JPH0680765B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a resin-sealed non-volatile memory on an integrated circuit substrate,
For example EPROM (UV erasable programmable lead
EPROM built-in type hybrid integrated circuit device in which only memory is mounted.

(B) Conventional technology EPRO with a UV irradiation window that can erase and rewrite memory information that has already been written by UV irradiation.
The M element is preferably used in various electronic devices. This E
Most of the PROM elements are currently mounted on the printed wiring board in the control area together with the driving integrated circuit, and are usually mounted on the printed wiring board which is easy to attach and detach to rewrite the information once written. ing. For various electronic devices that are required to be smaller and lighter, a semiconductor integrated circuit (IC) is mounted on the printed wiring board by a technique called chip-on-board.
The chip is directly mounted, and after the required wiring is provided, the IC chip including this wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be reduced in size and weight because the irradiation window becomes a neck and is still manufactured by being assembled in a sardip type package and mounted on a printed wiring board.

A mounting structure of such a conventional EPROM element will be described with reference to FIG. 13. FIG. 13 is a perspective view having a partial cross section of the conventional EPROM element, in which a conductive wiring pattern (4
An EPROM element (44) is mounted in a sardip type package in a through hole (43) of an insulating substrate (42) made of glass epoxy resin or the like on which 1) is formed. The EPROM element (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) with an external lead (48) or a low melting point glass material. Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed with glass is adhered onto the low melting point glass material or the ceramic base material (47), This element mounting part (50)
An EPROM chip (51) is mounted on the surface of the chip (51) with the UV irradiation surface facing upward, and the electrodes of the chip (51) and the external leads (4) are attached.
8) and are connected by a thin metal wire (52). The cap (46) is a storage member, and the EPROM chip (5
An EPROM that includes a ceramic substrate (54) having a window (53) in a portion facing the ultraviolet irradiation surface of 1), and this cap (46) is placed on a header (45) by a low melting point glass.
The tip (51) is sealed. In this way EPROM chip (5
The EPROM device (44) with the sealed 1) is the insulating substrate (4).
An external lead (48) is inserted through the through hole (43) of 2) and fixed by soldering. This through hole (4
3) has a required wiring arrangement by the conductive wiring pattern (41) and is connected from the male connector terminal portion (55) provided at the end of the insulating substrate to a female connector (not shown). .

Now, the packaging structure of such a conventional EPROM element has an extremely large package outer shape as compared with the EPROM chip (51), and is three-dimensional, that is, the height is several times as high as the height of the chip as well as the plane occupancy rate. It is extremely disadvantageous. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM device is once assembled into a package prior to mounting on an insulating substrate. Since the EPROM element has a window for UV irradiation, the package is assembled into a cerdip type package that uses ceramics as a base material. However, this package is sealed with a low melting point glass, so it can be used at high temperatures (400 to 500). If the metal thin wire that connects the electrode (aluminum) of the EPROM chip and the external lead is not made of the same kind of material, alloying occurs and wiring resistance increases or disconnection occurs. In order to avoid such a situation, aluminum thin wires are usually used, but this EPROM chip requires a substrate to be at ground potential, so the ground electrode of the EPROM chip is wire-connected to the chip mounting part made of gold paste. . Even in this case, since the secondary or multi-component alloy reaction proceeds between the metal such as gold or foil in the gold paste and the aluminum, a silicon piece having aluminum coated on the head called a ground die is used. Separately from the EPROM chip, fix it to the chip mounting part made of the gold paste, and
The conventional mounting structure is unsatisfactory in terms of small size, light weight, and low price, such as the extremely complicated work of connecting to the ground electrode of the EPROM chip.

In order to solve such a problem, there is an EPROM mounting structure shown in FIG.

The EPROM mounting structure shown in FIG. 14 will be described below.

