JPH0550158B2 - - Google Patents
Info
- Publication number
- JPH0550158B2 JPH0550158B2 JP58231685A JP23168583A JPH0550158B2 JP H0550158 B2 JPH0550158 B2 JP H0550158B2 JP 58231685 A JP58231685 A JP 58231685A JP 23168583 A JP23168583 A JP 23168583A JP H0550158 B2 JPH0550158 B2 JP H0550158B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- stripe
- current blocking
- substrate
- blocking layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 16
- 230000000903 blocking effect Effects 0.000 claims description 14
- 238000005253 cladding Methods 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 230000002902 bimodal effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Description
【発明の詳細な説明】
<技術分野>
本発明は利得導波機構と屈折率導波機構の中間
の性質を有する半導体レーザの素子に関するもの
である。Detailed Description of the Invention <Technical Field> The present invention relates to a semiconductor laser element having properties intermediate between a gain waveguide mechanism and a refractive index waveguide mechanism.
<従来技術>
従来の半導体レーザ素子を導波路構造より分類
すると利得導波路型と屈折率導波路型に区分され
る。前者の場合は縦マルチモードで発振しやす
い、接合に平行方向のビームウエストが共振器
端面から内部へ20〜40μm程度奥まつた位置に存
在する、横モードが注入電流により不安定にな
り易い、電流注入用のストライプを4μm程度
に狭くすると、いわゆるリーキーモードとなり接
合に平行方向の遠視野像が双峰パターンとなる、
等の性質を有する。一方、後者の場合は、縦シ
ングルモードで発振する、接合に平行方向のビ
ームウエストは共振端面近傍に存在する、横モ
ードが安定である、遠視野像が単峰でピークシ
フトが少ない、等の性質がある。<Prior Art> Conventional semiconductor laser devices are classified into gain waveguide type and refractive index waveguide type based on waveguide structure. In the former case, oscillation is likely to occur in longitudinal multi-mode, the beam waist in the direction parallel to the junction is located about 20 to 40 μm deep into the cavity from the end face of the resonator, and the transverse mode is likely to become unstable due to the injected current. When the stripe for current injection is narrowed to about 4 μm, it becomes a so-called leaky mode, and the far-field pattern parallel to the junction becomes a bimodal pattern.
It has the following properties. On the other hand, in the latter case, the beam waist in the direction parallel to the junction is located near the resonant end face, oscillates in a single longitudinal mode, the transverse mode is stable, the far-field pattern is single-peaked, and the peak shift is small, etc. It has a nature.
第1図Aは利得導波路型ダブルヘテロ接合半導
体レーザの一例として、酸化膜ストライプ形レー
ザ素子の断面図を、同B,Cは接合に平行な方向
の遠視野像を示す。第1図Bは電流注入用ストラ
イプ構造のストライプ横Sが10μm程度に広い場
合の遠視野像、第1図CはSが4μm程度に狭く
設定された場合の遠視野像である。また第1図D
には縦モードの一例を示す。第1図Aに於いて、
1は基板、2は第1クラツド層、3は活性層、4
は第2クラツド層、5はキヤツプ層、6,6′は
電極、7は酸化膜、8は電流注入用ストライプ即
ち電流通路である。 FIG. 1A shows a cross-sectional view of an oxide film stripe type laser element as an example of a gain waveguide type double heterojunction semiconductor laser, and FIG. 1B and C show far-field images in a direction parallel to the junction. FIG. 1B is a far-field image when the stripe lateral S of the current injection stripe structure is wide at about 10 μm, and FIG. 1C is a far-field image when S is set to be narrow at about 4 μm. Also, Figure 1D
shows an example of vertical mode. In Figure 1A,
1 is a substrate, 2 is a first cladding layer, 3 is an active layer, 4
5 is a second cladding layer, 5 is a cap layer, 6 and 6' are electrodes, 7 is an oxide film, and 8 is a current injection stripe, that is, a current path.
