JPH0680783B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention has a built-in EPROM in which a chip-type non-volatile memory, for example, EPROM (ultraviolet ray erasable programmable read only memory) is mounted on an integrated circuit substrate. Type hybrid integrated circuit device.

(B) Conventional technology EPRO with a UV irradiation window that can erase and rewrite memory information that has already been written by UV irradiation.
The M element is preferably used in various electronic devices. This E
Most of PROM elements are currently mounted on a printed wiring board together with an integrated circuit for control or driving. In order to rewrite information once written, it is usually mounted on a printed wiring board that is easily removable. ing. For various electronic devices that are required to be smaller and lighter, a semiconductor integrated circuit (IC) is mounted on the printed wiring board by a technique called chip-on-board.
The chip is directly mounted, and after the required wiring is provided, the IC chip including this wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be made smaller and lighter because the irradiation window becomes a neck and is still manufactured by being assembled in a sardip type package and mounted on a printed wiring board.

The mounting structure of such a conventional EPROM element will be described with reference to FIG. 11. FIG. 11 is a perspective view having a partial cross section of the conventional EPROM element, in which a conductive wiring pattern (4
An EPROM element (44) to be incorporated into a sardip type package is mounted in a through hole (43) of an insulating substrate (42) made of glass epoxy resin or the like on which 1) is formed. The EPROM element (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic substrate (47) by an external lead (48) or a low melting point glass material. Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed in glass is adhered onto the low melting point glass material or the ceramic substrate (47). Element mounting part (5
The EPROM chip (51) is mounted on the surface (0) with the ultraviolet irradiation surface facing upward, and the electrode of the chip (51) and the external lead (48) are connected by a thin metal wire (52). The cap (46) is a storage member, and includes a ceramic substrate (54) having a window (53) in a portion facing the ultraviolet irradiation surface of the EPROM chip (51), and the cap (46) is a low melting point glass. EPRO placed in the header (45) by
The M tip (51) is sealed. The EPROM element (44) thus sealed with the EPROM chip (51) is fixed by solder by inserting the external lead (48) into the through hole (43) of the insulating substrate (42). The through hole (43) is laid out as required by the conductive wiring pattern (41), and the male connector terminal (55) provided at the end of the insulating substrate is transferred to a female connector (not shown). Connected with.

Now, the packaging structure of such a conventional EPROM element has an extremely large package outer shape as compared with the EPROM chip (51), and is three-dimensional, that is, the height is several times as high as the height of the chip as well as the plane occupancy rate. It is extremely disadvantageous. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM device is once assembled into a package prior to mounting on an insulating substrate. Since the EPROM device has a window for UV irradiation, the package is assembled into a cerdip type package based on ceramics, but this package is sealed with a low melting point glass, so it can be used at high temperatures (400-500). If it is not made of the same material as the thin metal wire that connects the electrode (aluminum) of the EPROM chip and the external lead, alloying will occur, increasing wiring resistance and causing wire breakage. In order to avoid such a situation, aluminum thin wires are usually used, but this EPROM chip requires a substrate to be at ground potential, so the ground electrode of the EPROM chip is wire-connected to the chip mounting part made of gold paste. . Even in this case, since the secondary or multi-component alloy reaction proceeds between the metal such as gold or foil in the gold paste and the aluminum, a silicon piece having aluminum coated on the head called a ground die is used. Separately from the EPROM chip, fix it to the chip mounting part made of the gold paste, and
The conventional mounting structure is unsatisfactory in terms of small size, light weight, and low price, such as the extremely complicated work of connecting to the ground electrode of the EPROM chip.

In order to solve such a problem, there is an EPROM mounting structure shown in FIG.

The EPROM mounting structure shown in FIG. 12 will be described below.