An insulating substrate (60) such as a glass / epoxy resin plate with a conductive wiring pattern (60b) formed on the main surface (60a)
It has a chip mounting area (60c) on which the EPROM chip 21 is mounted, and the wiring pattern (60b) is routed from the vicinity of this area on the main surface (60a) and connected to a male connector terminal portion (not shown). ing. The Eliya (60c) has an EPR
An OM chip (61) is mounted, and the surface electrode of this chip (61) and the wiring pattern (60b) are connected by a thin metal wire (62). Of course, one of the thin metal wires (62) is wired to the wiring pattern (60b) on which the chip (61) is mounted in order to connect with the substrate of the chip (61). On the ultraviolet irradiation surface (61a) of the EPROM chip (61), an ultraviolet-transparent resin (63) (for example, manufactured by Toray Industries, Inc., model name TX-978) is used, and an ultraviolet-transparent window material (6) is used.
4) is stuck. The window material (64) is a known ultraviolet ray transmissive material such as quartz or transparent alumina. And
The top surface (64a) of the window material (64) has an EPROM chip (61)
Since it is a surface that introduces light to the ultraviolet irradiation surface, the remaining window material (64) excluding the top surface (64a), the metal thin wire (62), the metal thin wire (62) and the wiring pattern. (60
The connecting portion with b) is covered with a synthetic resin (65) (for example, model name MP-10 manufactured by Nitto Denko Corporation). If it is necessary to further reduce the total thickness of the insulating substrate (60), the EPROM chip (61) and the window material (64), the chip-mounted area (60c) of the substrate (60). Use as a countersunk hole and hold about half the thickness of this substrate (60). Further, if such counterbore holes are formed, a flow stop dam of the synthetic resin (65) is formed, which effectively acts on ingress of moisture and the like.

The EPROM mounting structure shown in FIG. 13 and FIG.
-83393 (H05K 1/18).

(C) Problems to be Solved by the Invention Needless to say, the EPROM mounting structure shown in FIG. 14 is miniaturized because the EPROM chip is die-bonded onto the printed circuit board. However, the miniaturization referred to here is only miniaturization of the EPROM itself. That is, the first
Although it is not clear from Fig. 4, the microcomputer and its peripheral circuit elements that are fixed around the EPROM are composed of electronic components such as discretes. When the entire system is viewed, there is a problem that the size of the printed circuit board does not become small at all, that is, the size of the entire system becomes large as usual. Furthermore, in the EPROM structure shown in FIG. 14, E
When erasing the program data of the PROM, after erasing by irradiating the printed circuit board with ultraviolet rays, write terminals such as a probe are contacted with the conductive pattern of the routing wire extended from the EPROM and rewriting is performed. However, the conventional general ROM writer cannot be used, and there is a problem in that EPROM rewriting is complicated.

In addition, in the EPROM mounting structure shown in FIG. 13, since the EPROM can be attached to and detached from the printed circuit board in terms of rewriting after erasing, it is possible to write using a general ROM writer. It can be done easily. However, in the mounting structure shown in FIG. 13 as well, as in FIG. 14, circuits around the EPROM, that is, circuit elements such as a microcomputer and its peripheral LSI, IC are composed of discrete electronic components. However, there is a big problem that the printed circuit board becomes large in size, that is, the entire system becomes large in size, and it is impossible to provide a light, thin, short and small EPROM mounted integrated circuit which is required by the user.

Furthermore, in the EPROM mounting structure shown in FIGS. 13 and 14,
As mentioned above, the whole system becomes larger and EPROM
Also, since the conductive patterns that connect the circuit elements in the surroundings to each other are exposed, there is a problem that reliability is reduced.

Furthermore, in the EPROM mounting structure shown in FIG. 13 and FIG.
Since the OM and the circuit elements such as the microcomputer and ICs, LSIs and the like around the OM are exposed, there is a problem that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle and reduces workability.

Furthermore, in the EPROM mounting structure shown in FIG. 13 and FIG. 14, since all the elements of the microcomputer consisting of the EPROM and discrete components and the peripheral circuit elements are mounted on one printed circuit board, as described above. This is a big problem in terms of downsizing the system itself.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and at least a resin-sealed EPRO is provided on one of the two substrates.
M and a microcomputer are mounted, and all other circuit elements are mounted on the other board or on one board,
EP on the other board at the specified position on the peripheral edge
It is characterized by a structure in which only the ROM is exposed and a microcomputer and all other circuit elements are sealed in a sealed space formed by two substrates and a case material.

Therefore, it is possible to downsize a hybrid integrated circuit equipped with an EPROM and also to mount circuit elements on two substrates.
A built-in hybrid integrated circuit device can be provided. Further, since the top surface of the EPROM is exposed from the recess provided on the peripheral edge of one of the substrates, the EPROM can be freely inserted and removed.

(E) Action As described above, according to the present invention, a recess is provided at a predetermined position on the peripheral edge of one of the two substrates, and the EPROM is connected to the conductive path on the other substrate exposed by the recess. So EPROM
Since the mounting position of the EPRO can be set arbitrarily, the EPRO can be efficiently used in consideration of the electrical connection with the built-in microcomputer.
The M and the microcomputer can be connected, and the signal line, that is, the lead line of the conductive path can be eliminated.