第2図Aは屈折率導波路型ダブルヘテロ接合半
導体レーザの一例として、CSPレーザ素子の断面
図を、同Bは接合に平行な方向の遠視野像を、同
Cは縦モードの一例を示す。図中第1図と同一符
号は同一内容を表わしている。また、9はキヤツ
プ層5と反対導電形の不純物拡散によつて形成し
た電流注入用ストライプ(幅S)、10は基板1
に形成した溝(幅W)である。活性層3で発生し
た光を溝10の外側で基板に到達させることによ
り光のしみ出し効果に基いて活性層内の実効屈折
率を溝10の外側部分で低下させ、屈折率導波路
を形成している。溝10の外側では第1クラツド
層2の厚さが薄いため、活性層3で発生した光は
基板1へしみ出すこととなる。 Figure 2A shows a cross-sectional view of a CSP laser element as an example of a refractive index waveguide type double heterojunction semiconductor laser, Figure 2B shows a far-field pattern in the direction parallel to the junction, and Figure 2C shows an example of a longitudinal mode. . In the figure, the same reference numerals as in FIG. 1 represent the same contents. Further, 9 is a current injection stripe (width S) formed by diffusing impurities of a conductivity type opposite to that of the cap layer 5, and 10 is a substrate 1.
This is a groove (width W) formed in the groove. By allowing the light generated in the active layer 3 to reach the substrate outside the groove 10, the effective refractive index within the active layer is lowered at the outside of the groove 10 based on the light seepage effect, forming a refractive index waveguide. are doing. Since the first cladding layer 2 is thinner outside the groove 10, the light generated in the active layer 3 leaks into the substrate 1.
以上述べた性質から、屈折率導波型半導体レー
ザの方が優れているように考えられるが、このレ
ーザ素子も以下の如き欠点を有している。即ち、
レーザ発光出力が変化した場合や素子温度が変化
した場合あるいはい出力されたレーザ光が光学部
品等で反射されてその一部がわずかでも素子自体
に帰還された場合には第2図Cに示したシングル
モードが、他の波長に転移し、これが原因となつ
て雑音が発生することである。これはいわゆるモ
ード競合雑音と呼ばれているものである。この雑
音は数MHz(メガヘルツ)から10MHzの比較的低
周波であり、SN比も70dB(デシベル)程度と低
下するのでビデオデイスク等の光源として利用す
る場合に大きな障害となつている。このモード競
合雑音はマルチモードレーザの場合はほとんど発
生しないことがわかつている。しかしながらマル
チモードを有する利得導波型半導体レーザは既に
述べたように、横モードの不安定性等の欠点があ
るので実用面で問題がある。 From the above-mentioned properties, it seems that the refractive index guided semiconductor laser is superior, but this laser element also has the following drawbacks. That is,
If the laser emission output changes, the element temperature changes, or the emitted laser beam is reflected by an optical component, etc., and even a small portion of it is returned to the element itself, the situation is shown in Figure 2C. The single mode transferred to other wavelengths causes noise. This is what is called mode competition noise. This noise has a relatively low frequency ranging from several MHz (megahertz) to 10 MHz, and the signal-to-noise ratio decreases to about 70 dB (decibels), making it a major hindrance when used as a light source for video discs and the like. It is known that this mode competition noise rarely occurs in multimode lasers. However, as mentioned above, gain-guided semiconductor lasers having multi-modes have drawbacks such as instability in transverse modes, which poses problems in practical use.
以上述べた如く、横モード特性の安定なレーザ
光源として現在屈折率導波路型のマルチモード半
導体レーザ素子の出現が待ち望まれている。 As described above, the emergence of a refractive index waveguide type multimode semiconductor laser device is currently awaited as a laser light source with stable transverse mode characteristics.