An insulating substrate (60) such as a glass / epoxy resin plate with a conductive wiring pattern (60b) formed on the main surface (60a)
Area with chip (60c) to mount EPROM chip (61)
The wiring pattern (60b) is routed from near the area on the main surface (60a) and is connected to a male connector terminal portion (not shown). An EPROM chip (61) is mounted on the area (60c), and this chip (61)
The surface electrode and the wiring pattern (60b) of the metal thin wire (6
Connected by 2). Of course, one of the thin metal wires (62) is connected to the substrate of the chip (61),
It is wired with the wiring pattern (60b) on which the chip (61) is mounted. On the ultraviolet irradiation surface (61a) of the EPROM chip (61), an ultraviolet transparent window material (64) is fixed via an ultraviolet transparent resin (63) (for example, Toray Co., model name TX-978). ing. The window material (64) is a known ultraviolet ray transmissive material such as quartz or transparent alumina.
Since the top surface (64a) of the window material (64) is a surface for introducing light to the ultraviolet irradiation surface of the EPROM chip (61),
The remaining window material (64) excluding this top surface (64a),
The thin metal wire (62) and the connecting portion between the thin metal wire (62) and the wiring pattern (60b) are covered with a synthetic resin (65) (for example, model name MP-10 manufactured by Nitto Denko Corporation). if,
Insulating substrate (60), EPROM chip (61) and window material (64)
If it is necessary to further reduce the total thickness dimension including
The chip mounting area (60c) of the substrate (60) may be used as a countersunk hole to grip about half the thickness of the substrate (60). Further, if such counterbore holes are formed, a flow stop dam of the synthetic resin (65) is formed, which effectively acts on ingress of moisture and the like.

The EPROM mounting structure shown in FIGS. 11 and 12 is disclosed in
-83393 (H05K 1/18).

(C) Problems to be Solved by the Invention Needless to say, the EPROM mounting structure shown in FIG. 12 is miniaturized because the EPROM chip is die-bonded onto the printed circuit board. However, the miniaturization referred to here is only miniaturization of the EPROM itself. That is, the first
Although it is not clear from Fig. 2, the microcomputer and its peripheral circuit elements fixed around the EPROM are composed of electronic components such as discretes. When the entire system is viewed, there is a problem that the size of the printed circuit board does not become small at all, that is, the size of the entire system becomes large as usual. Also, in the mounting structure shown in FIG. 11 as well as in FIG. 14, the circuit around the EPROM, that is, the circuit elements such as the microcomputer and its peripheral LSI, IC are composed of discrete electronic components. However, there is a big problem that the printed circuit board becomes large in size, that is, the entire system becomes large in size, and it is impossible to provide a light, thin, short and small EPROM mounted integrated circuit which is required by the user.

Furthermore, in the EPROM mounting structure shown in FIGS. 11 and 12,
As mentioned above, the whole system becomes larger and EPROM
Also, since the conductive patterns that connect the circuit elements in the surroundings to each other are exposed, there is a problem that reliability is reduced.

Furthermore, in the EPROM mounting structure shown in FIGS. 11 and 12, the EPR
Since the OM and the circuit elements such as the microcomputer and ICs, LSIs and the like around the OM are exposed, there is a problem that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle and reduces workability.

Furthermore, in the EPROM mounting structure shown in FIG. 11 and FIG. 12, since all the elements of the microcomputer consisting of the EPROM and discrete components and the peripheral circuit elements are mounted on one printed circuit board, as described above. This is a big problem in terms of downsizing the system itself.

(D) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and a chip type EPROM and a microcomputer are mounted on one of two substrates, and the other substrate is mounted. All other circuit elements are mounted on or on one board, and the EPROM chip is mounted on the board where only the EPROM chip is exposed by the recess provided at the predetermined position on the peripheral edge side of the other board. All of the circuit elements are sealed in a sealing space formed by two substrates and a case material.

Accordingly, it is possible to provide a hybrid integrated circuit device with a built-in EPROM which is extremely small in size, and in which circuit elements can be mounted on two substrates, and which has a EPROM chip mounted therein.

(E) Operation As described above, according to the present invention, an indent is formed at a predetermined position on the peripheral edge of one of the two substrates, and the EPROM chip is provided in the conductive path on the other substrate exposed by the indent. Since the mounting position of the EPROM chip can be set arbitrarily since the connection of the EPROM chip, it is possible to efficiently connect the EPROM and the microcomputer in consideration of the electrical connection with the built-in microcomputer, and It is possible to eliminate the wiring line of the conductive path.