Furthermore, the most closely related microcomputer can be placed in the adjacent position of the EPROM, the data line for exchanging data between the EPROM and the microcomputer can be realized with the shortest distance or the minimum distance, and the loss of packaging density due to the routing of the data line. Will be suppressed to the minimum, and high-density mounting can be performed.

Further, in the present invention, all the circuit elements other than the EPROM are mounted as chips on one of the two substrates and housed in the sealed space formed by the two substrates and the case material. It is possible to provide a hybrid integrated circuit device which is small in size, can be mounted at high density, and has excellent handleability.

(F) Embodiment A hybrid integrated circuit device according to the present invention will be described in detail below with reference to an embodiment shown in FIGS. 1 to 12.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having a function independently in a wide range of fields such as computers.

As shown in FIGS. 1 and 2, this hybrid integrated circuit device (1) has two integrated circuit boards (2) and (3) and one of the two integrated circuit boards (2) and (3). A recess (4) provided at a predetermined position on the peripheral edge of the substrate (2), a conductive path (5) having a desired shape formed on the two integrated circuit substrates (2) and (3), and one of A non-volatile memory (6) connected to the conductive path (5) and a conductive path (5) on one substrate (2) to which data is supplied from the memory (6) and the nonvolatile memory (6) is mounted. ), A peripheral circuit element (8) connected to the conductive paths (5) on the two substrates (2) and (3), and two substrates (2) ( And a case member (9) which separates and integrates 3).

As the two integrated circuit boards (2) and (3), hard boards made of ceramics, glass epoxy, metal, or the like are used, and in this embodiment, metal boards excellent in heat dissipation and mechanical strength are used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9) (alumite layer) is formed on the surfaces of the two substrates (2) and (3) by well-known anodic oxidation, and 10 to 70 μm is formed on one main surface side thereof. An insulating resin layer (10) having flexibility such as thick polyimide is attached. Insulating resin layer (10)
A copper foil (11) having a thickness of 10 to 70 μm is adhered to the upper surface of the insulating resin layer (10) at the same time by means of a roller or a hot press. By the way, the two substrates (2) and (3) are in a state of being connected to each other with a predetermined gap therebetween by the insulating resin layer (10) having flexibility.

On the surface of the copper foil (11) provided on one main surface of the two substrates (2) and (3), a conductive path of a desired shape is exposed by screen printing and masked with a resist.
A silver, platinum) plating layer is plated on the surface of the copper foil (11).
After that, the resist is removed, and the copper foil (11) is etched using the noble metal plating layer as a mask to perform the desired conductive path (5).
Is formed. Here, the thickness of the conductive path (5) by screen printing is limited to 0.5 mm, so when a very fine wiring pattern is required, it is about 2 by the well-known photo-etching technique.
It is possible to form an ultrafine electric path (5) up to μ.

A non-volatile memory (6) and a microcomputer (7) supplied with data from the memory (6) are mounted on the conductive path (5) on one substrate (3), and the one substrate (3) and the other A circuit element (8) around the conductive path (5) on the substrate (2) is mounted. Further, a conductive path (5) is extended to one side edge of both substrates (2) and (3) or a peripheral edge portion of opposite sides to form a plurality of pads for fixing external lead terminals (12) and (13). Has been done. External lead terminals (12) and (13) are fixed to the pad by solder, are led out horizontally, and are bent at a substantially right angle in the central portion. Further, since the conductive paths (5) formed on both the substrates (2) and (3) are formed on the flexible resin layer (10), the two substrates (2) and (3) are cleaved. Both substrates (2) and (3) that are patterned can be connected at predetermined positions and arbitrarily.

EPROM (Eras-able Prog) as non-volatile memory (6)
ramable read only memory) is used (hereinafter, nonvolatile memory (6) is referred to as EPROM). This EPROM
As is well known, (6) irradiates light with electrons (program data) accumulated in the floating gate formed in the pellet of EPROM (6) to excite it and restore it to an unstored pellet for rewriting. It is an element that can be used by

The structure of a general EPROM (6) is a DIP (dual in line) type as shown in FIG. 5 and FIG. 6, and is roughly classified into a resin mold type package type and a ceramics type package type. With either resin mold type or ceramic type, it is necessary to irradiate light to erase the memory of the pellet (14), so the part above the pellet (14) transmits high energy light (ultraviolet rays). A transparent member (15) is arranged. In this embodiment, either a resin mold type or a ceramic type package may be used as long as it is a DIP type EPROM (6). Such an EPROM device is disclosed in JP-A-53-74358 and JP-A-62-290160.

