JPH0680771B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a resin-sealed non-volatile memory on an integrated circuit substrate,
For example EPROM (UV erasable programmable lead
EPROM built-in type hybrid integrated circuit device in which only memory is mounted.

(B) Conventional technology EPRO with a UV irradiation window that can erase and rewrite memory information that has already been written by UV irradiation.
The M element is preferably used in various electronic devices. This E
Most of PROM elements are currently mounted on a printed wiring board together with an integrated circuit for control or driving. In order to rewrite information once written, it is usually mounted on a printed wiring board that is easily removable. ing. For various electronic devices that are required to be smaller and lighter, a semiconductor integrated circuit (IC) is mounted on the printed wiring board by a technique called chip-on-board.
The chip is directly mounted, and after the required wiring is provided, the IC chip including this wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be made smaller and lighter because the irradiation window becomes a neck and is still manufactured by being assembled in a sardip type package and mounted on a printed wiring board.

The conventional mounting and manufacturing of the EPROM element will be described with reference to FIG. 12. FIG. 12 is a perspective view having a partial cross section of the conventional EPROM element, in which a conductive wiring pattern (4
An EPROM element (44) is mounted in a sardip type package in a through hole (43) of an insulating substrate (42) made of glass epoxy resin or the like on which 1) is formed. The EPROM element (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) with an external lead (48) or a low melting point glass material. Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold pace in which a large amount of gold powder is mixed with glass is adhered onto the low melting point glass material or the ceramic base material (47), In this element mounting part (50)
The EPROM chip (51) is mounted with the UV irradiation surface facing up, and the electrodes of the chip (51) and the external lead (4) are attached.
8) and are connected by a thin metal wire (52). The cap (46) is a storage member, and the EPROM chip (5
An EPROM that includes a ceramic substrate (54) having a window (53) in a portion facing the ultraviolet irradiation surface of 1), and this cap (46) is placed on a header (45) by a low melting point glass.
The tip (51) is sealed. In this way EPROM chip (5
The EPROM device (44) with the sealed 1) is the insulating substrate (4).
An external lead (48) is inserted through the through hole (43) of 2) and fixed by soldering. This through hole (4
3) has a required wiring arrangement by the conductive wiring pattern (41) and is connected from the male connector terminal portion (55) provided at the end of the insulating substrate to a female connector (not shown). .

Now, the packaging structure of such a conventional EPROM element has an extremely large package outer shape as compared with the EPROM chip (51), and is three-dimensional, that is, the height is several times as high as the height of the chip as well as the plane occupancy rate. It is extremely disadvantageous. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM device is once assembled into a package prior to mounting on an insulating substrate. Since the EPROM element has a window for UV irradiation, the package is assembled into a cerdip type package that uses ceramics as a base material. However, this package is sealed with a low melting point glass, so it can be used at high temperatures (400 to 500). If the metal thin wire that connects the electrode (aluminum) of the EPROM chip and the external lead is not made of the same kind of material, alloying occurs and wiring resistance increases or disconnection occurs. In order to avoid such a situation, aluminum thin wires are usually used, but this EPROM chip requires a substrate to be at ground potential, so the ground electrode of the EPROM chip is wire-connected to the chip mounting part made of gold paste. . Even in this case, since the secondary or multi-component alloy reaction proceeds between the metal such as gold or foil in the gold paste and the aluminum, a silicon piece having aluminum coated on the head called a ground die is used. Separately from the EPROM chip, fix it to the chip mounting part made of the gold paste, and
The conventional mounting structure is unsatisfactory in terms of small size, light weight, and low price, such as the extremely complicated work of connecting to the ground electrode of the EPROM chip.

In order to solve such a problem, there is an EPROM mounting structure shown in FIG.

The EPROM mounting structure shown in FIG. 13 will be described below.