Furthermore, the most closely related microcomputer can be placed in the adjacent position of the EPROM chip, the data line for exchanging data between the EPROM chip and the microcomputer can be realized with the shortest distance or the minimum distance, and the data line can be mounted by routing. You will minimize the loss of density,
High-density mounting is possible.

Further, in the present invention, all the circuit elements other than the EPROM chip are mounted on one of the two substrates by the chip, and are housed in the sealed space formed by the two substrates and the case material. Therefore, it is possible to provide a hybrid integrated circuit device which is small in size, can be mounted at high density, and has excellent handleability.

(F) Embodiment A hybrid integrated circuit device according to the present invention will be described below in detail with reference to the embodiments shown in FIGS. 1 to 10.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having a function independently in a wide range of fields such as computers.

As shown in FIGS. 1 and 2, this hybrid integrated circuit device (1) has two integrated circuit boards (2) and (3) and one of the two integrated circuit boards (2) and (3). A recess (4) provided at a predetermined position on the peripheral edge of the board (2) and a conductive path (5) of a desired shape formed on the two integrated circuit boards (2) and (3).
A non-volatile memory chip (6) connected to the conductive path (5), and another substrate (3) to which data is supplied from the memory chip (6) and the non-volatile memory chip (6) is mounted. A microcomputer (7) connected to the conductive path (5) of (1), peripheral circuit elements (8) connected to the conductive path (5) on the two substrates (2) and (3), and two And a case member (9) that separates and integrates the substrates (2) and (3).

As the two integrated circuit boards (2) and (3), hard boards made of ceramics, glass epoxy, metal, or the like are used, and in this embodiment, metal boards excellent in heat dissipation and mechanical strength are used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9) (alumite layer) is formed on the surfaces of the two substrates (2) and (3) by well-known anodic oxidation, and 10 to 70 μm is formed on one main surface side thereof. An insulating resin layer (10) having flexibility such as thick polyimide is attached. Insulating resin layer (10)
A copper foil (11) having a thickness of 10 to 70 μm is adhered to the upper surface of the insulating resin layer (10) at the same time by means of a roller or a hot press. By the way, the two substrates (2) and (3) are in a state of being connected to each other with a predetermined gap therebetween by the insulating resin layer (10) having flexibility.

On the surface of the copper foil (11) provided on one main surface of the two substrates (2) and (3), a conductive path of a desired shape is exposed by screen printing and masked with a resist.
A silver, platinum) plating layer is plated on the surface of the copper foil (11).
After that, the resist is removed, and the copper foil (11) is etched using the noble metal plating layer as a mask to perform the desired conductive path (5).
Is formed. Here, the thickness of the conductive path (5) by screen printing is limited to 0.5 mm, so when a very fine wiring pattern is required, it is about 2 by the well-known photo-etching technique.
It is possible to form ultrafine conductive paths (5) up to μ.

A non-volatile memory chip (6) and a microcomputer (7) supplied with data from the memory chip (6) are mounted on the conductive path (5) on one of the substrates (3),
Circuit elements (8) around the conductive paths (5) on one substrate (3) and the other substrate (2) are mounted.
In addition, a conductive path (5) is extended to one side edge or opposite side edge portions of both substrates (2) and (3), and external lead terminals (12) are provided.
A plurality of pads for fixing (13) are formed. External lead terminals (12) and (13) are fixed to the pad by solder, are led out horizontally, and are bent at a substantially right angle in the central portion. The conductive paths (5) formed on both substrates (2) and (3) are flexible resin layers (10).
Since it is formed above, the two substrates (2) and (3) are patterned in a crotch pattern, and the two substrates (2) and (3) can be connected at predetermined positions and arbitrarily.

EPROM chip (Era as a non-volatile memory chip (6)
Sable Programmable Read Only Memory) is used (hereinafter, the nonvolatile memory chip (6) is referred to as an EPROM chip). As is well known, this EPROM (6) irradiates light with electrons (program data) accumulated in the floating gate formed in the pellet of the EPROM chip (6) to excite the unstored pellet. It is an element that can be used by returning to and rewriting. EPROM chip (6)
Is commercially available, and its shape is not limited as long as it is a chip type, and the description of the EPROM chip (6) is omitted in this embodiment.