<発明の目的>
本発明は利得導波機構と屈折率導波機構の双方
の構造と性質を併せもつ即ち安定な基本横モード
動作と縦マルチモード発振とを同時に行なうこと
のできる半導体レーザ素子を提供することを目的
とするものである。<Objective of the Invention> The present invention provides a semiconductor laser device that has the structure and properties of both a gain waveguide mechanism and a refractive index waveguide mechanism, that is, can perform stable fundamental transverse mode operation and longitudinal multimode oscillation at the same time. The purpose is to provide
<構成及び効果の説明>
本発明の半導体レーザ素子について第3図A,
B,Cを参照しながら説明する。基板1上にスト
ライプ状の溝を平行に2本形成する。次にこの溝
を含む基板1上に基板1と逆導電型の(又は高抵
抗値を有する層から成る)電流阻止層11を堆積
して基板に対する電流遮断機能を付与した後、電
流阻止層11表面より上記2本の溝の間の山形部
に対応する部分をエツチングして幅Wの凹状溝1
3を加工しこの山形部表面を露呈させる。基板1
の山形部に対応する部分が電流阻止層11の除去
された電流通路即ち電流注入用内部ストライプ
(ストライブ幅S)12となる。電流阻止層11
に溝13を加工成形することによりこの上に積層
される第1クラツド層2に凹状溝13部と溝13
部以外との間に層厚分布が付与され、第1クラツ
ド層2に重畳される活性層3の実効屈折率がこの
層厚分布に対応して変化した光導波路が形成され
る。活性層3には第2のクラツド層4、キヤツプ
層5が重畳される。基板1及びキヤツプ層5上に
は電極6,6′が形成され、半導体レーザ素子の
基本構造が得られる。電流注入用内部ストライプ
12の幅Sはエツチング加工時にサイドエツチ効
果を利用することにより相当に小さくすることが
できる。いま、溝13の幅WをSよりも充分広く
設定した場合、溝13による屈折率導波の効果は
小さくなり、屈折率分布はストライプ12から注
入されて活性層3に蓄積される少数キヤリアによ
る屈折率変化(キヤリアが多くなると屈折率は小
さくなる)によつて支配される。即ち、第1図に
示した利得導波形レーザとなる。WをSと同程度
かあるいは狭くした場合には屈折率分布はストラ
イプ12から注入されて活性層3に蓄積される少
数キヤリアによる屈折率変化の影響をほとんど受
けず、溝13によつて完全な屈折率導波路が形成
される。即ち、第2図に示した屈折率導波形レー
ザとなる。W>2Sの範囲でWを広くしていくと、
次第に第2図B,Cの特性から第1図C,Dの特
性へと変化していく。この場合の接合に平行な方
向の遠視野像と縦モードをそれぞれ第3図B,C
に示す。また、WをSより広くしていくに従つ
て、接合に平行な方向のビームウエストも端面か
ら次第に内部の方へ移動していく。W>5Sとす
ると、利得導波形の性質である横モードの不安定
性が起こるので、2S<W<5Sが望ましい。また、
高次モードを抑制するにはWは8μm以下で狭く
する方が良い。このようにして、安定な基本横モ
ードと同時に縦マルチモードを発振する半導体レ
ーザが実現される。<Description of structure and effects> Regarding the semiconductor laser device of the present invention, FIG.
This will be explained with reference to B and C. Two stripe-shaped grooves are formed in parallel on a substrate 1. Next, a current blocking layer 11 having a conductivity type opposite to that of the substrate 1 (or consisting of a layer having a high resistance value) is deposited on the substrate 1 including the groove to impart a current blocking function to the substrate. A concave groove 1 with a width W is formed by etching a portion corresponding to the chevron between the two grooves from the surface.
3 to expose the surface of this chevron. Board 1
The portion corresponding to the chevron-shaped portion becomes a current path from which the current blocking layer 11 is removed, that is, an internal stripe for current injection (stripe width S) 12. Current blocking layer 11
By processing and forming the groove 13 in the first cladding layer 2 laminated thereon, the concave groove 13 and the groove 13 are formed.
An optical waveguide is formed in which a layer thickness distribution is provided between the first cladding layer 2 and the other portions, and the effective refractive index of the active layer 3 superimposed on the first cladding layer 2 changes in accordance with this layer thickness distribution. A second cladding layer 4 and a cap layer 5 are superimposed on the active layer 3. Electrodes 6 and 6' are formed on the substrate 1 and the cap layer 5 to obtain the basic structure of a semiconductor laser device. The width S of the internal stripe 12 for current injection can be made considerably smaller by utilizing the side etch effect during etching. Now, if the width W of the groove 13 is set sufficiently wider than S, the effect of refractive index waveguiding by the groove 13 becomes small, and the refractive index distribution is caused by minority carriers injected from the stripe 12 and accumulated in the active layer 3. It is dominated by refractive index changes (the more carriers there are, the smaller the refractive index is). That is, the gain waveguide laser shown in FIG. 1 is obtained. When W is made to be the same as or narrower than S, the refractive index distribution is almost unaffected by changes in the refractive index due to minority carriers injected from the stripes 12 and accumulated in the active layer 3, and is completely suppressed by the grooves 13. A refractive index waveguide is formed. That is, the refractive index guided laser shown in FIG. 2 is obtained. As W becomes wider within the range of W > 2S,
The characteristics gradually change from those shown in FIG. 2 B and C to those shown in FIG. 1 C and D. In this case, the far-field image and longitudinal mode in the direction parallel to the junction are shown in Figures 3B and C, respectively.
Shown below. Furthermore, as W is made wider than S, the beam waist in the direction parallel to the joint gradually moves inward from the end face. If W>5S, instability of the transverse mode, which is a property of the gain waveguide, will occur, so it is desirable that 2S<W<5S. Also,
In order to suppress higher-order modes, it is better to narrow W to 8 μm or less. In this way, a semiconductor laser that oscillates in a stable fundamental transverse mode and simultaneously in longitudinal multi-modes is realized.