An insulating substrate (60) such as a glass / epoxy resin plate with a conductive wiring pattern (60b) formed on the main surface (60a)
Area with chip (60c) to mount EPROM chip (61)
The wiring pattern (60b) is routed from near the area on the main surface (60a) and is connected to a male connector terminal portion (not shown). An EPROM chip (61) is mounted on the area (60c), and this chip (61)
The surface electrode and the wiring pattern (60b) of the metal thin wire (6
Connected by 2). Of course, one of the thin metal wires (62) is connected to the substrate of the chip (61),
The chip (61) is wired with the wiring pattern (60b) mounted thereon. On the ultraviolet irradiation surface (61a) of the EPROM chip (61), an ultraviolet transparent window material (64) is fixed via an ultraviolet transparent resin (63) (for example, Toray Co., model name TX-978). ing. The window material (64) is a known ultraviolet-transparent material such as quartz or transparent alumina.
Since the top surface (64a) of the window material (64) is a surface for introducing light to the ultraviolet irradiation surface of the EPROM chip (61),
The remaining window material (64) excluding this top surface (64a),
The thin metal wire (62) and the connecting portion between the thin metal wire (62) and the wiring pattern (60b) are covered with a synthetic resin (65) (for example, model name MP-10 manufactured by Nitto Denko Corporation). if,
Insulating substrate (60), EPROM chip (61) and window material (64)
If it is necessary to further reduce the total thickness dimension including
The chip mounting area (60c) of the substrate (60) may be used as a countersunk hole to grip about half the thickness of the substrate (60). If such counterbore holes are provided, a flow stop dam for the synthetic resin (65) is formed, which effectively acts on the entry of moisture and the like.

The EPROM mounting structure shown in FIG. 12 and FIG.
-83393 (H05K 1/18).

(C) Problems to be Solved by the Invention Needless to say, the EPROM mounting structure shown in FIG. 14 is miniaturized because the EPROM chip is die-bonded onto the printed circuit board. However, the miniaturization referred to here is only miniaturization of the EPROM itself. That is, the first
Although it is not clear from Fig. 4, the microcomputer and its peripheral circuit elements that are fixed around the EPROM are composed of electronic components such as discretes. When the entire system is viewed, there is a problem that the size of the printed circuit board does not become small at all, that is, the size of the entire system becomes large as usual. Furthermore, in the EPROM structure shown in FIG. 14, E
When erasing the program data of the PROM, after erasing by irradiating the printed circuit board with ultraviolet rays, the writing terminal of the probe etc. is brought into contact with the conductive pattern image of the routing line extended from the EPROM and rewriting is performed. However, the conventional general ROM writer cannot be used, and there is a problem in that EPROM rewriting is complicated.

In addition, in the EPROM mounting structure shown in FIG. 13, since the EPROM can be attached to and detached from the printed circuit board in terms of rewriting after erasing, it is possible to write using a general ROM writer. It can be done easily. However, in the mounting structure shown in FIG. 12 as well, as in FIG. 14, the circuits around the EPROM, that is, the circuit elements such as the microcomputer and its peripheral LSI, IC are composed of discrete electronic components. However, there is a big problem that the printed circuit board becomes large in size, that is, the entire system becomes large in size, and it is impossible to provide a light, thin, short and small EPROM mounted integrated circuit which is required by the user.

Furthermore, in the EPROM mounting structure shown in FIGS. 13 and 14,
As mentioned above, the whole system becomes larger and EPROM
Also, since the conductive patterns that connect the circuit elements in the surroundings to each other are exposed, there is a problem that reliability is reduced.

Furthermore, in the EPROM mounting structure shown in FIG. 13 and FIG.
Since the OM and the circuit elements such as the microcomputer and ICs, LSIs and the like around the OM are exposed, there is a problem that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle and reduces workability.

Furthermore, in the EPROM mounting structure shown in FIG. 13 and FIG. 14, since all the elements of the microcomputer consisting of the EPROM and discrete components and the peripheral circuit elements are mounted on one printed circuit board, as described above. This is a big problem in terms of downsizing the system itself.

(D) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and a nonvolatile memory is arranged on one side surface of a case member for fixing and integrating two integrated circuit boards. It is characterized in that it is connected to a conductive path formed on two substrates and the microcomputer and its peripheral circuit elements are arranged in a sealed space formed by the two substrates and a case material.

Therefore, it is possible to downsize the hybrid integrated circuit equipped with EPROM and to mount the circuit elements on the entire surface of the two substrates.
It is possible to provide a hybrid integrated circuit device having a high-density mounting EPROM.

(E) Operation As described above, according to the present invention, the non-volatile memory is arranged on one side surface of the case material that fixes and integrates the two substrates, and is connected to the conductive paths on the respective substrates. The mounting position of the non-volatile memory can be set arbitrarily, the EPROM and the microcomputer can be efficiently connected in consideration of the electrical connection with the built-in microcomputer, and the routing of the signal line, that is, the conductive path can be performed. Lines can be eliminated.

Furthermore, the most closely related microcomputer can be placed in the adjacent position of the EPROM, the data line for exchanging data between the EPROM and the microcomputer can be realized with the shortest distance or the minimum distance, and the loss of packaging density due to the routing of the data line. Will be suppressed to the minimum, and high-density mounting can be performed.