On the other hand, in the present invention, the recess (4) is provided at a predetermined position on the peripheral edge of one of the two substrates (2) and (3). The two substrates (2) and (3) are fixed to each other by a predetermined distance by a case member (9) described later. At this time, the EPROM chip (6) has Ag paste, solder, etc. on the conductive path (5) on the other substrate (3) exposed by the recess (4) provided on the peripheral edge of the one substrate (2). EP on the other substrate (3) that is fixed by the brazing filler metal and exposed at the recess (4).
One end of a plurality of conductive paths (5) connected to the ROM chip (6) is extended. The conductive path (5) and the EPROM chip (6) are ultrasonically bonded by an Al wire line.

The IC, transistors, chip resistors, chip capacitors, etc. of the microcomputer (7) and its peripheral circuit elements (8) supplied by selecting the program data of the EPROM chip (6) are desired conductive paths ( 5) Soldered or attached by a brazing material such as Ag paste, and the microcomputer (7) and the circuit element (8) are ultrasonically bonded to the conductive path (5) in the vicinity. Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5).

More specifically, the EPROM chip (6) and the microcomputer (7) are connected to the conductive path (5) on the other substrate (3) where the recess (4) is not provided, and all other circuit elements (8). ) Is attached on the conductive paths (5) at predetermined positions on the one and the other substrates (2) and (3).

The case material (9) is made of a thermoplastic resin of an insulating member, and as shown in FIG. 3, the two substrates (2) and (3) are separated by a predetermined distance and are formed into a frame shape so as to form a sealed space. Has been formed. The case material (9) is in contact with the periphery of the recess (4) provided on the peripheral edge of one substrate (2) and the periphery of the surface of the other substrate (3) exposed by the recess (4). A frame body (18) having a constant thickness is provided. The frame body (18) is formed by recessing along the recess (4) provided in the substrate (2). Further, one side of the case member (9) is formed in an arc shape so that the film resin layer (10) can be easily bent when both substrates (2) and (3) are arranged.

The case material (9) and the two substrates (2) and (3) are fixed to each other by an adhesive sheet, and the case material (9) is formed by the two substrates (2) and (3) connected by the film resin layer (10). They are fixed so that the mounted circuit elements face each other so as to sandwich them. At this time, the film resin layer (10) connecting the two substrates (2) and (3) is abutted against the arcuate portion provided on the case member (9) and bent, so that the conductivity of the bent portion is reduced. There is no risk of the road (5) being cut when it is bent. After the case material (9) and both substrates (2) and (3) are integrated, the resin layer (10) of the connecting portion is exposed. Therefore, in this embodiment, the connecting portion exposed by the lid (20) is removed. It shall be completely sealed. The lid body (20) is made of the same material as the case material (9), and the bonding is performed by a predetermined means such as the above-mentioned adhesive sheet.

One end of a plurality of conductive paths (5) connected to the EPROM chip (6) is formed on the other substrate (3) exposed by the recess (4) provided on the peripheral edge of one substrate (2). The EPROM chip (6) is fixed to the tip of the conductive path (5). E
The other end of the conductive path (5) to which the PROM chip (6) is fixed is efficiently routed to the vicinity of the microcomputer (7) and electrically connected to the chip-shaped microcomputer (7) by a bonding wire.

Here, the positional relationship between the EPROM (6) and the microcomputer (7) will be described. As shown in FIG. 1, since a plurality of conductive paths (5) are connected, the EPROM chip (6) and the microcomputer (7) are respectively connected in order to shorten the routing of the conductive paths (5). , Are arranged so that they are adjacent to each other or as close to each other as possible. Therefore, the conductive path (5) between the EPROM chip (6) and the microcomputer (7) can be formed in the shortest distance, and the mounting area on the substrate can be effectively used. As shown in FIG. 7, the EPROM chip (6) and the chip-shaped microcomputer (7) arranged near or adjacent to it are as shown in FIG.
The conductive path (5) extending in the vicinity of the microcomputer (7) is bonded and connected to the EPROM chip (6) by wire bonding with the tip of the conductive path (5).

The EPROM chip is, as is clear from FIG. 1 and FIG.
It is mounted on the other substrate (3) exposed by the recess (4) provided on the one substrate (2), and the frame body (1) of the case material (9) is mounted.
The structure is surrounded by 8). More specifically, the frame body (18)
This is surrounded by the EPROM chip (6) and the wire line connecting the EPROM chip (6) and the conductive path (5) in the vicinity.