Although a DIP type EPROM device is used for the EPROM (6) in this embodiment, the type of the EPROM (6) is basically arbitrary, and for example, a ceramic type or resin mold type LCC, PLCC, or other package may be used. It can be used. LCC and PLC
Each type of EPROM device has a structure in which electrodes for connection are provided on four sides of the bottom surface. LCC and PLCC type EPR
Although the OM is smaller than the DIP type EPROM, this embodiment will be described using the DIP type EPROM device, which has the highest diffusion rate.However, in the case of requiring a more compact system, the LCC, PL
The effect is great if a CC type EPROM device is used. Further, the LCC and PLCC type EPROMs are mounted on the substrate via the sockets similarly to the DIP type.

On the other hand, in the present invention, the recess (4) is provided at a predetermined position on the peripheral edge of one of the two substrates (2) and (3). The two substrates (2) and (3) are fixed to each other by a predetermined distance by a case member (9) described later. At this time, a socket (16) for mounting the EPROM (6) is connected to a plurality of conductive members on the other substrate (3) exposed by the recess (4) provided on the peripheral edge of the one substrate (2). The road (5) is extended. The recess (4) is substantially solid with the outer shape of the EPROM (6), and is formed slightly larger than the EPROM (6) in order to facilitate the insertion and removal of the EPROM (6).

The ICs, transistors, chip resistors, chip capacitors, etc. of the microcomputer (7) and its peripheral circuit elements (8) supplied by selecting the program data of the EPROM (6) are the desired conductive paths (5 ) Soldered or attached by a brazing material such as Ag paste onto the microcomputer (7) and circuit element (8)
Are bonded to a nearby conductive path (5).
Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

More specifically, the socket (1 where the EPROM (6) is mounted is
6) and the microcomputer (7) are connected to the conductive paths (5) on one substrate (3) not provided with the recess (4), and all other circuit elements (8) are on one and the other substrate. (2) It is attached on the conductive path (5) at a predetermined position of (3).

The case material (9) is made of a thermoplastic resin of an insulating member, and as shown in FIG. 3, the two substrates (2) and (3) are separated by a predetermined distance and are formed into a frame shape so as to form a sealed space. Has been formed. The case material (9) is in contact with the periphery of the recess (4) provided on the peripheral edge of one substrate (2) and the periphery of the surface of the other substrate (3) exposed by the recess (4). A frame body (18) having a constant thickness is provided. The frame body (18) is formed by recessing along the recess (4) provided in the substrate (2). Further, one side of the case member (9) is formed in an arc shape so that the film resin layer (10) can be easily bent when both substrates (2) and (3) are arranged.

The case material (9) and the two substrates (2) and (3) are fixed to each other by an adhesive sheet, and the case material (9) is formed by the two substrates (2) and (3) connected by the film resin layer (10). They are fixed so that the mounted circuit elements face each other so as to sandwich them. At this time, the film resin layer (10) connecting the two substrates (2) and (3) is abutted against the arcuate portion provided on the case member (9) and bent, so that the conductivity of the bent portion is reduced. There is no risk of the road (5) being cut when it is bent. After the case material (9) and both substrates (2) and (3) are integrated, the resin layer (10) of the connecting portion is exposed. Therefore, in this embodiment, the connecting portion exposed by the lid (20) is removed. It shall be completely sealed. The lid body (20) is made of the same material as the case material (9), and the bonding is performed by a predetermined means such as the above-mentioned adhesive sheet.

One end of a plurality of conductive paths (5) fixedly connected to the electrodes of the socket (16) is provided on the other substrate (3) exposed by the recess (4) provided on the peripheral edge side of the one substrate (2). The socket (16) into which the EPROM (6) is inserted is fixed to the tip of the conductive path (5) formed. The other end of the conductive path (5) to which the socket (16) is fixed is efficiently routed near the microcomputer (7) and electrically connected to the chip-shaped microcomputer (7) by a bonding wire.

