JPH0680782B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention has a built-in EPROM in which a chip-type non-volatile memory, for example, EPROM (ultraviolet ray erasable programmable read only memory) is mounted on an integrated circuit substrate. Type hybrid integrated circuit device.

(B) Conventional technology EPRO with a UV irradiation window that can erase and rewrite memory information that has already been written by UV irradiation.
The M element is preferably used in various electronic devices. This E
Most of PROM elements are currently mounted on a printed wiring board together with an integrated circuit for control or driving. In order to rewrite information once written, it is usually mounted on a printed wiring board that is easily removable. ing. For various electronic devices that are required to be smaller and lighter, after a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board by a technique called chip-on-board and the required wiring is performed. The IC chip including the wiring portion is covered with a synthetic resin, and the size and weight are extremely reduced.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be reduced in size and weight because the irradiation window becomes a neck and is still manufactured by being assembled in a sardip type package and mounted on a printed wiring board.

A conventional EPROM device mounting structure will be described with reference to FIG. 10. FIG. 10 is a perspective view showing a partial cross section of a conventional EPROM device, in which a conductive wiring pattern (4
An EPROM device (44) is mounted in a sardive type package in a through hole (43) of an insulating substrate (42) made of glass epoxy resin or the like on which 1) is formed. This EPROM element (44) has a header (45) and a cap (46), and the header (45) is bonded to a ceramic base material (47) from an external lead (48) with a low melting point glass material. Further, in this header (45), an element mounting portion (50) obtained by sintering a so-called gold paste in which a large amount of gold powder is mixed with glass is adhered onto the low melting point glass material or the ceramic base material (47), This element mounting part (5
The EPROM chip (51) is mounted on the surface (0) with the ultraviolet irradiation surface facing upward, and the electrode of the chip (51) and the external lead (48) are connected by a thin metal wire (52). The cap (46) is a storage member, and includes a ceramic substrate (54) having a window (53) in a portion facing the ultraviolet irradiation surface of the EPROM chip (51), and the cap (46) has a low melting point. EPRO placed in header (45) by glass
The M tip (51) is sealed. The EPROM element (44) thus sealed with the EPROM chip (51) is fixed by solder by inserting the external lead (48) into the through hole (43) of the insulating substrate (42). The through hole (43) is laid out as required by the conductive wiring pattern (41), and the male connector terminal (55) provided at the end of the insulating substrate is transferred to a female connector (not shown). Connected with.

Now, the packaging structure of such a conventional EPROM element has an extremely large package outer shape as compared with the EPROM chip (51), and is three-dimensional, that is, the height is several times as high as the height of the chip as well as the plane occupancy rate. It is extremely disadvantageous. Furthermore, it is necessary to fix the lead-out lead through the through-hole (43) with solder or the like. A further major drawback to be noted is that the EPROM device is once assembled into a package prior to mounting on an insulating substrate. Since the EPROM element has a window for UV irradiation, the package is assembled into a cerdip type package that uses ceramics as a base material. However, this package is sealed with a low melting point glass, so it can be used at high temperatures (400 to 500). If the metal thin wires connecting the EPROM chip electrodes (aluminum) and the external leads are not made of the same material, alloying will occur, increasing wiring resistance and causing wire breakage. In order to avoid such a situation, aluminum thin wires are usually used, but this EPROM chip requires a substrate to be at ground potential, so the ground electrode of the EPROM chip is wire-connected to the chip mounting part made of gold paste. . Even in this case, since the secondary or multi-component alloy reaction proceeds between the metal such as gold or foil in the gold paste and the aluminum, a silicon piece having aluminum coated on the head called a ground die is used. Separately from the EPROM chip, fix it to the chip mounting part made of the gold paste, and
The conventional mounting structure is unsatisfactory in terms of small size, light weight, and low price, such as the extremely complicated work of connecting to the ground electrode of the EPROM chip.

There is an EPROM mounting structure shown in FIG. 11 to solve such a problem.

The EPROM mounting structure shown in FIG. 11 will be described below.