Furthermore, the space (18a) formed by the frame (18) has 1
More than one layer of resin is filled and the EPROM chip (6) and wire wires are completely covered by the resin layer. EPROM
The resin of the first layer directly coated on the chip (6) is EPRO
The ultraviolet ray transmissive resin (21a) is used because it is necessary to transmit ultraviolet rays when erasing the data of the M chip (6). The ultraviolet-transparent resin (21a) is not limited as long as it is a non-aromatic resin, and for example, methyl silicon rubber or silicon gel is used.

In this embodiment, the second resin layer (21b) is filled on the first resin layer (21a). Unlike the first layer, the second resin layer is a UV impermeable resin (21) that blocks UV rays in order to prevent accidental erasure of the EPROM chip (6).
b) is used. The resin layer (21b) is not limited as long as it is a resin containing an aromatic ring (benzene ring). For example, an epoxy-based or polyimide-based resin is used, and the resin layer (21b) is filled until it substantially matches the upper surface of one substrate (2). To be done.

Therefore, only the EPROM chip (6) is surrounded by the frame (18) and covered with two layers of resin, and the other microcomputer (7) and the other circuit element (8) are connected to both substrates (2) and (3). It is arranged in the sealed space (21) formed by the case material (9).

As described above, the microcomputer (7) connected to the EPROM chip (6) and the circuit element (8) around the microcomputer (7) are formed by the two substrates (2) and (3) and the case material (9). It is set to be placed in the space (21). That is, all elements such as chip-shaped electronic components and resistance elements such as printing resistors and plating resistors are provided in the sealing space (14).

By the way, in the present embodiment, the space (19
a) UV transparent resin (21a) and non-transparent resin (21a)
Although it has a two-layer resin structure of b), instead of the impermeable resin (21b), as shown in FIG. 5, a light-shielding sealant (22) is placed on the recess (4) of one substrate (2). Even if they are adhered, they can completely block ultraviolet rays like the impermeable resin (21b).

In this embodiment, when erasing the data of the EPROM chip (6), the UV impermeable resin (21b) or the sealing material (2
When peeling off 2) and irradiating with ultraviolet rays to rewrite, peel off the ultraviolet transparent resin (21a) on the EPROM chip (6) and attach a terminal such as a probe to the conductive path (5) near the bonding And write data from the writing device. At this time, when the ultraviolet-transparent resin (21a) is peeled off, since the resin (21a) does not have a strong adhesive force, the wire line is not cut.

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

First, a modem (MODEM) exists for data communication in which digitized data handled by a data terminal such as a personal computer is transmitted and received at a distance from each other using a telephone line. The function of the model is to use the frequency that can use the digitized data on the telephone line, modulate it with the data and put it on the telephone line as an analog signal, and the analog signal that is modulated with the data sent from the other party. It has the function of demodulating and returning to digitized data.

The modem will be briefly described based on the block diagram shown in FIG.

FIG. 6 is a block diagram when a modem is mounted on the integrated circuit board (2).

The model stores the data transmitted from the personal computer in the built-in memory and outputs the data, and the micro that outputs a predetermined output signal based on the data output from the DTE interface (31). EPROM containing data addressed by the computer (7) and the microcomputer (7)
(6), first and second modulation / demodulation circuits (32) (33) that modulate and demodulate the output signal from the microcomputer (7) and output to the NCU (NETWORK CONTROL UNIT), and output from the microcomputer (7) Desired DTMF depending on the signal
And a DTMF generator (34) for generating a signal (tone signal).

The DTE interface (31) is composed of an IC such as STC9610 (Seiko Epson), supplies the output signal of the personal computer, accumulates the output signal in the internal memory and outputs it to the microcomputer (7) as shown in FIG. A transmission memory section (35), a reception memory section (36) for accumulating a signal supplied with an output signal from the microcomputer (7) in the internal memory and outputting the signal to the personal computer (38), and a transmission memory section ( 35) and a control section (37) for switching respective signals input and output through the reception memory section (36), and has a predetermined function for connecting the personal computer (38) and the microcomputer (7). I have.