Here, the positional relationship between the EPROM (6) and the microcomputer (7) will be described. FIG. 7 is an enlarged view of a main part when the EPROM (6) and the microcomputer (7) are arranged on one substrate (3). The EPROM (6) and the chip-shaped microcomputer (7) are different from each other. As shown in FIG.
The EPROM (6) and the microcomputer (7) are adjacent to each other or as close as possible in order to shorten the routing of the conductive paths (5) because they are connected through a large number of conductive paths (5). It is arranged to be located in. Therefore
The routing of the conductive path (5) between the EPROM (6) and the microcomputer (7) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. As shown in FIG. 7, the EPROM (6) and the chip-shaped microcomputer (7) arranged in the vicinity of or adjacent to the EPROM (6) are the tips of the conductive paths (5) extending in the vicinity of the microcomputer (7). EPROM (6) with a wire and wire bonding connection
Electrically connected to.

By the way, the EPROM (6) will be inserted into the socket (16) and mounted on one of the substrates (3).
Only the upper surface of (6) is exposed to the outside. At this time, it is preferable that the upper surface of the EPROM (6) and the upper surface of the other substrate (2) are substantially aligned with each other. As a result, EPRO
Only M (6) is exposed, and the other microcomputer (7) and its peripheral circuit elements (8) are formed by the two substrates (2) and (3) and the case material (9) to form a sealed space ( 21) will be placed inside.

As described above, the microcomputer (7) connected to the EPROM (6) and the circuit element (8) around it are the sealed space formed by the two substrates (2) and (3) and the case material (9). It is set to be placed in the section (21). That is, all elements such as chip-shaped electronic components and resistance elements such as printing resistors and plating resistors are provided in the sealing space (14).

By the way, one substrate (2) with EPROM (6) exposed
A light-shielding sealant (22) is adhered on the hollow (4) to completely shield light and to completely seal the EPROM (6).

When erasing the data of the EPROM (6) in this embodiment, the sealing material (22) is peeled off and ultraviolet rays are irradiated, or the EPROM (6) is removed from the socket (16) and ultraviolet rays are irradiated. For rewriting, the EPROM (6) may be removed from the socket, electrically written using a general ROM writer, and then inserted into the socket (16) after writing.

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

First, with a modem (MODEM), there exists a modem for data communication in which digitized data handled by a data terminal such as a personal computer is transmitted and received at a distance from each other using a telephone line. The function of the modem is to modulate the digitized data by using the frequency that can be used in the telephone line, convert it into an analog signal and put it on the telephone line, and the analog signal modulated with the data sent from the other party. It has the function of demodulating and returning to digitized data.

The modem will be briefly described based on the block diagram shown in FIG.

FIG. 8 is a block diagram when a modem is mounted on the integrated circuit board (2).

The modem stores a data transmitted from a personal computer in a built-in memory and outputs the data, and a micro that outputs a predetermined output signal based on the data output from the DTE interface (31). Computer (7) and Macro Computer (7)
EPROM (6) with data addressed from
Modulates and demodulates the output signal from the microcomputer (7)
DTMF generation that generates a desired DTMF signal (tone signal) according to the output signals from the first and second modulation / demodulation circuits (32) (33) and the microcomputer (7) that are output to the NCU (NETWORK CONTROL UNIT) It is composed of a vessel (34) and.

The DTE interface (31) is composed of an IC such as STC9610 (Seiko Epson), supplies the output signal of the personal computer as shown in FIG. 9, stores the output signal in the built-in memory, and outputs it to the microcomputer (7). A transmission memory section (35), a reception memory section (36) for accumulating a signal supplied with an output signal from the microcomputer (7) in the internal memory and outputting the signal to the personal computer (38), and a transmission memory section ( 35) and a control section (37) for switching respective signals input and output through the reception memory section (36), and has a predetermined function for connecting the personal computer (38) and the microcomputer (7). I have.

The microcomputer (7) is composed of, for example, an IC such as STC9620 (Seiko Epson), and as shown in FIG. 10, it is recognized by the command recognition unit that recognizes the output signal output from the DTE interface (31) and the command recognition unit. The command decoding unit that decodes the output signal, the command execution unit that compares the data in the memory unit based on the signal decoded by the command decoding unit and supplies the data to the modem circuit, the data in the command decoding unit and the data in the memory unit When incorrect data is supplied to the command execution unit as a result of comparison with
The DTE interface (31) includes a response code generation unit that outputs an output signal.

The modulation / demodulation circuit (38) converts the digital signal transmitted from the microcomputer (7) into an analog signal and transmits it to the NCU unit. On the contrary, it converts an analog signal transmitted from the NCU unit into a digital signal and transmits it to the microcomputer (7), and includes low-speed and medium-speed circuits. The first modulation / demodulation circuit (32) is 30
This is a low-speed modulation / demodulation circuit of 0 bps, and the second modulation / demodulation circuit (33)
Is a 1200bps medium speed modulation / demodulation circuit. One of the first and second modulation / demodulation circuits (32, 33) is selected by the microcomputer (7).