Further, in the present invention, all the circuit elements other than the non-volatile memory are chip parts and are arranged in the sealed space formed by the two substrates and the case material, and the non-volatile memory is electrically conductive at the peripheral end portion of each substrate. Provided with a hybrid integrated circuit device with a built-in EPROM, which is excellent in downsizing or high-density mounting because the entire surface of each substrate can be used as a mounting area by being connected to a path and mounted substantially on the side surface of the case material. be able to.

(F) Embodiment A hybrid integrated circuit device according to the present invention will be described in detail below with reference to an embodiment shown in FIGS. 1 to 12.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having a function independently in a wide range of fields such as computers.

This hybrid integrated circuit device (1) is formed on two integrated circuit boards (2) and (3) and two integrated circuit boards (2) and (3) as shown in FIGS. 1 and 2. The electrically conductive paths (5) having the desired shape, the non-volatile memories (6) connected to the respective electrically conductive paths (5), and the nonvolatile memory (6) to which data is supplied from the memories (6) are mounted. A microcomputer (7) connected to the electrically conductive path (5) and a peripheral circuit element (8) connected to the electrically conductive path (5) on the two substrates (2) and (3); And a case member (9) that separates and integrates the substrates (2) and (3).

As the two integrated circuit boards (2) and (3), hard boards made of ceramics, glass epoxy, metal, or the like are used, and in this embodiment, metal boards excellent in heat dissipation and mechanical strength are used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9) (alumite layer) is formed on the surfaces of the two substrates (2) and (3) by well-known anodic oxidation, and 10 to 70 μm is formed on one main surface side thereof. An insulating resin layer (10) having flexibility such as thick polyimide is attached. Insulating resin layer (10)
A copper foil (11) having a thickness of 10 to 70 μm is adhered to the upper surface of the insulating resin layer (10) at the same time by means of a roller or a hot press. By the way, the two substrates (2) and (3) are in a state of being connected to each other with a predetermined gap therebetween by the insulating resin layer (10) having flexibility.

On the surface of the copper foil (11) provided on one main surface of the two substrates (2) and (3), a conductive path of a desired shape is exposed by screen printing and masked with a resist.
A silver, platinum) plating layer is plated on the surface of the copper foil (11).
After that, the resist is removed, and the copper foil (11) is etched using the noble metal plating layer as a mask to perform the desired conductive path (5).
Is formed. Here, the thickness of the conductive path (5) by screen printing is limited to 0.5 mm, so when a very fine wiring pattern is required, it is about 2 by the well-known photo-etching technique.
It is possible to form ultrafine conductive paths (5) up to μ.

A nonvolatile memory (6) and a microcomputer (7) supplied with data from the memory (6) are mounted on the conductive paths (5) on the respective substrates (2) and (3), and one substrate (6) 3) and a circuit element (8) around the conductive path (5) on the other substrate (2). Further, a conductive path (5) is extended to one side edge of both substrates (2) and (3) or a peripheral edge portion of opposite sides to form a plurality of pads for fixing external lead terminals (12) and (13). Has been done. External lead terminals (12) and (13) are fixed to the pad by solder, are led out horizontally, and are bent at a substantially right angle in the central portion. Further, since the conductive paths (5) formed on both the substrates (2) and (3) are formed on the flexible resin layer (10), the two substrates (2) and (3) are cleaved. Both substrates (2) and (3) that are patterned can be connected at predetermined positions and arbitrarily.

EPROM (Eras-able Progr) as non-volatile memory (6)
amable Read Only Memory) is used (hereinafter, non-volatile memory (6) is referred to as EPROM). As is well known, this EPROM (6) emits electrons (program data) accumulated in the floating gate formed in the pellet of the EPROM (6) by irradiating light to excite it to restore it to the unstored state. It is an element that can be rewritten and used.

The structure of a general EPROM (6) is a DIP (dual in line) type as shown in FIG. 5 and FIG. 6, and is roughly classified into a resin mold type package type and a ceramics type package type. With either resin mold type or ceramic type, it is necessary to irradiate light to erase the memory of the pellet (14), so the part above the pellet (14) transmits high energy light (ultraviolet rays). A transparent member (15) is arranged. In this embodiment, either a resin mold type or a ceramic type package may be used as long as it is a DIP type EPROM (6). Such an EPROM device is disclosed in JP-A-53-74358 and JP-A-62-290160.