The microcomputer (7) is composed of an IC such as STC9620 (Seiko Epson), and as shown in FIG. 8, it is recognized by the command recognition unit and the command recognition unit that recognizes the output signal output from the DTE interface (31). The command decoding unit that decodes the output signal, the command execution unit that compares the data in the memory unit based on the signal decoded by the command decoding unit and supplies the data to the modem circuit, the data in the command decoding unit and the data in the memory unit When incorrect data is supplied to the command execution unit as a result of comparison with
The DTE interface (31) includes a response code generation unit that outputs an output signal.

The modulation / demodulation circuit (38) converts the digital signal transmitted from the microcomputer (7) into an analog signal and transmits it to the NCU unit. On the contrary, it converts an analog signal transmitted from the NCU unit into a digital signal and transmits it to the microcomputer (7), and includes low-speed and medium-speed circuits. The first modulation / demodulation circuit (32) is 30
This is a low-speed modulation / demodulation circuit of 0 bps, and the second modulation / demodulation circuit (33)
Is a 1200bps medium speed modulation / demodulation circuit. One of the first and second modulation / demodulation circuits (32, 33) is selected by the microcomputer (7).

The DTMF generator (34) generates a predetermined DTMF signal by inputting the data output from the command execution unit of the microcomputer (7) to the input terminals of each of COL and ROW, and transmits AM.
Output to P (39) to supply signal to telephone line.

Program data is stored in the EPROM (6) even when various modes of the modem are set, and the program data is supplied to the microcomputer (7) based on the address of the microcomputer (7).

Next, the operation of the modem will be briefly described.

First, when personal computer communication is started, the control switch (40) operates based on the read signal from the microcomputer (38), and the predetermined address data is transferred to the EPROM (7).
The program data of the EPROM (6) is supplied to the microcomputer (7) based on the address, and the communication standard (BELL / CCITT) of each modem for communication is supplied.
Standard), communication speed (300 / 1200bps), matching of data format, switching of DIP switch mode, etc. are checked to see if they match.

If the various modes are the same, enter the telephone number of the answering modem into the personal computer. The telephone number is input to the DTE interface (31) for interfacing with a personal computer and transferred to the microcomputer (7) for decoding the telephone number. The decrypted result is DT
The signal is transmitted to the MF generator (34), the DTMF signal is transmitted from the DTMF generator (34), and the signal is transferred to the general telephone line via the transmission AMP (39) and the line transformer (41).

The transferred DTMF signal sends a calling signal to the answering modem, and the answering modem receives the calling signal and automatically receives the incoming call. The answering modem then sends the answer tone to the calling modem for the connection procedure.

The modem on the calling side passes through the line transformer (41) and the receiving amplifier (42), and the low speed modulation / demodulation circuit (32) detects whether or not the answer tone is a predetermined answer tone for the modem on the calling side. . If it is a predetermined answer tone, the communication state is entered.

In the communication state, parallel data from the personal computer is input to the DTE interface (31) based on a predetermined key input signal from the keyboard of the calling personal computer, and the data is transferred to the microcomputer (7). Here, the parallel data is converted into serial data. The digital signal converted into serial data is transmitted to the low speed modulation / demodulation circuit (32). Here, the digital signal is converted into an analog signal, frequency modulation FSK is performed based on the corresponding communication standard, communication AMP (39), line transformer (41)
To the modem on the answering side.

On the other hand, the frequency-modulated analog signal sent by the key input signal of the responding personal computer is sent to the calling modem and input to the low speed modulation / demodulation circuit (32) via the line transformer (41) and receiving AMP (42). To be done. Here analog signals are converted to digital signals and DTE interface (31)
The serial digital signal is converted to a parallel digital signal and input to the calling personal computer. As a result, the personal computer for the calling side and the personal computer for the answering side can perform full-duplex communication, thus realizing personal computer communication.