The DTMF generator (34) generates a predetermined DTMF signal by inputting the data output from the command execution unit of the microcomputer (7) to the input terminals of each of COL and ROW, and transmits AMP.
Output to (39) and supply signal to telephone line.

Program data for setting various modes of the modem is stored in the EPROM (6) and is supplied to the microcomputer (7) based on the address of the microcomputer (7).

Next, the operation of the modem will be briefly described.

First, when the personal computer communication is started, the control switch (40) operates based on the read signal from the microcomputer (38), and the predetermined address data is transferred to the EPROM (7).
Is supplied to the microcomputer (7), and the program data of the EPROM (6) based on the address is supplied to the microcomputer (7), and the communication standard (BELL / CCITT) of each modem is used for communication.
Standard), communication speed (300 / 1200bps), matching of data format, switching of DIP switch mode, etc. are checked to see if they match.

Assuming that the various modes are the same, enter the telephone number of the answering modem into the personal computer. The telephone number is input to the DTE interface (31) for interfacing with a personal computer and transferred to the microcomputer (7) for decoding the telephone number. The decrypted result
Send to DTMF generator (34) and DTMF from DTMF generator (34)
A signal is transmitted and the signal is transferred to a general telephone line via a transmission AMP (39) and a line transformer (41).

The transferred DTMF signal sends a calling signal to the answering modem, and the answering modem receives the calling signal and automatically receives the incoming call. The answering modem then sends the answer tone to the calling modem for the connection procedure.

In the calling side model, the low speed modulation / demodulation circuit (32) passes through the line transformer (41) and the receiving amplifier (42) to detect whether or not the answer tone is a predetermined answer tone for the calling side modem. . If it is a predetermined answer tone, the communication state is entered.

In the communication state, parallel data from the personal computer is input to the DTE interface (31) based on a predetermined key input signal from the keyboard of the calling personal computer, and the data is transferred to the microcomputer (7). Here, the parallel data is converted into serial data. The digital signal converted into serial data is transmitted to the low speed modulation / demodulation circuit (32). Here, the digital signal is converted into an analog signal, frequency modulation FSK is performed based on the communication standard corresponding to it, transmission AMP (39), line transformer (41)
To the modem on the answering side.

On the other hand, the frequency-modulated analog signal sent by the key input signal of the responding personal computer is sent to the calling modem and input to the low speed modulation / demodulation circuit (32) via the line transformer (41) and receiving AMP (42). To be done. Here analog signals are converted to digital signals and DTE interface (31)
The serial digital signal is converted to a parallel digital signal and input to the calling personal computer. As a result, the personal computer for the calling side and the personal computer for the answering side can perform full-duplex communication, thus realizing personal computer communication.

FIG. 11 is a plan view of the modem circuit shown in FIG. 8 mounted on one of the substrates (3) used in this embodiment, and the circuit elements to be mounted have the same reference numerals. EPROM
The connection between (6) and the microcomputer (7) is shown by a bus line. The conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 11, a plurality of fixing pads (5a) to which the external lead terminals (13) are fixed are provided at the opposing peripheral ends of one substrate (3). A socket (16) for mounting a plurality of circuit elements (8) and EPROM (6) is fixed at a predetermined position on a conductive path (5) extending from the fixing pad (5a). A plurality of circuit elements (8) including a microcomputer (7) other than the EPROM (6) are fixed on the substrate (3), (31) is a DTE interface, (32) ((33) The first and second modulation / demodulation circuits, (3
4) is a DTMF generation circuit, (40) is a control switch for controlling the EPROM (6), (7) is a microcomputer, and (8) is a chip component such as a capacitor.

As shown in FIG. 11, the socket (16) on which the EPROM (6) is mounted is fixed near or adjacent to the microcomputer (7). Microcomputer (7)
By fixing the socket (16) near or adjacent to the microcomputer (7) and EPROM (6)
The distance between the bus line and the wiring line of the conductive path (5) can be set to the shortest distance and the shortest distance, and other mounting patterns can be effectively used and high-density mounting can be performed. The area surrounded by the alternate long and short dash line shows the area where the case material (9) is fixed with an adhesive sheet.