Although a DIP type EPROM device is used for the EPROM (6) in this embodiment, the type of the EPROM (6) is basically arbitrary, and for example, a ceramic type or resin mold type LCC, PLCC, or other package may be used. It can be used. LCC and PLC
Each type of EPROM device has a structure in which electrodes for connection are provided on four sides of the bottom surface. LCC and PLCC type EPR
Although the OM is smaller than the DIP type EPROM, this embodiment will be described using the DIP type EPROM device, which has the highest diffusion rate.However, in the case of requiring a more compact system, the LCC, PL
The effect is great if a CC type EPROM device is used. Further, the LCC and PLCC type EPROMs are mounted on the substrate via the sockets similarly to the DIP type.

On the other hand, the ICs, transistors, chip resistors, chip capacitors, etc. of the microcomputer (7) and its peripheral circuit elements (8), which are supplied by selecting the program data of the EPROM (6), are desired conductive paths in chip parts. It is attached to (5) by soldering or a brazing material such as Ag paste, and the microcomputer (7) and the circuit element (8) are connected by bonding to a conductive path (5) in the vicinity. Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

The two substrates (2) and (3) described above are fixed and integrated so as to hold the case material (9), and the EPROM (6) is arranged on one side surface of the case material (9). That is, EPROM (6)
Is connected to the conductive paths (5) of the respective substrates (2) (3),
It will be mounted on the two substrates (2) and (3). More specifically, the EPROM (6) is connected to the conductive path (5) via a pair of sockets (16) fixed on the conductive paths (5) at the peripheral ends of the substrates (2) and (3). Will be done.

The case material (9) is made of a thermoplastic resin as an insulating member, and as shown in FIG. 3, the two substrates (2) and (3) are separated by a predetermined distance to form a sealed space (21). It has a fixed thickness and is formed in a frame shape. A socket (16), that is, a hole (4) for accommodating the EPROM (6) is provided on one side surface of the case material (9). The hole (4) is EPRO
Can accommodate M (6) and socket (16) and EPROM (6)
The outer shape is substantially the same as the outer shape. EPROM
It is formed slightly larger than the EPROM (6) to facilitate the insertion and removal of (6). Further, the resin layer (10) is easily bent when the substrates (2) and (3) are arranged on the other side of the case member (9) provided with the holes (4). It is formed in an arc shape.

The case material (9) and the two substrates (2) and (3) are fixed to each other by an adhesive sheet, and the case material (9) is formed by the two substrates (2) and (3) connected by the film resin layer (10). They are fixed so that the mounted circuit elements face each other so as to sandwich them. At this time, the film resin layer (10) connecting the two substrates (2) and (3) is abutted against the arcuate portion provided on the case member (9) and bent, so that the conductivity of the bent portion is reduced. There is no risk of the road (5) being cut when it is bent. After the case material (9) and both substrates (2) and (3) are integrated, the resin layer (10) of the connecting portion is exposed. Therefore, in this embodiment, the connecting portion exposed by the lid (20) is removed. It shall be completely sealed. The lid body (20) is made of the same material as the case material (9), and the bonding is performed by a predetermined means such as the above-mentioned adhesive sheet.

When the case material (9) and the two substrates (2) and (3) are fixed and integrated, an EPROM (between the holes (4) provided on one side of the case material (9) and the substrates (2) and (3)) 6) is arranged. That is,
The peripheral edges on the substrates (2) and (3) to which the holes (4) are fixed are
A plurality of conductive paths (5) connected to the EPROM (6) are formed, and sockets (16) for connecting the EPROM (6) are soldered and fixed onto the respective electric paths (5). The socket (16) is formed in a pair as shown in FIG.
One lead of the PROM (6) is inserted into one socket (16), and the other lead is inserted into the other socket (16) to be connected. That is, the EPROM (6) is mounted over both substrates (2) and (3) via the pair of sockets (16). The other end of the one conductive path (5) to which the pair of sockets (16) are fixed is extended to the vicinity of the microcomputer (7) and electrically connected to the chip-shaped microcomputer (7) by a bonding wire. . That is, the microcomputer (7) connected to the EPROM (6) is arranged near the socket (16) provided on one of the substrates.

