the substrate 55A, that is, the surface of the inlet sheet 72 on which the IC chip 56 and the antenna 57 are provided (hereinafter referred to as “one side”). The inlet sheet 72 is overlaid on one surface 71a of the first release substrate 71 so that the surfaces 72a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component mixed urethane resin that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 71 and the inlet sheet 72. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. Accordingly, the one surface 72a of the inlet sheet 72, and the IC chip 56 and the antenna 57 provided on the one surface 72a are covered with the first adhesive 53A, and the first peeling substrate 71 An inlet sheet 72 is temporarily fixed on one surface 71a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first release substrate 71 and the inlet sheet 72 is caused by at least the IC chip 56 and the antenna 57 of the inlet sheet 72. The degree of unevenness does not appear on the surface 53c opposite to the surface in contact with the inlet sheet 72 of the first adhesive 53A, and the IC chip 56 and the antenna 57 are not damaged by an external impact. The range is 10 μm to 2000 mm.

Further, in step B, a force for sandwiching the first release substrate 71 and the inlet sheet 72 between the pair of rollers 82 and 83, that is, pressing the inlet sheet 72 in the thickness direction against the first release substrate 71. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 71 and the inlet sheet 72, the coating amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 56 and the antenna 57 are completely covered by the first adhesive 53A, and the first adhesive 53A is substantially between the first peeling base 71 and the inlet sheet 72 without any gap. Filled.

 Next, as shown in FIG. 12, while transporting the laminate α2 composed of the first peeling substrate 71 and the inlet sheet 72 in the direction of the arrow in the figure, the side opposite to the one surface 72a of the inlet sheet 72 is provided. A surface (hereinafter referred to as “the other surface”) 72b, that is, a central portion of the other surface 55b of the base material 55A, is discharged from the nozzle 84 of the adhesive application device along the transport direction of the stacked body α2. The second adhesive 54A is applied linearly (step E).

As the second adhesive 54A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the second adhesive 54A to the other surface 72b of the inlet sheet 72, that is, the amount of the second adhesive 54A applied to the other surface 55b of the base material 55A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 12, the second peeling base material 73 conveyed in the direction of the arrow in the figure is placed at the inlet of the pair of rollers 85 and 86 that rotate in the direction of the arrow in the figure. The second adhesive 54A applied to the other surface 72b of the sheet 72 is overlaid on the other surface 72b of the inlet sheet 72 constituting the laminate α2 conveyed in the direction of the arrow in the drawing, By sandwiching the laminate α2 and the second release substrate 73 with the rollers 85 and 86, as shown in FIG. 13, the inlet sheet 72 is formed over almost the entire area between the laminate α2 and the second release substrate 73. The second adhesive 54A applied to the other surface 72b is developed (step F), and the first adhesive 53A and the inlet sheet are interposed between the first release substrate 71 and the second release substrate 73. 72 and second Chakuzai 54A is laminated in this order, to form an integrated laminate .beta.2.

 As the 2nd peeling base material 73, the thing similar to said 1st peeling base material 71 is used. That is, one surface 73a of the second release substrate 73 is composed of a release layer made of silicon.

 In this step F, since the above-described release film or release paper is used as the second release substrate 73, one surface 73a of the second release substrate 73 is formed on the other surface 72b of the inlet sheet 72. The second release substrate 73 is overlaid on the other surface 72b of the inlet sheet 72 so that the formed release layers (not shown) face each other.

 Further, in the step F, as described above, the second adhesive 54A made of a two-component mixed urethane resin that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 54A has fluidity until it is developed between the laminate α2 and the second release substrate 73, but gradually becomes fluid as the reaction proceeds. It disappears and eventually hardens. As a result, the other surface 72b of the inlet sheet 72 is covered with the second adhesive 54A, and the second release substrate 73 is temporarily fixed on the laminate α2. When the second adhesive 54A is cured, the second covering material 54 is obtained.

  Moreover, in the process F, the thickness of the second adhesive 54A after being developed between the laminate α2 and the second release substrate 73 is the same as that of the first release substrate 71 in the process B described above. The thickness is the same as the thickness of the first adhesive 53 </ b> A after being spread between the inlet sheets 72, for example, in the range of 10 μm to 1000 mm.

Moreover, in the process F, the force which pinches | interposes the laminated body (alpha) 2 and the 2nd peeling base material 73 with a pair of rollers 85 and 86, ie, presses the 2nd peeling base material 73 to the thickness direction with respect to the inlet sheet 72. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the laminate α2 and the second release substrate 73, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this process F, the second adhesive 54 </ b> A is filled between the laminate α <b> 2 and the second release substrate 73 with almost no gap.

Next, as shown in FIG. 14, the first peeling substrate 71, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second peeling are performed by a cutting blade (not shown) of the cutting device. The laminated body γ2 made of the base material 73 is cut in the thickness direction (along the alternate long and short dash line in FIG. 14) according to the shape of the antenna 57, and as shown in FIG. (Step C).
Here, cutting the laminated body according to the shape of the antenna 57 means cutting the antenna 57 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 57.