An insulating substrate (60) such as a glass / epoxy resin plate with a conductive wiring pattern (60b) formed on the main surface (60a)
Area with chip (60c) to mount EPROM chip (61)
The wiring pattern (60b) is routed from near the area on the main surface (60a) and is connected to a male connector terminal portion (not shown). An EPROM chip (61) is mounted on the area (60c), and this chip (61)
The surface electrode and the wiring pattern (60b) of the metal thin wire (6
Connected by 2). Of course, one of the thin metal wires (62) is connected to the substrate of the chip (61),
The chip (61) is wired with the wiring pattern (60b) mounted thereon. On the ultraviolet irradiation surface (61a) of the EPROM chip (61), an ultraviolet transparent window material (64) is fixed via an ultraviolet transparent resin (63) (for example, Toray Co., model name TX-978). ing. The window material (64) is a known ultraviolet ray transmissive material such as quartz or transparent alumina.
Since the top surface (64a) of the window material (64) is a surface for introducing light to the ultraviolet irradiation surface of the EPROM chip (61),
The remaining window material (64) excluding this top surface (64a),
The thin metal wire (62) and the connecting portion between the thin metal wire (62) and the wiring pattern (60b) are covered with a synthetic resin (65) (for example, model name MP-10 manufactured by Nitto Denko Corporation). if,
Insulating substrate (60), EPROM chip (61) and window material (64)
If it is necessary to further reduce the total thickness dimension including
The chip mounting area (60c) of the substrate (60) may be used as a countersunk hole to grip about half the thickness of the substrate (60). Further, if such counterbore holes are formed, a flow stop dam of the synthetic resin (65) is formed, which effectively acts on ingress of moisture and the like.

The EPROM mounting structure shown in FIG. 10 and FIG.
-83393 (H05K 1/18).

(C) Problems to be Solved by the Invention It goes without saying that the EPROM mounting structure shown in FIG. 11 is miniaturized because the EPROM chip is die-bonded onto the printed circuit board. However, the miniaturization referred to here is only miniaturization of the EPROM itself. That is, the first
Although it is not clear from Fig. 1, since the microcomputer and its peripheral circuit elements that are fixed around the EPROM are composed of electronic components such as discretes, it can be used as an integrated circuit for a printed circuit board equipped with the EPROM. When the entire system is viewed, there is a problem that the size of the printed circuit board does not become small at all, that is, the size of the entire system becomes large as usual.

Also in the mounting structure shown in FIG. 10, as in the case of FIG. 11, the circuit around the EPROM, that is, the circuit elements such as the microcomputer and its peripheral LSI, IC are composed of discrete electronic components. However, there is a big problem that the printed circuit board becomes large in size, that is, the entire system becomes large in size, and it is impossible to provide a light, thin, short and small EPROM mounted integrated circuit which is required by the user.

Furthermore, in the EPROM mounting structure shown in FIGS. 10 and 11,
As mentioned above, the whole system becomes larger and EPROM
Also, since the conductive patterns that connect the circuit elements in the surroundings to each other are exposed, there is a problem that reliability is reduced.

Furthermore, in the EPROM mounting structure shown in FIGS. 10 and 11, the EPR
Since the OM and the circuit elements such as the microcomputer and ICs, LSIs and the like around the OM are exposed, there is a problem that unevenness is generated on the upper surface of the substrate, which makes it difficult to handle and reduces workability.

Furthermore, in the EPROM mounting structure shown in FIG. 10 and FIG. 11, since all the elements of the microcomputer consisting of the EPROM and discrete components and the peripheral circuit elements are mounted on one printed circuit board, as described above. This is a big problem in terms of downsizing the system itself.

(D) Means for Solving the Problems The present invention has been made in view of the above problems, and a header is provided at a desired position on the main surface exposed to the outside of one substrate, and the nonvolatile The memory chip is fixed, the electrodes of the memory chip and the lead wires connected to the desired conductive paths are connected by bonding wires, and the microcomputer and all other circuit elements are formed by two substrates and a case material. The structure is characterized in that the sealed space is sealed.

Therefore, a hybrid integrated circuit equipped with an EPROM chip can be made extremely small.

(E) Operation As described above, according to the present invention, a header is provided at a desired position on the main surface exposed to the outside of one substrate, and a nonvolatile memory chip is fixed on the header, and an electrode of the memory chip is attached. And since the lead wire connected to the desired conductive path is connected with a bonding wire, the mounting position of the non-volatile memory chip can be arbitrarily set, and in consideration of the electrical connection with the built-in microcomputer, EPROM efficiently
The chip and the microcomputer can be connected, and the signal line, that is, the wiring line of the conductive path can be eliminated.