Here, the positional relationship between the EPROM (6) and the microcomputer (7) will be described. FIG. 7 is an enlarged view of an essential part when a pair of one socket (16) into which the EPROM (6) is inserted and the microcomputer (7) are arranged on one substrate (3). ) And the chip-shaped microcomputer (7) are connected through a large number of conductive paths (5) as shown in FIG. 7, so that EPROM is used to shorten the routing of the conductive paths (5). The socket (16) into which (6) is inserted and the microcomputer (7) are arranged so as to be adjacent to each other or as close to each other as possible. Therefore, the routing of the conductive path (5) between the socket (16) into which the EPROM (6) is inserted and the microcomputer (7) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. The socket (16) into which the EPROM (6) is inserted and the chip-shaped microcomputer (7) arranged in the vicinity of or adjacent to the socket (16) are extended in the vicinity of the microcomputer (7) as shown in FIG. The tip of the conductive part (5) is bonded and connected by a wire wire, and is electrically connected by inserting the EPROM (6) into the socket (16).

By the way, the EPROM (6) is housed in the hole (4) provided in the case material (9) and connected to the respective substrates (2) and (3), so that only the upper surface of the EPROM (6) is exposed to the outside. Will be done. At this time, the EPROM is placed in the hole (4) so that the upper surface of the EPROM (6) and the upper surface of the case material (9) are substantially aligned with each other.
Set when storing (6). As a result, EPROM
Only (6) is exposed by the hole (4), and the other microcomputer (7) and its peripheral circuit element (8) are sealed with both substrates (2) and (3) and the case material (9). It will be placed in the space (21).

As described above, the microcomputer (7) connected to the EPROM (6) and the circuit element (8) around it are the sealed space formed by the two substrates (2) and (3) and the case material (9). It is set to be placed in the section (21). That is, all the chip-shaped electronic components and resistance elements such as printing resistors and plating resistors are provided in the sealing space (21).

By the way, a sealing material (22) for light shielding is adhered on the hole (4) provided on one side surface of the case material (9) where the EPROM (6) is exposed, so that the EPROM (6) completely shields light and the EPROM
(6) is completely sealed.

When erasing the data of the EPROM (6) in this embodiment, the sealing material (22) is peeled off and ultraviolet rays are irradiated, or the EPROM (6) is removed from the socket (16) and ultraviolet rays are irradiated. For rewriting, the EPROM (6) may be removed from the socket, electrically written using a general ROM writer, and then inserted into the socket (16) after writing.

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

First, there is a model for data communication in which a modem (MODEM) transmits and receives digitized data handled by a data terminal such as a personal computer by using a telephone line and being separated from each other. The function of the modem is to modulate the digitized data by using the frequency that can be used in the telephone line, convert it into an analog signal and put it on the telephone line, and the analog signal modulated with the data sent from the other party. It has the function of demodulating and returning to digitized data.

The modem will be briefly described based on the block diagram shown in FIG.

FIG. 8 is a block diagram when a modem is mounted on the integrated circuit board (2).

The modem stores a data transmitted from a personal computer in a built-in memory and outputs the data, and a micro that outputs a predetermined output signal based on the data output from the DTE interface (31). EPROM containing data addressed by the computer (7) and the microcomputer (7)
(6), first and second modulation / demodulation circuits (32) (33) that modulate and demodulate the output signal from the microcomputer (7) and output to the NCU (NETWORK CONTROL UNIT), and output from the microcomputer (7) Desired DTMF depending on the signal
And a DTMF generator (34) for generating a signal (tone signal).

The DTE interface (31) is composed of an IC such as STC9610 (Seiko Epson), supplies the output signal of the personal computer as shown in FIG. 9, stores the output signal in the built-in memory, and outputs it to the microcomputer (7). A transmission memory section (35), a reception memory section (36) for accumulating a signal supplied with an output signal from the microcomputer (7) in the internal memory and outputting the signal to the personal computer (38), and a transmission memory section ( 35) and a control section (37) for switching respective signals input and output through the reception memory section (36), and has a predetermined function for connecting the personal computer (38) and the microcomputer (7). I have.

The microcomputer (7) is composed of, for example, an IC such as STC9620 (Seiko Ebson), and as shown in FIG. 10, is recognized by the command recognition unit and the command recognition unit that recognizes the output signal output from the DTE interface (31). Command decoding section that decodes the output signal, the command execution section that compares the data in the memory section based on the signal decoded in the command decoding section and supplies the data to the modulation / demodulation circuit, and the data in the command decoding section and the memory section If incorrect data is supplied to the command execution section as a result of comparison with the data,
The DTE interface (31) includes a response code generation unit that outputs an output signal.

The modulation / demodulation circuit (38) converts the digital signal transmitted from the microcomputer (7) into an analog signal and transmits it to the NCU unit. On the contrary, it converts an analog signal transmitted from the NCU unit into a digital signal and transmits it to the microcomputer (7), and includes low-speed and medium-speed circuits. The first modulation / demodulation circuit (32) is 30
This is a low-speed modulation / demodulation circuit of 0 bps, and the second modulation / demodulation circuit (33)
Is a 1200bps medium speed modulation / demodulation circuit. One of the first and second modulation / demodulation circuits (32, 33) is selected by the microcomputer (7).