FIG. 9 is a plan view of the modem circuit shown in FIG. 6 mounted on the other substrate (3) used in this embodiment, and the circuit elements to be mounted have the same reference numerals. The connection between the EPROM chip (6) and the microcomputer (7) is shown by a bus line. The conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 9, a plurality of fixing pads (5a) to which the external lead terminals (13) are fixed are provided on the opposite peripheral edges of the other substrate (3). A socket (16) for mounting a plurality of circuit elements (8) and EPROM (6) is fixed at a predetermined position on a conductive path (5) extending from the fixing pad (5a). EPROM chip (6) on such substrate (3)
A plurality of circuit elements (8) including a microcomputer (7) other than the above are fixed, (31) is a DTE interface, (32) and (33) are first and second modulation / demodulation circuits,
(34) is a DTMF generation circuit, (40) is a control switch for controlling the EPROM chip (6), (7) is a microcomputer, and (8) is a chip component such as a capacitor. The substrate (2) has a film resin layer (1
A plurality of conductive paths (5) extend from the substrate (3) through the substrate (0), and an optional circuit or a part of a circuit necessary for a modem is arranged on the substrate (2).

As shown in FIG. 9, the EPROM chip (6) is fixed at a position near or adjacent to the microcomputer (7). By fixing the EPROM chip (6) near or adjacent to the microcomputer (7), a bus line between the microcomputer (7) and the EPROM chip (6), that is, a wiring line of the conductive path (5) can be formed. The distance can be set at the shortest distance and the shortest distance, and other mounting patterns can be effectively used and high-density mounting can be performed. The area surrounded by the alternate long and short dash line shows the area where the case material (9) is fixed with an adhesive sheet.

FIG. 10 shows the case material (9) on the substrate (3) shown in FIG.
FIG. 2 is a plan view of a finished product of the hybrid integrated circuit device for a modem when one substrate (2) is fixed via the above, and the EPROM chip (6) is covered from the upper surface of the one substrate (2). Only the upper surface of the resin layer (21b) is exposed. That is, all the elements other than the EPROM chip (6) are sealed in the sealing space (21) formed by the case material (9) and the two substrates (2) and (3).

According to the present invention, the depression (4) is provided at a desired position on the peripheral edge of one substrate (2), and the conductive path (5) on the other substrate (3) exposed by the depression (4) is provided. ) Is connected to EPROM chip (6), and both substrates (2) and (3) and case material (9)
By fixing the microcomputer (7) and other circuit elements (8) to the sealed space (21) formed by and, it is possible to provide a device in which the hybrid integrated circuit and the EPROM chip are integrated with extremely small size. .

(G) Effect of the Invention As described in detail above, according to the present invention, firstly, the depression (4) is provided at the desired position on the peripheral end portion of the one substrate (2), and is exposed at the depression (4). Since the EPROM chip (6) is connected to the conductive path (5) on the other substrate (3), the EPROM
There is an advantage that the mounting position of the chip (6) can be arbitrarily selected. Therefore, in consideration of the electrical connection with the built-in microcomputer (7), the EPROM chip (6) and the microcomputer (7) can be efficiently connected, and the wiring of signal lines can be eliminated. More specifically, the most closely related microcomputer (7) can be placed adjacent to the EPROM chip (6), resulting in EPROM chip (6).
The data line for exchanging data between the microcomputer and the microcomputer (7) can be realized with the shortest distance or the layout with the simplest design, and the loss of the mounting density due to the routing of the data line can be minimized. Two more substrates (2) (3)
Since it is more formed, it is possible to provide a high-density and downsized hybrid integrated circuit device.

Secondly, the EPROM (6) is arranged in the recess (4) at the desired position on the peripheral edge of one of the boards (2), and the microcomputer and its peripheral circuits to be incorporated on the two integrated circuit boards (2) and (3). By increasing the mounting density of elements, the conventionally required printed circuit board can be eliminated, and a hybrid integrated circuit device containing an extremely small EPROM chip (6) can be realized.

Thirdly, by using a metal substrate as the integrated circuit boards (2) and (3), the heat radiation effect thereof can be significantly improved as compared with the printed circuit board, which can contribute to further improvement of the mounting density. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (3) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fourthly, the microcomputer (7) connected to the EPROM chip (6) and its peripheral circuit elements (8) are sealed by a case material (9) and two integrated circuit boards (2) and (3). Since it is incorporated in the stop space (21) in a die shape or a chip shape, it has an advantage that the occupied area becomes extremely small as compared with a conventional resin-molded printed circuit board and the packaging density can be greatly improved.