Furthermore, the most closely related microcomputer can be placed in the adjacent position of the EPROM chip, the data line for exchanging data between the EPROM chip and the microcomputer can be realized in the shortest distance or the minimum distance, and the packing density by routing the data line Will minimize the loss of
High-density mounting is possible.

Further, in the present invention, since only the non-volatile memory chip is fixed to the header provided on the main surface exposed to the outside of one substrate, all other circuit elements are sealed with two substrates and a case material. Since it is housed in the stop space, it is possible to provide a miniaturized and high-density packaging hybrid integrated circuit device.

(F) Embodiment Hereinafter, the hybrid integrated circuit device of the present invention will be described in detail based on the embodiment shown in FIGS. 1 to 9.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having a function independently in a wide range of fields such as computers.

This hybrid integrated circuit device (1) includes two integrated circuit boards (2) and (3) and one of the two integrated circuit boards (2) and (3) as shown in FIGS. 1 and 2. A header (4) provided at a desired position on the main surface exposed to the outside of (2), and a conductive path (5) having a desired shape formed on the two integrated circuit boards (2) and (3), A non-volatile memory chip (6) fixed on a header (4) and a microcomputer (7) supplied with data from the memory chip (6) and connected to a conductive path (5) on one substrate (2). )When,
A peripheral circuit element (8) connected to the conductive path (5) on the two substrates (2) and (3) and a case material (2) that separates and integrates the two substrates (2) and (3). 9) and.

As the two integrated circuit boards (2) and (3), hard boards made of ceramics, glass epoxy, metal, or the like are used, and in this embodiment, metal boards excellent in heat dissipation and mechanical strength are used.

As the metal substrate, for example, an aluminum substrate having a thickness of 0.5 to 1.0 mm is used. As shown in FIG. 4, an aluminum oxide film (9 ') (alumite layer) is formed on the surface of the substrate (2) (3) by well-known anodic oxidation, and one main surface side thereof is formed.
An insulating resin layer (10) having flexibility such as polyimide having a thickness of 10 to 70 μm is attached. Furthermore, a copper foil (11) having a thickness of 10 to 70 μm is adhered to the insulating resin layer (10) at the same time as the insulating resin layer (10) by means such as a roller or a hot press.

By the way, the two substrates (2) and (3) are in a state of being connected to each other with a predetermined gap therebetween by the insulating resin layer (10) having flexibility.

On the surface of the copper foil (11) provided on one main surface of the two substrates (2) and (3), a conductive path of a desired shape is exposed by screen printing and masked with a resist.
A silver, platinum) plating layer is plated on the surface of the copper foil (11).
After that, the resist is removed, and the copper foil (11) is etched using the noble metal plating layer as a mask to perform the desired conductive path (5).
Is formed. Since the thinness of the conductive path (4) by screen printing is 0.5 mm, when it is necessary to use a very fine wiring pattern, it is possible to use about 2 by the well-known photo-etching technique.
It is possible to form ultrafine conductive paths (5) up to μ.

A header (4) is provided on the main surface exposed to the outside of one substrate (2), and a nonvolatile memory chip (6) is mounted on the header (4). A microcomputer (7) supplied with data from the memory chip (6) is mounted on one substrate (2), and is connected to a conductive path (5) on one substrate (3) and the other substrate (2). A circuit element (8) around it is mounted. Further, a conductive path (5) is extended to one side edge of both substrates (2) and (3) or a peripheral edge portion of opposite sides to form a plurality of pads for fixing external lead terminals (12) and (13). Has been done. External lead terminals (12) and (13) are fixed to the pad by solder, are led out horizontally, and are bent at a substantially right angle in the central portion. Further, since the conductive paths (5) formed on both the substrates (2) and (3) are formed on the flexible resin layer (10), the two substrates (2) and (3) are cleaved. Both substrates (2) and (3) that are patterned can be connected at predetermined positions and arbitrarily.

EPROM (Erasable as a non-volatile memory chip (6)
Programmable Read Only Memory) is used (hereinafter, the nonvolatile memory chip (6) is referred to as an EPROM chip).
As is well known, this EPROM chip (6) irradiates light with electrons (program data) accumulated in the floating gate formed in the pellet of the EPROM chip (6) to excite the unstored pellet. It is an element that can be used by returning to and rewriting. Since the EPROM chip (6) is commercially available, its explanation is omitted in this embodiment.