<実施例>
GaAs−AlGaAs系の化合物半導体を用いて本
発明の半導体レーザ素子の1実施例を製作する場
合について説明する。<Example> A case will be described in which an example of the semiconductor laser device of the present invention is manufactured using a GaAs-AlGaAs-based compound semiconductor.
第4図Aに示すように、P形GaAs基板14の
(100)面上にホトリソグラフイ技術とメサエツチ
ングによつて、平行な2本のストライプ溝15,
15′を形成する。両方とも溝幅4μm、深さ0.8μ
mでその間隔(即ち後述する電流注入用通路とな
る内部ストライプ16は2μmとした。このGaAs
基板14上に第4図Bに示す如く液相エピタキシ
ヤル成長法により3×1018cm-3のキヤリア濃度の
n形GaAsから成る電流阻止層17を溝外側の厚
さで0.8μmの厚さに形成する。次に第4図Cに示
すように、幅W=8μmの凹状溝18をストライ
プ16の部分が中央になるようにエツチング形成
し、電流阻止層17を除去してストライプ16の
表面を露呈させる。その後、再び液相エピタキシ
ヤル成長法により、第3図Aに示すようなダブル
ヘテロ接合を有する多層結晶構造を形成しレーザ
発振用動作部を構成する。多層結晶構造の各層の
組成及び厚さは第1クラツド層2(P−Al0.45
Ga0.55As、0.15μm)、活性層3(P−Al0.15Ga0.85
As、0.08μm)、第2クラツド層4(n−Al0.45
Ga0.55As、1.0μm)及びキヤツプ層5(n−
GaAs、3.0μm)とした。キヤツプ層5表面には
n側電極6としてAu−Ge−Niを、基板裏面には
P側電極6′としてAu−Znをそれぞれ蒸着し、
450℃で合金化することにより電流注入用電極層
を形成する。 As shown in FIG. 4A, two parallel stripe grooves 15,
15' is formed. Both groove width 4μm, depth 0.8μm
m, and the interval between them (that is, the internal stripe 16, which will become a current injection path to be described later), was 2 μm.
As shown in FIG. 4B, a current blocking layer 17 made of n-type GaAs with a carrier concentration of 3×10 18 cm -3 is formed on the substrate 14 by liquid phase epitaxial growth to a thickness of 0.8 μm outside the groove. to form. Next, as shown in FIG. 4C, a concave groove 18 having a width W=8 μm is formed by etching so that the stripe 16 is in the center, and the current blocking layer 17 is removed to expose the surface of the stripe 16. Thereafter, a multilayer crystal structure having a double heterojunction as shown in FIG. 3A is formed by liquid phase epitaxial growth again to constitute a laser oscillation operating section. The composition and thickness of each layer of the multilayer crystal structure are as follows: first cladding layer 2 (P-Al 0.45
Ga 0.55 As, 0.15 μm), active layer 3 (P-Al 0.15 Ga 0.85
As, 0.08 μm), second cladding layer 4 (n-Al 0.45
Ga 0.55 As, 1.0 μm) and cap layer 5 (n-
GaAs, 3.0 μm). Au-Ge-Ni was deposited on the surface of the cap layer 5 as the n-side electrode 6, and Au-Zn was deposited on the back surface of the substrate as the p-side electrode 6'.
A current injection electrode layer is formed by alloying at 450°C.
以上により、電流阻止層を除去して形成した凹
状溝幅W=8μm、電流注入用内部ストライプ幅
S=2μmを有する半導体レーザが作製される。 As described above, a semiconductor laser having a concave groove width W=8 μm formed by removing the current blocking layer and a current injection internal stripe width S=2 μm is manufactured.
上記実施例のレーザはしきい値電流60mA、波
長780μmで発振し、発光出力20mWまで安定な
基本横モードで作動した。また15mWまで縦マル
チモードであつた。この半導体レーザ素子をビデ
オデイスク用の信号光源として用いたところ、モ
ード競合雑音や戻り光雑音等が発生せず、良好な
画像が得られた。 The laser of the above example oscillated at a threshold current of 60 mA and a wavelength of 780 μm, and operated in a stable fundamental transverse mode up to an emission output of 20 mW. It was also vertical multi-mode up to 15mW. When this semiconductor laser device was used as a signal light source for a video disk, good images were obtained without mode competition noise or return light noise.