 Next, after the first adhesive 53A is completely cured to become the first covering material 53, and the second adhesive 54A is completely cured to become the second covering material 54, FIG. As shown, the first release base material 71 and the second release base material 73 are peeled from the laminate γ2 (step D), and the first covering material 53, the inlet sheet 72, and the second covering material 54 are peeled off. A laminate B2 made of is obtained.

 Next, the laminate B2 is exposed to an environment having a temperature of 80 to 90 ° C. and a humidity of 75 to 95% RH for 168 hours (24 hours × 7 days) or more, whereby the non-contact type data receiving / transmitting body shown in FIG. Get 50.

 That is, when the laminate B2 is exposed to an environment having a temperature of 80 to 90 ° C. and a humidity of 75 to 95% RH for 168 hours (24 hours × 7 days) or more, the laminate B2 is partially along the longitudinal direction. And the curing reaction of the first adhesive 53A forming the first covering material 53 and the second adhesive 54A forming the second covering material 54 is further reduced at the contracted portion of the laminate B2. The non-contact type data receiving / transmitting body 50 in which the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65 that are promoted and partially hardened is formed is obtained.

 The conditions (temperature, humidity) of the high temperature and high humidity environment to which the laminate B2 is exposed are not particularly limited, and the bent portions 60 and 61 and the undulating portions 62, which are formed in the non-contact type data receiving / transmitting body 50 are not limited. It is appropriately adjusted according to the curvature of 63, 64, 65, the material of the first adhesive 53A, the material of the second adhesive 54A, the material of the inlet sheet 72, and the like.

 In this embodiment, the above-described non-contact type data receiving / transmitting body 50 is continuously manufactured by using the long first peeling base material 71, the inlet sheet 72, and the second peeling base material 73. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process C was performed after the process F was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process D is performed after the process F, and the process C may not be performed.

 In this embodiment, after step F, a laminate γ2 composed of the first release base 71, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second release base 73 is provided. When the step C is cut in accordance with the shape of the antenna 57 and the step D of peeling the first peeling substrate 71 and the second peeling substrate 73 from the cut laminate γ2 is performed in this order. However, the present invention is not limited to this. In the present invention, after step F, step C and step D may be performed in random order. That is, in the present invention, in Step D, the first release substrate, the first adhesive, the inlet sheet, the second adhesive, and the laminate composed of the second release substrate, After peeling the release substrate and the second release substrate, in Step C, the laminate composed of the first adhesive, the inlet sheet, and the second adhesive is cut according to the shape of the antenna. Also good.

 EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to a following example.

"Example 1"
A two-component mixed urethane resin is applied to one surface of the inlet, and then the two-component mixed urethane resin is cured to form a laminate in which the surface on which the IC chip of the inlet is provided is covered with a coating material. Produced.
Next, the laminate was exposed to an environment of temperature 85 ± 5 ° C. and humidity 85 ± 10% RH for 168 hours (24 hours × 7 days) or more, and as shown in FIG. A non-contact type data receiving / transmitting body provided with a bent portion and a undulating portion along the longitudinal direction was obtained.
The thickness of the obtained non-contact type data transmitting / receiving body is 1 mm, and the valleys and peaks of the bent portions and the undulating portions (bending portions 20, 21 and undulating portions 22, 23, 24, 25 shown in FIG. 1). The maximum height difference was 2 mm to 2.5 mm.

"Example 2"
A two-component mixed urethane resin is applied to one surface of the inlet, and then the two-component mixed urethane resin is cured to form a laminate in which the surface on which the IC chip of the inlet is provided is covered with a coating material. Produced.
Then, this laminate was exposed to an environment of temperature 85 ± 5 ° C. and humidity 85 ± 10% RH for 360 hours (24 hours × 15 days) or more, and as shown in FIG. A non-contact type data receiving / transmitting body provided with a bent portion and a undulating portion along the longitudinal direction was obtained.
The thickness of the obtained non-contact type data transmitting / receiving body is 1 mm, and the valleys and peaks of the bent portions and the undulating portions (bending portions 20, 21 and undulating portions 22, 23, 24, 25 shown in FIG. 1). The maximum height difference was 2 mm to 3 mm.

"Example 3"
After the two-component mixed urethane resin is applied to one surface and the other surface of the inlet, the two-component mixed urethane resin is cured, and the one surface and the other surface of the inlet are covered with the coating material. The laminated body which becomes this was produced.
Next, this laminate was exposed to an environment of temperature 85 ± 5 ° C. and humidity 85 ± 10% RH for 168 hours (24 hours × 7 days) or more, and as shown in FIG. A non-contact type data receiving / transmitting body provided with a bent portion and a undulating portion along the longitudinal direction was obtained.
The thickness of the obtained non-contact type data transmitting / receiving body is 1 mm, and the valleys and peaks of the bent portions and the undulating portions (the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65 shown in FIG. 8). The maximum height difference was 2 mm to 2.5 mm.