Fifth, case material (9) and two integrated circuit boards (2)
By making the peripheral edges of (3) substantially coincide with each other, almost the entire surface of the integrated circuit board (2) (3) can be used as a sealing space (21), and an extremely compact hybrid integrated circuit combined with an improvement in mounting density. The device can be realized.

Sixth, a resin layer (21b) for shading on the EPROM chip (6)
Since the EPROM chip (6) is provided, the EPROM chip (6) can be protected, the EPROM chip (6) can be shielded from light, and the gap between the EPROM chip (6) and one of the substrates (2) can be sealed. Have.

FIG. 7 shows that the external leads (12) and (13) can be derived from one side of the two integrated circuit boards (2) and (3) or opposite sides thereof, which has an advantage of realizing an extremely multi-pin hybrid integrated circuit device. .

[Brief description of drawings]

FIG. 1 is a perspective view showing this embodiment, and FIG. 2 is I- in FIG.
I sectional view, FIG. 3 is a perspective view showing a case member used in this embodiment, FIG. 4 is a sectional view of a substrate used in this embodiment, FIG. 5 is a sectional view showing another embodiment, and FIG. FIG. 7 is a block diagram showing a modem used in this embodiment, FIG. 7 is a block diagram showing a DTE interface of the modem shown in FIG. 6, and FIG. 8 is a block showing a microcomputer of the modem shown in FIG. FIG. 9 is a plan view of the block diagram shown in FIG. 6 mounted on a substrate, and FIG. 10 is a plan view of a case member fixed on the substrate shown in FIG. Figure and number
FIG. 12 is a sectional view showing a conventional EPROM mounting structure. (1) ... hybrid integrated circuit device, (2) (3) ... integrated circuit board, (5) ... conductive path, (6) ... EPROM chip,
(7) ... Microcomputer, (8) ... Circuit element, (4) ... Dimple, (9) ... Case material, (21a)
…… UV transparent resin, (21b) …… UV opaque resin, (22) …… Sealant.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Osamu Nakamoto 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Katsumi Okawa 2-18 Keiyo Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18, Keihanhondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 41-1, Omama-cho, Yamama-gun, Gunma Prefecture Tokyo IC

Claims (12)

[Claims] 1. Two integrated circuit substrates arranged to face each other, a conductive path having a desired pattern formed on main surfaces of the substrate facing each other, and a nonvolatile memory chip connected to the conductive path. A microcomputer supplied with data from the memory and connected to a conductive path on the substrate and its peripheral circuit element; and a case material integrated between the substrates, the periphery of the one substrate , The non-volatile memory chip is fixed to the conductive path on the other substrate exposed by the hollow, and the electrode of the non-volatile memory chip and the desired conductive path are connected by a bonding wire. A hybrid integrated circuit device characterized in that the microcomputer and its peripheral circuit elements are arranged in a sealed space formed by the both substrates and the case material. . 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein the substrates have substantially the same shape. 4. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 5. The hybrid integrated circuit device according to claim 1, wherein the microcomputer is mounted on the conductive path in a die shape. 6. The hybrid integrated circuit device according to claim 1, wherein a chip resistor and a chip capacitor are used as the peripheral circuit element. 7. The hybrid integrated circuit device according to claim 1, further comprising a frame body having a constant thickness in which the case member is substantially aligned with the peripheral end portions of the both substrates. 8. The hybrid integrated circuit device according to claim 7, wherein the frame body is arranged between the two substrates along the periphery of the recess provided on the one substrate. 9. The hybrid integrated circuit device according to claim 1, wherein the nonvolatile memory chip is sealed with a sealing resin layer in which a resin that transmits ultraviolet rays is injected into the hole. 10. The hybrid integrated circuit device according to claim 9, wherein a sealing resin layer for blocking ultraviolet rays is provided on the sealing resin layer in the hole. 11. The upper surface of the sealing resin layer and the upper surface of the case member are substantially aligned with each other.
11. The hybrid integrated circuit device according to item 10. 12. The hybrid integrated circuit device according to claim 1, wherein a light-shielding sealing material is bonded to the upper surface of the one substrate so as to cover the recess.