The DTMF generator (34) generates a predetermined DTMF signal by inputting the data output from the command execution unit of the microcomputer (7) to the input terminals of each of COL and ROW, and transmits AMP.
Output to (39) and supply signal to telephone line.

Program data for setting various modes of the modem is stored in the EPROM (6) and is supplied to the microcomputer (7) based on the address of the microcomputer (7).

Next, the operation of the modem will be briefly described.

First, when the personal computer communication is started, the control switch (40) operates based on the read signal from the microcomputer (38), and the predetermined address data is transferred to the EPROM (7).
Is supplied to the microcomputer (7), and the program data of the EPROM (6) based on the address is supplied to the microcomputer (7), and the communication standard (BELL / CCITT) of each modem is used for communication.
Standard), communication speed (300 / 1200bps), matching of data format, switching of DIP switch mode, etc. are checked to see if they match.

Assuming that the various modes are the same, enter the telephone number of the answering modem into the personal computer. The telephone number is input to the DTE interface (31) for interfacing with a personal computer and transferred to the microcomputer (7) for decoding the telephone number. The decrypted result
Send to DTMF generator (34) and DTMF from DTMF generator (34)
A signal is transmitted and the signal is transferred to a general telephone line via a transmission AMP (39) and a line transformer (41).

The transferred DTMF signal sends a calling signal to the answering modem, and the answering modem receives the calling signal and automatically receives the incoming call. Then, the answering modem sends an answer tone for the connection procedure to the calling modem.

The modem on the calling side passes through the line transformer (41) and the receiving amplifier (42), and the low speed modulation / demodulation circuit (32) detects whether or not the answer tone is a predetermined answer tone for the modem on the calling side. . If it is a predetermined answer tone, the communication state is entered.

In the communication state, parallel data from the personal computer is input to the DTE interface (31) based on a predetermined key input signal from the keyboard of the calling personal computer, and the data is transferred to the microcomputer (7). Here, it is converted into parallel data. The digital signal converted into serial data is transmitted to the low speed modulation / demodulation circuit (32). Here, the digital signal is converted to an analog signal, frequency-modulated FSK based on the corresponding communication standard,
It is transmitted to the modem on the response side via the transmission AMP (39) and the line transformer (41).

On the other hand, the frequency-modulated analog signal sent by the key input signal of the responding personal computer is sent to the calling modem and input to the low speed modulation / demodulation circuit (32) via the line transformer (41) and receiving AMP (42). To be done. Here analog signals are converted to digital signals and DTE interface (31)
The serial digital signal is converted to a parallel digital signal and input to the calling personal computer. As a result, the personal computer for the calling side and the personal computer for the answering side can perform full-duplex communication, thus realizing personal computer communication.

FIG. 11 is a plan view of the modem circuit shown in FIG. 8 mounted on one of the substrates (3) used in this embodiment, and the circuit elements to be mounted have the same reference numerals. EPROM
The connection between (6) and the microcomputer (7) is shown by a bus line. The conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 11, a plurality of fixing pads (5a) to which the external lead terminals (13) are fixed are provided at the opposing peripheral ends of one substrate (3). A pair of sockets (1) for mounting a plurality of circuit elements (8) and EPROM (6) at predetermined positions on a conductive path (5) extending from the fixing pad (5a).
6) One socket (16) is fixed. A plurality of circuit elements (8) including a microcomputer (7) other than the EPROM (6) are fixed on the substrate (3),
(31) is a DTE interface, (32) ((33) first and second modulation / demodulation circuits, (34) is a DTMF generation circuit, (40)
Is a control switch for controlling the EPROM (6), (7) is a microcomputer, and (8) is a chip component such as a capacitor. The substrate (2) has a plurality of conductive paths (5) from the substrate (3) via a flexible resin layer (10).
Are extended, and optional circuits or some circuits necessary for a modem are arranged on the board (2).

As shown in FIG. 11, one socket (16) of the pair of sockets (16) on which the EPROM (6) is mounted is fixed near or adjacent to the microcomputer (7). By fixing the socket (16) near or adjacent to the microcomputer (7), the distance between the bus line between the microcomputer (7) and the EPROM (6), that is, the routing line of the conductive path (5) can be increased. It can be routed at the shortest distance and at the shortest distance, other mounting patterns can be effectively used, and high-density mounting can be performed. The area surrounded by the alternate long and short dash line shows the area where the case material (9) is fixed with an adhesive sheet.