On the other hand, in the present invention, when the EPROM chip (6) is mounted on the substrate, it is fixed on the header (4) as described above. More specifically, the header (4) is provided at a desired position on the main surface exposed to the outside of one substrate (2), and
The electrodes of the ROM chip (6) are connected to the lead-out leads (5b) connected to the conductive paths (5) by bonding wires.

Further, in this embodiment, the header (4) to which the EPROM chip (6) is fixed is not directly mounted on one substrate (2), but is mounted on one substrate (2) via the header mounting body (4a). It is installed.

The header mounting body (4a) is made of an insulator such as ceramics, glass epoxy or insulating resin, and is formed in a convex shape as shown in FIG. The header (4) is formed of a metal layer on the bottom surface of the mounting body (4a) formed in a convex shape, and as the metal layer, a metal layer such as copper foil, gold or silver is used. In addition, the mounting body (4a) has a substrate (2)
Conductive path (5) and EPRO formed on one main surface (inner surface side) of
A metal lead-out lead (5b) for connecting an electrode to the M chip (6) is integrally formed so as to be embedded inside.

The header mounting body (4a) is fitted into the hole (5c) previously provided in the one substrate (2) and integrated with the substrate (2). As a result, the header (4) formed on the mounting body (4a) is exposed outside the one substrate (2). One end of the lead-out lead (5b) embedded in the mounting body (4a) fitted into the hole (5c) of the one substrate (2) has a conductive path (5) formed on the one substrate (2). It is connected by solder (or wire wire) to its lead (5
The other end of b) is connected to the electrode of the EPROM chip (6) fixed on the header (4) by a bonding wire.

Further, on the upper surface of the header mount (4a), the header (4)
And an auxiliary frame (4b) surrounding the wire wire is placed on the mounting body (4a).
It is integrally formed with. The space surrounded by the auxiliary frame (4b) is filled with a UV transparent resin that transmits UV to cover and protect the EPROM chip (6) fixed on the header (4). The first layer resin directly coated on the EPROM chip (6) needs to pass ultraviolet rays when erasing the data of the EPROM chip (6), and thus the ultraviolet transparent resin (21
a) is used. The ultraviolet-transparent resin (21a) is not limited as long as it is a non-aromatic resin, and for example, methyl silicon rubber or silicon gel is used.

In this embodiment, the second resin layer (21b) is filled on the first resin layer (21a). Unlike the first layer, the second layer resin is a UV impermeable resin (21b) that blocks UV rays to prevent accidental erasure of the EPROM chip (6).
Is used. The resin layer (21b) is not limited as long as it is a resin containing an aromatic ring (benzene ring), and for example, an epoxy resin or a polyimide resin is used.

On the other hand, the IC, transistor, chip resistor, chip capacitor, etc. of the microcomputer (7) and its peripheral circuit elements (8), which are supplied by selecting the program data of the EPROM chip (6), are the desired conductivity in the chip parts. The microcomputer (7) and the circuit element (8) are bonded to the conductive path (5) in the vicinity by soldering or a brazing material such as Ag paste on the path (5). Further, a carbon resistor by screen printing or a nickel-plated resistor by nickel plating is formed as a resistance element between the conductive paths (5). More specifically, the header mounting body (4a) on which the EPROM chip (6) is mounted and the header (4) is mounted, and the microcomputer (7) are the conductive paths (5) on one substrate (2). All the other circuit elements (8) that are connected are attached to the conductive paths (5) at predetermined positions on both substrates (2) and (3).

The two substrates (2) and (3) are fixedly integrated by a case material (9) with a predetermined gap therebetween.

The case material (9) is made of a thermoplastic resin of an insulating member, and as shown in FIG. 3, the two substrates (2) and (3) are separated by a predetermined distance and are formed into a frame shape so as to form a sealed space. Has been formed. When both substrates (2) and (3) are arranged on one side of the frame-shaped case material (9), both substrates (2)
The resin layer (10) connecting (3) is formed in an arc shape so as to be easily bent.