尚、本発明の半導体レーザ素子は上述した
GaAs−AlGaAs系に限定されるものではなく、
InP−InGaAsP系やその他のヘテロ接合レーザ素
子に適用することができる Incidentally, the semiconductor laser device of the present invention has the above-mentioned characteristics.
It is not limited to GaAs-AlGaAs system,
Can be applied to InP-InGaAsP system and other heterojunction laser devices
第1図A,B,C,Dは従来の酸化膜ストライ
プ構造半導体レーザ素子の構成図及び特性説明図
である。第2図A,B,Cは従来のCSPレーザ素
子の構成図及び特性説明図である。第3図A,
B,Cは本発明の説明に供する半導体レーザ素子
の構成図及び特性説明図である。第4図A,B,
Cは本発明の1実施例を説明する半導体レーザ素
子の内部ストライプ構造の工程図である。
1……基板、2……第2クラツド層、3……活
性層、4……第2クラツド層、5……キヤツプ
層、6,6′……電極、15……ストライプ溝、
16……内部ストライプ、17……電流阻止層。
FIGS. 1A, B, C, and D are diagrams illustrating the configuration and characteristics of a conventional oxide film stripe structure semiconductor laser device. FIGS. 2A, B, and C are diagrams showing the configuration and characteristics of a conventional CSP laser device. Figure 3A,
B and C are a configuration diagram and a characteristic explanatory diagram of a semiconductor laser device used to explain the present invention. Figure 4 A, B,
C is a process diagram of an internal stripe structure of a semiconductor laser device illustrating one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Second cladding layer, 3... Active layer, 4... Second cladding layer, 5... Cap layer, 6, 6'... Electrode, 15... Stripe groove,
16... Internal stripe, 17... Current blocking layer.
Claims (1)
と、該基板上に積層された電流阻止層と、前記ス
トライプ溝間の前記基板面より、前記積層された
電流阻止層を除去して前記電流阻止層に形成され
た凹状溝と、該凹状溝を覆い前記電流阻止層上に
形成された第1クラツド層、活性層及び第2クラ
ツド層からなるダブルヘテロ接合層とを有し、前
記電流阻止層が除去された前記基板面を電流注入
用内部ストライプとするとともに、前記第1クラ
ツド層の前記凹状溝部と溝部以外との間で層厚分
布を付与して光導波路を形成し、前記電流注入用
内部ストライプの幅S、前記電流阻止層に形成す
る凹状溝の幅Wを、 2S<W<5S に設定してなることを特徴とする半導体レーザ素
子。[Scope of Claims] 1. A substrate on which two parallel stripe grooves are formed, a current blocking layer laminated on the substrate, and a layer of the laminated current blocking layer from the substrate surface between the stripe grooves. a concave groove formed in the current blocking layer by removing the concave groove, and a double heterojunction layer consisting of a first clad layer, an active layer and a second clad layer, which covers the concave groove and is formed on the current blocking layer. The surface of the substrate from which the current blocking layer has been removed is used as an internal stripe for current injection, and a layer thickness distribution is provided between the concave groove portion of the first cladding layer and a portion other than the groove portion to form an optical waveguide. A semiconductor laser device characterized in that the width S of the internal stripe for current injection and the width W of the concave groove formed in the current blocking layer are set to satisfy 2S<W<5S.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58231685A JPS60123082A (en) | 1983-12-06 | 1983-12-06 | Semiconductor laser element |
| EP84114366A EP0143460B1 (en) | 1983-11-30 | 1984-11-28 | Semiconductor laser device and production method thereof |
| DE8484114366T DE3484266D1 (en) | 1983-11-30 | 1984-11-28 | SEMICONDUCTOR LASER DEVICE AND METHOD FOR THE PRODUCTION THEREOF. |
| US06/675,849 US4937836A (en) | 1983-11-30 | 1984-11-28 | Semiconductor laser device and production method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58231685A JPS60123082A (en) | 1983-12-06 | 1983-12-06 | Semiconductor laser element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60123082A JPS60123082A (en) | 1985-07-01 |
| JPH0550158B2 true JPH0550158B2 (en) | 1993-07-28 |
Family
ID=16927383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58231685A Granted JPS60123082A (en) | 1983-11-30 | 1983-12-06 | Semiconductor laser element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60123082A (en) |
-
1983
- 1983-12-06 JP JP58231685A patent/JPS60123082A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60123082A (en) | 1985-07-01 |
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