FIG. 12 shows the case material (9) on the substrate (3) shown in FIG.
FIG. 9 is a plan view of a finished product of the hybrid integrated circuit device for the modem when the other substrate (2) is fixed via the above, and only the upper surface of the EPROM (6) is exposed from the upper surface of the other substrate (2). It becomes a state. That is, all elements other than the EPROM (6) are sealed in the sealed space (21) formed by the case material (9) and the two substrates (2) and (3), and the EPROM (6) Only the top surface of the case is exposed from the hole (4) of the case material (9), so EP
The ROM (6) can be freely inserted and removed as needed.

The above EPROM (6) of the hybrid integrated circuit device for the modem should be able to easily cope with the specification changes required by the set maker (user) such as the destination, OEM, and in-house sales in preparation for the diversification of product specifications. You can That is, the circuit configurations other than the EPROM (6) were designed in advance to cope with various specification changes, but if a hybrid integrated circuit is designed based on the specifications of a specific user, it may not match the specifications of other users. If so, conventionally, it was necessary to review the design of the hybrid integrated circuit itself.

However, in the hybrid integrated circuit device of the present invention, the EPROM (6) is mounted on each substrate (2) (3) through a pair of sockets (9) provided on each substrate (2) (3). Moreover, since the surface thereof is exposed from the hole (4) of the case material (9), the EPROM (6) can be detached, so that the user can select and mount the EPROM to mount it into one hybrid integrated circuit device. Can realize multi-model hybrid integrated circuit devices.

According to the present invention, the hole (4) is formed on the side surface of the case material (9).
And each substrate (2) exposed in the hole (4)
An EPROM (6) is connected to a conductive path (5) on the (3) via a pair of sockets (16), and a sealed space formed by both substrates (2) and (3) and a case material (9) By fixing the microcomputer (7) and other circuit elements (8) to (21), an integrated device of the hybrid integrated circuit and the EPROM can be formed, and the EPROM can be easily inserted and removed as necessary. It has characteristics.

(G) Effect of the Invention As described above in detail, according to the present invention, first, the holes (4) are provided on one side surface of the case material (9), and the respective substrates exposed by the holes (4) are exposed. (2) EPROM on the conductive path (5) on (3)
Since this is connected, there is an advantage that the mounting position of the EPROM (6) can be arbitrarily selected. For this reason, considering the electrical connection with the built-in microcomputer (7),
The EPROM (6) and the microcomputer (7) can be connected and the wiring of the signal line can be eliminated. More specifically, EP
The most closely related microcomputer (7) can be arranged in the adjacent position of the ROM (6), and as a result, the data line for exchanging data between the EPROM (6) and the microcomputer (7) can be designed in the shortest distance or the easiest design. It can be realized with a simple layout, and the loss of mounting density due to the routing of data lines can be suppressed to the minimum. Further, since it is formed of two substrates (2) and (3), it is possible to provide a high-density and downsized hybrid integrated circuit device.

Secondly, EPRO is installed in the hole (4) provided on one side of the case material (9).
Since M (6) is mounted, commercially available mold type EPROM
Despite the use of (6), it has an advantage that it can be handled as an integrated small-sized hybrid integrated circuit device. Further, by improving the mounting density of the microcomputer and its peripheral circuit elements to be incorporated on the two integrated circuit boards (2) and (3), the conventionally required printed circuit board can be eliminated.
A hybrid integrated circuit device in which two miniaturized EPROMs (6) are detachably incorporated can be realized.

Thirdly, by using a metal substrate as the integrated circuit boards (2) and (3), the heat radiation effect thereof can be significantly improved as compared with the printed circuit board, which can contribute to further improvement of the mounting density. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (3) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fourthly, since a commercially available dual in-line type or LCC type can be used as the EPROM (6), there is an advantage that the EPROM (6) can be very easily mounted on the hybrid integrated circuit device. Furthermore, by making the hole (4) of the case material (9) and the outer shape of the EPROM (6) the same shape, they can be embedded exactly in the case material (9), and an EPROM built-in type hybrid integrated circuit device having an extremely neat shape can be obtained. realizable.

Fifth, the microcomputer (7) connected to the EPROM (6) and its peripheral circuit elements (8) are case materials (9).
Since it is assembled in a die shape or a chip shape in the sealing space (21) formed by the integrated circuit board (2) and two integrated circuit boards (3), compared with the conventional printed circuit board that is resin-molded. It has an advantage that the occupied area becomes extremely small and the packaging density can be greatly improved.