The case material (9) and the two substrates (2) and (3) are fixed to each other by an adhesive sheet, and the case material (9) is formed by the two substrates (2) and (3) connected by the film resin layer (10). They are fixed so that the mounted circuit elements face each other so as to sandwich them. At this time, the film resin layer (10) connecting the two substrates (2) and (3) is abutted against the arcuate portion provided on the case member (8) and bent, so that the bent portion There is no risk of the conductive path (5) breaking during bending. After integrating the case material (9) and both substrates (2) and (3),
Since the resin layer (10) of the connecting portion is exposed, the exposed connecting portion is completely sealed by the lid body (20) in this embodiment. The lid body (20) is made of the same material as the case material (9), and the bonding is performed by a predetermined means such as the above-mentioned adhesive sheet.

By the way, when the mounting body (4a) on which the header (4) is formed is fitted into the hole provided in the one substrate (2), a conductive path ( One end of 5) is extended, and the conductive path (5) and the lead-out lead (5b) of the mounting body (4a) are connected by solder or the like. Lead Out (5
A part of the other end of the conductive path (5) connected to b) extends in the vicinity of the microcomputer (7) and is electrically connected to the chip-shaped microcomputer (7) by a bonding wire.

Here, the positional relationship between the EPROM chip (6) and the microcomputer will be described. Since the mounting body (4a) on which the EPROM chip (6) is mounted via the header (4) and the microcomputer (7) are connected via a large number of conductive paths (5), The header (4) on which the EPROM chip (6) is mounted in order to shorten the routing of the path (5), that is, the header mount (4a) and the microcomputer (7) are respectively located at adjacent positions or as close to each other as possible. It is arranged to be located. Therefore EPROM chips (6)
The conductive path (5) can be routed between the microcomputer (7) and the microcomputer (7) in the shortest distance, and the mounting area on the substrate can be effectively used. The chip-shaped microcomputer (7) arranged in the vicinity of or adjacent to the mounting body (4a) on which the header (4) mounting the EPROM chip (6) is mounted is The conductive path (5) extending in the vicinity is bonded and connected by a wire to the EPROM chip (6).

By the way, since the EPROM chip (6) is mounted on the main surface exposed to the outside of one substrate (2) via the header (4), only the EPROM chip (6) is mounted outside the substrate. The microcomputer (7) and its peripheral circuit elements (8) other than the EPROM chip (6) are in a sealed space (21) formed by two substrates (2) and (3) and a case material (9). Will be placed in.

As described above, the microcomputer (7) connected to the EPROM chip (6) and the circuit element (8) around the microcomputer (7) are formed by the two substrates (2) and (3) and the case material (9). It is set to be placed in the space (21). Furthermore, all the chip-shaped electronic components and resistive elements such as printing resistors and plating resistors are provided in the sealing space (21).

In this embodiment, when erasing the data of the EPROM chip (6), the ultraviolet impermeable resin (21b) is peeled off and irradiated with ultraviolet rays, and when rewriting is performed, the ultraviolet transparent resin on the EPROM chip (6). A terminal such as a probe is brought into contact with the lead-out lead (5b) in the vicinity where the (21a) is also peeled off and bonded, and data is written by the writing device. At this time, when the ultraviolet-transparent resin (21a) is peeled off, since the resin (21a) does not have a strong adhesive force, the wire line is not cut.

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

First, with a modem (MODEM), there exists a modem for data communication in which data digitized by a data terminal such as a personal computer is transmitted and received at a distance from each other using a telephone line. The function of the modem is to modulate the digitized data by using the frequency that can be used in the telephone line, convert it into an analog signal and put it on the telephone line, and the analog signal modulated with the data sent from the other party. It has the function of demodulating and returning to digitized data.

The modem will be briefly described based on the block diagram shown in FIG.

FIG. 5 is a block diagram when a modem is mounted on the integrated circuit board (2).

The modem stores a data transmitted from a personal computer in a built-in memory and outputs the data, and a micro that outputs a predetermined output signal based on the data output from the DTE interface (31). EPROM containing data addressed by the computer (7) and the microcomputer (7)
(6), the first and second modulation / demodulation circuits (32) (33) that modulate and demodulate the output signal from the microcomputer (7) and output to the NCU (NETWORK CNTROL UNIT), and the output from the microcomputer (7) And a DTMF generator (34) for generating a desired DTMF signal (tone signal) according to the signal.

The DTE interface (31) is composed of an IC such as STC9610) Seiko Epson) and supplies the output signal of the personal computer as shown in FIG. 6, accumulates the output signal in the built-in memory and outputs it to the microcomputer (7). A transmission memory section (35), a reception memory section (36) for accumulating a signal supplied with an output signal from the microcomputer (7) in the internal memory and outputting the signal to the personal computer (38), and a transmission memory section ( 35) and a control section (37) for switching respective signals input and output through the reception memory section (36), and has a predetermined function for connecting the personal computer (38) and the microcomputer (7). I have.