Example 4
After the two-component mixed urethane resin is applied to one surface and the other surface of the inlet, the two-component mixed urethane resin is cured, and the one surface and the other surface of the inlet are covered with the coating material. The laminated body which becomes this was produced.
Next, the laminate was exposed to an environment of temperature 85 ± 5 ° C. and humidity 85 ± 10% RH for 360 hours (24 hours × 15 days) or more, and as shown in FIG. A non-contact type data receiving / transmitting body provided with a bent portion and a undulating portion along the longitudinal direction was obtained.
The thickness of the obtained non-contact type data transmitting / receiving body is 1 mm, and the valleys and peaks of the bent portions and the undulating portions (the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65 shown in FIG. 8). The maximum height difference was 2 mm to 3 mm.

"Example 5"
After the two-component mixed urethane resin is applied to one surface and the other surface of the inlet, the two-component mixed urethane resin is cured, and the one surface and the other surface of the inlet are covered with the coating material. The laminated body which becomes this was produced.
Next, the laminate was heated at a temperature of 125 ± 5 ° C. for 30 minutes, and then heated at a temperature of 55 ± 5 ° C. for 30 minutes to make one cycle, and this treatment was performed for 50 cycles.
As a result, as shown in FIG. 8, a non-contact type data receiving / transmitting body was obtained in which a bent portion and a undulating portion were provided along the longitudinal direction at the outer edge portion.
The thickness of the obtained non-contact type data transmitting / receiving body is 1 mm, and the valleys and peaks of the bent portions and the undulating portions (the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65 shown in FIG. 8). The maximum height difference was 1.5 mm to 2.0 mm.

"Example 6"
After the two-component mixed urethane resin is applied to one surface and the other surface of the inlet, the two-component mixed urethane resin is cured, and the one surface and the other surface of the inlet are covered with the coating material. The laminated body which becomes this was produced.
Next, the laminate was heated at a temperature of 125 ± 5 ° C. for 30 minutes and then heated at a temperature of 55 ± 5 ° C. for 30 minutes to make one cycle, and this treatment was performed for 150 cycles.
As a result, as shown in FIG. 8, a non-contact type data receiving / transmitting body was obtained in which a bent portion and a undulating portion were provided along the longitudinal direction at the outer edge portion.
The thickness of the obtained non-contact type data transmitting / receiving body is 1 mm, and the valleys and peaks of the bent portions and the undulating portions (the bent portions 60 and 61 and the undulating portions 62, 63, 64, and 65 shown in FIG. 8). The maximum height difference was 1.5 mm to 3.0 mm.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13, 13A ... Base material, 14 ... IC chip, 15 * .. Antennas 16, 17 ... Radiating elements, 20, 21 ... Bent parts, 22, 23, 24, 25 ... Uneven parts, 50 ... Non-contact type data receiving / transmitting body, 51 ... -Inlet, 52 ... coating material, 53 ... first coating material, 53A ... first adhesive, 54 ... second coating material, 54A ... second adhesive, 55, 55A ... base material, 56 ... IC chip, 57 ... antenna, 58, 59 ... radiation element, 60, 61 ... bent portion, 62, 63, 64, 65 ... Undulations.

Claims (2)

Non-contact type data comprising an inlet and a covering material that covers at least the surface of the inlet on which the IC chip is provided, and in which a plurality of bent portions and / or undulating portions are partially provided on the outer edge portion A method of manufacturing a transmitter / receiver,
Step A of applying an adhesive composed of a two-component curable urethane adhesive on the release layer forming one surface of the release substrate;
Via the adhesive applied to the release substrate, the surface of the release sheet on which the IC chip is provided is superimposed on one surface of the release substrate, and the inlet sheet is applied to the release substrate. Step B for unfolding the adhesive between the release substrate and the inlet sheet by pressing
After the adhesive is cured, a step D of peeling the release substrate from a laminate including at least the release substrate, the adhesive, and the inlet sheet;
And a step G of exposing the peeling substrate to the high temperature and high humidity environment for a predetermined time after peeling the peeling substrate from the laminate. Between the process B and the process G,
Furthermore, a step E of applying an adhesive made of a two-component curable urethane-based adhesive to the surface opposite to the surface on which the IC chip is provided in the inlet sheet;
Through the adhesive applied to the inlet sheet, a release substrate is placed on the surface of the inlet sheet opposite to the surface on which the IC chip is provided, so that the release layer forming one surface faces the surface. By overlapping and pressing the release substrate against the inlet sheet, the adhesive is provided between the surface of the inlet sheet opposite to the surface on which the IC chip is provided and the release substrate. The method for manufacturing a non-contact type data receiving / transmitting body according to claim 1, further comprising:

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