Sixth, case material (9) and two integrated circuit boards (2)
By making the peripheral edges of (3) substantially coincide with each other, almost the entire surface of the integrated circuit board (2) (3) can be used as a sealing space (21), and an extremely compact hybrid integrated circuit combined with an improvement in mounting density. The device can be realized.

Seventh, by providing a pair of sockets (16) on the integrated circuit boards (3) corresponding to the holes (4) of the case material (9), the EPROM (6) can be freely attached and detached. 6)
It has the advantage that it can be freely exchanged, erased and rewritten.

Eighth, there is an advantage that a hybrid integrated circuit device having a flat upper surface can be realized by making the side surface of the case member (9) and the upper surface of the EPROM (6) coincide. Further, by providing the sealing material (22), the EPROM (6) can be shielded from light and EPROM
There is an advantage that the gap between (6) and the case material (9) can be sealed.

Ninth, the external leads (12) (13) can be derived from one side of the two integrated circuit boards (2) (3) or the opposite sides,
There is an advantage that a hybrid integrated circuit device having an extremely large number of pins can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a perspective view showing a case member used in this embodiment, FIG. 4 is a sectional view of a substrate used in this embodiment, FIG. 5 is an EPROM used in this embodiment, and FIG. Sectional view of FIG.
FIG. 7 is an enlarged perspective view of an essential part showing the periphery of the EPROM on the board, FIG. 8 is a block diagram showing a modem used in this embodiment, and FIG.
8 is a block diagram showing the DTE interface of the modem shown in FIG. 8, FIG. 10 is a block diagram showing the microcomputer of the modem shown in FIG. 8, and FIG. 11 is a block diagram showing the block diagram shown in FIG. Top view when mounted on top, No. 12
FIG. 13 is a plan view of a case member fixed on the substrate shown in FIG. 11, and FIGS. 13 and 14 are sectional views showing a conventional EPROM mounting structure. (1) ... hybrid integrated circuit device, (2) (3) ... integrated circuit board, (5) ... conductive path, (6) ... EPROM, (7)
...... Microcomputer, (8) …… Circuit element,
(4) …… Hole, (9) …… Case material, (16) …… Socket, (22) …… Seal material.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Osamu Nakamoto 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Katsumi Okawa 2-18 Keiyo Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18, Keihanhondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 41-1, Omama-cho, Yamama-gun, Gunma Prefecture Tokyo IC

Claims (14)

[Claims] 1. An integrated circuit board arranged opposite to each other, a conductive path having a desired pattern formed on the main surfaces of the board facing each other, and a resin mold connected to the conductive path. The nonvolatile memory includes: a nonvolatile memory; a microcomputer supplied with data from the memory and connected to a conductive path on the substrate and its peripheral circuit element; and a case member integrated between the substrates. A memory is arranged on one side of the case material and connected to the conductive path, and the microcomputer and its peripheral circuit elements are arranged in a sealed space formed by the both substrates and the case material. Integrated circuit device. 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein the substrates have substantially the same shape. 4. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 5. The hybrid integrated circuit device according to claim 1, wherein the microcomputer is mounted on the conductive path in a die shape. 6. The hybrid integrated circuit device according to claim 1, wherein a chip resistor and a chip capacitor are used as the peripheral circuit element. 7. The hybrid integrated circuit device according to claim 1, wherein the case member is a frame body having a constant thickness which substantially coincides with the peripheral end portions of the both substrates. 8. The hybrid integrated circuit device according to claim 1, wherein the nonvolatile memory is embedded in a hole provided in the frame body and arranged. 9. The hybrid integrated circuit device according to claim 7, wherein the size of the non-volatile memory and the thickness of the frame are substantially equal. 10. The hybrid integrated circuit device according to claim 7, wherein a dual in-line type or LCC type structure is used as the nonvolatile memory. 11. The hybrid integrated circuit device according to claim 7, wherein the frame is provided with a socket connected to the conductive path, and the nonvolatile memory is inserted into the socket. 12. The hybrid integrated circuit device according to claim 8, wherein an upper surface of the non-volatile memory and an upper surface of the case member are substantially aligned with each other. 13. The hybrid integrated circuit device according to claim 12, wherein a sealing material for light shielding is provided on an upper surface of the non-volatile memory so as to extend over a case material around the non-volatile memory. 14. The hybrid integrated circuit device according to claim 1, wherein the connection body of both substrates is provided on a side different from the side on which the nonvolatile memory is provided.