The microcomputer (7) is composed of, for example, an IC such as STC9620 (Seiko Epson), and as shown in FIG. 7, it is recognized by the command recognition unit that recognizes the output signal output from the DTE interface (31) and the command recognition unit. A command decoding unit that decodes the output signal, and a command execution unit that compares the data decoded in the command decoding unit with the data in the memory unit and supplies the data to the modulation / demodulation circuit,
As a result of comparing the data in the command decoding unit with the data in the memory unit, the response code generating unit outputs an output signal to the DTE interface (31) when erroneous data is supplied to the command executing unit.

The modulation / demodulation circuit (38) converts the digital signal transmitted from the microcomputer (7) into an analog signal and transmits it to the NCU unit. On the other hand, the analog signal transmitted from the NCU unit is converted into a digital signal and transmitted to the microcomputer (7), which includes low-speed and medium-speed circuits. The first modulation / demodulation circuit (32) is 30
This is a low-speed modulation / demodulation circuit of 0 bps, and the second modulation / demodulation circuit (33)
Is a 1200bps medium speed modulation / demodulation circuit. One of the first and second modulation / demodulation circuits (32, 33) is selected by the microcomputer (7).

The DTMF generator (34) generates a predetermined DTMF signal by inputting the data output from the command execution unit of the microcomputer (7) to the input terminals of each of COL and ROW, and transmits AMP.
Output to (39) and supply signal to telephone line.

Program data for setting various modes of the modem is stored in the EPROM (6) and is supplied to the microcomputer (7) based on the address of the microcomputer (7).

Next, the operation of the modem will be briefly described.

First, when the personal computer communication is started, the control switch (40) operates based on the read signal from the microcomputer (38), and the predetermined address data is transferred to the EPROM (7).
Is supplied to the microcomputer (7), and the program data of the EPROM (6) based on the address is supplied to the microcomputer (7), and the communication standard (BELL / CCITT) of each modem is used for communication.
Standard), communication speed (300 / 1200bps), matching of data format, switching of DIP switch mode, etc. are checked to see if they match.

Assuming that the various modes are the same, enter the telephone number of the answering modem into the personal computer. The telephone number is input to the DTE interface (31) for interfacing with the personal computer and transferred to the microcomputer (7) for decoding the telephone number. The decrypted result is DT
The signal is transmitted to the MF generator (34), the DTMF signal is transmitted from the DTMF generator (34), and the signal is transferred to the general telephone line via the transmission AMP (39) and the line transformer (41).

The transferred DTMF signal sends a calling signal to the answering modem, and the answering modem receives the calling signal and automatically receives the incoming call. Then, the answering modem sends an answer tone for the connection procedure to the calling modem.

The modem on the calling side passes through the line transformer (41) and the receiving amplifier (42), and the low speed modulation / demodulation circuit (32) detects whether or not the answer tone is a predetermined answer tone for the modem on the calling side. . If it is a predetermined answer tone, the communication state is entered.

In the communication state, parallel data from the personal computer is input to the DTE interface (31) based on a predetermined key input signal from the keyboard of the calling personal computer, and the data is transferred to the microcomputer (7). Here, the parallel data is converted into serial data. The digital signal converted into serial data is transmitted to the low speed modulation / demodulation circuit (32). Here, the digital signal is converted into an analog signal, frequency modulation FSK is performed based on the communication standard corresponding to it, transmission AMP (39), line transformer (41)
To the modem on the answering side. On the other hand, the frequency-modulated analog signal sent by the key input signal of the responding personal computer is sent to the calling modem, and the low-speed modulation / demodulation circuit (3) is sent via the line transformer (41) and the receiving AMP (42).
Entered in 2). Here, the analog signal is converted into a digital signal and input to the DTE interface (31), converted from a serial digital signal into a parallel digital signal, and input into the calling personal computer. As a result, the personal computer for the calling side and the personal computer for the answering side can perform full-duplex communication, thus realizing personal computer communication.