FIG. 12 shows the case material (9) on the substrate (3) shown in FIG.
FIG. 9 is a plan view of a finished product of the hybrid integrated circuit device for the modem when the other substrate (2) is fixed via the above, and only the upper surface of the EPROM (6) is exposed from the upper surface of the other substrate (2). It will be in a state of being. That is, all elements other than the EPROM (6) are sealed in the sealed space (21) formed by the case material (9) and the two substrates (2) and (3), and the EPROM (6) EPROM as only the top surface of is exposed by the indentation (4)
The insertion / removal of (6) can be freely performed as necessary.

The above EPROM (6) of the hybrid integrated circuit device for the modem should be able to easily cope with the specification changes required by the set maker (user) such as the destination, OEM, and in-house sales in preparation for the diversification of product specifications. You can That is, the circuit configurations other than the EPROM (6) were designed in advance to cope with various specification changes, but if a hybrid integrated circuit is designed based on the specifications of a specific user, it may not match the specifications of other users. If so, conventionally, it was necessary to review the design of the hybrid integrated circuit itself.

However, in the hybrid integrated circuit device of the present invention, the EPROM (6) is mounted on one substrate (3) through the socket (9) and the surface thereof is a recess provided on the peripheral edge of the other substrate (2). EPROM as it is exposed from (4)
Since the separation of (6) can be performed, a user can select and mount an EPROM to implement a multi-type hybrid integrated circuit device with one hybrid integrated circuit device.

According to the present invention, the recess (4) is provided at a desired position on the peripheral edge of the other substrate (2), and the conductive path () formed on the one substrate (3) is exposed at the recess (4). 5) Socket (16)
The EPROM (6) is connected via the, and the microcomputer (7) and other circuit elements (8) are placed in the sealed space (21) formed by both substrates (2) and (3) and the case material (9). By fixing the device, a device in which the hybrid integrated circuit and the EPROM are integrated can be formed, and the EPROM can be easily inserted and removed according to need.

(G) Effect of the Invention As described in detail above, according to the present invention, firstly, the depression (4) is provided at the desired position on the peripheral end portion of the one substrate (2), and is exposed at the depression (4). Since the EPROM (6) is connected to the conductive path (5) on the other substrate (3), the EPROM (6)
It has an advantage that the mounting position of can be arbitrarily selected. Therefore, considering the electrical connection with the built-in microcomputer (7), the EPROM (6) and the microcomputer (7) can be efficiently connected, and the wiring of the signal line can be eliminated.
More specifically, the most closely related microcomputer (7) can be arranged at a position adjacent to the EPROM (6), and as a result, the data line for exchanging data between the EPROM (6) and the microcomputer (7) can be minimized. It can be realized with the distance or the layout that is most easily designed, and the loss of the mounting density due to the routing of the data lines can be suppressed to the minimum. Further, since it is formed of two substrates (2) and (3), it is possible to provide a high-density and downsized hybrid integrated circuit device.

Secondly, since the EPROM (6) is arranged in the recess (4) at the desired position on the peripheral edge of one of the substrates (2), the EPROM (6), which is a commercially available mold type, is used to integrate the EPROM (6). It has an advantage that it can be handled as a miniaturized hybrid integrated circuit device. Further, by improving the packaging density of the microcomputer and its peripheral circuit elements to be incorporated on the two integrated circuit boards (2) and (3), the conventionally required printed circuit board can be eliminated and one miniaturized EPROM. A hybrid integrated circuit device in which (6) is detachably incorporated can be realized.

Thirdly, by using a metal substrate as the integrated circuit boards (2) and (3), the heat radiation effect thereof can be significantly improved as compared with the printed circuit board, which can contribute to further improvement of the mounting density. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (3) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fourthly, since a commercially available dual in-line type or LCC type can be used as the EPROM (6), there is an advantage that the EPROM (6) can be very easily mounted on the hybrid integrated circuit device. Further dimples (4) and EPROM
By making the outer shape of (6) the same, the case material (9)
The embedded integrated circuit device of EPROM built-in type, which can be embedded exactly in the frame body (18) and has an extremely neat shape, can be realized.

Fifth, the microcomputer (7) connected to the EPROM (6) and its peripheral circuit elements (8) are case materials (9).
Since it is assembled in a die shape or a chip shape in the sealing space (21) formed by the integrated circuit board (2) and two integrated circuit boards (3), compared with the conventional printed circuit board that is resin-molded. It has an advantage that the occupied area becomes extremely small and the packaging density can be greatly improved.