FIG. 8 is a plan view when the modem circuit shown in FIG. 5 is mounted on one of the substrates (2) used in this embodiment, and the reference numerals of the mounted circuit elements are the same. The connection between the EPROM chip (6) and the microcomputer (7) is shown by a bus line. The conductive paths connecting the plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 8, a plurality of fixing pads (5a), to which the external lead terminals (12) are fixed, are provided on the opposing peripheral ends of one substrate (2). A mounting body (4a) on which a header (4) mounting a plurality of circuit elements (8) and EPROM chips (6) is mounted at a predetermined position on a conductive path (5) extending from the fixing pad (5a). ) Is fitted. A plurality of circuit elements (8) including a microcomputer (7) other than the EPROM chip (6) are fixed on the substrate (2), (31) is a DTE interface, (32) (3).
3) is the first and second modulation / demodulation circuits, (34) is a DTMF generation circuit, (40) is a control switch for controlling the EPROM (6),
(7) is a microcomputer, and (8) is a chip component such as a capacitor. The other substrate (3) has a plurality of conductive paths (5) extending from the one substrate (2) through a film resin layer (10) such as polyimide, and is provided on the other substrate (3). Is equipped with optional circuits or some circuits necessary for the modem.

As shown in FIG. 8, a mounting body (4a) to which a hender (4) mounting an EPROM chip (6) is fixed is arranged near or adjacent to the microcomputer (7). By disposing the EPROM chip (6) and the header (4) near or adjacent to the microcomputer (7) via the bus line, that is, the conductive path (5) between the microcomputer (7) and the EPROM chip (6). It is possible to route the lead wire in () with the shortest distance and the shortest distance, so that other mounting patterns can be effectively used and high-density mounting can be performed. The area surrounded by the alternate long and short dash line shows the area where the case material (9) is fixed with an adhesive sheet.

FIG. 9 is a plan view of a finished product of a hybrid integrated circuit device for a modem when the other substrate (3) is fixed to the one substrate (2) shown in FIG. 8 via the case material (9). In addition, from the upper surface of one of the substrates (2), the header mounting body (4a) having the header (4) on which the EPROM chip (6) is mounted and the ultraviolet ray opaque filled in the auxiliary frame (4b) are opaque. Resin (21
b) is exposed. That is, EPROM chip (6)
Other than the above, all other elements are sealed in the sealing space (21) formed by the case material (9) and the two substrates (2) and (3), and only the EPROM chip (6) is mounted outside the substrate. Will be placed.

According to the present invention, the header (4) is provided at a desired position on the main surface exposed to the outside of the one substrate (2), and the EPROM chip (6) is fixed on the header (4) to obtain the EPROM. The electrode of the chip (6) and the lead-out lead connected to the conductive path are connected by a bossing wire to form a sealed space (21) formed by the two substrates (2) and (3) and the case material (9). By arranging the microcomputer (7) and its circuit element (8), it is possible to provide a system in which the hybrid integrated circuit and the EPROM chip are integrated and which is extremely small. .

(G) Effect of the Invention As described in detail above, according to the present invention, firstly, the header (4) provided on the main surface exposed to the outside of the one substrate (2).
Since the EPROM chip (6) is fixed on the upper part and the electrode of the EPROM chip (6) and the lead-out lead connected to the conductive path are connected by a bonding wire, the mounting position of the EPROM chip (6) is arbitrary. It has the advantage that it can be selected. Therefore, in consideration of the electrical connection with the built-in microcomputer (7), the EPROM chip (6) and the microcomputer (7) can be efficiently connected, and the wiring of signal lines can be eliminated. More specifically, the most closely related microcomputer (7) can be placed in the adjacent position of the EPROM chip (6),
As a result, the data lines for exchanging data between the EPROM chip (6) and the microcomputer (7) can be realized with the shortest distance or the layout that is the easiest to design, and the loss of packaging density due to the routing of the data lines can be minimized. it can. Further, since it is formed of two substrates (2) and (3), it is possible to provide a high-density and downsized hybrid integrated circuit device.

Secondly, by improving the packaging density of the microcomputer and its peripheral circuit elements to be incorporated on the two integrated circuit boards (2) and (3), the conventionally required printed circuit board can be eliminated and one miniaturization can be achieved. It is possible to realize a hybrid integrated circuit device having a built-in EPROM chip (6).