Sixth, case material (9) and two integrated circuit boards (2)
By making the peripheral edges of (3) substantially coincide with each other, almost the entire surface of the integrated circuit board (2) (3) can be used as a sealing space (21), and an extremely compact hybrid integrated circuit combined with an improvement in mounting density. The device can be realized.

Seventh, by providing a socket (16) on one integrated circuit board (3) corresponding to the depression (4), EPROM
(6) can be freely attached and detached, and EPROM (6) can be freely exchanged, erased and rewritten.

Eighthly, by matching the upper surface of one substrate (2) with the upper surface of the EPROM (6), there is an advantage that a hybrid integrated circuit device having a flat upper surface can be realized. Further, by providing the sealing material (22), the EPROM (6) can be shielded from light and EPROM
There is an advantage that the gap between (6) and one of the substrates (2) can be sealed.

Ninth, the external leads (12) (13) can be derived from one side of the two integrated circuit boards (2) (3) or the opposite sides,
There is an advantage that a hybrid integrated circuit device having an extremely large number of pins can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a perspective view showing a case member used in this embodiment, FIG. 4 is a sectional view of a substrate used in this embodiment, and FIG. 5 is a perspective view of an EPROM used in this embodiment. 6 is a sectional view of FIG. 5, FIG. 7 is an enlarged perspective view of an essential part showing the EPROM periphery on the substrate, FIG. 8 is a block diagram showing a modem used in this embodiment, and FIG. 9 is FIG. Block diagram showing the DTE interface of the modem shown in Fig. 10, Fig. 10 is a block diagram showing the microcomputer of the modem shown in Fig. 8, and Fig. 11 is a block diagram showing the block diagram shown in Fig. 8 when mounted on a substrate. FIG. 12 is a plan view when the case member is fixed on the substrate shown in FIG. 11, and FIGS. 13 and 14 are sectional views showing a conventional EPROM mounting structure. (1) ... hybrid integrated circuit device, (2) (3) ... integrated circuit board, (5) ... conductive path, (6) ... EPROM, (7)
...... Microcomputer, (8) …… Circuit element,
(4) …… Dimple, (9) …… Case material, (16) …… Socket, (22) …… Seal material.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Osamu Nakamoto 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Katsumi Okawa 2-18 Keiyo Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18, Keihanhondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 41-1, Omama-cho, Yamama-gun, Gunma Prefecture Tokyo IC

Claims (14)

[Claims] 1. An integrated circuit board arranged opposite to each other, a conductive path having a desired pattern formed on the main surfaces of the board facing each other, and a resin mold connected to the conductive path. A nonvolatile memory; a microcomputer supplied with data from the memory and connected to a conductive path on the substrate; and peripheral circuit elements thereof; and a case member integrated between the substrates. A recess is provided at a desired position on the peripheral edge of the substrate, the nonvolatile memory is connected to a conductive path on the other substrate exposed in the recess, and a sealed space formed by both the substrate and the case member is provided. A hybrid integrated circuit device in which the microcomputer and its peripheral circuit elements are arranged. 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein the substrates have substantially the same shape. 4. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 5. The hybrid integrated circuit device according to claim 1, wherein the nonvolatile memory is a dual in-line type or LCC type resin mold. 6. The hybrid integrated circuit device according to claim 4, wherein the hollow and the non-volatile memory have substantially the same outer shape. 7. The hybrid integrated circuit device according to claim 1, wherein the microcomputer is mounted on the conductive path in a die shape. 8. The hybrid integrated circuit device according to claim 1, wherein a chip resistor and a chip capacitor are used as the peripheral circuit element. 9. The hybrid integrated circuit device according to claim 1, wherein the case member has a frame body having a constant thickness which is substantially the same as the peripheral end portions of the both substrates except the recess. 10. The frame body is recessed according to the recess, and is disposed between the both substrates.
A hybrid integrated circuit device as described. 11. The hybrid integrated circuit device according to claim 1, wherein a socket connected to the conductive path of the other substrate is provided, and the nonvolatile memory is inserted into the socket. 12. The hybrid integrated circuit device according to claim 11, wherein an upper surface of the non-volatile memory and an upper surface of the other substrate are substantially aligned with each other. 13. The hybrid integrated circuit device according to claim 12, wherein a sealing material for light shielding is provided over the upper surface of the nonvolatile memory and the other substrate around the upper surface of the nonvolatile memory. 14. The hybrid integrated circuit device according to claim 1, wherein the two integrated circuit boards are connected by an insulating resin layer having flexibility.