Thirdly, by using a metal substrate as the two integrated circuit boards (2) and (3), the heat radiation effect thereof can be significantly improved as compared with the printed circuit board, and it can contribute to the improvement of the mounting density. Further, by using the copper foil (11) as the conductive path (5), the resistance value of the conductive path (5) can be significantly reduced as compared with the conductive paste, and the mounted circuit can be expanded to a level equal to or larger than that of the printed circuit board.

Fourthly, the microcomputer (7) connected to the EPROM chip (6) and its peripheral circuit elements (8) are sealed by a case material (9) and two integrated circuit boards (2) and (3). Since it is incorporated in the stop space (21) in a die shape or a chip shape, it has an advantage that the occupied area becomes extremely small as compared with a conventional resin-molded printed circuit board and the packaging density can be greatly improved.

Fifth, case material (9) and two integrated circuit boards (2)
By making the peripheral edges of (3) substantially coincide with each other, almost the entire surface of the integrated circuit board (2) (3) can be used as a sealing space (21), and an extremely compact hybrid integrated circuit combined with an improvement in mounting density. The device can be realized.

Sixth, the external lead terminals (12) and (13) can be derived from one side of the two integrated circuit boards (2) and (3) or opposite sides thereof, which is an advantage that an extremely multi-pin hybrid integrated circuit device can be realized. .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing the present embodiment, and FIG. 2 is I- of FIG.
I sectional view, FIG. 3 is a perspective view of a case material, FIG. 4 is a sectional view of a substrate used in this embodiment, FIG. 5 is a block diagram showing a modem circuit used in this embodiment, and FIG. 6 is FIG. Fig. 7 is a block diagram showing the DTE interface of the modem shown in Fig. 7, Fig. 7 is a block diagram showing the microcomputer of the modem shown in Fig. 5, and Fig. 8 is a block diagram showing the block diagram shown in Fig. 5 mounted on a substrate. FIG. 9 is a plan view when the other substrate is fixed to the substrate shown in FIG. 8 via a case material, and FIGS. 10 and 11 are perspective views showing a conventional EPROM mounting structure. Is. (1) ... hybrid integrated circuit device, (2) (3) ... integrated circuit board, (5) ... conductive path, (6) ... EPROM chip,
(7) …… Microcomputer, (8) …… Circuit element, (4) …… Header, (9) …… Case material, (4a)
…… Header mount, (21a) …… UV transparent resin,
(21b) …… UV impermeable resin.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Osamu Nakamoto 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Katsumi Okawa 2-18 Keiyo Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuhiro Koike, 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Masao Kaneko 2-18, Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Seiwa Ueno 2-18, Keihanhondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Saito 41-1, Omama-cho, Yamama-gun, Gunma Prefecture Tokyo IC

Claims (9)

[Claims] 1. Two integrated circuit substrates arranged to face each other, a conductive path having a desired pattern formed on main surfaces of the substrate facing each other, and a nonvolatile memory chip connected to the conductive path. A microcomputer supplied with data from the memory and connected to a conductive path on the substrate and its peripheral circuit element; and a case member integrated between the substrates, the outside of the one substrate. A header is provided at a desired position on the exposed main surface, the non-volatile memory chip is fixed on the header, and the electrode of the non-volatile memory chip and a desired lead lead connected to the conductive path are bonded by a bonding wire. A hybrid characterized in that the microcomputer and its peripheral circuit elements are arranged in a sealed space formed by connecting the two substrates and the case material. AND circuit device. 2. The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit substrate. 3. The hybrid integrated circuit device according to claim 1, wherein the substrates have substantially the same shape. 4. The hybrid integrated circuit device according to claim 1, wherein a copper foil is used as the conductive path. 5. The hybrid integrated circuit device according to claim 1, wherein the microcomputer is mounted on the conductive path in a die shape. 6. The hybrid integrated circuit device according to claim 1, wherein a chip resistor and a chip capacitor are used as the peripheral circuit element. 7. The hybrid integrated circuit device according to claim 1, further comprising a frame body having a constant thickness in which the case member is substantially aligned with the peripheral end portions of the both substrates. 8. The hybrid memory according to claim 1, wherein an auxiliary frame surrounding the header is provided, and a sealing resin layer that transmits ultraviolet rays is injected into the auxiliary frame to seal the nonvolatile memory chip. Integrated circuit device. 9. A sealing resin for blocking ultraviolet rays is provided on the sealing resin layer in the header.
A hybrid integrated circuit device as described.